•Combines 74F245 and two 74F374 type functions in one chip
•High impedance base inputs for reduced loading (70µA in high
and low states)
•Independent registers for A and B buses
•Multiplexed real-time and stored data
•Choice of non-inverting and inverting data paths
•Controlled ramp outputs for 74F646A/74F648A
•3-state outputs
•300 mil wide 24-pin slim dip package
TYPE
74F646/74F648115MHz140mA
74F646A/74F648A185MHz105mA
DESCRIPTION
The 74F646/74F646A and 74F648/74F648A transceivers/registers
consist of bus transceiver circuits with 3–state outputs, D–type
flip–flops, and control circuitry arranged for multiplexed transmission
of data directly from the input bus or the internal registers. Data on
the A or B bus will be clocked into the registers as the appropriate
clock pin goes high. Output enable (OE
to control the transceiver function. In the transceiver mode, data
present at the high impedance port may be stored in either the A or
B register or both.
The select (SAB, SBA) pins determine whether data is stored or
transferred through the device in real–time. The DIR determines
which bus will receive data when the OE
isolation mode (OE
register and/or data from bus B may be stored in the A register.
When an output function is disabled, the input function is still
enabled and may be used to store and transmit data. Only one of
the two buses, A or B may be driven at a time.
XX↑XXXInputUnspecified*Store A, B unspecified*Store A, B unspecified*
XXX↑XXUnspecified*InputStore B, A unspecified*Store B, A unspecified*
HX↑↑XXInputInputStore A and B dataStore A and B data
HXH or LH or LXXInputInputIsolation, hold storageIsolation, hold storage
LLXXXLOutputInputReal time B data to A busReal time B data to A bus
LLXH or LXHOutputInputStored B data to A busStored B data to A bus
LHXXLXInputOutputReal time A data to B busReal time A data to B bus
LHH or LXHXInputOutputStored A data to B busStored A data to B bus
NOTES:
1. H = High–voltage level
2. L = Low–voltage level
3. X = Don’t care
4. ↑ = Low–to–high clock transition
5. * = The data output function may be enabled or disabled by various signals at the OE
always enabled, i.e., data at the bus pins will be stored on every low–to–high transition of the clock.
and DIR inputs. Data input functions are
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free air temperature range.)
SYMBOL
V
CC
V
IN
I
IN
V
OUT
I
OUT
T
amb
T
stg
Supply voltage–0.5 to +7.0V
Input voltage –0.5 to +7.0V
Input current–30 to +5mA
Voltage applied to output in high output state–0.5 to V
Current applied to output in low output state74F646A, 74F648A72mA
Operating free air temperature range
Storage temperature range–65 to +150
The following examples demonstrate the four fundamental
bus–management functions that can be performed with the
74F646/646A and 74F648/648A. The select pins determine whether
BUS MANAGEMENT FUNCTIONS
REAL TIME BUS TRANSFER
BUS A
OE DIR CPABCPBA SAB SBA
LL X X X L
BUS B TO BUS A
BUS B
REAL TIME BUS TRANSFER
BUS A TO BUS B
BUS ABUS A
DIR CPABCPBA SAB SBA
OE
LH X X L X
data is stored or transferred through the device in real time. The
output enable pins determine the direction of the data flow.
STORAGE FROM
A, B, OR A AND B
OE DIR CPABCPBA SAB SBA
XX ↑XXX
XX X ↑XX
HX ↑↑XX
TRANSFER STORED DATA
TO A AND/OR B
BUS ABUS BBUS BBUS B
OE DIR CPABCPBA SAB SBA
LLX H or L XH
LH H or L XHX
SF00392
1990 Sep 25
6
Philips Semiconductors Product specification
74F646/A/74F648/ATransceivers/registers
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
V
OH
V
OL
V
IK
I
I
High-level output voltage
Low-level output voltageAll
Input clamp voltageVCC = MIN, II = I
Input current atothersVCC = 0.0V, VI = 7.0V100µA
maximum input voltageA0–A7, B0–B7VCC = MAX, VI = 5.5V1mA
I
IH
I
IL
I
OZH
I
OZL
I
OS
I
O
I
CC
High–level input current OE, DIR, CPAB,VCC = MAX, VI = 2.7V20µA
Low–level input current CPBA, SAB, SBAVCC = MAX, VI = 0.5V–20µA
Off–state output current,
+ I
IH
high–level voltage applied
Off–state output current,
+ I
IL
low–level voltage applied
Short–circuit output current
Output current
Supply current (total)I
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
Unless otherwise specified, V
2. All typical values are at VCC = 5V, T
3. Not more than one output should be shorted at a time. For testing I
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I
is tested under conditions that produce current approximately one half of the true short–circuit output current (IOS).
4. I
O
PARAMETERTESTLIMITSUNIT
IOH =
1
±10%V
±5%V
±10%V
MINTYP2MAX
2.4V
CC
2.73.4V
CC
2.0V
CC
CC
CC
0.380.55V
0.420.55V
–0.73-1.2V
CONDITIONS
VCC = MIN,IOH = –3mA
VIL = MAX,
VIH = MIN
VCC = MIN,
VIL = MAX,
–15mA
IOL = 48mA±10%V
74F646/74F648 only VIH = MINIOL = 64mA±5%V
IK
A0 – A7, B0 –B7
VCC = MAX, V
= 2.7V70
O
VCC = MAX, VO = 0.5V–70
3
74F646, 74F648VCC = MAX-100-225mA
4
= VCC for all test conditions.
X
tests should be performed last.
OS
74F646A, 74F648AVCC = MAX, V0 = 2.25V-60-150mA
amb
= 25°C.
74F646,I
74F648I
74F646A,I
74F648AI
CCH
CCLVCC
CCZ
CCH
CCLVCC
I
CCZ
OS
= MAX160210mA
= MAX110155mA
, the use of high-speed test apparatus and/or sample-and-hold
SO24: plastic small outline package; 24 leads; body width 7.5 mmSOT137-1
74F646/A/74F648/A
1990 Sep 25
14
Philips SemiconductorsProduct specification
Transceivers/registers
74F646/A/74F648/A
NOTES
1990 Sep 25
15
Philips SemiconductorsProduct specification
Transceivers/registers
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
74F646/A/74F648/A
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 10-98
Document order number:9397-750-05151
yyyy mmm dd
16
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.