Datasheet N74F245DB, N74F245D, N74F245N Datasheet (Philips)

INTEGRATED CIRCUITS

74F245

Octal transceiver (3-State)

Product specification 1994 Nov 15
IC15 Data Handbook

Philips Semiconductors

Philips Semiconductors Product specification

74F245Octal transceiver (3-State)

FEA TURES

•Octal bidirectional bus interface

•3-State buffer outputs sink 64mA

•15mA source current

•Outputs are placed in high impedance state during power-off

conditions

DESCRIPTION

The 74F245 is an octal transceiver featuring non-inverting 3-State
bus compatible outputs in both transmit and receive directions. The
B port outputs are capable of sinking 64mA and sourcing 15mA,
producing very good capacitive drive characteristics. The device
features an Output Enable (OE
Transmit/Receive (T/R
outputs, B0–B7, have been designed to prevent output bus loading if
the power is removed from the device.

TYPE TYPICAL PROPAGATION DELAY TYPICAL SUPPLY CURRENT (TOTAL)

74F245 4.0ns 70mA

ORDERING INFORMATION

DESCRIPTION

20-Pin Plastic DIP N74F245N SOT146-1

20-Pin Plastic SO N74F245D SOT163-1

20-Pin Plastic SSOP Type II N74F245DB SOT339-1

) input for easy cascading and

) input for direction control. The 3-State

PIN CONFIGURATION

COMMERCIAL RANGE

VCC = 5V ±10%, T

amb

1

T/R

2

A0

3

A1

4

A2

5

A3

6

A4

7

A5

8

A6

9

A7

10 11

GND

= 0°C to +70°C

V

20

CC

19

OE

18

B0

17

B1

16

B2

15

B3

14

B4

13

B5

12

B6
B7

SF00198

DRAWING NUMBER

INPUT AND OUTPUT LOADING AND FAN-OUT TABLE

PINS DESCRIPTION 74F (U.L.) HIGH/LOW LOAD VALUE HIGH/LOW

A0–A7, B0–B7 Data inputs 3.5/1.0 70µA/0.6mA

OE Output Enable input (active Low) 1.0/2.0 20µA/1.2mA

T/R Transmit/Receive input 1.0/2.0 20µA/1.2mA
A0–A7 A port outputs 150/40 3.0mA/24mA
B0–B7 B port outputs 750/106.7 15mA/64mA

NOTE: One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.

LOGIC SYMBOL

19

1

V

= Pin 20

CC

GND = Pin 10

OE
T/R

234

A0 A1 A2 A3 A4 A5

B1

B0

17

18

567

B2 B3 B4 B5

16 15 14 13

89

A6 A7

B6 B7

12 11

SF00199

IEC/IEEE SYMBOL

19

1

2
3
4
5
6
7
8
9

G3
3EN1 (BA)
3EN1 (AB)

∇ 1

2 ∇

18
17
16
15
14
13
12
11

SF00200

November 15, 1994 853–0025 14256

2

Philips Semiconductors Product specification

OUTPUTS

I

Current applied to output in Low output state

SYMBOL

PARAMETER

UNIT

IOHHigh-level output current

IOLLow-level output current

74F245Octal transceiver (3-State)

LOGIC DIAGRAM

A0 A1 A2 A3 A4 A5 A6 A7

23456789

19

OE

1

T/R

VCC = Pin 20
GND = Pin 10

FUNCTION TABLE

INPUTS

OE T/R

L L Bus B data to Bus A
L H Bus A data to Bus B

H X Z

H = High voltage level
L = Low voltage level
X = Don’t care
Z = High impedance “off” state

18

B0

17

B1

16

B2

15

B3

14

B4

13

B5

12

B6

B7

SF00201

11

ABSOLUTE MAXIMUM RATINGS

(Operation beyond the limits set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free-air temperature range.)

SYMBOL

V

CC

V

IN

I

IN

V

OUT

OUT

T

amb

T

stg

Supply voltage –0.5 to +7.0 V
Input voltage –0.5 to +7.0 V
Input current –30 to +5 mA
Voltage applied to output in High output state –0.5 to +5.5 V

pp

p

Operating free-air temperature range 0 to +70 °C
Storage temperature range –65 to +150 °C

PARAMETER RATING UNIT

p

A0–A7 48 mA
B0–B7 128 mA

RECOMMENDED OPERATING CONDITIONS

V
V
V
I

T

CC
IH
IL

IK

amb

Supply voltage 4.5 5.0 5.5 V
High-level input voltage 2.0 V
Low-level input voltage 0.8 V
Input clamp current –18 mA

p

p

A0–A7 –3 mA
B0–B7 –15 mA
A0–A7 24 mA
B0–B7 64 mA

Operating free-air temperature range 0 +70 °C

LIMITS

MIN NOM MAX

November 15, 1994

3

Philips Semiconductors Product specification

1

SYMBOL

PARAMETER

TEST CONDITIONS

1

UNIT

A0–A7, B0–B7

I

3mA

VOHHigh-level output voltage

V

MAX

B0–B7

I

15mA

A0–A7

V

CC

MIN

V

MIN

I

IOSShort-circuit output current

3

V

MAX

74F245Octal transceiver (3-State)

DC ELECTRICAL CHARACTERISTICS

(Over recommended operating free-air temperature range unless otherwise noted.)

LIMITS

MIN TYP2MAX

= –

VCC = MIN,

p

V

=

IL

= MIN

IH

=

V

OL

Low-level output voltage

B0–B7

VIL = MAX,

=

IH

OH

,

= –

OH

IOL = 20mA ±10% V

,

IOL = 24mA ±5% V
IOL = MAX ±10% V

±10% V

±5% V

±10% V

±5% V

VCC = MIN,

V

OL

V

IK

I

I

IH

I

IL

IIH+I

IIL+I

I

CC

Low-level output voltage B0–B7

Input clamp voltage VCC = MIN, II = I
Input current at maximum

input voltage

OE, T/R VCC = 5.5V, VI = 7.0V 100 µA

A0–A7, B0–B7 VCC = 5.5V, VI = 5.5V 1 mA
High-level input current OE, T/R only VCC = MAX, VI = 2.7V 20 µA
Low-level input current OE, T/R only VCC = MAX, VI = 0.5V –1.2 mA
Off-state output current

OZH

High level voltage applied
Off-state output current

OZL

Low level voltage applied

p

Supply current (total)

A0–A7

B0–B7

I

CCH

I

CCL

I

CCZ

VIL = MAX,
V

= MIN

IH

IOL = MAX ±5% V

IK

VCC = MAX, VO = 2.7V 70 µA

VCC = MAX, VO = 0.5V –600 µA

=

CC

VCC = MAX

NOTES:

1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.

2. All typical values are at VCC = 5V, T

3. Not more than one output should be shorted at a time. For testing I
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting

amb

= 25°C.

, the use of high-speed test apparatus and/or sample-and-hold

OS

of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I

tests should be performed last.

OS

2.4 V

CC

2.7 3.4 V

CC

2.0 V

CC

2.0 V

CC

CC

CC

CC

CC

0.30 0.50 V

0.35 0.50 V

0.42 0.55 V

–0.73 –1.2 V

–60 –150 mA

–100 –225 mA

60 87 mA
70 100 mA
75 110 mA

0.55 V

AC ELECTRICAL CHARACTERISTICS

SYMBOL PARAMETER

t

PLH

t

PHL

t

PZH

t

PZL

t

PHZ

t

PLZ

November 15, 1994

Propagation delay
An to Bn, Bn to An

Output Enable time
to High or Low level

Output Disable time
from High or Low level

TEST

CONDITION

Waveform 1
Waveform 2

Waveform 3
Waveform 2

Waveform 3

LIMITS

VCC = +5.0V

T

= +25°C

amb

C

= 50pF, RL = 500Ω

L

VCC = +5.0V ± 10%

T

amb

C

= 50pF, RL = 500Ω

L

MIN TYP MAX MIN MAX

2.5

2.5

2.0

3.5

2.5

1.0

3.5

4.0

4.5

5.5

5.0

3.5

6.0

6.0

7.0

8.0

6.5

6.0

2.5

2.5

2.0

3.5

2.0

1.0

4

= 0°C to +70°C

7.0

7.0

8.0

9.0

7.5

7.0

UNIT

ns

ns

ns

Philips Semiconductors Product specification

74F245Octal transceiver (3-State)

AC WAVEFORMS

For all waveforms, VM = 1.5V.

An, Bn

Bn, An

V

M

t

PLH

V

M

t

PHL

V

M

V

M

SF00202

Waveform 1. Propagation Delay for Non-Inverting Output

OE

V

M

t

PHZ

V

M

VOH–0.3V

SF00203

An, Bn

V

M

t

PZH

Waveform 2. 3-State Output Enable Time to High Level and

Output Disable Time from High Level

TEST CIRCUIT AND WAVEFORMS

OE

V

M

t

PZL

An, Bn

0V

V

M

t

PLZ

V

M

VOL+0.3V

SF00204

Waveform 3. 3-State Output Enable Time to Low Level and

Output Disable Time from Low Level

V

CC

R

PULSE

GENERATOR

V

IN

R

T

D.U.T.

V

OUT

L

C

R

L

L

Test Circuit for Open Collector Outputs

SWITCH POSITION

TEST SWITCH

t
t

PLZ
PZL

closed
closed

All other open

DEFINITIONS:

= Load resistor;

R

L

see AC electrical characteristics for value.

C

= Load capacitance includes jig and probe capacitance;

L

see AC electrical characteristics for value.

R

= Termination resistance should be equal to Z

T

pulse generators.

OUT

of

7.0V
NEGATIVE

PULSE

POSITIVE
PULSE

family

74F

90%

10%

amplitude

t

w

V

M

10%

)

V

90%

M

t

THL (tf

t

TLH (tr

)

t

TLH (tr

t

THL (tf

t

w

Input Pulse Definition

INPUT PULSE REQUIREMENTS

V

rep. rate

M

3.0V

1.5V

1MHz 500ns

10%

)

)

90%

t

w

V

M

V

M

90%

10%

t

TLH

t

THL

2.5ns 2.5ns

AMP (V)

0V

AMP (V)

0V

SF00128

November 15, 1994

5

Philips Semiconductors Product specification

74F245Octal transceiver (3-State)

DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1

1994 Nov 15

6

Philips Semiconductors Product specification

74F245Octal transceiver (3-State)

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1994 Nov 15

7

Philips Semiconductors Product specification

74F245Octal transceiver (3-State)

NOTES

1994 Nov 15

8

Philips Semiconductors Product specification

74F245Octal transceiver (3-State)

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1

1994 Nov 15

9

Philips Semiconductors Product specification

74F245Octal transceiver (3-State)

DEFINITIONS

Data Sheet Identification Product Status Definition

Objective Specification

Preliminary Specification

Product Specification

Formative or in Design

Preproduction Product

Full Production

Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.

LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected

to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.

Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone [phone]

This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.

This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.

This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.

Philips Semiconductors and Philips Electronics North America Corporation

register eligible circuits under the Semiconductor Chip Protection Act.

 Copyright Philips Electronics North America Corporation 1996

All rights reserved. Printed in U.S.A.

(print code) Date of release: July 1994
Document order number: 9397-750-05104