Datasheet MX98715AEC-E Datasheet (MXIC)

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1. INTRODUCTION
PRELIMINARY
MX98715AEC-E
APPLICATION NOTE
The purpose of this application note is to describe the implementation of a PCI bus master 100 Base-TX F ast Ethernet node using MXIC’ highly integrated single chip Fast Ethernet NIC controller MX98715AEC-E. In de­tails, this document presents product overview , program­ming guide, hardware design and layout recommenda­tions that can help you to quickly and smoothly imple­ment a Fast Ethernet adapter card.
As you can find in the MX98715AEC-E driver diskette,
2. PRODUCT OVERVIEW
The MX98715AEC-E implements the 10/100Mbps MAC layer and Physical layer on a single chip in accordance with the IEEE 802.3 standard.
The MX98715AEC-E highly integrates with direct PCI bus interface, including PCI bus master with DMA chan­nel capability, direct EEPROM as well as Boot ROM interface, and large on chip transmit/receiv e FIFOs. Also , the MX98715AEC-E is equipped with intelligent
MXIC already provided a complete set of high quality drivers for easier and more efficient way to interface with MX98715AEC-E on the most popular Network Operat­ing Systems. Nevertheless, there are still some special applications or environment not covered in the MX98715AEC-E driver diskette. Driver developers, how­ever, could still refer to the section of driver program­ming guide to accomplish the required driver. It is rec­ommended that you are familiar with the MX98715AEC­E data sheet before reading this guide.
IEEE802.3u-compliant Nway auto-negotiation capability allowing a single RJ-45 connector to link with the other IEEE802.3u-compliant device without re-configuration. T o optimiz e operating bandwidth, network data integrity and throughput, the proprietary Adaptive Network Throughput Control (ANTC) function is implemented. For detailed product specification information, please refer to the MX98715AEC-E data sheet.
3. HARDWARE DESIGN CONSIDERATIONS
3.1 SYSTEM APPLICA TION BLOCK DIAGRAM
A system block diagram for the MX98715AEC-E based Fast Ethernet adapter card is shown as f ollowing:
PCI Bus
Osc or Crystal
25MHz
EEPROM
MX98715AEC-E
Fig. 1
Boot ROM
LED
Magnetic
RJ45
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MX98715AEC-E
3.2 PCI CONNECTION
The MX98715AEC-E provides direct PCI bus interface to PCI connector. Board designers should especially take care of the four pins of TDI,TDO,PRSNT1# & PRSNT2# that are only related to PCI bus connector. Boards that do not implement JTAG Boundary Scan should tight TDI and TDO together to prevent the scan chain from been broken.
Both pins PRSNT1# and PRSNT2# should be connected to ground indicating that the board is physically present­ing in a PCI slot and providing information about the total power requirements ( less than 7.5W ) of the board.
3.3 OSCILLA TOR OR CR YST AL
The MX98715AEC-E is designed to operate with a 25MHz oscillator or crystal module. The clock specification of this oscillator should meet 25MHz +/- 50PPM.
3.4 BOOT R OM
The MX98715AEC-E support a direct boot ROM inter­face allowing diskless workstations to remotely down­load operating system from network server. F or proper operation, the access time of adapt EPROM should not excess 240ns.
ing indicates the configuration setting table for LED dis­play programming.
CSR9 <28:29> LED0 LED1 0 0 Activity Goodlink 11 Link speed Link Activity
3.7 NETWORK INTERF ACE TO MA GNETIC COMPONENT
For isolating and impedance matching purpose, an iso­lating transformer with 1:1 transmit and 1:1 receive turns ratio is required for transmit and receive twisted pair in­terface. In Appendix B, several transformers that we had verified successfully with MX98715AEC-E are listed for quick reference purpose.
3.8 OPTIMIZED EQUALIZER COMPONENTS
M XI C ’ Fast Ethernet solution utilizes adaptive equal­izer to compensate the attenuation and phase distortion induced by different lengths of cab le. To optimize trans­mit and receive signal quality, pins RTX and RTX2EQ should be connected to external resistors 560 ohm (±1%) and 1.4K ohm (±1%) and then to g round respectively.
3.9 Remote-Power -On and ACPI application
3.5 SERIAL EEPROM
The MX98715AEC-E provides pins EECS,BPA0 (EECK), BPA1 (EEDI) and BPD0 (EEDO) for directly accessing the serial EEPROM. BPA0-1 and BPD0 serve as SK (EECK), DI (EEDI) and DO (EEDO) respectively. The contents of the EEPROM includes the ID information of the MX98715AEC-E (V endorID , DeviceID , Sub-vendorID , Sub-deviceID and MAC ID), and the configuration pa­rameters for software driver. The EEPROM contents should be programmed according to MXIC's definition as mentioned in Appendix A. Detailed software program­ming example is described in section 4.5.
3.6 PROGRAMMABLE LED SUPPORT
The MX98715AEC-E provides two pins LED0 and LED1 to control display LEDs. Displayed messages are pro­grammable through setting CSR9 bit-28 & bit-29 to serve as Activity /Linkspeed and Goodlink/Linkactivity LED respectively . The maximum sinking current of these out­put pins is 16mA. Current limiting resistor (560 ohm) should be added to ensure proper operation. The f ollow-
MX98715AEC-E fully supports Remote-Power-ON and ACPI spec that meet PC98 requirement for power­sensitive applications. It accepts the following wake-up events in the power-down mode.
* Reception of a Magic Pack et. * Reception of a Network wake-up frame. * Detection of change in the network link state.
To put MX98715A into the sleep mode and enable the wake-up events detection are done as following:
1. Write 1 to PPMCSR [8] to enable power management feature.
If D1, D2 or D3
state is set, the PC is still turned on
hot
and is commonly called entering the Remote W ak e-up mode. Otherwise if the main power on a PC is totally
shut off, we call that it is in the D3
state or Remote
cold
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Po wer-On mode. T o sustain the oper ation of the Lancard, a 5V standby power is required. Once the PC is turned on, MX98715AEC-E loads the magic ID from EEPROM and set it up automatically. No register is needed to be
programmed. After then, simply turn of PC to enter D3
cold
state. In either Remote W ake-up mode or Remote P ower­On mode. The transceiver and the RX b lock are still alive to monitor the network activity . If one of the three wak e­up events occured, the following status is changed:
1. PPMCSR [15] (PME status) is set to 1.
2. CRS5 [28] (WKUPI) is set to 1.
3. PCI interrupt pin INTA# is asserted low.
4. LANWAKE pin is asserted high.
4. DRIVER PROGRAMMING GUIDE
This chapter will provide you the necessary information for programming driver for the MX98715AEC-E based node. Initialization module is introduced first that de­scribes how MX98715AEC-E is initialized before any other operations can commence, then followed by ac­tual implementation examples for both transmit and re­ceive operations.
MX98715AEC-E
for (i=0; i<NumTXBuffers; i++) { /* initialize the own bit to host tdes0 */ tx_resource[i]->ownership=0x00; tx_resource[i]->tstatus=0x0000; tx_resource[i]->tdes0_unused=0x00;
/* fill buffer_1_address tdes2 */ get_ea((void far *)(tx_resource[i]->tx_buffer_data), &physicaladdress); tx_resource[i]->buff_1_addr=physicaladdress;
/* fill buffer_2_address tdes3 */ if (i==NumTXBuffers-1) j=0; else j=i+1; get_ea((void far *)(tx_resource[j], &physicaladdress); tx_resource[i]->buff_2_addr=physicaladdress; } }
initializeTheReceiveRing() { unsigned int i,j; unsigned long physicaladdress; for (i=0; i<NumRXBuffers; i++) { /* memory allocation for rx descriptor_buffer (allign 4) */ rx_resource[i]= (struct RX_RESOURCE *)((((unsigned int)rx_temp[i])+4)& 0xfffc); }
for (i=0; i<NumRXBuffers; i++) { /* set the own bit to chip rdes0 */ rx_resource[i]->frame_length=RDES0_OWN_BIT; rx_resource[i]->rstatus=0x0000;
4.1 INITIALIZA TION
initializeTheTransmitRing() { unsigned int i,j; unsigned long physicaladdress; for (i=0; i<NumTXBuffers; i++) { /* memory allocation for tx descriptor_buffer (allign 4) */ tx_resource[i]= (struct TX_RESOURCE *)((((unsigned int)tx_temp[i])+4)& 0xfffc); }
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/* fill rdes1 */ rx_resource[i]->command=RDES1_BUFF­RX_BUFFER_SIZE+rxpkt_size[i];
/* fill buffer_1_address rdes2 */ get_ea((void far *)(rx_resource[i]->rx_buffer_data), &physicaladdress); rx_resource[i]->buff_1_addr=physicaladdress; /* fill buffer_2_address rdes3 */ if (i==NumRXBuffers-1) j=0; else j=i+1;
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get_ea((void far *)(rx_resource[j], &physicaladdress); rx_resource[i]->buff_2_addr=physicaladdress; } }
initialize() { unsigned long physicaladdress;
NIC_read_reg(&csr6); NIC_write_reg(&csr6,csr6.value&(~(CSR6_SR|CSR6_ST))); delay(10); InitializeTheTransmitRing (6); InitializeTheReceiveRing (6); NIC_write_reg(&csr0,CSR0_L_SWR); delay(50);
NIC_write_reg(&csr0,csr0shadow); get_ea((void far *)rx_resource[0],&physicaladdress); NIC_write_reg(&csr3,physicaladdress); get_ea((void far *)tx_resource[0],&physicaladdress); NIC_write_reg(&csr4,physicaladdress); NIC_read_reg(&csr16); NIC_write_reg(&csr7,csr7shadow); NIC_write_reg(&csr16,csr16shadow); //Clear status register NIC_write_reg(&csr5,(unsigned long)0xffffffff); NIC_write_reg(&csr6,csr6shadow); NIC_read_reg(&csr6); setup_frame(TDES1_SETUP_LAST,perfect); }
4.2 TRANSMISSION MODULE
bmtx() { unsigned char editmode, j; struct TX_RESOURCE *tx_pointer;
initialize(); fill_pattern(6); //fill pattern NIC_write_reg(&csr6,csr6.value&(~CSR6_ST)); //stop NIC_read_reg(&csr6); NIC_write_reg(&csr6,csr6.value|CSR6_SF); //store and forward NIC_read_reg(&csr0) NIC_write_reg(&csr0,csr0.value|0x020000); //TAP=01 tx_pointer=tx_resource[0]; j=0;
editmode=1;
while (editmode) { if ((tx_pointer->ownership & 0x80)==0) { j++; j%=tx_pkt_num; if (tx_pointer->command & TDES1_LS_BIT) tx_error_detect(tx_pointer->tstatus); tx_pointer->ownership |= 0x80; tx_pointer=tx_resource[j]; } if (kbhit()) { keycode_get(); if (M_code!=0) { switch (M_code) { case 0x1b: // ESC: quit editmode=0; break; case 0x20: NIC_read_reg(&csr6); NIC_write_reg(&csr6,csr6.value^CSR6_ST); break default: break; } } } } }
4.3 RECEPTION MODULE
bmrx() { unsigned char editmode,i,j; unsigned long physicaladdress; struct RX_RESOURCE *rcv_pointer;
initialize(); rcv_pointer=rx_resource[0]; j=0; editmode=1;
while (editmode) { // if data received if ((rcv_pointer->frame_length & 0x8000)==0) { j++; j%=6; if (rcv_pointer->rstatus & RDES0_LS) rx_error_detect(rcv_pointer->rstatus); rcv_pointer->frame_length |= 0x8000;
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rcv_pointer=rx_resource[j]; } if (kbhit()) { keycode_get(); if (M_code!=0) { switch (M_code) { case 0x1b: // ESC: quit editmode=0; break; default: break; } } } } }
MX98715AEC-E
CSR20.16 should be set to the same value as CSR20.22. For PC99 certification, Rev.H IC is requred, therefore
both CSR20.22 and CSR20.16 should be set to 1 by drivers.
4.5 EEPROM ACCESSING
The following is a reference code for accessing the con­tents of EEPROM that stores ID information and node configuration for the MX98715AEC-E.
4.4 SPECIAL CODING of MX98715AEC-E
4.4.1 SPEED SELECTION
Speed selection for MX98715AEC-E is controlled by in­ternal Nway registers.
The Internal NWay registers are remov ed and protocol selection is controlled by Operation Mode Register (CSR6) and 10Base-T Control Register (CSR14)
NWay Active 100F 100H 10F 10 H CSR6_PS 0 1 1 0 0 CSR6_PCS X 1 1 X X CSR6_FD 1 1 0 1 0 CSR14_ANE 1 0 0 0 0
4.4.2 REGISTERS SETTING FOR DEVELOPING Y OUR OWN DRIVER
The contents of CSR16 for MXIC 10/100Base NIC con­trollers should be set differently as follow:
MX98715AEC-E = 0x0b3cXXXX
Meanwhile, you could directly access the Nway auto­negotiation status from CSR20. Detailed format infor­mation please refer to MX98715AEC-E data sheet.
/************************************* * Read all content from EEPROM **************************************/ eeprom_read() { unsigned int i, address, eeval; char bit; for (address=0; address<64; address++{ NIC_write_reg(&csr9,(unsigned long)0x04800); eeprom_serial_in(0); eeprom_serial_in(1); //command eeprom_serial_in(1); eeprom_serial_in(0); for(i=0; i<6; i++){ //address serial in bit = ((address>>(5-i)) & 0x01) ? 1:0; eeprom_serial_in(bit); } eeval=0; for(i=0; i<16; i++){ //dat serial out NIC_write_reg(&csr9,(unsigned long)0x04803); NIC_read_reg(&csr9); eeval += (((unsigned long)0x008 & csr9.value)>>3)<<(15­i); NIC_write_reg(&csr9,(unsigned long)0x04801); } NIC_write_reg(&csr9,(unsigned long)0x04800); c46[address*2] = eeval & 0x0ff; c46[address*2+1] = (eeval >>8) & 0x0ff; } }
If EEPROM offset 77h bit5=1 (autocomp), then CSR20.14=CSR20.9=1. To enable long cable compen­sation circuit to improve quality & yield when long cable is used.
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/************************************* * Write a word to EEPROM **************************************/ eeprom_write(unsigned int address, unsigned int data) { unsigned int i; char bit; eeprom_wen(); NIC_write_reg(&csr9,(unsigned long)0x04800); eeprom_serial_in(0); eeprom_serial_in(1); //command eeprom_serial_in(0); eeprom_serial_in(1);
for(i=0; i<6; i++){ //address serial in bit = ((address>>(5-i)) & 0x01) ? 1:0; eeprom_serial_in(bit); } for(i=0; i<16; i++){ //data serial in bit = ((data>>(15-i)) & 0x01) ? 1:0; eeprom_serial_in(bit); } NIC_write_reg(&csr9,(unsigned long)0x04800); NIC_write_reg(&csr9,(unsigned long)0x04801); i=0; do{ i++; NIC_read_reg(&csr9); } while ((!(csr9.value & 0x08)) && (i<10000)); NIC_write_reg(&csr9,(unsigned long)0x04800); if (i==10000) prstring (“Writing EEPROM error !!”); eeprom_wds(); }
eeprom_wds() { NIC_write_reg(&csr9,(unsigned long)0x04800); eeprom_serial_in(0); eeprom_serial_in(1); eeprom_serial_in(0); eeprom_serial_in(0); eeprom_serial_in(0); eeprom_serial_in(0); eeprom_serial_in(0); eeprom_serial_in(0); eeprom_serial_in(0); eeprom_serial_in(0); NIC_write_reg(&csr9,(unsigned long)0x04800); }
/************************************* * Serial inject a bit to EEPROM **************************************/ eeprom_serial_in(unsigned int bit2) { NIC_write_reg(&csr9,(unsigned long)0x04800+4*bit2); NIC_write_reg(&csr9,(unsigned long)0x04803+4*bit2); NIC_write_reg(&csr9,(unsigned long)0x04801+4*bit2); }
4.6 AUTO-COMPENSATION ON TRANSCEIVER
The driver must set bits CSR20<9> and CSR20<14> high to enable auto-compensation function. Be careful not to clear these two bits while accessing CRS20 at any time.
eeprom_wen() { NIC_write_reg(&csr9,(unsigned long)0x04800); eeprom_serial_in(0); eeprom_serial_in(1); eeprom_serial_in(0); eeprom_serial_in(0); eeprom_serial_in(1); eeprom_serial_in(1); eeprom_serial_in(0); eeprom_serial_in(0); eeprom_serial_in(0); eeprom_serial_in(0); NIC_write_reg(&csr9,(unsigned long)0x04800); }
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5. PCB layout recommendation
Introduction: Due to the high frequency and the increasing degree of integration, system board designs are becoming complex. The purpose of this section is to give system designer more information. Such as pow er stability , placement, signal trace routing and de-coupling capacitor.
5.1 Power / Gr ound consideration
It is recommended to separate power plane into 3 domains (Power for digital , analog and receive section). Seg­mented power supplies reduces noise from one section to another . It is also recommended to separate ground plane into 3 domains ( Digital Ground, Analog Ground and Receive Ground). The reason f or separating is to prev ent digital noise from coupling onto the analog or receive ground. All power/ground lines should be as wide as possible to allow noise de-coupling and efficient low resistive paths for supply current.
3.3V
bead
V digital
V analog
GND GNDR
40mil
Bridge
V receive
GND GNDA
Depending upon the environment, any or all of these filters may be simplified.o
GNDR
(Receive ground)
GNDS
CardBus
GNDA
(Chassis
Interface
(Analog ground)
ground)
GND (digital ground)
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Oscillat
5.2 Board Layout / Trace Routing
¨ 90 degree corners should be avoided, smooth cornering is preferred.
¨ Keep the lengths of clock lines short and minimize the numbers of VIAs.
¨ All pair lines ( i.e. TX+/- , RX+/-) are of the equal length and run in parallel
then possible noise is common and can be ignored on different inputs.
Magnetic
Tx+ Tx-
Tx+ Tx-
¨ A good practice is that never run transmit and receive pair too close.
Crosstalk may become a problem.
Tx+ Tx-
Rx+ Rx-
Magnetic
Tx+ Tx-
Rx+ Rx-
¨ The ground shield of clock line may reduce extra noise.
Magnetic
Magnetic
Tx+ Tx-
Rx+ Rx-
Ground Shield
or
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¨
All differential pair ( Tx +/ - , Rx +/-) to the magnetic should have matched impedance. See schematics for details.
V
50
Tx+ Tx-
V
Rx+ Rx-
100 Ohm
¨
A chassis ground is used to isolate the cable side and ground.
Magnetic
50
Magnetic
Chassis
System Ground
5.3 Component placement
General:
External components are placed as close as possible
Magnetic
Osc/Crystal
IC
Ground
RJ-45
BootRom
Eeprom
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MX98715AEC-E
¨
De-coupling capacitor De-coupling cap should be placed close to power pin. It stabilize current to
the device and de-coupling noise from the power plane to ground.
PIN
0.1 U
¨
Analog Region Receive Region Digital Region
81. VDD 90. VDD Others
82. GND 89. GND
84. VDD 93. V DD
88. VDD 94. GND
87. GND 95. GND
86.GND
96. VDD
99. GND
103. VDD
104. GND
105. GND
106. VDD
107. GND
108. VDD
109. GND
IC
Transformer
RX­RX+
TX­TX+
Receive Region
Bead
Bead
109 110
95
96
88
89
Analog Region
OSC or crystal
25MHz
81 80
Digital Region
MX98715AEC-E
128
1
Fig. 2
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APPENDIX A: EEPROM FORMAT
BYTE OFFSET (HEX) DESCRIPTIONS 00-13 Reserved 1 4 MAC ID Byte0 ( is automatically loaded into IC ) 1 5 MAC ID Byte1 ( is automatically loaded into IC ) 1 6 MAC ID byte2 ( is automatically loaded into IC ) 1 7 MAC ID byte3 ( is automatically loaded into IC ) 1 8 MAC ID byte4 ( is automatically loaded into IC ) 1 9 MAC ID byte5 ( is automatically loaded into IC ) 1 a Magic Pac k et ID Byte0 ( is automatically loaded into IC ) 1 b Magic Pac k et ID Byte1 ( is automatically loaded into IC ) 1c Magic Packet ID Byte2 ( is automatically loaded into IC ) 1 d Magic Pac k et ID Byte3 ( is automatically loaded into IC ) 1e-39 Reserved 3 a Magic Pac k et ID Byte4 ( is automatically loaded into IC ) 3 b Magic Pac k et ID Byte5 ( is automatically loaded into IC ) 3c-59 Reserved 5 a LSB of Sub-Device ID ( is automatically loaded into IC ) 5 b MSB of Sub-Device ID ( is automatically loaded into IC ) 5c LSB of Sub-Vendor ID ( is automatically loaded into IC ) 5 d MSB of Sub-Vendor ID ( is automatically loaded into IC ) 5e-6f Reserved 7 0 Network ID index: to indicates the starting address of Network ID in length of continu-
ous 6 bytes. The content of this field could be in the range of 00-04h, or 10-14h, or
21-24h, or 31-34h. IC always automatically load ID from 14h after reset or power up. 71-75 Reserved, and should be set to 0 76 LED option: The conent of this field is automatically loaded into CSR9 register for LED option.
Bit0:CSR9<28>=LED0SEL
Bit1:CSR9<29>=LED1SEL
Bit2:CSR9<30>=LEDSEL2
Bit3:CSR9<31>=LEDSEL3
Bit4:CSR9<24>=LEDSEL4
Bit5:CSR9<25>:WKFCAT0
Bit6:CSR9<26>:WKFCAT1
Bit7:Must be zero
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LED programing option table
01 LED0SEL ACT SPEED LED1SEL LINK LINK/ACT LED2SEL SPEED COL (NO T USED) LED3SEL R X FULL/HALF (NOT USED) LED4SEL* CO L PMEB (NOT USED)
7 7 Miscellaneous options is automatically loaded into CSR21 register & IC. :
Bit0:CSR21<2>MPHITDIS=Set to disable magic packet detection, Bit1:CSR21<3>LNKCHGDIS=Set to disable link change detection. Bit2:LW AKEPOR (NOT USED), DON'T CARE. Bit3:CSR21<4> WKFCATEN, wake up frame concatenation option enable . Bit4:PCI PM1.1=Default 0 for PM1.0 support, Set for pm1.1 support, PCI configuration Register PPMC bit 18-16 will be affected. Bit5:AUT OCOMP: Default is 1,set to enable transceiv er auto-compensation function. It overrides bits CSR20<9> and CSR20<14>. Bit<7:6>:Must be zero.
78-79 Reserved, and should be set to 0 7 a LSB of Device ID 7 b MSB of Device ID 7c LSB of V endor ID 7 d MSB of Vendor ID 7e-7f Reserved, and should be set to 0
* Note :Byte 77 Bit 5 (Autocomp) must always set to 1.
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APPENDIX B: SPECIAL COMPONENTS
1.MAGNETIC
A.BASIC ELECTRICAL SPECIFICA TION
T urn Ratio T ransmit 1:1
Receive 1:1
OC L 350uH min measured between 0 and 70°C with a 0.1V rms, 100KHz
signal at a DC. bias between 0 and 8mA. L L 0.4uH Max at >1MHz Cw w 18pF Max DC R 0.9W Max per winding Isolation Resistance not less than 1GW @ 2000V rms Isolation Voltage 2000V rms Min @ 60Hz for 1 min Rise/Fall Time 3ns Min 4ns Max Insertion Loss (100 KHz to 100 MHz) -1.1 dB Max CMDR & DCMR (100 KHz to 80 MHz) 38 dB Min Cross Talk (100KHz to 80 MHz) -38 dB Max
B. T ransformer REFERENCE VENDORS
V endor Part No V alor ST6118 (PT4171S) PE PE68515 BelFuse S558-5999-15 Delta LF8200 T aimic HSIP-002
2.CRYSTAL
BASIC ELECTRICAL SPECIFICA TION
A.
CL=((C1*C2)/(C1+C2))+CIC+ C, Rd 100 ohm,R 1M ohm CL=Crystal's external load capacitor
Specified by crystal's specification CIC=MX98715AEC-E internal capacitor, 7pF C=PCB's stray capacitance Assume C1=C2=C CL=1/2C
+ 7pf + 3pf
Ext
if CL=20pf, than C
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, C=3pf,
Ext
Ext=C1=C2
C1
=20pf.
13
IC
R
Rd
C2
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MX98715AEC-E
B. CR YST AL REFERENCE VEDORS
SPK 25MHz±50PPM NDK JEN JAAN ENTERPRISE
3. SPECIAL REQUIREMENT ON RESIST ORS & BEAD
Resistors for RTX=560 ohm ± 1% Resistor for RTX2EQ=1.4K ± 1% Resistor for RD A=10K ± 5%(F or 10 Base-T Vpp swing) Ferrite Bead maximum current capacity for analog Vdd > 300mA Ferrite Bead maximum current capacity for Receiv e Region Vdd > 100mA
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Bill Of Materials ( Refer to schematic dated Nov 6, 1999)
Item Quantity Reference Part 1 20 C1,C4,C7,C8,C9,C10,C11, 0.1u
C12,C14,C15,C16,C17,C18,
C22,C23,C28,C30,C33,C35,
C37 2 3 C2,C24,C27 22u 3 1 C3 470p 4 1 C5 47p 5 1 C13 2.2u 6 2 C20,C19 30p 7 1 C 29 0.01u/1KV 8 1 C31 82p 9 1 C38 47u 10 2 D1,D2 LED 11 1 D3 1N5817 12 1 J1 CON3 13 3 L1,L3,L4 F.B. ( L1 must sustain maximum current up to 200mA ) 1 4 1 L6 25uH (L4 must sustain maximum current up to 300mA) 15 1 OSC1 25MHz 16 1 P1 PCI5V_A 17 1 Q2 PNP 18 1 RJ1 RJ-45 19 3 R1,R2,R9 560 20 2 R3,R26 100 21 1 R4 10K 22 3 R6,R10,R11 49.9 ( R10,R11 must sustain up to 0.25W ) 23 4 R7,R13,R14,R15 75 24 1 R 8 1.4K 25 2 R17,R28 51K 26 1 R 1 8 0 ohm 27 1 R18 22 28 1 R19 27K 29 1 R21 68K 30 1 R27 0 31 1 U2 27512 32 1 U3 93C46 33 1 U4 ST6118 34 1 U5 AIC1631-5 35 1 U6 FDC6324L 36 1 U7 NDC631N 37 1 U8 MX98715AC
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Appendix C: IEEE802.3 CONFORMANCE TEST
1. Testing Conditions (1) DUT diagram (using MX98715AEC-E standard 2-layer PCB demo board)
5V
TXOP
MX98715AEC-E
TXON
50
5V
50
33pF
Tran sforme r
1:1
33pF
(2) Testing equipment and setting
T ektronix TDS744A Digitizing Oscilloscope trigger Slope + rise time: 10% ~ 90% fall time: 90% ~ 10% probe input capacitance: 1pF probe input impedance: 200K ohm
2. UTP Differential Output Test (950mV V out 1050mV)
(1) Vout (+) = 500.0mV (2) Vout (-) = -500.0mV (3) Result: Pass
3. UTP Active Output Interface T emplate T est
(1) UTP active output interface template (see below scanned figure)
100
+
V
out
_
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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3 UTP Active Output Interface Templace Test
(1) 10 BT Transmit tenplate checker
TXOP
+
_
TXON
TP -
Model
MX98715AEC-E
100
+
V0
_
(2) UTP active output interface template
10 BT Transmit Templatc
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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(3) 10BT Transmit waveform
MX98715AEC-E
Result: Pass
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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4. Vout T ransmit Wa veform Overshoot (shall not exceed 5%)
(1) V out (+) pattern (see below scanned figure)
MX98715AEC-E
100BT Transmit overshoot non-scramble pattern=000000000000001- - - - -
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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(2) V out (-) pattern (see below scanned figure)
MX98715AEC-E
100BT Transmit overshoot non-scramble pattern=000000000000001- - - - -
(3) Result: Pass
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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MX98715AEC-E
5. Transmit Signal Amplitude Symmetry (0.98 +Vout(+) / -Vout(-) 1.02)
(1) Vout(+) = 500mV (2) V out(-) = -500mV
(3) Results: P ass
6. Vout T ransmit Rise/Fall Times (3.0nsec < T rise/fall < 5.0nsec)
100BT Transmit rise/fall time. non-scramb le pattern=000000000000001 - - - - -
(3) Results: Pass
7. Vout T ransmit Duty Cycle Distortion (The deviation of the 50% crossing times fr om a best fit to a time grid of 16ns shall not exceed .25ns) (DSO: Lecro y9384, Vcc: 5.0V olts)
(1) Amplitude Results (see below scanned figure)
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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(2) First half cycle (see below scanned figure)
MX98715AEC-E
100BT Transmit Duty Cycle Distortion. non-scramble pattern=010101 - - - - -
(3) Second half cycle (see below scanned figure)
100BT Transmit Duty Cycle Distortion. non-scramble pattern=010101 - - - - -
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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(4) Third half cycle (see below scanned figure)
MX98715AEC-E
100BT Transmit Duty Cycle Distortion. non-scramble pattern=010101 - - - - -
(5) Fourth half cycle (see below scanned figure)
100BT Transmit Duty Cycle Distortion. non-scramble pattern=010101 - - - - -
(6) Test Result : Pass
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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8. Transmit peak to peak votlage (1.9V Vpp 2.1V)
MX98715AEC-E
100BT Transmit Vpp non-scramble pattern=000000000000001 - - - - -
9. Transmit jitter ( jitter 1.4ns)
100BT Transmit jitter random pattern
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MX98715AEC-E
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MX98715AEC-E
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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MX98715AEC-E
REVISION HISTORY
REVISION DESCRIPTION PAGE DATE
0.1 Modify the power switch application circuits (option 1&2) P12,13,14 NOV/09/1999
0.2 Modify Appendix A and add 14~19 byte offset(HEX) P9, 10 DEC/13/1999
0.3 Modify contents: Registers setting for developing your own driver P5 MA Y/04/2000
0.4 Add appendix C P14~22 JUN/15/2000
Modify 5. PCB Layout Recommendations P7~10 JUN/21/2000
P/N:PM0678 REV. 0.4, JUN. 21, 2000
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TOP SIDE MARKING
MX98715AEC-E
MX98715AEC-E
C9930 TA777001 37DEX
TAIWAN
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-6688 FAX:+886-3-563-2888
line 1 : MX98715A is MXIC parts No.
"E" : PQFP "C" : commercial grade
"-E" : bonding option line 2 : Assembly Date Code. line 3 : Wafer Lot No. line 4 : "37D" : revision code,
"E" : bonding option
"X" : no used line 5 : State
EUROPE OFFICE:
TEL:+32-2-456-8020 FAX:+32-2-456-8021
JAPAN OFFICE:
TEL:+81-44-246-9100 FAX:+81-44-246-9105
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TEL:+65-348-8385 FAX:+65-348-8096
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TEL:+1-408-453-8088 FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900 FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
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