The MSM7577 is an LSI for Audio Signal Level adjustment for telephone set, etc.
Conventionally, its circuit has been made within individual unit, such as amplifiers, resistors and
switches. However, using this LSI allows for simple mounting and economically small space.
FEATURES
Receiving system
••
• Built-in electrical volume
••
Digital control (3 bit / 8 step)
••
• For transmission voice, with side tone route available.
••
••
• Mute function available.
••
Transmitting system
••
• Built-in operational amplifier for transmission signal level adjustment.
••
••
• Mute function available.
••
••
• Single +2.7 V to +5.25 V power supply
••
••
• Power down function
••
••
• Package:
••
16-pin plastic SOP(SOP16-P-300-1.27-K) (Product name : MSM7577MS-K)
APPLICATION
Cellular handset, cordless telephone, etc.
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Page 2
BLOCK DIAGRAM
MSM7577¡ Semiconductor
RAUD
ATT0
ATT1
ATT2
ATTE
AO3
AN3
MIC
200 kW
SG
ATT
56 kW
–
+
io
ATT0
ATT1
ATT2
ATTE
10 kW
–
+
SG
150 kW
RCV1
AN2
–
+
RCV2
SG
–
SG
+
200 kW
35 kW
SG
SG
35 kW
–
+
TAUD
V
DD
GND
PD
PIN CONFIGURATION (TOP VIEW)
TAUD 1
AN2 2
PD 3
RCV2 4
RCV1 5
NC 6
RAUD 7
GND 8
NC : No connect pin
16-Pin Plastic SOP
DD
16 V
15 AO3
14 MIC
13 AN3
12 ATTE
11 ATT2
10 ATT1
9 ATT0
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Page 3
PIN DESCRIPTION
Pin No.NameI/ODescription
1
2
3
4
5
6
7
8
TAUDOOutput pin of transmitting voice.
AN2I
PD1
RCV2O
RCV1O
NC—No Connection.
RAUDIReceive voice input.
GND—Ground (0 V).
Receive voice input.
Gain control should be connected by a resistor between AN2 pin RCV2 pin.
Power down control.
H : Power down
L : Power on
Output pin of receiving voice.
Gain control should be connected by a resistor between AN2 and RCV2 pin.
RCV2 signal is opposite phase to RCV1 signal.
Receive voice input.
RCV1 signal is opposite phase to RCV2 signal.
Volume control.
MSM7577¡ Semiconductor
9
10
11
12ATTEI
13
14
15
16V
ATT0
ATT1
ATT2
AN3I
MICIInput pin of Microphone signal.
AO3O
DD
ATT2ATT1ATT0Loss level (dB)
0000 ±0.3
001–2 ±0.3
010–4 ±0.3
I
Mute signal input.
H : Mute mode
L : Operating mode
Gain control and frequency responce control.
Gain control should be controlled by a resistor between AN3 and AO3.
Gain control and frequency responce control.
Gain control should be controlled by a resistor between AN3 and AO3.
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
Cu alloy
Solder plating
5 mm or more
0.21 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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