The MSM6794 is a dot matrix graphic liquid crystal display LSI device to display bit maps.
It drives an LCD panel for dot matrix graphic display under the control of a 4- or 8-bit
microcomputer.
All necessary functions for driving a bit map type LCD are built in on one chip. Therefore,by
using the MSM6794, a bit map type dot matrix graphic liquid crystal display system can be
implemented with a small number of chips.
Since 1-bit data of the display RAM corresponds to the light-on/off of 1-dot of the LCD panel (bit
map system), a flexible display, including kanji display, is possible. One chip comprises a graphic
display system of a maximum of 128¥48 dots. This display can be expanded by using multiple
chips.
The MSM6794 uses CMOS process. Since it is an internal RAM type, the MSM 6794 features low
power consumption, and is suited to display for battery-driven portable equipment.
FEATURES
• Segment outputs: Maximum of 128
• Common outputs: Maximum of 48
• Display duty: 1/33, 1/41, 1/44, 1/48
• Bit map type internal RAM: 6,144 bits (128¥48 bits)
• Display data I/F: 8-bit parallel/serial switchable
• Standby function by program
• LCD drive bias resistor (externally connected)
• Built-in voltage multiplier circuit
• LOGIC voltage: 2.7 to 5.5V
• LCD driving voltage: VBI 5 to 12V (positive voltage)
• Low current consumption: Maximum of 10mA (in standby mode)
• Number of pads: 224
1/34
Page 2
¡ SemiconductorMSM6794
BLOCK DIAGRAM
COM48
SEG1
SEG128COM1
LCD drive power supply
V1, V3, V4, V6
V
VC1
VC2
VS1
VS2
DT
to V
V
DD1
DD4
V
to V
SS1
SS3
IN
DF
LCDCK
FLM
M/S
RESET
CO
OSC1
OSC2
OSC3
TEST1
TEST2
multiplier
SI
Voltage
circuit
Segment driver
Level shifter
Data latch
22
RAM
128 × 48 bit
display memory
X decoder
5
X address
counter
8
Timing
generator
MPX
Clock
frequency
divider
circuit
BUSY
driver
Common
6
6
MPX
Y decoder
Memory
/output
2
8
input
buffer
6
8-, 6-bit conversion circuit
X address
5
register
Y address
6
register
Control
register
7
7
Address
register
MPXMPX
8-bit Serial register
LCD drive power supply
V1, V2, V5, V6
Common
counter
Decoder
Y address
counter
8
8
SO
P/S
I/O control
SHT CS WR RD RS
Input/output buffer
DB7 to DB0
2/34
Page 3
¡ SemiconductorMSM6794
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolConditionRatingUnitApplicable Pins
Supply voltage
Bias voltage
Voltage multiplication
reference voltage
Input voltage
Power dissipation
Storage temperature
*2
*3
–0.3 to +7
–0.3 to +14
–0.3 to +7
–0.3 to +4.6
–0.3 to V
*1
–55 to +150
DD
+0.3
V
DD
V
BI
V
IN
V
I
P
D
T
STG
Ta=25˚C,
V
DD1-4–VSS1-3
Ta=25˚C,V1–V6
V
IN–VSS1-3
VIN–V
SS1-3
Ta=25˚C
—
—
V
V
V
V
mW
˚C
V
DD1-4
V1, V6
V
IN, VSS1-3
All Inputs
—
—
, V
SS1-3
Ta : ambient temperature
*1 Power dissipation depends on the heat radiation in a device attach condition. Set junction
temperature to 150˚C or lower.
*2 Ta = 25˚C; when doubler is used.
*3 Ta = 25˚C; when tripler is used.
RECOMMENDED OPERATING CONDITIONS
ParameterSymbolConditionRangeUnitApplicable Pins
Supply voltage
Bias voltage
Voltage multiplicatipon
reference voltage
Operating frequency
Operating temperature
1
2.7 to 5.5
5 to 12
1 to V
DD
1 to 4
270 to 500
–25 to +85
V
V
V
kHz
˚C
V
DD
V
BI
V
IN
f
op
T
op
V
DD1-4–VSS1-3
V1–V6
VIN–V
SS1-3
See Note 1 on p.6
2
—
V
DD1-4, VSS1-3
V1, V6
V
, V
IN
SS1-3
OSC1
—
1 For bias potential, V1 has the highest potential and V6 has the lowest potential. Use V6 at the
same potential as V
SS1
to V
SS3
.
2 RC oscillation and external input clock frequency (when frequency dividing ratio is 1).
For divided frequency operation, clock frequency after dividing must be within this range.
"H" input voltage 1
"H" input voltage 2
"H" input voltage 3
"L" input voltage 1
"L" input voltage 2
"L" input voltage 3
DD
DD
DD
—
—
—
—
—
—
V
V
DD
V
0.2V
0.2V
0.2V
DD
DD
V
IH1
V
IH2
V
IH3
V
IL1
V
IL2
V
IL3
—
—
—
—
—
—
0.8V
0.8V
0.8V
0
0
0
DD
DD
DD
V
V
V
V
V
Unit.
DB0-7, LCDCK, FLM, DF
Other input pins
DB0-7, LCDCK, FLM, DF
Other input pins
Input pins excluding
"H" input current 1
I
IH1
V
I=VDD
—
—
5
µA
DB0-7
FLM and DF
"H" input current 2
I
IH2
VI=V
DD
–5
—
5
DB0-7, LCDCK, FLM, DF
µA
Input pins excluding
"L" input current I
I
IL1
VI=0V
–5
—
—
µA
DB0-7
FLM and DF
"L" input current 2
OFF leakage
current
"H" output voltage 1
"H" output voltage 2
"L" output voltage 1
"L" output voltage 2
Multiplied voltage 1
Doubler output
Multiplied voltage 2
Tripler output
COM output
resistance
SEG output
resistance
I
IL2
I
off
V
OH1
V
OH2
V
OL1
V
OL2
V
DB
V
TR
R
C
R
S
V
V
I=VDD
I
=–1.0mA
O
=–1.0mA
I
O
=1.0mA
I
O
=1.0mA
I
O
=–500µA
I
O
=350kHz
f
osc
=–500µA
I
O
=350kHz
f
osc
I
=±50µA
O
=±20µA
I
O
=0V
I
or 0V
–5
–5
0.9V
0.9V
—
—
V
IN
–0.5
V
IN
–1.0
—
—
×2
×3
DD
DD
—
—
—
—
—
—
—
—
—
—
—
—
0.1V
0.1V
—
—
10
20
5
5
DD
DD
DB0-7, LCDCK, FLM, DF
µA
µA
CO, LCDCK, FLM, DF, SO
V
V
V
V
DB0 to DB7
CO, LCDCK, FLM, DF, SO
DB0 to DB7
V
V
kΩ
kΩ
COM1 to COM48
SEG1 to SEG128
During display
Supply Current 1
I
DD1
External clock
= 350kHz
f
osc
—
—
450
µA
During display
Supply Current 2
I
DD2
Internal
oscillation
= 350kHz
f
osc
—
360
700
µA
OSC1
OSC1
, LCDCK,
, LCDCK,
SO
VS2
VS2
V
DD
V
DD
Supply Current 3
Oscillation
frequency
I
f
DDS
OSC
During standby
R
=18kΩ
f
=56pF
C
f
See Note 3 on p.6
—
292
—
350
10
437
µA
kHz
V
DD
OSC1, OSC2, OSC3
4/34
Page 5
¡ SemiconductorMSM6794
DC Characteristics (2)
=4.5 to 5.5V, VBI=5 to 12V, Ta=–25 to +85˚C)
(V
DD
ParameterSymbol ConditionMin. Typ. Max. Unit Applicable Pin
"H" input voltage 1
"H" input voltage 2
"H" input voltage 3
"L" input voltage 1
"L" input voltage 2
"L" input voltage 3
"H" input current 1
"H" input current 2
"L" input current I
"L" input current 2
OFF leakage
current
"H" output voltage 1
"H" output voltage 2
"L" output voltage 1
"L" output voltage 2
Multiplied voltage 1
Doubler output
Multiplied voltage 2
Tripler output
V
IH1
V
IH2
V
IH3
V
IL1
V
IL2
V
IL3
I
IH1
I
IH2
I
IL1
I
IL2
I
off
V
OH1
V
OH2
V
OL1
V
OL2
V
DB
V
TR
—0.8V
—0.8V
—0.8V
—0—0.2V
—0—0.2V
—0—0.2V
—VDDVOSC1
DD
—VDDV
DD
—VDDVOther input pins
DD
DD
DD
DD
DB0-7, LCDCK, FLM, DF
VOSC1
V
DB0-7, LCDCK, FLM, DF
VOther input pins
Input pins excluding
VI=V
DD
—— 5µA
DB0-7
FLM and DF
VI=V
DD
–5—5µA
DB0-7, LCDCK, FLM, DF
Input pins excluding
V
=0V–5——µA
I
DB0-7
FLM and DF
V
=0V–5—5µA
I
VI=V
/0V–5—5µASO
DD
IO=–1.5mA0.9V
IO=–1.5mA0.9V
IO=1.5mA——0.1V
IO=1.5mA——0.1V
I
=–500µA
O
f
=350kHz
osc
I
=–500µA
O
f
=350kHz
osc
V
–0.5
V
–1.0
IN
IN
——VCO, LCDCK, FLM, DF, SO
DD
——VDB0 to DB7
DD
DD
DD
×2
——VVS2
×3
——VVS2
DB0-7, LCDCK, FLM, DF
VCO, LCDCK, FLM, DF, SO
VDB0 to DB7
, LCDCK,
, LCDCK,
COM output
resistance
SEG output
resistance
Supply Current 1
Supply Current 2
Supply Current 3
Oscillation
frequency
I
I
I
f
R
C
R
S
DD1
DD2
DDS
OSC
See Note 3 on p.6
I
=±50µA——10kΩCOM1 to COM48
O
I
=±20µA——20kΩSEG1 to SEG128
O
During display
External clock
f
= 350kHz
osc
——450µAV
During display
Internal
oscillation
f
=350kHz
osc
During standby
R
=22kΩ
f
C
=56pF
f
—360700µAV
——10µAV
292350437kHzOSC1, OSC2, OSC3
DD
DD
DD
5/34
Page 6
¡ SemiconductorMSM6794
g
g
Notes: 1. Voltage multiplication reference voltage is = VDD maximum when the multiplied
voltage is 12V or less.
The voltage multiplication reference voltage is 4V maximum when the multiplied
voltage is 12V or more (tripler output).
Condition: f
= 350kHz
osc
Voltage multiplier circuit configuration: connect as in the following diagram.
<Usin
V
IN
VC1
VC2
VS1
VS2
tripler>
Voltage multiplication
reference voltage
Doubler output
4.7µF
4.7µF
+
+
<Usin
Voltage multiplication
reference voltage
Tripler output
4.7µF
4.7µF
4.7µF
+
+
+
2. If the multiplied voltage output and bias power supply are directly connected, the
voltage multiplier circuit operation may malfunction due to bias power supply noise.
A countermeasure for noise is necessary, such as inserting a series resistor to prevent
noise from entering multiplied voltage output (VS1, VS2).
+
4.7µF
VS1
V
IN
VC1
VC2
VS1
VS2
doubler>
100Ω
Tripler output
+
VS2
4.7µF
3. RC oscillation circuit configuration: connect as in the following diagram.
R
= 18kΩ ± 2 % (V
OSC1
C
f
R
f
OSC2
f
= 22kΩ ± 2 % (V
R
f
C
= 56pF ± 5 %
f
OSC3
= 2.7 to 4.5V)
DD
= 4.5 to 5.5V)
DD
6/34
Page 7
¡ SemiconductorMSM6794
AC Characteristics
Parallel interface (1)
ParameterSymbol ConditionMinMaxUnit
RD "H" level width
RD "L" level width
WR "H" level width
WR "L" level width
WR-RD "H" level width
CS, RS setup time
CS, RS hold time
Write data setup time
Write data hold time
Read data output delay time
Read data hold time
External clock "H" level width
External clock "L" level width
RESET pulse width
External clock rise time, fall time
Parallel interface (2)
ParameterSymbol ConditionMinMaxUnit
RD "H" level width
RD "L" level width
WR "H" level width
WR "L" level width
WR-RD "H" level width
CS, RS setup time
CS, RS hold time
Write data setup time
Write data hold time
Read data output delay time
Read data hold time
External clock "H" level width
External clock "L" level width
RESET pulse width
External clock rise time, fall timetr, t
SO ON delay time
SO output delay time
SO OFF delay time
BUSY delay time
WR setup time
WR "L" pulse width
RESET pulse width
f
t
SAS
t
SAH
t
IS
t
IH
t
WSHH
t
WSHL
t
SYS
t
ON
t
DS
t
OFF
t
BUSY
t
SHS
t
WWL
t
WRE
——100ns
=4.5 to 5.5V, VBI=5 to 12V, Ta=–25 to +85˚C)
(V
DD
—50—ns
—10—ns
—50—ns
—10—ns
—80—ns
—80—ns
—200—ns
CL=50pF—100ns
CL=50pF0100ns
——20ns
CL=50pF—100ns
—50—ns
—80—ns
—2.0—µs
External clock rise time, fall timetr, t
f
——20ns
9/34
Page 10
¡ SemiconductorMSM6794
Serial Interface Timing Diagram
—
V
CS
RS
SI
SHT
WR
IH
—
V
IL
—
V
IH
—
V
IL
—
V
IH
—
V
IL
t
SAS
—
V
IH
—
V
IL
—
V
IH
—
V
IL
50%
t
ON
t
WSHL
t
t
IS
IH
t
WSHH
t
SYS
t
DS
t
SAH
t
SHS
t
WWLtBUSYtOFF
SO
RESET
OSC1
—
V
V
V
V
V
“Z”
OH
—
OL
t
WRE
—
IL
t
r
—
IH
—
IL
t
f
= 0.8VDD, VIL = 0.2V
V
IH
VOH = 0.9VDD, VOL = 0.1V
DD
DD
“Z”
10/34
Page 11
¡ SemiconductorMSM6794
Serial Interface Input/Output Timing
Input timing
CS
RS
SHT
SI
WR
Output timing
RS
SO
CS
SHT
WR
D7D6D5D4
BUSYBUSY
D7D6D5D4
D3
D2D1D0
D3
D2D1D0
For SO output, 8 bits after input of the WR pulse are valid.
11/34
Page 12
¡ SemiconductorMSM6794
FUNCTIONAL DESCRIPTION
Pin Functional Description
•CS (Chip Select)
Chip select input pin. "L" is for Select, "H" is for Unselect. Internal registers can be accessed
only when this pin is at "L".
When this pin is "H", the SO pin becomes high impedance.
•WR (Write Enable)
This is a write signal input pin when a parallel interface is used. Data is written to a register
at the rising edge of a signal pulse.
This becomes a latch signal input pin when a serial interface is used.
This pin is normally "H".
•RD (Read Enable)
This is a read signal input pin when a parallel interface is used. Data can be read while the pulse
is "L". This pin is normally "H".
Set this pin to "H" or "L" when a serial interface is used.
•RS (Register Select)
Input pin to select register. Setting this pin to "L" selects the address register. Setting to "H"
selects a register set by the address register.
If this pin is changed from "H" to "L" while a serial interface is used, the SERW bit (D4 bit) of
the address register is automatically reset to "0".
•DB0 to DB7 (Data Buses 0 to 7)
Data input/output pins for parallel interface. These pins are normally in high impedance
status. When RD = "L", each register data is output.
Leave this pin open when a serial interface is used.
•SI (Serial Data Input)
Data input pin for serial interface. Each register data and display data are read at the rising edge
of SHT, and written to the register at the falling edge of WR. 8-bit data just before the rise of
WR is valid data.
Set this pin to "H" or "L" when a parallel interface is used.
•SO (Serial Data Output)
Data output pin for serial interface. Each register data is output synchronizing with the rise of
SHT. For busy/non-busy data, busy ("H") is output after the rise of WR, and automatically
becomes non-busy ("L") after a specified time.
This pin is always in high impedance status when a parallel interface is used.
•SHT (Shift Clock)
Clock input pin for serial interface data input/output. Data is input synchronizing with the
rise of the clock, and data is output synchronizing with the fall of the clock.
This pin is normally in "H".
Set this pin to "H" or "L" when a parallel interface is used.
•P/S (Parallel/Serial Select)
Input pin for selecting parallel interface or serial interface. Setting this pin to "L" selects parallel
interface. Setting to "H" selects serial interface. Do not change the setting value after power
is turned on.
12/34
Page 13
¡ SemiconductorMSM6794
•LCDCK (LCD Clock)
Input/output pin for display data latch clock. This pin is an output pin if master is specified
and is an input pin if slave is specified. To use two or more MSM6794 devices, connect LCDCK
of the master with LCDCK of the slave.
•FLM (First Line Marker)
Input/output pin for the first line marker. This pin is an output pin if master is specified, and
is an input pin if slave is specified. To use two or more MSM6794 devices, connect FLM of the
master with FLM of the slave.
•DF (Display Frequency)
Input/output pin for LCD alternating frame signals. This pin is an output pin if master is
specified, and an input pin if slave is specified. To use two or more MSM6794 devices, connect
DF of the master with DF of the slave.
•OSC1 (Oscillation 1)
Input pin for RC oscillation. Connecting the specified capacitor and resistor to this pin and the
OSC2 and OSC3 pins creates an RC oscillation circuit. To generate an original oscillation clock
externally, input the original oscillation clock to this pin.
•OSC2, OSC3 (Oscillation 2, Oscillation 3)
Output pins for RC oscillation. Connecting the specified capacitor and resistor to these pins
and the OSC1 pin creates an RC oscillation circuit. To generate an original oscillation clock
externally, leave these pins open.
OSC1
OSC2
OSC3
For RC oscillation circuitFor external clock input
Oscillation circuit diagram
OSC1
OSC2
OSC3
External clock
Open
Open
M/S (Master/Slave)
Input pin for switching between master and slave. Setting this pin to "L" sets this IC to the IC
at the master side. Setting this pin to "H" sets this IC to the IC at the slave side. Do not change
the setting value after power is turned on.
CO (Clock Output)
Output pin for original oscillation clock. The clock in the same phase as OSC1 is output. To
use two or more MSM6794 devices, connect CO of the master with OSC1 of the slave.
13/34
Page 14
¡ SemiconductorMSM6794
RESET (Reset)
Pin for reset signal input. Setting this pin to "L" sets initial status. For the status of each register
and display after reset input, see "Status of Pins and Registers after Reset Input".
TEST1, TEST2 (Test Signal 1, Test Signal 2)
Test signal input pins. These pins are used by Oki to test. Set these pins to "L" permanently.
SEG1 to SEG128 (Segment 1 to Segment 128)
Segment signal output pins for driving LCD. Leave unused segment pins open.
COM1 to COM48 (Common 1 to Common 48)
Common signal output pins for driving LCD. Use COM1 to COM33 and leave COM34 to
COM48 open for 1/33 duty. Use COM1 to COM41 and leave COM42 to COM48 open for 1/
41 duty. Use COM1 to COM44 and leave COM45 to COM48 open for 1/44 duty.
V
to V
DD1
DD4
Pins to connect the logic power supply. Connect these pins to positive pins of the power
supply.
V
to V
SS1
SS3
Pins to connect GND power supply.
V1,V3, V4, V6
LCD power supply pins for the segment driver. Connect V6 to GND.
V1, V2, V5, V6
LCD power supply pins for the common driver. Connect V6 to GND.
DT (Doubler/Tripler Select)
Input pin to select voltage multiplier circuit. Setting this pin to "L" selects tripler, and setting
this pin to "H" selects doubler. Do not change the selection after power is turned on.
VS1
Doubler voltage output pin. Voltage twice as high as voltage that is input from VIN is output
from this pin. Connect a 4.7mF capacitor between this pin and the V
SS1
to V
pins to stabilize
SS3
power supply. When doubler is used, connect this pin with VS2.
Set this pin to GND level if the voltage multiplier circuit is not used.
VS2
Multiplied voltage output pin. Multiplied voltage set by the DT pin is output from this pin. If
tripler is used, connect a 4.7mF capacitor between this pin and the V
SS1
to V
pins to stabilize
SS3
power supply. If doubler is used, connect this pin with VS1.
Set this pin to GND level if the voltage multiplier circuit is not used.
VC1, VC2
Capacitor connection pins for voltage multiplication. Connect a 4.7mF capacitor between the VC1
and VC2 pins. When an electrolytic capacitor is used, connect the VC2 pin to the positive side.
Set these pins to GND level if the voltage multiplier circuit is not used.
V
IN
Voltage multiplication reference voltage input pin. Voltage two or three times higher than
voltage that is input to this pin is output from the VS2 pin.
Set this pin to GND level if the voltage multiplier circuit is not used.
0: ready
This bit indicates that this IC is in internal processing. Reading/Writing display memory sets
this bit to "1". This bit becomes busy for a period of a maximum of 8 clocks by reading/writing
display memory. Registers other than this register cannot be read or written while this bit is
"1".
Setting the RESET pin to "L" also sets this bit to "1". This bit becomes "1" while the RESET pin
is "L", and becomes "0" when the RESET pin becomes "H". In the case of a serial interface, the
SO pin becomes high impedance if the RESET pin becomes "L". Therefore this bit cannot be
read during a reset period.
This bit is read only. Writing to this bit is invalid.
(2) D6 STBY (Standby)
1: standby
0: normal
This bit sets this IC to standby mode. This IC enters standby mode by writing "1" to this bit,
and returns from standby mode to normal mode by writing "0" to this bit.
This bit is set to normal status by setting the RESET pin to "L".
Setting this bit to standby mode in a busy state may cause a malfunction.
For details of standby mode, see "Pin status during Standby Operation and Register Status
after Cancellation".
(3) D5 DISP (Display on/off)
1: display on
0: display off
This bit sets ON/OFF of the liquid crystal display connected to this IC. Writing "1" to this bit
turns the liquid crystal display ON, and writing "0" turns it OFF. This bit is used to prevent
a random display until the initialization of the display memory after power-on.
This bit is set to display off status by setting the RESET pin to "L".
(4) D4 SERW (Serial Data Read/Write)
1: writing registers other than address register is invalid
0: writing all registers is valid
This bit limits writing to registers when a serial interface is used. Writing "1" to this bit disables
writing to registers other than the address register, and writing "0" enables writing to all
registers.
This bit is a command to make registers read-only when a serial interface is used. When serial
data is read from the SO pin, this pin disables writing to registers other than the address
register, even if data is input to the SI pin.
This bit is valid only when a serial interface is used. When a parallel interface is used, writing
to this bit is invalid, and "0" is always read from this bit.
This bit is set to write enable of all registers by setting the RESET pin to "L". This bit is
automatically reset to "0" each time the RS pin is set from "H" to "L".
0: output enable
This bit sets the status of the SO pin when a serial interface is used. Writing "1" to this bit sets
the SO pin to a high impedance state, and writing "0" to this bit sets the SO pin to an output
enable state.
This bit is valid only when a serial interface is used. When a parallel interface is used, writing
to this bit is invalid, and "0" is always read from this bit.
This bit is set to a high impedance state by setting the RESET pin to "L".
(6) D2 (Invalid Bit)
Writing to this bit is invalid, and "0" is always read from this bit.
(7) D1, D0 (Register Number)
These bits select a register other than the address register. The relationship between each bit
and each register is shown in the table below.
CodeD1D0Register Name
000Display data register
101X address register
210Y address register
311Control register
These bits are reset to (D1, D0) = (0, 0) (display data register select status) by setting the RESET
pin to "L".
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¡ Semiconductor
MSM6794
Display data register (DRAM)
D7D6D5D4D3D2D1D0
8-bit DATA
—6-bit DATA
This register is used to write or read display data to and from the liquid crystal display RAM. The
contents of this register are written or read to and from the address set by the X address register
and Y address register.
The bit length of display data is selected by the WLS bit (D6 bit) of the control register. If 6-bit
data is selected, writing to the D7 and D6 bit is invalid, and "0" is always read from these bits.
D7 (D5 for 6-bit DATA) is MSB, and D0 is LSB.
The content of this register does not change, even if the RESET pin is set to "L".
X address register (XAR)
D7D6D5D4D3D2D1D0
—XAD
This register is used to set the X address of the liquid crystal display RAM.
If 8-bit data is selected by the WLS bit (D6 bit) of the control register, the addresses are 0 to15 (00H
to 0FH). If 6-bit data is selected, the addresses are 0 to 21 (00H to 15H). If other addresses are set,
operation is unpredictable.
Writing to the D7 to D5 bits is invalid, and "0" is always read from these bits.
This register is reset to "0" by setting the RESET pin to "L".
Y address register (YAR)
D7D6D5D4D3D2D1D0
—YAD
This register is used to set the Y address of the liquid crystal display RAM.
If 1/48 duty is selected by DUTY bits (D1, D0 bits) of the control register, the address set value
is 0 to 47 (00H to 2FH). If 1/44 duty is selected, the address set value is 0 to 43 (00H to 2BH). If
1/41 duty is selected, the address set value is 0 to 40 (00H to 28H), and if 1/33 duty is selected,
the address set value is 0 to 32 (00H to 20H). If other values are set, operation is unpredictable.
Writing to D7 and D6 bits is invalid, and "0" is always read from these bits.
This register is reset to "0" by setting the RESET pin to "L".
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¡ Semiconductor
MSM6794
Control register (FCR)
D7D6D5D4D3D2D1D0
INCWLS—FFSDUTY
(1) D7 INC (Address Increment Direction)
1: X direction
0: Y direction
This bit sets the address increment direction of the display RAM. The address of the display
RAM is automatically incremented by 1 by writing data to the display data register. Writing
"1" to this bit sets the X address increment, and writing "0" to this bit sets the Y address
increment.
For details of address increment, see "X, Y Address Counter Auto Increment".
The value of this register does not change, even if the RESET pin is set to "L".
(2) D6 WLS (Word Length Select)
1: 6 bits
0: 8 bits
This bit selects the read/write word length to the display RAM. Writing "1" to this bit sets
read/write data to the display RAM in 6 bit units, and writing "0" to this bit sets read/write
data to the display RAM in 8 bit units. Select the word length according to the character font
to be used.
The value of this register does not change, even if the RESET pin is set to "L".
(3) D5 (Invalid Bit)
Writing to this bit is invalid. "0" is always read from this bit.
(4) D4 to D2 FFS (Frame Frequency Select)
This bit selects the internal clock frequency dividing ratio to the original oscillation frequency.
Correspondence between each bit and each frequency dividing ratio is shown in the table
below.
CodeD4D3D2Frequency Dividing Ratio
00001
10011/2
20101/3
30111/4
41001/6
51011/8
6110TEST
7111TEST
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¡ Semiconductor
MSM6794
When the original oscillation frequency is 350kHz and the frequency dividing ratio is 1, the
frame frequency is about 80Hz. When the display data register is written/read, the busy time
is a maximum of 8 original oscillation clocks. If the original oscillation frequency is increased
to shorten the busy time, the frame frequency increases in proportion to the original
oscillation frequency. In this case the frequency dividing ratio must be changed so that the
frame frequency falls in the range of 60 to 100Hz. For details on the relation between original
oscillation frequency and frame frequency, see "Original Oscillation Frequency and Frame
Frequency".
(D4, D3, D2) = (1, 1, 0) and (1, 1, 1) are combinations which Oki uses for testing.
If these combinations are used by the user, the operation of this IC is unpredictable.
The value of this register does not change even if the RESET pin is set to "L".
Once frame frequency is set after power is turned on, the value cannot be changed. To change
the frame frequency, set it again according to the power-on flowchart. See "Power-on
Flowchart".
(5) D1, D0 DUTY (Display Duty Select)
These bits select the display duty. Correspondence between each bit and display duty is
shown in the table below.
CodeD1D0DUTY
0001/48
1011/44
2101/41
3111/33
The value of this register does not change, even if the RESET pin is set to "L".
Once display duty is set after power is turned on, the value cannot be changed. To change
display duty, set it again according to the power-on flowchart. See "Power-on Flowchart".
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¡ Semiconductor
Status of Pins and Registers After Reset Input
The following tables show pin and register status after reset input.
PinStatus
OSC2, 3Clock output or oscillation status
COClock output
SOHigh impedance
DF"H" (master), high impedance (slave)
FLM"L" (master), high impedance (slave)
LCDCK"L" (master), high impedance (slave)
RegisterStatus
Address registerHZ = "1", other bits are reset to "0".
Display data registerDisplay data is held
X address registerReset to "0"
Y address registerReset to "0".
Control registerNo change from status before inputting reset
MSM6794
Pin Status during Standby Operation and Register Status after Cancellation
The following tables show pin status during standby operation and register status after
cancellation.
PinStatus
OSC2"L"
OSC3"H"
CO"L"
SOHigh impedance
DF"H" (master), high impedance (slave)
FLM"L" (master), high impedance (slave)
LCDCK"L" (master), high impedance (slave)
RegisterStatus
Address registerSTBY = "0", other bits maintain data before standby
Display data registerMaintains data before standby
X address registerReset to "0"
Y address registerReset to "0"
Control registerMaintains data before standby
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¡ Semiconductor
MSM6794
X , Y Address Counter Auto Increment
RAM for the liquid crystal display of the MSM6794 has an X address counter and Y address
counter, and both have an auto increment function.
Writing/reading display data increments either X or Y address counter. The INC bit (D7 bit) of
the control register selects X or Y address to be incremented.
(When X address is selected:)
Address count cycle of X address counter changes depending on word length: 8- or 6-bit.
If the word length is 8-bit, X address is counted in a 0 to 15 range.
If the word length is 6-bit, X address is counted in a 0 to 21 range.
When the maximum value of an X address count value (15 for an 8-bit word length, and 21 for
a 6-bit word length) returns to "0", the Y address count value is also automatically incremented.
(When Y address is selected:)
The address count of Y address counter changes depending on the display duty: 1/33, 1/41,
1/44 or 1/48.
If the display duty is 1/33, Y address is counted in a 0 to 32 range.
If the display duty is 1/41, Y address is counted in a 0 to 40 range.
If the display duty is 1/44, Y address is counted in a 0 to 43 range.
If the display duty is 1/48, Y address is counted in a 0 to 47 range.
When the maximum value of a Y address count value (32 for display duty 1/33, 40 for display
duty 1/41, 43 for display duty 1/44, and 47 for display duty 1/48) returns to "0", the X address
count value is also automatically incremented.
(Note) If an address other than the count cycle is set at X or Y address counter, count operation
becomes abnormal.
1. Example of X address increment2. Example of Y address increment
(8-bit word length, 1/33 duty)(8-bit word length, 1/33 duty)
X address
012131415
0
1
Y address
32
0
01150
0
1
2
Y address
30
31
32
X address
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¡ Semiconductor
MSM6794
Display Screen and Memory Address
The MSM6794 includes a bit map type display RAM (48 ¥ 128 bit). Display data is written to
display memory with MSB as (Xn, Yn) address, and LSB as (Xn+7, Yn) address, as shown in
Figure 1.
Writing "1" to display memory turns the light on, and writing "0" turns the light off.
The address assignment of memory address changes depending on the selection of word length:
8 bits or 6 bits. The memory address is 0 to 15 for 8 bits per word, and 0 to 21 for 6 bits per word.
When X address is 21 with 6 bits per word, the display memory is 2 bits. 2 bits (D5, D4) from MSB
of data display are written to memory, with the remaining 4 bits (D3 to D0) becoming invalid.
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
COM1
COM2
128 × 48 dot LCD panel
COM48
SEG128
X0X1X2X3X4X5X6
10101001
Y0
Y1
MSBLSB
Y direction
Y47
Figure 1. Correspondence between display screen and memory
Address assignment for 8 bits/word
012315
0
1
(8 bits)
X direction
X7
RAM for 128 × 48 bit display
Address assignment for 6 bits/word
012321
0
1
(6 bits)(2 bits)
X127
47
47
Figure 2. Display memory address
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¡ Semiconductor
Power-on Flowchart (Serial Interface)
Power on
MSM6794
Reset input
Set CS = "L"
Set RS = "L", AR
Set RS = "H", FCR
Set RS = "L", AR
Set RS = "H". Input display data.
Wait for 8 OSC clocks
5µs, external or power-on reset
Chip enable
D7D6D5D4D3D2D1D0
*1000*11
(Standby setting, FCR select, SO output enable)
Select duty according to specification. Set FFS, WLS, INC.
D7D6D5D4D3D2D1D0
*0000*00
(Standby release, DRAM select)
Note: This wait is a wait during busy period. To detect
busy by SO, wait until the busy output is set from
"H" to "L".
NO
Initial screen data
input complete?
YES
Set RS = "L", AR
Normal operation
D7D6D5D4D3D2D1D0
*0100*XX
Arbitrary
(DISP ON)
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¡ Semiconductor
STBY Setting and Cancellation Flowchart
Normal operation
MSM6794
NO
Check for BUSY data
Non-busy?
YES
Set RS = "L", AR
Standby status
Set RS = "L", AR
Wait until oscillation stabilizes
Confirm non-busy.
D7D6D5D4D3D2D1D0
*1000*XX
Arbitrary
(Standby setting)
D7D6D5D4D3D2D1D0
*0000*XX
Arbitrary
(Standby release)
Wait until voltage multiplier circuit stabilizes
Set RS = "L", AR
Normal operation
D7D6D5D4D3D2D1D0
*0100*XX
Arbitrary
(DISP ON)
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¡ Semiconductor
MSM6794
Original Oscillation Frequency and Frame Frequency
Frame frequency can be calculated by the above formulas.
Example 1) For original oscillation 350 [kHz], frequency dividing ratio 1/1, and 1/33 duty
specification:
By formula 1, frame cycle Tf = 1 /(350¥103) ¥ 1 ¥ 4224 = 12.1 [ms]
Therefore, frame frequency = 82.9 [Hz]
Example 2) For original oscillation 1 [MHz], frequency dividing ratio 1/3, 1/41 duty specification:
By formula 2, frame cycle Tf = 1 /(1¥106) ¥ 3 ¥ 4264 = 12.8 [ms]
Therefore, frame frequency = 78.2 [Hz]
Original oscillation frequency and BUSY time
When RAM data is written or read, data processing time (BUSY time) occurs. BUSY time is a
maximum of [(original oscillation clock cycle) ¥ 8]. As the original oscillation frequency
increases, BUSY time becomes shorter (not influenced by the frequency dividing ratio).
By increasing the original oscillation frequency, BUSY time can be made shorter in proportion.
In this case frame frequency also increases. So, set the frequency dividing ratio so that frame
frequency reaches a frequency close to the frame frequency to be used.
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¡ Semiconductor
LCD Drive Power Supply
MSM6794
COM output example (COM1)
V1
V2
V3
V4
V5
V6
SEG output example
V1
V2
V3
V4
V5
V6
Light ON/light OFF
1 line
1 frame
COM DRV input power supply
SEG DRV input power supply
Light ON
Light OFF
: V1, V2, V5, V6
: V1, V3, V4, V6
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¡ Semiconductor
APPLICATION CIRCUITS
Application example (1)
(1/48 duty, serial interface, voltage multiplier circuit (tripler) used, single chip)
: 8 characters × 2 lines (16 × 16 dots)
Kanji
: 21 characters × 1 line (5 × 7 dots)
LCD panel
Alphabet
Cursor
: 4 lines
MSM6794
COM
48 lines
V
CC
and
Temperature
4.7µF
compensation
stabilization circuit
4.7µF
4.7µF
Bias generation circuit
V
VC1
VC2
VS1
VS2
V1
V2
V3
V4
V5
V6
V
DT
M/S
P/S
C1 to C48
IN
MSM6794
SS
CSWRRDRSSI
DB7 to DB0
OPEN
SEG 128 lines
S1 to S128
SO
SHT
V
OSC1
OSC2
OSC3
TEST1
TEST2
RESET
LCDCKDFFLM
OPEN
CO
DD
56pF
22kΩ
OPEN
100kΩ
1µF
PORT
28/34
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¡ Semiconductor
Application example (2)
(1/33 duty, parallel interface, voltage multiplier circuit unused, single chip)
Kanji
LCD panel
: 8 characters × 2 lines (16 × 16 dots)
Symbol
: 128 × 1 line
MSM6794
COM
OPEN
33 lines
C1 to C33
V
IN
V
CC
and
Temperature
compensation
stabilization circuit
Bias generation circuit
VC1
VC2
VS1
VS2
V1
V2
V3
V4
V5
V6
V
DT
M/S
P/S
SS
DB7 to DB0
8
15
C34 to C48
MSM6794
CSWRRDRSSI
SEG 128 lines
S1 to S128
SO
SHT
OPEN
V
OSC1
OSC2
OSC3
CO
TEST1
TEST2
RESET
LCDCKDFFLM
OPEN
DD
56pF
22kΩ
OPEN
100kΩ
1µF
PORT
29/34
Page 30
¡ Semiconductor
Application example (3)
(1/48 duty, serial interface, 2 chips used, cascade connection)
1µF
100kW
OPEN
MSM6794
: 16 characters ¥ 2 lines (16 ¥ 16 dots)
: 42 characters ¥ 1 line (5 ¥ 7 dots)
: 4 lines
Kanji
Alphabet
Cursor
LCD panel
(SEG) 256 ¥ (COM) 48
DD
V
S1 to S128
SEG 128 lines
OPEN
C1 to C48C1 to C48
IN
V
DD
V
S1 to S128
SEG 128 lines
COM
48 lines
IN
V
OCS1
VC1
OCS1
VC1
OCS2
VC2
22kW
56pF
OCS2
VC2
OCS3
VS1
OCS3
VS1
CO
VS2
CO
TEST1
TEST1
VS2
TEST2
MSM6794
(SLAVE)
V1
V2
V3
TEST2
MSM6794
(MASTER)
V1
V2
V3
V4V5V6
V4V5V6
RESET
SS
V
RESET
SS
V
DT
DT
FLM
DF
LCDCK
SHT
SO
SI
RS
RD
WR
CS
DB7 to DB0
M/S
P/S
FLM
DF
LCDCK
SHT
SO
SI
RS
RD
WR
CS
DB7 to DB0
M/S
P/S
OPEN
OPEN
4.7µF
stabilization circuit
and
compensation
Temperature
CC
V
4.7µF
4.7µF
circuit
Bias generation
PORT
30/34
Page 31
¡ Semiconductor
Interface Connection Example
For serial interface (only control signals are described)
MSM6794
PORT
SO (M)
SO (S)
SHT
CS (M)
CS (S)
WR
RS
(Master)
SO
SI
SI
SHT
CS
WR
RS
SO
SI
(Slave)
SHT
CS
WR
RS
Master and slave control operation
Connect as in the above diagram. The master side and slave side can be selected by setting CS
to "L" respectively.
Rise or fall the CS signal level after confirming NON-BUSY.
Example of continuous writing of RAM data (all master addresses Æ all slave addresses):