Datasheet MSM6596A-xxxJS, MSM6596A-xxxRS, MSM6596A-xxxGS-AK, MSM6596A-xxxGS-K Datasheet (OKI)

E2D0039-39-21

¡ Semiconductor MSM6596A-xxx

¡ Semiconductor

This version: Feb. 1999

Previous version: May. 1997

MSM6596A-xxx

2-Mbit Serial Voice ROM

GENERAL DESCRIPTION

The MSM6596A is the shorter-TAT processing version of the MSM6596.
The MSM6596A is a serial voice ROM with a 1,048,576-word ¥ 1-bit ¥ 2-bank configuration.
The MSM6596A has a built-in internal address-generating circuit. A single, external clock input
allows continuous, serial read operations. The internal addresses are automatically incremented
by 1 by read operation. 1024 words in X direction and 1024 words in Y direction can be addressed
by inputting external serial addresses. Banks are switched with CS1 and CS2.
A read and playback device with predetermined messages can easily be configured by storing the
voice data into the MSM6596A and combining it with one of OKI's recording and playback ICs and
serial register IC.

A serial register is required to drive the MSM6596A by the MSM6388 or MSM6588. (The MSM6596A
does not operate without a serial register.)

The major functional differences between the MSM6596A and MSM6596 are shown below.

MSM6596A DC Characteristics

Parameter Symbol Condition Min. Max. Unit

Current consumption (1) I

Current consumption (2) I

DD

DS

t

RDC

CS1 = CS2 =
V

– 0.2 V

DD

= 2.5 ms — 20 mA

Ta = –40
to +70°C

Ta = –40
to +85°C

Typical values are at V

= 2.7 to 5.5 V, Ta = –40 to +85°C

V

DD

Typ.

9

—

—

—

DD

10

50—

= 5.0 V, Ta = 25°C.

MSM6596 DC Characteristics

= 3.5 to 5.5 V, Ta = –40 to +85C°

V

DD

Parameter Symbol Condition Min. Max. Unit

Current consumption (1) I

Current consumption (2) I

DD

DS

t

= 2.5 ms — 15 mA

RDC

CS1 = CS2 = VDD–0.2 V — 10 mA—

Typical values are at V

Typ.

—

= 5.0 V, Ta = 25°C.

DD

For other details, refer to individual sections in this data sheet.

FEATURES

mA

• Configuration : 1,048,576 words ¥ 1 bit ¥ 2 banks

• Serial access : Read cycle time of 2.5 ms

• Shorter-TAT processing

• Power-supply voltage : 2.7 to 5.5 V

• Package options :
18-pin plastic QFJ (QFJ18-P-R290-1.27) (Product name : MSM6596A-xxxJS)
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name : MSM6596A-xxxGS-K)
18-pin plastic DIP (DIP18-P-300-2.54) (Product name : MSM6596A-xxxRS)
30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name : MSM6596A-xxxGS-AK)

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¡ Semiconductor MSM6596A-xxx

BLOCK DIAGRAM

SADX

Sin

Memory Cell

Matrix

262144 ¥ 8

V

DD

GND

SASX

X-ADDRESS

REGISTER

CK

10

X-ADDRESS

COUNTER

LD

CK

10

1

1

X-DECODERY-DECODER

SADY

SASY

TAS

RDCK

CS2

CS1

Sin

10

Y-ADDRESS

REGISTER

CK

CS CONTROL

Y-ADDRESS

COUNTER

LD

CK

TEST

MULTIPLEXER

6

3

MULTIPLEXER

TESTO1
TESTO2

DOUT

2/12

¡ Semiconductor MSM6596A-xxx

PIN CONFIGURATIONS (TOP VIEW)

SASY

SADY

GND

DOUT

24
23
22
21
20
19
18
17
16
15
14
13

GND
NC
DOUT
TESTO1
NC
NC
NC
NC
NC

RDCK

TESTO2
TEST

CS2
CS1

NC

SADX

SASX

2 1 18 17

3
4
5
6
7

8 9 10 11

DD

TAS

V

TEST

NC: No connection

16
15
14
13
12

TESTO2

TESTO1
NC
NC

RDCK

NC

SADY

SASY

CS2
CS1

NC
NC
NC
NC

SADX

SASX

TAS

V

DD

1
2
3
4
5
6
7
8

9
10
11
12

NC: No connection

SADY

SASY

CS2

CS1

NC

SADX

SASX

TAS

V

DD

18-Pin Plastic QFJ

1

2

3

4

5

6

7

8

9

NC: No connection

18-Pin Plastic DIP

18

17

16

15

14

13

12

11

10

GND

DOUT

TESTO1

NC

NC

RDCK

NC

TESTO2

TEST

SADY

SASY

CS2

NC

CS1

NC
NC
NC
NC
NC
NC

SADX

SASX

TAS

V

DD

24-Pin Plastic SOP

1
2
3
4
5
6
7
8

9
10
11
12
13
14
15

NC: No connection

30
29
28
27
26
25
24
23
22
21
20
19
18
17
16

GND
NC
DOUT
TESTO1
NC
NC
NC
NC
NC
NC
NC
NC

RDCK

TESTO2
TEST

30-Pin Plastic SSOP

3/12

¡ Semiconductor MSM6596A-xxx

PIN DESCRIPTIONS

18

Pin

Symbol

SSOP

DIPSOPQFJ

Type

Description

Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this

9

12

24

9

18

15

30

V

DD

GND

—

pin and the GND pin.

Ground pin

—

(SERIAL ADDRESS) This pin inputs the starting X address of a read operation.

6

9

6

12

SADX

Addressing in units of 1024 words is possible. The 1024-word address data

I

can be input as 10-bit (AX0 - AX9) serial data via the SADX pin.

(SERIAL ADDRESS) This pin inputs the starting Y address of a read operation.

1

1

1

1

SADY

Addressing in units of 1024 words is possible. The 1024-word address data

I

can be input as 10-bit (AY0 - AY9) serial data via the SADY pin.

(SERIAL ADDRESS STROBE) This is the clock input pin which is used to store

7

10

7

13

SASX

I

the serial address data of the X address into the device's internal register.

(SERIAL ADDRESS STROBE) This is the clock input pin which is used to store

2

2

2

2

ISASY

the serial address data of the Y address into the device's internal register.

(TRANSFER ADDRESS STROBE) This is the input pin for loading the serial

8

11

8

14

TAS

address data into the internal address counter.

I

The X and Y addresses are stored at the falling edge of TAS.

(READ CLOCK) This is the clock input pin for reading information out of the data

13

15

13

18

RDCK

register. Internal operation starts at the falling edge of RDCK. The information

I

in the data register is output on the DOUT pin. The internal address counter is
automatically incremented at the falling edge of RDCK.

(DATA OUT) The data output pin is always kept in a high-impedance state

17

22

17

28

DOUT

when RDCK or CS is kept "H". This pin reflects the "H" or "L" level data being

O

read, and the current data is hold until ROCK is asserted "H".

(CHIP SELECT) When CS1 is set to "L", bank 1 is selected. When CS2 is set to
"L", bank 2 is selected. Setting both CS1 and CS2 to "H" disables all input and

I

output pins. These pins enable parallel use of multiple serial voice ROMs by
connecting the data output pins.

Pin for testing. Apply a "L" level.

I

Pins for testing. Leave these pins open.

O

10

16

4

4

4

CS1

5

3333 CS2

13

21

10

16

16

27

17111411

TEST

TESTO1

TESTO2

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit

Power Supply Voltage V

Input Voltage V

Storage Temperature T

DD

IN

STG

Ta = 25°C –0.3 to +7.0 V

Ta = 25°C –0.3 to VDD+0.3 V

— –55 to +150 °C

4/12

¡ Semiconductor MSM6596A-xxx

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Condition Range Unit

Power Supply Voltage V

Operating Temperature T

DD

op

GND=0 V 2.7 to 5.5 V

— –40 to +85 °C

ELECTRICAL CHARACTERISTICS

DC Characteristics

= 2.7 to 5.5 V, Ta = –40 to +85°C

V

DD

Parameter Symbol Condition Min. Max. Unit

"H" Level Input Voltage V

"L" Level Input Voltage V

"H" Level Output Voltage V

"L" Level Output Voltage V

"H" Level Input Current I
"L" Level Input Current I

Current Consumption (1) I

Current Consumption (2) I

OH

OL

IH

IL

DD

DS

IH

IL

— 0.85xV

— — 0.15xV

I

= –40 mAV

OH

I

= 2 mA — 0.45 V

OL

V

= V

IH

DD

V

= GND –10 — mA

IL

t

= 2.5 ms — 20 mA

RDC

–0.3 — V

DD

—10mA

Ta = –40

CS1 = CS2 =
V

– 0.2 V

DD

to +70°C

Ta = –40
to +85°C

—

—

DD

Typ.

—

—

—

—

—
—

9

—

—V

V

DD

10

mA

50—

Typical values are at V

AC Characteristics

V

Parameter Symbol Min. Max. Unit

CS, SAS Setup Time t
SASX, SASY Cycle Time t
SASX, SASY Precharge Time t
SASX, SASY Pulse Width t

Address Setup Time t
Address Hold Time t

TAS Setup Time t
TAS, RDCK Setup Time t
TAS Pulse Width t

Read Cycle Time t

Access Time t

Output Turn-off Delay Time t

RDCK Precharge Time t
RDCK Pulse Width t

= 5.0 V, Ta = 25°C.

DD

= 2.7 to 5.5 V, Ta = –40 to +85°C

DD

CSS

SSC

SAP

SAS

AS

AH

ATS

TRS

TAS

RDC

ACC

OFF

RDP

RD

1000 — ns

500 — ns

250 — ns

250 — ns

100 — ns
100 — ns

500 — ns

500 — ns

250 — ns

2500 — ns

— 1500 ns

0 200 ns

1000 — ns

1500 — ns

5/12

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¡ Semiconductor MSM6596A-xxx

TIMING DIAGRAMS

Serial Address Input Timing

,







CS2 (I)

SADX (I)

SASX (I)

SADY (I)

t

AH

TAS (I)

SASY (I)

AX1 AX2 AX3 AX4 AX5 AX6 AX7 AX8 AX9

t

AS

t

SAS

t

CSS

t

SSC

t

SAP

t

ATS

t

ATS

t

TAS

t

AS

t

AH

t

SAS

t

SAP

t

SSC

t

CSS

AX0

AY0 AY1 AY2 AY3 AY4 AY5 AY6 AY7 AY8 AY9

,

,

,













,







,

,







CS1 (I)

7/12

¡ Semiconductor MSM6596A-xxx

Read Access Timing

,

,

t

TAS

t

TRS

t

RDC

tRDt

RDP

t

OFF

t

ACC

XnY

m

XnY

m+1

XnY

m+2

XnY

1023

X

n+1Y0

X

n+1Y1

TAS (I)

RDCK (I)

DOUT (O)

¡ Semiconductor MSM6596A-xxx

APPLICATION CIRCUIT

MSM6588 Playback Storage Example

MICROCONTROLLER

+

AV

DD

+

+

DVDD D V

DD'

D3
D2
D1
D0

RD
WR
CE

MCUM

TEST

RSEL1
RSEL2
TEST
TEST
TEST
TEST

RESET

MIN

MOUT

LIN

LOUT
AMON
FIN
FOUT
ADIN

SG

DGND AGND

A V

DD

SAD

SAS

TAS

RWCK

WE

DI/O

CS1

MSM6588

CS2
CS3
CS4

MON

XT

XT

AOUT

DGND

SAD

SAS
TAS
RWCK
WE

DIN
DOUT

AU/D

TEST
TEST
TEST
TEST

TEST

CS

4.096 MHz

V

DD

MSM6389

GND

Speaker amplifier

V

DD

MSM6389

1-Mbit SERIAL REGISTER

CS

GND

SADX

SASX
TAS
RDCK

DOUT

SASY

SADY

TEST

CS1

V

DD

MSM6596A-xxx

2-Mbit SERIAL VOICE ROM

CS2

GND

AGND

Note: When the MSM6596A is driven by the MSM6388 or MSM6588, a serial register is required.

(The MSM6596A does not operate without it.) The MSM6389 is being used as the serial
register in the above example.

8/12

¡ Semiconductor MSM6596A-xxx

PACKAGE DIMENSIONS

(Unit : mm)

QFJ18-P-R290-1.27

Spherical surface

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.50 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

9/12

¡ Semiconductor MSM6596A-xxx

(Unit : mm)

SOP24-P-430-1.27-K

Mirror finish

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.58 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

10/12

¡ Semiconductor MSM6596A-xxx

(Unit : mm)

DIP18-P-300-2.54

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

1.30 TYP.

11/12

¡ Semiconductor MSM6596A-xxx

(Unit : mm)

SSOP30-P-56-0.65-K

Mirror finish

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.19 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

12/12

E2Y0002-29-11

NOTICE

1. The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or

unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.

5. Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.

6. The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.

7. Certain products in this document may need government approval before they can be
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own expense for these.

8. No part of the contents cotained herein may be reprinted or reproduced without our prior
permission.

9. MS-DOS is a registered trademark of Microsoft Corporation.

Copyright 1999 Oki Electric Industry Co., Ltd.

Printed in Japan