Datasheet MSM6595A-xxxJS, MSM6595A-xxxRS, MSM6595A-xxxGS-K, MSM6595A-xxxGS-AK Datasheet (OKI)

E2D0038-39-21

¡ Semiconductor MSM6595A-xxx

¡ Semiconductor

This version: Feb. 1999

Previous version: May. 1997

MSM6595A-xxx

1-Mbit Serial Voice ROM

GENERAL DESCRIPTION

The MSM6595A is a MSM6595 short TAT process version.
The MSM6595A is a serial voice ROM with a 1,048,576-word ¥ 1-bit configuration.
The MSM6595A has a built-in internal address-generating circuit. A single, external clock input
allows continuous, serial read operations. The internal addresses are automatically incremented by
1 by read operation. 1024 words in X direction and 1024 words in Y direction can be addressed by
inputting external serial addresses. A read and playback device with predetermined messages can
easily be configured by storing voice data into the MSM6595A and by combining it with one of Oki's
recording and playback ICs and a serial register IC.

A serial register is required to drive the MSM6595A by the MSM6388 or MSM6588. (The MSM6595A
does not operate without a serial register.)

The major differences between the MSM6595A and MSM6595 are shown below.

MSM6595A DC Characteristics

= 2.7 to 5.5 V, Ta = –40 to +85°C

V

DD

Parameter Symbol Condition Min Max Unit

Current consumption (1) I

Current consumption (2) I

DD

DS

t

RDC

CS =
VDD–0.2 V

= 2.5 ms — 20 mA

Ta = –40
to +70°C

Ta = –40
to +85°C

Typical values are at V

—

—

Typ

9

—

= 5.0 V, Ta = 25°C.

DD

MSM6595 DC Characteristics

= 3.5 to 5.5 V, Ta = –40 to +85°C

V

DD

Parameter Symbol Condition Min Max Unit

Current consumption (1) I

Current consumption (2) I

DD

DS

t

= 2.5 ms — 15 mA

RDC

CS = VDD–0.2 V — 10 mA—

Typ

—

FEATURES

10

mA

50—

• Configuration : 1,048,576 words ¥ 1 bit

• Serial access : Read cycle time of 2.5 ms

• Shorter-TAT processing

• Power-supply voltage : 2.7 to 5.5 V

• Package options :
18-pin plastic QFJ (QFJ18-P-R290-1.27) (Product Name : MSM6595A-xxxJS)
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product Name : MSM6595A-xxxGS-K)
18-pin plastic DIP (DIP18-P-300-2.54) (Product name : MSM6595A-xxxRS)
30-pin plastic SSOP (SSOP30-P-56-0.65-K) (Product name : MSM6595A-xxxGS-AK)

xxx indicates the code number

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¡ Semiconductor MSM6595A-xxx

BLOCK DIAGRAM

SADX

Sin

Memory Cell

Matrix

131072 ¥ 8

MULTIPLEXER

MULTIPLEXER

V

DD

GND
TEST

TEST

TESTO1
TESTO2

DOUT

SASX

SADY

SASY

TAS

X-ADDRESS

CK

Sin

Y-ADDRESS

CK

10

REGISTER

10

REGISTER

X-ADDRESS

COUNTER

LD

CK

Y-ADDRESS

COUNTER

LD

CK

10

1

X-DECODERY-DECODER

6

3

RDCK

CS

CS CONTROL

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¡ Semiconductor MSM6595A-xxx

PIN CONFIGURATIONS (TOP VIEW)

SASY

SADY

GND

DOUT

24
23
22
21
20
19
18
17
16
15
14
13

GND
NC
DOUT
TESTO1
NC
NC
NC
NC
NC

RDCK

TESTO2
TEST

TEST

CS

NC

SADX

SASX

2 1 18 17

3

4

5

6

7

8 9 10 11

DD

V

TAS

TEST

NC : No connection

16

15

14

13

12

TESTO2

TESTO1

NC

NC

RDCK

NC

SADY

SASY

TEST

CS

NC
NC
NC
NC

SADX

SASX

TAS

V

DD

1
2
3
4
5
6
7
8

9
10
11
12

NC : No connection

18-Pin Plastic QFJ

1

SADY

2

SASY

3

TEST

4

CS

5

NC

6

SADX

7

SASX

8

TAS

9

V

DD

NC : No connection

18

17

16

15

14

13

12

11

10

GND

DOUT

TESTO1

NC

NC

RDCK

NC

TESTO2

TEST

SADY

SASY

TEST

NC

CS

NC
NC
NC
NC
NC
NC

SADX

SASX

TAS

V

DD

24-Pin Plastic SOP

1

2

3

4

5

6

7

8

9
10
11
12
13
14
15

NC : No connection

30
29
28
27
26
25
24
23
22
21
20
19
18
17
16

GND
NC
DOUT
TESTO1
NC
NC
NC
NC
NC
NC
NC
NC

RDCK

TESTO2
TEST

18-Pin Plastic DIP

30-Pin Plastic SSOP

3/12

¡ Semiconductor MSM6595A-xxx

PIN DESCRIPTIONS

QFJ

9

18

6

1

7

2

8

SOP

12

24

9

1

10

2

11

Pin

DIP

9

18

6

1

7

2

8

SSOP

15

30

12

1

13

2

14

Symbol

V

DD

GND

SADX

SADY

SASX

TAS

Type Description

Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this

—

pin and the GND pin.

— Ground pin

(SERIAL ADDRESS) This pin inputs the starting X address of a read operation.

Addressing in units of 1024 words is possible. The 1024-word address data

I

can be input as 10-bit (AX0 - AX9) serial data via the SADX pin.

(SERIAL ADDRESS) This pin inputs the starting Y address of a read operation.
Addressing in units of 1024 words is possible. The 1024-word address data

I

can be input as 10-bit (AY0 - AY9) serial data via the SADY pin.

(SERIAL ADDRESS STROBE) This is the clock input pin which is used to store

I

the serial address data of the X address into the device's internal register.

(SERIAL ADDRESS STROBE) This is the clock input pin to store the serial

ISASY

address data of the Y address into the device's internal register.

(ADDRESS TRANSFER STROBE) This is the input pin for loading the serial
address data into the internal address counter.

I

The X and Y addresses are stored at the falling edge of TAS.

(READ CLOCK) This is the clock input pin for reading information out of the data

13

15

13

18

RDCK

register. Internal operation starts at the falling edge of RDCK. The information

I

in the data register is output on the DOUT pin. The internal address counter is
automatically incremented at the falling edge of RDCK.

(DATA OUT) The data output pin is always kept in a high-impedance state when

17

22

17

28

DOUT

RDCK or CS is kept at "H". This pin reflects the "H" or "L" level data being read,

O

and the current data is held until RDCK is asserted High.

(CHIP SELECT) Setting this pin to "H" disables all input and output pins. This pin

4

4

4

10

16

13

21

10

16

5

16

3333

27

17111411

CS

TEST

TEST

TESTO1

TESTO2

I

enables parallel use of multiple serial voice ROMs by connecting the data output pins.

Pins for testing. Apply a "L" level to the TEST pin and "H" level to the TEST pin.

I

Pins for testing. Leave these pins open.

O

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit

Power Supply Voltage V

Input Voltage V

Storage Temperature T

DD

IN

STG

Ta = 25°C –0.3 to +7.0 V

Ta = 25°C –0.3 to VDD+0.3 V

— –55 to +150 °C

4/12

¡ Semiconductor MSM6595A-xxx

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Condition Range Unit

Power Supply Voltage V

Operating Temperature T

DD

op

GND=0 V 2.7 to 5.5 V

— –40 to +85 °C

ELECTRICAL CHARACTERISTICS

DC Characteristics

= 2.7 to 5.5 V, Ta = –40 to +85°C

V

DD

Parameter Symbol Condition Min. Max. Unit

"H" Level Input Voltage V

"L" Level Input Voltage V

"H" Level Output Voltage V

"L" Level Output Voltage V

"H" Level Input Current I
"L" Level Input Current I

Current Consumption (1) I

OH

OL

IH

IL

DD

IH

IL

— 0.85xV

— — 0.15xV

I

= –40 mAV

OH

I

= 2 mA — 0.45 V

OL

V

= V

IH

DD

V

= GND –10 — mA

IL

t

= 2.5 ms — 20 mA

RDC

–0.3 — V

DD

—10mA

DD

Typ.

—

—

—

—

—
—

9

—V

V

DD

Ta = –40
to +70°C

Current Consumption (2) I

DS

CS =
VDD–0.2 V

Ta = –40
to +85°C

Typical values are at V

AC Characteristics

Parameter Symbol Min. Max. Unit

CS, SAS Setup Time t
SASX, SASY Cycle Time t
SASX, SASY Precharge Time t
SASX, SASY Pulse Width t

Address Setup Time t
Address Hold Time t

TAS Setup Time t
TAS, RDCK Setup Time t
TAS Pulse Width t

Read Cycle Time t

Access Time t

Output Turn-off Delay Time t

RDCK Precharge Time t
RDCK Pulse Width t

—

—

= 2.7 to 5.5 V, Ta = –40 to +85°C

V

DD

CSS

SSC

SAP

SAS

AS

AH

ATS

TRS

TAS

RDC

ACC

OFF

RDP

RD

—

10

50—

= 5.0 V, Ta = 25°C.

DD

1000 — ns

500 — ns

250 — ns

250 — ns

100 — ns
100 — ns

500 — ns

500 — ns

250 — ns

2500 — ns

— 1500 ns

0 200 ns

1000 — ns

1500 — ns

mA

5/12

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¡ Semiconductor MSM6595A-xxx

TIMING DIAGRAMS

Serial Address Input Timing

,







CS (I)

SADX (I)

SASX (I)

SADY (I)

t

AH

TAS (I)

SASY (I)

AX1 AX2 AX3 AX4 AX5 AX6 AX7 AX8 AX9

t

AS

t

SAS

t

CSS

t

SSC

t

SAP

t

ATS

t

ATS

t

TAS

t

AS

t

AH

t

SAS

t

SAP

t

SSC

t

CSS

AX0

AY0 AY1 AY2 AY3 AY4 AY5 AY6 AY7 AY8 AY9

,

,

,













,







,

,







7/12

¡ Semiconductor MSM6595A-xxx

Read Access Timing

,

,

t

TAS

t

TRS

t

RDC

tRDt

RDP

t

OFF

t

ACC

XnY

m

XnY

m+1

XnY

m+2

XnY

1023

X

n+1Y0

X

n+1Y1

TAS (I)

RDCK (I)

DOUT (O)

¡ Semiconductor MSM6595A-xxx

APPLICATION CIRCUIT

MSM6588 Playback Storage Example

MICROCONTROLLER

+

AV

DD

+

+

DVDD D V

DD'

D3
D2
D1
D0

RD
WR
CE

MCUM

TEST

RSEL1
RSEL2
TEST
TEST
TEST
TEST

RESET

MIN

MOUT

LIN

LOUT
AMON
FIN
FOUT
ADIN
SG

DGND AGND

AV

DD

SAD

SAS

TAS

RWCK

WE

DI/O

CS1

MSM6588

CS2
CS3
CS4

MON

XT

XT

AOUT

SAD

SAS
TAS
RWCK
WE

DIN
DOUT

AU/D

TEST
TEST
TEST
TEST
TEST

CS

4.096 MHz

DGND

V

DD

MSM6389

GND

Speaker amplifier

V

DD

MSM6389

1-Mbit SERIAL REGISTER

CS

GND

SADX

SASX
TAS
RDCK

DOUT

SASY

SADY

TEST

TEST

CS

V

DD

MSM6595A-xxx

1-Mbit SERIAL VOICE ROM

GND

AGND

Note: When the MSM6595A is driven by the MSM6388 or MSM6588, a serial register is required.

(The MSM6595A does not operate without it.) The MSM6389 is being used as the serial
register in the above example.

8/12

¡ Semiconductor MSM6595A-xxx

PACKAGE DIMENSIONS

(Unit : mm)

QFJ18-P-R290-1.27

Spherical surface

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.50 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

9/12

¡ Semiconductor MSM6595A-xxx

(Unit : mm)

SOP24-P-430-1.27-K

Mirror finish

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.58 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

10/12

¡ Semiconductor MSM6595A-xxx

(Unit : mm)

DIP18-P-300-2.54

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

1.30 TYP.

11/12

¡ Semiconductor MSM6595A-xxx

(Unit : mm)

SSOP30-P-56-0.65-K

Mirror finish

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.19 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

12/12

E2Y0002-29-11

NOTICE

1. The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or

unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.

5. Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.

6. The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.

7. Certain products in this document may need government approval before they can be
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the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.

8. No part of the contents cotained herein may be reprinted or reproduced without our prior
permission.

9. MS-DOS is a registered trademark of Microsoft Corporation.

Copyright 1999 Oki Electric Industry Co., Ltd.

Printed in Japan