The MSM6544 is a 42-segment duplex driver which can drive the LCD panel up to a maximum
of 84 segments.
Since the package is a 56-pin small QFP, an LCD module can be compactly configured. An
internal RC oscillator is provided for ease of use.
An RC oscillator circuit for 3-pin type can be configured. Since the OSC-IN pin is in a high
input impedance state, it is susceptible to noise.
•DATA-IN
This is the display data input. When this pin is at "H" level, the segments are turned on and
when at "L" level, the segments are turned off.
•CLOCK
Pin for clocking display data in. Display data is shifted on the rising edge of the clock pulse.
•LOAD
This is the signal for latching the shift register data. When this pin is set at a "H" level, the shift
register data is transmitted to LATCH <A> or LATCH <B>.
•SEG1 - SEG42
These pins drive the LCD segments.
•COM-A, COM-B
These pins drive the LCD commons. COM-A and COM-B correspond to LATCH <A> output
and LATCH <B>output, respectively.
•V
DD2
This is connected to the V
•V
LCM
pin internally.
DD1
This is the center bias pin of the LCD. Supply the middle voltage between VDD and V
•V
LCL
This is the power supply pin of the LCD driver. The contrast of the LCD can be adjusted by
changing the voltage at this pin, but do not set the voltage less than the GND level.
•BLANK
This pin is used to test the all segment outputs (SEG1 to SEG42). All segment outputs are
turned off when this pin is set to "H" level. The display returns to the condition before the pin
was set to "H" level.
•V
DD1
, GND
These are power supply voltage and ground pins.
LCL
.
3/12
Page 4
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol Condition RatingUnit
Supply Voltage
Input Voltage
Storage Temperature
T
V
DD
V
STG
I
T
= 25°C
a
T
= 25°C
a
—
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Condition RangeUnit
Supply Voltage
Operating Temperature
LCD Driving Voltage
OSC Circuit
V
DD
T
op
V
LCD
—
—
V
DD–VLCL
–0.3 to +6.5V
GND–0.3 to VDD +0.3
–55 to +150
3 to 6V
–40 to +85
3 to V
DD
MSM6544¡ Semiconductor
V
°C
°C
V
Parameter Min.
SymbolConditionTyp.Max.Unit Applicable Pin
Oscillation Resistance
Oscillation Capacitance0.001C
Current Control Resistance 33R
Common Signal Frequency25f
R
0
C
0
R
1
0
0
1
COM
OSC-R
OSC-C
OSC-IN
——68kWOSC-R
10R
Film capacitor—0.047mFOSC-C
——220kWOSC-IN
COM-A
——250Hz
COM-B
(MSM6544)
4/12
Page 5
ELECTRICAL CHARACTERISTICS
DC Characteristics
(V
= 5.0V
DD
MSM6544¡ Semiconductor
Ta = –40 to +85°C)
Parameter SymbolCondition
"H" Input Voltage
V
IH
Corresponding
Pin
BLANK
LOAD
IL
DATA
CLOCK
OSC-IN
Input Leakage Current
I
LI
OSC-R
OSC-C
"H" Output Voltage
V
OH
All segment
outputs
COM-A
COM-B
"M" Output Voltage
V
OM
COM-A
COM-B
OSC-R
OSC-C
Min.
Typ. Max. Unit
—
—
3.6—V
GND—1.0V"L" Input VoltageV
DD
V
VI = 5.0V/0V——±1mA
I
= –200mA4.5——V
O
V
= 2.5V
LCM
V
= 0V
LCL
I
= –30mA
O
= 2.5V
V
LCM
V
= 0V
LCL
I
= –150mA
O
= 2.5V
V
LCM
V
= 0V
LCL
I
= ±150mA
O
= 200mA——0.5V
I
O
4.8——V
4.8——V
2.3—2.7V
"L" Output Voltage
Segment Output
Impedance
Common Output
Impedance
Static Supply Current
Dynamic Supply Current
R
R
V
COM
I
DD1
I
DD2
OL
SEG
All segment
outputs
COM-A
COM-B
All segment
outputs
COM-A
COM-B
V
DD
V
= 2.5V
LCM
V
= 0V
LCL
I
= 30mA
O
= 2.5V
V
LCM
V
= 0V
LCL
I
= 150mA
O
V
= (5+V
V
V
V
LCM
LCL
LCM
LCL
= 0 to 2V
= 0 to 2V
= (5+V
LCL
LCL
Fix all inputs to
V
or GND
DD
No load
= 47kW
R
o
= 0.0047mF
C
o
=150kW
R
1
)/2
)/2
——0.2V
——0.2V
——10kW
——1.5kW
——100mA
—0.220.5mA
5/12
Page 6
Switching Characteristics
MSM6544¡ Semiconductor
Parameter SymbolCondition
Clock Pulse Frequency
Clock Pulse "H" Timet
Clock Pulse "L" Timet
Data Setup Timet
Data Hold Timet
Load Pulse "H" Timet
Clock-Load Timingt
OSC-IN Input Frequencyf
V
DATA-IN
H
V
L
t
CLOCK
V
L
f
fH
fL
D-f
f-D
f-L
OSC
fL
f
L
t
D-f
Corresponding
V
H
V
L
V
H
V
L
Pin
CLOCK
DATA
CLOCK
LOAD
LOAD
OSC-IN
t
f-D
t
fH
= 3.0 to 6.0V,
(V
DD
—
—
—
—
—
—
—
—
V
H
Ta = –40 to +85°C)
Min.
Max.Unit
—4MHz
100—ns
100—ns
80—ns
40—ns
100—ns
100—ns
—20kHz
LOAD
t
f-L
t
L
V
H
V
L
(V
H
V
H
= 0.8 VDD, VL = 0.2 VDD)
6/12
Page 7
Data Input Timing
• DATA input timing for COM-A
MSM6544¡ Semiconductor
Invalid data
DATA
––––––––
4241404321"L"
CLOCK
LOAD
• DATA input timing for COM-B
Invalid data
DATA
––––––––
4241404321"H"
CLOCK
LOAD
SEG-DATA
(A)
SEG-DATA
(B)
SEL
SEL
LOAD
LOAD
Output Waveforms
COM-A
COM-B
SEG
off
off
n
on
off
on
off
off
off
on
off
on
off
COM-A
COM-B
V
V
V
V
V
V
DD
LCM
LCL
DD
LCM
LCL
on
on
on
on
7/12
Page 8
MSM6544¡ Semiconductor
FUNCTIONAL DESCRIPTION
Data Input
The data input consists of the following three timing sections:
i)SEG-DATA section (42-bit)
ii)SEL bit section (1-bit)
iii)LOAD section
A total of 43 bits of 42-bit segment data and 1-bit select bit are taken in the 43-bit shift register
at the rising edge of the clock.
The segment data corresponds to "L" (segment OFF) and "H" (segment ON). Input the
segment data from SEG42 to SEG1 in this order.
The select bit following the segment data is a bit used to specify the transmit destination of
the segment data. The selection is performed as follows.
"L":LATCH <A> ; corresponds to COM-A
"H" :LATCH <B> ; corresponds to COM-B
The data from the shift register to LATCH <A> or LATCH <B> is transmitted when the LOAD
pin is at the "H" level.
The indication corresponding to the transmit destination latch is also changed at the same
time that data is transmitted.
8/12
Page 9
APPLICATION CIRCUITS
MSM6544¡ Semiconductor
From Controller
COM-B
COM-A
R
x 2
COM
42
V
LCM
V
DD
R
LC
COM-A
R
COM-B
V
LCL
LC
BLANK
LOAD
DATA
LCD PANEL
1/2 DUTY 84-SEGMENT
SEG
1
MSM6544
SEG
CLOCK
V
DD1
V
DD
GNDOSC-INOSC-COSC-R
R
1
C
0
V
LCL
R
0
>
1kW
R
=
COM
>
R
R
x 3
=
1
o
9/12
Page 10
REFERENCE DATA
MSM6544¡ Semiconductor
I
DD2
vs. V
I
DD2
mA
400
Requirements
300
200
100
01 2 34 567V
• At no lead and during oscillation
• At room temperature
= 47 kW
• R
0
= 0.0047 mF
• C
0
= 150 kW
• R
1
Characteristic
DD
V
DD
10/12
Page 11
MSM6544¡ Semiconductor
f
COM
f
COM
vs. V
Characteristics
DD
Hz
60
Requirements
• At room temperature
= 47 kW
• R
0
= 0.0047 mF
• C
55
50
COM-A
0
= 150 kW
• R
1
COM-B
45
1/f
COM
01 2 3 4 5 6 7V
V
DD
f
COM
R
f
COM
vs.
Characteristics
0
Hz
320
240
160
120
80
60
40
30
20
15
Requirements
• At room temperature
10
• VDD = 5.0 kW
.
• R1 = 3R
.
0
= 0.047mF
0
0101522334768kW
R
0
C
= 0.001mF
0
= 0.0022mF
C
0
C
= 0.0047mF
0
C
= 0.01mF
0
C
= 0.022mFC
0
11/12
Page 12
PACKAGE DIMENSIONS
QFP56-P-910-0.65-2K
Mirror finish
MSM6544¡ Semiconductor
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.36 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
12/12
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