Datasheet ML4812CP Datasheet (Fairchild Semiconductor)

Page 1
April 1998
ML4812
Power Factor Controller
GENERAL DESCRIPTION
The ML4812 is designed to optimally facilitate a peak
FEATURES
Precision buffered 5V reference (±0.5%)
current control boost type power factor correction system. Special care has been taken in the design of the ML4812 to increase system noise immunity. The circuit includes a
Current-input gain modulator reduces external
components and improves noise immunity precision reference, gain modulator, error amplifier, over­voltage protection, ramp compensation, as well as a high
Programmable ramp compensation circuit
current output. In addition, start-up is simplified by an under-voltage lockout circuit with 6V hysteresis.
In a typical application, the ML4812 functions as a current mode regulator. The current which is necessary to
1A peak current totem-pole output drive
Overvoltage comparator helps prevent output
voltage “runaway” terminate the cycle is a product of the sinusoidal line voltage times the output of the error amplifier which is regulating the output DC voltage. Ramp compensation is
Wide common mode range in current sense
comparators for better noise immunity programmable with an external resistor, to provide stable operation when the duty cycle exceeds 50%.
Large oscillator amplitude for better noise immunity
BLOCK DIAGRAM (Pin Configuration Shown is for DIP Version)
OVP
5
I
SENSE
1
GM OUT
2
EA OUT
3
EA–
4
5V
5V
5V
+ –
+ – –
ERROR
AMP
+ –
I
EA
SRQ
Q
UNDER VOLTAGE LOCKOUT
SHDN
OUT
V
V
32V
REF
CC
10
12
11
14
13
V
CC
PWR GND
I
SINE
6
RAMP COMP
7
C
T
16
R
T
8
GAIN MODULATOR
OSC
GND
15
5V
CLOCK
9
1k
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Page 2
ML4812
PIN CONFIGURATION
ML4812
16-Pin PDIP (P16)
1
I
SENSE
OVP
I
SINE
EA–
R
T
2
3
4
5
6
7
8
TOP VIEW
GM OUT
EA OUT
RAMP COMP
PIN DESCRIPTION
PIN NAME FUNCTION
ML4812
20-Pin PLCC (Q20)
16
C
T
15
GND
14
V
REF
13
V
CC
12
OUT
11
PWR GND
10
SHDN
9
CLOCK
EA OUT
PIN NAME FUNCTION
OVP
I
SINE
EA–
NC
4 5 6 7 8
SENSE
GM OUT
I
NC
CTGND
3212019
910111213
T
R
NC
SHDN
CLOCK
RAMP COMP
TOP VIEW
18 17 16 15 14
V
REF
V
CC
NC OUT PWR GND
1 I
SENSE
Input from the current sense transformer to the non-inverting input of the PWM comparator.
2 GM OUT Output of gain modulator.
A resistor to ground on this pin converts the current to a voltage. This pin is clamped to 5V and tied to the inverting input of the PWM comparator.
3 EA OUT Output of error amplifier.
4 EA– Inverting input to error amplifier.
5 OVP Input to over voltage comparator.
6 I
SINE
Current gain modulator input.
7 RAMP
COMP Buffered output from the oscillator
ramp (C
). A resistor to ground sets the
T
current which is internally subtracted from the product of I
and IEA in
SINE
the gain modulator.
8R
T
Oscillator timing resistor pin. A 5V source sets a current in the external resistor which is mirrored to charge C
.
T
9 CLOCK Digital clock output.
10 SHDN A TTL compatible low level on this pin
turns off the output.
11 PWR GND Return for the high current totem pole
output.
12 OUT High current totem pole output.
13 V
14 V
CC
REF
Positive Supply for the IC.
Buffered output for the 5V voltage reference.
15 GND Analog signal ground.
16 C
T
Timing capacitor for the oscillator.
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Page 3
ABSOLUTE MAXIMUM RATINGS
ML4812
Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional device operation is not implied.
Junction Temperature ............................................. 150°C
Storage Temperature Range ..................... –65°C to 150°C
Lead Temperature (soldering 10 sec.) ..................... 260°C
Thermal Resistance (θ
)
JA
20-Pin PLCC .................................................... 60°C/W
Supply Current (I
) ............................................... 30mA
CC
16-Pin PDIP .................................................... 65°C/W
Output Current Source or Sink (OUT) DC................ 1.0A
Output Energy (capacitive load per cycle) .................. 5µJ
Gain Modulator I
SINE
Input (I
) ......................... 1.2mA
SINE
Error Amp Sink Current (EA OUT).......................... 10mA
Oscillator Charge Current ........................................ 2mA
Analog Inputs (I
, EA–, OVP) ............... –0.3V to 5.5V
SENSE
OPERATING CONDITIONS
Temperature Range
ML4812CX ................................................ 0°C to 70°C
ML4812IX ............................................. –40°C to 85°C
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, VCC = 15V , RT = 14k, CT = 1000pF, TA = Operating Temperature Range (Notes 1, 2).
PARAMETER CONDITIONS MIN TYP MAX UNITS
OSCILLATOR
Initial Accuracy TJ = 25°C 91 98 105 kHz Voltage Stability 12V < VCC < 18V 0.3 % Temperature Stability 2% Total Variation Line, temperature 90 108 kHz Ramp Valley to Peak 3.3 V RT Voltage 4.8 5.0 5.2 V Discharge Current (RT open) TJ = 25°C, VCT= 2V 7.8 8.4 9.0 mA
VCT = 2V 7.3 8.4 9.3 mA Clock Out Voltage Low RL = 16k 0.2 0.5 V Clock Out Voltage High RL = 16k 3.0 3.5 V
REFERENCE
Output Voltage TJ = 25°C, IO = 1mA 4.95 5.00 5.05 V Line Regulation 12V < VCC < 25V 2 20 mV Load Regulation 1mA < IO < 20mA 2 20 mV Temperature Stability 0.4 % Total Variation Line, load, temp. 4.9 5.1 V Output Noise Voltage 10Hz to 10kHz 50 µV Long Term Stability TJ = 125°C, 1000 hours 5 25 mV Short Circuit Current V
ERROR AMPLIFIER
Input Offset Voltage ±15 mV Input Bias Current –0.1 –1.0 µA Open Loop Gain 1 < V PSRR 12V < VCC < 25V 60 75 dB Output Sink Current V Output Source Current V Output High Voltage I Output Low Voltage I Unity Gain Bandwidth 1.0 MHz
= 0V –30 –85 –180 mA
REF
< 5V 60 75 dB
EA OUT
EA OUT
EA OUT
EA OUT
EA OUT
= 1.1V, V = 5.0V, V
= –0.5mA, V
= 1mA, V
= 6.2V 2 12 mA
EA–
= 4.8V –0.5 –1.0 mA
EA–
= 4.8V 5.3 5.5 V
EA–
= 6.2V 0.5 1.0 V
EA–
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Page 4
ML4812
ELECTRICAL CHARACTERISTICS (Continued)
PARAMETER CONDITIONS MIN TYP MAX UNITS
GAIN MODULATOR
I
Input Voltage I
SINE
Output Current (GM OUT) I
Bandwidth 200 kHz PSRR 12V < VCC < 25V 70 dB
OVP COMPARATOR
Input Offset Voltage Output Off –25 +5 mV Hysteresis Output On 95 105 115 mV Input Bias Current –0.3 –3 µA Propagation Delay 150 ns
PWM COMPARATOR: I
SENSE
Input Offset Voltage ±15 mV Input Offset Current ±1 µA Input Common Mode Range –0.2 5.5 V Input Bias Current –2 –10 µA Propagation Delay 150 ns I
Trip Point V
LIMIT
OUTPUT
Output Voltage Low I
Output Voltage High I
Output Voltage Low in UVLO I Output Rise/Fall Time CL = 1000pF 50 ns Shutdown V
UNDER-VOLTAGE LOCKOUT
Startup Threshold 15 16 17 V Shutdown Threshold 9 10 11 V V
Good Threshold 4.4 V
REF
SUPPLY
Supply Current Start-Up, VCC = 14V, TJ = 25°C 0.8 1.2 mA
Internal Shunt Zener Voltage ICC = 30mA 25 30 34 V
= 500µA 0.4 0.7 0.9 V
SINE
= 500µA, EA– = V
SINE
I
= 500µA, EA– = V
SINE
I
= 1mA, EA– = V
SINE
I
= 500µA, EA– = V
SINE
I
RAMP COMP
GM OUT
OUT
I
OUT
OUT
I
OUT
OUT
IH
V
IL
IIL, V
IIH, V
= 50µA
= 5.5V 4.8 5 5.2 V
= –20mA 0.1 0.4 V = –200mA 1.6 2.2 V = 20mA 13 13.5 V = 200mA 12 13.4 V = –5mA, VCC = 8V 0.1 0.8 V
= 0V –1.5 mA
SHDN
= 5V 10 µA
SHDN
–20mV 430 470 510 µA
REF
+ 20mV 3 10 µA
REF
– 20mV 860 940 1020 µA
REF
– 20mV, 455 µA
REF
2.0 V
0.8 V
Operating, TJ = 25°C2025mA
Note 1: Limits are guaranteed by 100% testing, sampling, or correlation with worst-case test conditions. Note 2: V
is raised above the Startup Threshold first to activate the IC, then returned to 15V.
CC
4 REV. 1.0 10/10/2000
Page 5
FUNCTIONAL DESCRIPTION
ML4812
OSCILLATOR
The ML4812 oscillator charges the external capacitor (C with a current (I
) equal to 5/R
SET
. When the capacitor
SET
T
voltage reaches the upper threshold, the comparator changes state and the capacitor discharges to the lower threshold through Q1. While the capacitor is discharging, Q2 provides a high pulse.
The Oscillator period can be described by the following relationship:
EXTERNAL
CLOCK
C
SYNC
R
SYNC
I
SET
R
C
SYNC
10
R
T
9
T
C
T
16
T
8.4mA
I
SET
5.6V
Q
2
+
-
TT T
=+
OSC RAMP DEADTIME
)
where:
V
OUT
V
IN
=
-
D
1
ON
and:
´
CV
T RAM P VA LLEY TO PE AK
T
DEADTIME
(k)
T
R
=
10
8
5
3
2
1
10 100 1000
5nF 2nF
10nF
20nF
OSCILLATOR FREQUENCY (kHz)
84.
-
mA I
SET
90%
1nF
85%
MAXIMUM DUTY CYCLE (%)
80%
70%
Figure 2. Oscillator Timing Resistance vs. Frequency
15
V
CC
14
13
SOURCE SATURATION
LOAD TO GROUND
SINK SATURATION
LOAD TO V
3
2
1
OUTPUT SATURATION VOLTAGE (V)
0
0 200 400 800
CC
OUTPUT CURRENT (mA)
VCC = 15V
80µs PULSED LOAD
120Hz RATE
GND
600
CLOCK
RAMP PEAK
RAMP VALLEY
Figure 1. Oscillator Block Diagram
V(CT)
Q
1
t
D
Figure 3. Output Saturation Voltage vs. Output Current
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Page 6
ML4812
FUNCTIONAL DESCRIPTION (Continued)
OUTPUT DRIVER STAGE
The ML4812 output driver is a 1A peak output high speed totem pole circuit designed to quickly drive capacitive loads, such as power MOSFET gates. (Figure 3)
ERROR AMPLIFIER
The ML4812 error amplifier is a high open loop gain, wide bandwidth, amplifier.(Figures 4-5)
GAIN MODULATOR
The ML4812 gain modulator is of the current-input type to provide high immunity to the disturbances caused by high power switching. The rectified line input sine wave is converted to a current via a dropping resistor. In this way, small amounts of ground noise produce an insignificant effect on the reference to the PWM comparator. The output of the gain modulator is a current of the form: I is proportional to I the dropping resistor, and I
SINE
5V
I
where I
EA,
is a current proportional to
EA
+
is the current in
SINE
0.5mA
8V
OUT
the output of the error amplifier. When the error amplifier is saturated high, the output of the gain modulator is approximately equal to the I
input current. The gain
SINE
modulator output current is converted into the reference voltage for the PWM comparator through a resistor to ground on the gain modulator output. The gain modulator output is clamped to 5V to provide current limiting.
Ramp compensation is accomplished by subtracting 1/2 of the current flowing out of RAMP COMP through a buffer transistor driven by C
which is set by an external
T
resistor.
UNDER VOLTAGE LOCKOUT
On power-up the ML4812 remains in the UVLO condition; output low and quiescent current low. The IC becomes operational when V
reaches 16V. When V
CC
CC
drops below 10V, the UVLO condition is imposed. During the UVLO condition, the 5V V
pin is “off”,
REF
making it usable as a “flag” for starting up a downstream PWM converter.
ERROR CURRENT
I
SINE
6
9V
I – I
ERROR CURRENT
SINE ×
RAMP COMP
/2
EA–
4
EA OUT
3
Figure 4. Error Amplifier Configuration
100
80
60
40
20
, OPEN LOOP GAIN (dB)
VOL
A
0
-20 100 10k 10M100k
10 1k 1M
GAIN
FREQUENCY (Hz)
PHASE
0
-30
-60
-90
-120
-150
-180
EXCESS PHASE (degrees)
GM OUT
2
RAMP COMP
7
C
T
16
I
RAMP COMP
5V
Figure 6. Gain Modulator Block Diagram
500
400
300
200
100
MULTIPLE OUTPUT CURRENT (µA)
0
0 200 300 500400100
SINE INPUT CURRENT (µA)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
ERROR AMP OUTPUT VOLTAGE (V)
Figure 5. Error Amplifier Open-Loop Gain and
Figure 7. Gain Modulator Linearity
Phase vs Frequency
6 REV. 1.0 10/10/2000
Page 7
TYPICAL APPLICATIONS
INPUT INDUCTOR (L1) SELECTION
ML4812
25
The central component in the regulator is the input boost inductor. The value of this inductor controls various critical operational aspects of the regulator. If the value is too low, the input current distortion will be high and will result in low power factor and increased noise at the input. This will require more input filtering. In addition, when the value of the inductor is low the inductor dries out (runs out of current) at low currents. Thus the power factor will decrease at lower power levels and/or higher line voltages. If the inductor value is too high, then for a given operating current the required size of the inductor core will be large and/or the required number of turns will be high. So a balance must be reached between distortion and core size.
One more condition where the inductor can dry out is analyzed below where it is shown to be maximum duty cycle dependent.
For the boost converter at steady state:
V
V
OUT
Where D
Where D
input boost inductor will dry out when the following
input boost inductor will dry out when the following
condition is satisfied:
condition is satisfied:
IN
=
D
-1
ON
is the duty cycle [TON/(TON + T
is the duty cycle [TON/(TON + T
ON
ON
OFF
OFF
)]. The
)]. The
(1)
(1)
20
15
(mA)
CC
I
10
5
0
0
VCC (V)
3020 4010
Figure 9a. Total Supply Current vs. Supply Voltage
25
20
15
10
OPERATING CURRENT
(2)
Vt V D
() ( )-1
IN OUT ON
or
or
VD V
V
INDRY
V
OUT
=- ´
INDRY O N OUT
[(max)]1
: voltage where the inductor dries out.
: output DC voltage.
(2)
(3)
(3)
Effectively, the above relationship shows that the resetting volt-seconds are more than setting volt-seconds. In energy transfer terms this means that less energy is stored in the inductor during the ON time than it is asked to deliver during the OFF time. The net result is that the inductor dries out.
ENABLE
V
REF
V
REF
GEN.
9V
+
INTERNAL
BIAS
5V V
V
REF
CC
SUPPLY CURRENT (mA)
5
STARTUP
0
60 20 60 14010020
40 40 80 1200
TEMPERATURE (degrees)
Figure 9b. Supply Current (ICC) vs. Temperature
0
-4
-8
(mV)
-12
REF
V
-16
-20
-24 20 60 12080
0 40 100
I
(mA)
REF
Figure 10. Reference Load RegulationFigure 8. Under-Voltage Lockout Block Diagram
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Page 8
ML4812
TYPICAL APPLICATIONS (Continued)
The recommended maximum duty cycle is 95% at 100KHz to allow time for the input inductor to dump its energy to the output capacitors. For example, if: V
OUT
= 380V and DON (max) = 0.95, then substituting in (3) yields V
= 20V. The effect of drying out is an
INDRY
increase in distortion at low voltages.
For a given output power, the instantaneous value of the input current is a function of the input sinusoidal voltage waveform, i.e. as the input voltage sweeps from zero volts to a maximum value equal to its peak so does the current.
The load of the power factor regulator is usually a switching power supply which is essentially a constant power load. As a result, an increase in the input voltage will be offset by a decrease in the input current.
By combining the ideas set forth above, some ground rules can be obtained for the selection and design of the input inductor:
Step 1: Find minimum operating current.
I
(min)
IN PEAK
.(min)
=
V
IN
IN
(max)
(4)
´1414
P
VIN(max) = 260V
PIN(min) = 50W
then:
IIN(min)
PEAK
= 0.272A
Step 2: Choose a minimum current at which point the
inductor current will be on the verge of drying out. For this example 40% of the peak current found in step 1 was chosen.
then:
I
= 100mA
LDRY
Step 3: The value of the inductance can now be found
using previously calculated data.
VD
=
L
1
=
100 100
´
INDRY ON
´
If
LDRY OSC
´
V
20 0 95
mA KHz
.
´
(max)
=
(5)
mH
2
The inductor can be allowed to decrease in value when the current sweeps from minimum to maximum value. This allows the use of smaller core sizes. The only requirement is that the ramp compensation must be adequate for the lower inductance value of the core so that there is adequate compensation at high current.
Step 4: The presence of the ramp compensation will
change the dry out point, but the value found above can be considered a good starting point. Based on the amount of power factor correction the above value of L1 can be optimized after a few iterations.
Gapped Ferrites, Molypermalloy, and Powdered Iron cores are typical choices for core material. The core material selected should have a high saturation point and acceptable losses at the operating frequency.
One ferrite core that is suitable at around 200W is the #4119PL00-3C8 made by Philips Components (Ferroxcube). This ungapped core will require a total gap of 0.180" for this application.
OSCILLATOR COMPONENT SELECTION
The oscillator timing components can be calculated by using the following expression:
OSC
´
RC
TT
(6)
136.
=
f
For example:
Step 1: At 100kHz with 95% duty cycle T
= 500ns
OFF
calculate CT using the following formula:
=
C
T
V
OSC
=
1000
pF
(7)
´
TI
OFF DIS
Step 2: Calculate the required value of the timing
resistor.
136 136
..
=
R
T
fC KHz pF
OSC T
=W =W
136 14
.
k choose R k
=
´
100 1000
´
T
(8)
8 REV. 1.0 10/10/2000
Page 9
TYPICAL APPLICATIONS (Continued)
ML4812
CURRENT SENSE AND SLOPE (RAMP) COMPENSATION COMPONENT SELECTION
Slope compensation in the ML4812 is provided internally. Rather than adding slope to the noninverting input of the PWM comparator, it is actually subtracted from the voltage present at the inverting input of the PWM comparator. The amount of slope compensation should be at least 50% of the downslope of the inductor current during the off time, as reflected to the inverting input of the PWM comparator. Note that slope compensation is required only when the inductor current is continuous and the duty cycle is more than 50%. The downslope of the inductor current at the verge of discontinuity can be found using the expression given below:
di
dt
L
=
OUT INDRY
L
=
-
380 20
VV
2
mH
=m
018./
(9)
As
-
VV
The downslope as reflected to the input of the PWM comparator is given by:
S
S
VV
=
PWM
380 202100
=
PWM
OUT INDRY
L
-
V
mH
R
S
´
N
C
´= m
0 225./
80
Vs
(10)
-
Where RS is the current sense resistor and NC is the turns ratio of the current transformer (T1) used. In general, current transformers simplify the sensing of switch currents (especially at high power levels where the use of sense resistors is complicated by the amount of power they have to dissipate). Normally the primary side of the transformer consists of a single turn and the secondary consists of several turns of either enameled magnet wire or insulated wire. The diameter of the ferrite core used in this example is 0.5" (SPANG/Magnetics F41206-TC). The rectifying diode at the output of the current transformer can be a 1N4148 for secondary currents up to 75mA average.
Sense FETs or resistive sensing can also be used to sense the switch current. The sensed signal has to be amplified to the proper level before it is applied to the ML4812.
The value of the ramp compensation (SC
) as seen at
PWM
the inverting terminal of the PWM comparator is:
´
25.
R
SC
=
PWM
RCR
TTSC
M
´´
(11)
The required value for RSC can therefore be found by equating: SC
PWM
= A
SC
× S
where ASC is the amount
PWM,
of slope compensation and solving for RSC. The value of GM OUT depends on the selection of RAMP COMP.
(max)
V
IN PEAK
==´=
R
P
ImA
()
SINE PEAK
260 1414
.
05
.
750
k
(12)
VR
=
R
M
´
CLAMP P
V
()
IN PEAK
.
4 9 750
=
90 1414
´
k
´
.
=
28 8
.
k
(13)
The peak of the inductor current can be found approximately by:
I
LPE AK
P
V
IN RM S
OUT
()
=
=
´
1414 200
.
90
=
314
.
A
(14)
´
1414
.
Selection of NC which depends on the maximum switch current, assume 4A for this example is 80 turns.
VN
=
R
S
Where RS is the sense resistor, and V
´
CLAMP C
I
LPE AK
49 80
.
=
´
4
=W
100
is the current
CLAMP
(15)
clamp at the inverting input of the PWM comparator. This clamp is internally set to 5V. In actual application it is a good idea to assume a value less than 5V to avoid unwanted current limiting action due to component tolerances. In this application, V
was chosen as
CLAMP
4.9V.
Having calculated RS, the value S
and of RSC can
PWM
now be calculated:
´
25
R
.
=
R
SC
R
SC
´´´
AS RC
SC PWM T T
=
´´´´
0 7 0 225 10 14 1
.(. )
M
´
25 288
..
k
6
KnF
=
33
k
(16)
The following values were used in the calculation:
R
= 28.8k A
M
R
= 14k C
T
= 0.7
SC
= 1nF
T
VOLTAGE REGULATION COMPONENTS
The values of the voltage regulation loop components are calculated based on the operating output voltage. Note that voltage safety regulations require the use of sense resistors that have adequate voltage rating. As a rule of thumb if 1/4W resistors are chosen, two of them should be used in series. The input bias current of the error amplifier is approximately 0.5µA, therefore the current available from the voltage sense resistors should be significantly higher than this value. Since two 1/4W resistors have to be used the total power rating is 1/2W. The operating power is set to be 0.4W then with 380V output voltage the value can be calculated as follows:
==
RVWk
1
2
380 0 4 360
()/.
(17)
Choose two 178k, 1% connected in series. Then R2 can be calculated using the formula below:
´
VR
REF
=
R
2
VV
OUT REF
1
-
´
5356
Vk
=
-
380 5
VV
=
4747
.
k
(18)
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Page 10
ML4812
TYPICAL APPLICATIONS (Continued)
Choose 4.75k, 1%. One more critical component in the voltage regulation loop is the feedback capacitor for the error amplifier. The voltage loop bandwidth should be set such that it rejects the 120Hz ripple which is present at the output. If this ripple is not adequately attenuated it will cause distortion on the input current waveform. Typical bandwidths range anywhere from a few Hertz to 15Hz. The main compromise is between transient response and distortion. The feedback capacitor can be calculated using the following formula:
=
C
F
=
C
F
1
´´
RBW
3142
.
1
1
´´
3142 356 2
.
kHz
=m
044
.
F
(19)
OVERVOLTAGE PROTECTION (OVP) COMPONENTS
The OVP loop should be set so that there is no interaction with the voltage control loop. Typically it should be set to a level where the power components are safe to operate. Ten to fifteen volts above V
is generally a good
OUT
setpoint. This sets the maximum transient output voltage to about 395V. By choosing the high voltage side resistor of the OVP circuit the same way as above i.e. R then R
Choose 4.53k, 1%. Note that R
can be calculated as:
5
´
VR
REF
=
R
5
VV
OVP REF
4
-
´
5356
Vk
=
-
395 5
VV
=
, R2, R4 and R5 should
1
4564
.
k
= 356K
4
(20)
be tight tolerance resistors such as 1% or better.
CONTROLLER SHUTDOWN
The ML4812 provides a shutdown pin which could be used to shutdown the IC. Care should be taken when this pin is used because power supply sequencing problems could arise if another regulator with its own bootstrapping follows the ML4812. In such a case a special circuit should be used to allow for orderly start up. One way to accomplish this is by using the reference voltage of the ML4812 to inhibit the other controller IC or to shut down its bias supply current.
OFF-LINE START-UP AND BIAS SUPPLY GENERATION
The ML4812 can be started using a bleed resistor from the high voltage bus. After the voltage on V
exceeds
CC
16V, the IC starts up. The energy stored on the 330µF, C15, capacitor supplies the IC with running power until the supplemental winding on L1 can provide the power to sustain operation.
The values of the start-up resistor R10 and capacitor C15 may need to be optimized depending on the application. The charging waveform for the secondary winding of L1 is an inverted chopped sinusoid which reaches its peak when the line voltage is at its minimum. In this example, C9 = 0.1µF, C15 = 330µF, D8 = 1N4148, R10 = 39kΩ, 2W.
ENHANCEMENT CIRCUIT
The power factor enhancement circuit shown in Figure 12 is described in detail in Application Note 11. It improves the power factor and lowers the input current harmonics. Note that the circuit meets IEC 1000-3-2 specifications (with the enhancement) on the harmonics by a large margin while correcting the input power factor to better than 0.99 under most steady state operating conditions.
CONSTRUCTION AND LAYOUT TIPS
High frequency power circuits require special care during breadboard construction and layout. Double sided printed circuit boards with ground plane on one side are highly recommended. All critical switching leads (power FET, output diode, IC output and ground leads, bypass capacitors) should be kept as small as possible. This is to minimize both the transmission and pick-up of switching noise.
There are two kinds of noise coupling; inductive and capacitive. As the name implies inductive coupling is due to fast changing (high di/dt) circulating switching currents. The main source is the loop formed by Q1, D5, and C3–C4. Therefore this loop should be as small as possible, and the above capacitors should be good high frequency types.
The second form of noise coupling is due to fast changing voltages (high dv/dt). The main source in this case is the drain of the power FET. The radiated noise in this case can be minimized by insulating the drain of the FET from the heatsink and then tying the heatsink to the source of the FET with a high frequency capacitor (C
in Figure 12).
H
The IC has two ground pins named PWR GND and Signal GND. These two pins should be connected together with a very short lead at the printed circuit board exit point. In general grounding is very important and ground loops should be avoided. Star grounding or ground plane techniques are preferred.
10 REV. 1.0 10/10/2000
Page 11
TYPICAL APPLICATIONS (Continued)
MATERIAL MANUFACTURER PART # TURNS (#24AWG)
Powdered Iron Micrometals T225-8/90 200 Powdered Iron Micrometals T184-40 120
Molypermalloy SPANG (Mag. Inc.) 58076-A2 (high flux) 180
Table 1. Toroidal Cores (L1)
ML4812
MAGNETICS TIPS
L1 Main Inductor
As shown in Table 1, one of several toroidal cores can be used for L1. The T184-40 core above is the most economical, but has lower inductance at high current. This would yield higher ripple current and require more line EMI filtering. The value for R
(slope compensation
SC
resistor on RAMP COMP) was calculated for the T225-8/ 90 and should be recalculated for other inductor characteristics. The various core manufacturers have a range of applications literature available. A gapped ferrite core can also be used in place of the powdered iron core. One such core is a Philips Components (Ferroxcube) core #4229PL00-3C8. This is an ungapped core. Using 145 turns of #24 AWG wire, a total air gap of 0.180" is required to give a total inductance of about 2mH. Since 1/2 of the gap will be on the outside of the core and 1/2 the gap on the inside, putting a 0.09" spacer in the center will yield a 0.180" total gap. To prevent leakage fields from generating RFI, a shorted turn of copper tape should be wrapped around the gap as shown in Figure 11. For production, a gapped center leg can be ordered from most core vendors, eliminating the need for the external shorted copper turn when using a potentiometer core.
T1 Sense Transformer
In addition to the core type mentioned in the parts list, the following Siemens cores should be suitable for substitution and may be more readily available in Europe.
MATERIAL SIZE CODE PART #
N27 R16/6.3 B64290-K45-X27 N30 R16/6.3 B64290-K45-X830
The N27 material is for high frequency and will work better above 100KHz but both are adequate. In addition, Philips Components (Ferroxcube) core 768T188-3C8 can be used. Please also refer to the list of core vendors below
SPANG/Magnetics Inc. 1 (800) 245-3984, or
(412) 282-8282 Micrometals 1 (800) 356-5977 Philips Components (914) 247-2064
COPPER FOIL
SHORTED TURN
0.09" GAP
Figure 11. Copper Foil Shorted Turn
REV. 1.0 10/10/2000 11
Page 12
ML4812
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
90 TO
260 VAC
AC IN
P
1
FUSE F1
5A 250V
L
N
C
1
1µF
630V
D
1
1N5406
D
2
1N5406
D
3
1N5406
R
GMOUT
27k
D
10
1N5406
OPTIONAL
ENHANCEMENT
CKT.
R
12
1K
C
17
Q
3
C
19
+
D
13
D
12
D
11
R
3
22k
C
F
D
4
1N5406
R
2A
10k
R
2B
3.9k
R
5B
3.9k
R
5A
10k
R
1B
180k
R
4B
180k
R
PB
150k
R
PA
360k
R
4A
180k
1
2
N
P
N
S
R
10
39k
2W
R
SC
33k
R
T
7.5k
ML4812
IC
1
C
16
100µF
25V
+
D
9
D
8
Q
2
7812
C
T
2nF
C15
P3*
C10
1µF
330µF
25V
V
CC
D
5
MUR850
OFF-LINE START-UP
AND BIAS SUPPLY
C
18
R
11
33k
C
11
1nF
D
6
T
1
A
B
R
S
100
C
9
0.1µF
C
8
0.1µF
R
G
10
+
Q
1
IRF840
HEATSINK
C
H
6.8nF
R
7
150k
1W
R
6
150k
1W
C
3
6.8nF
1kV
C
4
1µF
630V
C
5
680µF
200V
C
6
680µF
200V
P
2
V
OUT
380 VDC
** SEE NOTES BELOW
NOTES:
1. ALL UNSPECIFIED DIODES ARE 1N4148.
2. ALL UNSPECIFIED RESISTORS ARE 1/4 WATT.
3. ALL UNSPECIFIED CAPACITOR VOLTAGE RATINGS ARE 50V.
4. ADJUST R
2A
AND R
5A
WITH CAUTION TO AVOID OVER VOLTAGE CONDITIONS.
Q
3
= 2N2222 OR EQUIVALENT.
P3 IS USED AT INITAL TURN-ON TO
CHECK THE IC FOR PROPER OPERATION.
APPLY 16VDC.
FIXED RESISTORS CAN BE USED FOR THE SENSING
COMPONENTS. BELOW ARE 1% STANDARD
RESISTORS THAT WILL FORCE THE CORRECT
OUTPUT VOLTAGES R1A, R1B, R4A, R4B = 178k
1%,
R2B = 4.75 1%, R5B = 4.53k
1%.
USE JUMPERS INSTEAD OF R2A AND R5A (POTS).
FOR HIGHER POWER USE MORE V
CC
DECOUPLING.
2µF OR MORE BE REQUIRED AT 1KW LEVELS.
*
**
***
R
13
22k
R
1A
180k
L
1
***
+
+
12 REV. 1.0 10/10/2000
Figure 12. Typical Application, 200W Power Factor Correction Circuit
Page 13
ML4812
REFERENCE DESCRIPTION
C1, C4 1µF, 630V Film (250VAC) C3, C
H
6.8nF, 1KV Ceramic disk
C5, C6 680µF, 200V Electrolytic C8, C9 0.1µF, 50V Ceramic C10, C19 1µF, 50V Ceramic C11 0.001µF, 50V Ceramic C15 330µF, 25V Electrolytic C16 100µF, 25V Electrolytic C17 10µF, 25V Electrolytic C
F
C
T
0.47µF, 50V Ceramic
0.002µF, 50V Ceramic
D1, D2, D3, D4, D10 1N5406 (Motorola) D5 MUR850 (Motorola) D6, D8, D9 1N4148
D11, D12, D13 F1 5A, 250V 3AG with clips IC1 ML4812CP (Micro Linear) L1 2mH, 4A I
PEAK
(see note) Q1 IRF840 or MTPN8N50 Q2 LM7815CT Q3 2N2222 or equivalent
REFERENCE DESCRIPTION
R1A, R1B, R4A, R4B 180k R2A, R5A 10k TRIMPOT BOURNS
3299 or equivalent
R2B, R5B 3.9k R3, R13 22k R6, R7, RPB 150k R10 39k, 2W R11 33k R12 1k RG 10 RM 27k RPA, R15 360k RS 100k RSC 33k RT 7.5k T1 SPANG F41206-TC
NS = 80, NP = 1 (see note)
Notes: All resistors 1/4W unless otherwise specified. Some reference designators
are skipped (e.g. C2, C12, etc.) and do not appear on the schematic. These designators were used in previous revisions of the board and are not used on this revision. Additional information on key components is included in the attached appendix.
Table 2. Component Values/Bill of Materials for Figure 12
REV. 1.0 10/10/2000 13
Page 14
ML4812
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
+
C12
1µF
630V
C10
680µF
250V
C11
680µF
250V
GND
V
OUT
C9
15µF
630V
C8
15µF
630V
D5 MUR3050
R4
150K
1W
R5
150K
1W
APT5025
GND
1T
Q2
APT5025
Q1
T1
D4
80T
C14
1µF
***
RG1
3
RG2
3
C7
0.1µF
C4
0.1µF
RS
22
C5
1nF
V
CC
CT 2.2nF
R3
33K
R722K
IC1
ML4812
RT
6.2K
RSC
51K
L1
566µH
RPA
360K
RPB
150K
R4A
360K
R4B
180K
R1B
180K
R1A
180K
CF
R5A
5K
R5B
3K
R2B
3K
R2A
5K
RM
27K
D1
1N5406
BRIDGE
RECTIFIER
C3
1µF
500V
C2
1µF
500V
C1
1µF
500V
FUSE F1
15A 250V
L
AC
IN
N
R1 R2
330K 22K R6
C13
10µF
GND
V
CC
Q3
D2
V
Z
3.5V
+
ENHANCEMENT CIRCUIT SEE TEXT
2N2222
**
C6
1µF
NOTES:
1. ALL UNSPECIFIED DIODES ARE 1N4148.
2. ALL UNSPECIFIED RESISTORS ARE 1/4 WATT.
3. ALL UNSPECIFIED CAPACITOR VOLTAGE RATINGS ARE 50V.
4. ADJUST R
2A
AND R
5A
WITH CAUTION TO AVOID OVER VOLTAGE CONDITIONS.
Q
3
= 2N2222 OR EQUIVALENT.
AT INITIAL TURN-ON TO CHECK
THE IC FOR PROPER OPERATION,
APPLY 16VDC.
FIXED RESISTORS CAN BE USED FOR THE SENSING
COMPONENTS. BELOW ARE 1% STANDARD
RESISTORS THAT WILL FORCE THE CORRECT
OUTPUT VOLTAGES R1A, R1B, R4A, R4B = 178k
1%,
R2B = 4.75 1%, R5B = 4.53k
1%.
USE JUMPERS INSTEAD OF R2A AND R5A (POTS).
FOR HIGHER POWER USE MORE V
CC
DECOUPLING.
*
**
***
14 REV. 1.0 10/10/2000
Figure 13. 1kW Input Power, Power Factor Correction Circuit
Page 15
PHYSICAL DIMENSIONS inches (millimeters)
0.740 - 0.760
(18.79 - 19.31)
16
ML4812
Package: P16
16-Pin PDIP
0.02 MIN (0.50 MIN) (4 PLACES)
0.170 MAX (4.32 MAX)
0.125 MIN (3.18 MIN)
PIN 1 ID
1
0.055 - 0.065 (1.40 - 1.65)
0.016 - 0.022 (0.40 - 0.56)
0.385 - 0.395
(8.89 - 10.03)
0.350 - 0.356 (8.89 - 9.04)
1
0.100 BSC (2.54 BSC)
SEATING PLANE
Package: Q20
20-Pin PLCC
0.240 - 0.260 (6.09 - 6.61)
0.015 MIN (0.38 MIN)
0.295 - 0.325 (7.49 - 8.26)
0º - 15º
0.042 - 0.056 (1.07 - 1.42)
0.008 - 0.012 (0.20 - 0.31)
0.025 - 0.045 (0.63 - 1.14)
(RADIUS)
0.042 - 0.048 (1.07 - 1.22)
PIN 1 ID
6
0.050 BSC (1.27 BSC)
0.026 - 0.032 (0.66 - 0.81)
0.013 - 0.021 (0.33 - 0.53)
11
SEATING PLANE
0.350 - 0.356
16
(8.89 - 9.04)
0.165 - 0.180 (4.19 - 4.57)
0.385 - 0.395
(8.89 - 10.03)
0.146 - 0.156 (3.71 - 3.96)
0.200 BSC (5.08 BSC)
0.009 - 0.011 (0.23 - 0.28)
0.100 - 0.110 (2.54 - 2.79)
0.290 - 0.330 (7.36 - 8.38)
REV. 1.0 10/10/2000 15
Page 16
ML4812
ORDERING INFORMATION
PART NUMBER TEMPERATURE RANGE PACKAGE
ML4812CP 0°C to 70°C Molded PDIP (P16)
ML4812CQ 0°C to 70°C Molded PLCC (Q20)
ML4812IP –40°C to 85°C Molded PDIP (P16)
ML4812IQ –40°C to 85°C Molded PLCC (Q20)
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
www.fairchildsemi.com © 2000 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
16 REV. 1.0 10/10/2000
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