Datasheet MK2058-01SI, MK2058-01SITR Datasheet (ICST)

MK2058-01

Communications Clock Jitter Attenuator

Description

The MK2058-01 is a VCXO (V oltage Controlled Crystal
Oscillator) based clock jitter attenuator designed for
system clock distribution applications. This monolithic
IC, combined with an external inexpensive quartz
crystal, can be used to replace a more costly hybrid
VCXO retiming module. The device accepts and
outputs the sa me cl o ck f re que ncy i n se lect a ble ra ng es
covering 4kHz to 27MHz. A dual input mux is also
provided.

By controlling the VCXO frequency within a
phase-locked loop (PLL), the output clock is phase and
frequency locked to the input clock. Through selection
of external loop filter components, the PLL loop
bandwidth and damping factor can be tailored to meet
system clock requirements. A loop bandwidth down to
the Hz range is possible.

Block Diagram

Features

• Excellent jitter attenuation for telecom clocks

• Also serves as a general purpose clock jitter

attenuator for distributed system clocks and
recovered data or video clocks

• 2:1 Input MUX for input reference clocks

• VCXO-based clock generation offers very low jitter

and phase noise generation

• Output clock is phase and frequency locked to the

selected input reference clock

• Fixed input to output phase relationship

• +115ppm minimum crystal frequency pullability

range, using recommended crystal

• Industrial temperature range

• Low power CMOS technology

• 20 pin SOIC package

• Single 3.3V power supply

Input Clock
Input Clock

ISEL

SEL2:0

ICLK2
ICLK1

Pullable xtal

ISET

1
0

3

Phase

Detector

Charge

Pump

CHGP

VCXO

VIN

X2X1

Selectable

VDD

Divider

4GND

VDD

3

CLK

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MK2058-01

Communications Clock Jitter Attenuator

Pin Assignment

X1 X2
VDD
VDD
VDD

VIN
GND
GND
GND

CHGP

ISE T

1
2
3
4
5
6
7
8
9
10

20 pin 300 mil SOIC

Pin Descriptions

Pin

Number

1 X1 - Crystal Input. Connect this pin to the specified crystal.
2 VDD Power Power Supply. Connect to +3.3V.
3 VDD Power Power Supply. Connect to +3.3V.
4 VDD Power Power Supply. Connect to +3.3V.
5 VIN Input VCXO Control Voltage Input. Connect this pin to CHGP pin and the external

6 GND Power Connect to ground
7 GND Power Connect to ground
8 GND Power Connect to ground
9 CHGP Output Charge Pump Output. Connect this pin to the external loop filter and to pin

10 ISET - Charge pump current setting node, connection for setting resistor.
11 SEL2 Input Output Frequency Selection Pin 2. Determines output frequency as per table

12 SEL1 Input Output Frequency Selection Pin 1. Determines output frequency as per table

13 NC Input No Internal Connection.
14 CLK Output Clock Output
15 SEL0 Input Output Frequency Selection Pin 0. Determines output frequency as per table

16 ICLK2 Input Input Clock Connection 2. Connect an input reference clock to this pin. If

17 ICLK1 Input Input Clock Connection 1. Connect an input reference clock to this pin. If

18 ISEL Input Input Sel ection. Us ed to select which refere nce input cloc k is activ e. Low inpu t

19 GND Power Connect to ground.
20 X2 - Crystal Output. Connect this pin to the specified crystal.

Pin

Name

20
19
18
17
16
15
14
13
12
11

Pin

Type

Output Clock Selection Table

Input / Output

SEL2 SEL1 SEL0

GND
ISEL
IC L K1
IC L K2
SEL0
CLK
NC
SEL1
SEL2

0 0 0 4.4 to 8.79 kHz 3072 x ICLK
0 0 1 1 to 1.6 MHz 16 x ICLK
0 1 0 1.6 to 2.7 MHz 10 x ICLK

0 1 1 2.7 to 4.5 MHz 6 x ICLK
M 0 0 6.6 to 13.2 kHz 2048 x ICLK
M 0 1 7.8 to 15.734kHz 1716 x ICLK
M 1 0 64 to 70 kHz 384 x ICLK
M 1 1 105 to 210 kHz 128 x ICLK

1 0 0 4.0 to 6.8 MHz 4 x ICLK

1 0 1 5.5 to 9 MHz 3 x ICLK

1 1 0 8.5 to 13.5 MHz 2 x ICLK

1 1 1 13.5 to 27 MHz 1 x ICLK

Note: For SEL input pin programming:

0 = GND, 1 = VDD, M = Floating

Pin Description

loop filter as shown in this data sheet.

VIN.

above. Internally biased to VDD/2.

above. Internal pull-up.

above. Internal pull-up.

unused, connect to ground.

unused, connect to ground.

level selects ICLK1, high input level selects ICLK2. Internal pull-up.

Range

Crystal

Frequency

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Communications Clock Jitter Attenuator

MK2058-01

Functional Description

The MK2058-01 is a clock generator IC that generates
an output clock directly from an internal VCXO circuit
which works in conjunction with an external quartz
crystal. The VCXO is controlled by an internal PLL
(Phase Locked Loop) circuit, enabling the device to
perform clock regeneration from an input reference
clock. The MK2058-01 is configured to provide an
output clock that is the same frequency as the input
clock. There are 12 selectable input / output frequency
ranges, each of which is a submultiple of the supported
quartz crystal frequency range. Please refer to the
Output Clock Selection Table on Page 2.

Most typical PLL clock devices use an internal VCO
(Voltage Controlled Oscillator) for output clock
generation. By using a VCXO with an external crystal,
the MK2058-01 is able to generate a low jitter, low
phase-noise output clock within a low bandwidth PLL.
This serves to provide input clock jitter attenuation and
enables stable operation with a low frequency
reference clock.

The VCXO circuit requires an external pullable crystal
for operation. External loop filter components enable a
PLL configuration with low loop band wid th.

Application Information

output clock will change to reflect the phase of the
newly selected input at a controlled phase slope (rate
of phase change) as influenced by the PLL loop
characteristics.

Quartz Crystal

It is important that the correct type of quartz crystal is
used with the MK2058-01. Failure to do so may result
in reduced frequency pullability range, inability of the
loop to lock, or excessive output phase jitter.

The MK2058-01 operates by phase-locking the VCXO
circuit to the input signal of the selected ICLK input.
The VCXO consists of the external crystal and the
integrated VCXO oscill ator circuit. To achieve the best
performance and reliability, a crystal device with the
recommended parameters (shown bel ow) must be
used, and the layout guidelines discussed in the PCB
Layout Recommendations section must be followed.

The frequency of oscillation of a quartz crystal is
determined by its cut and by the external load
capacitance. The MK2058-01 incorporates variable
load capacitors on-chip which “pull”, or change, the
frequency of the crystal. The crystals specified for use
with the MK2058-01 are designed to have zero
frequency error when the total of on-chip + stray
capacitance is 14pF. To achieve this, the layout should
use short traces between the MK2058-01 and the
crystal.

Input / Output Frequency Configuration

The MK2058-01 is configured to generate an output
frequency that is equal to the input reference
frequency. Clock frequencies that are supported are
those which fall into the ranges listed in the Output
Clock Selection Table on Page 2. Input bits SEL2:0 are
set according to this table, as is the external crystal
frequency. The nominal (center) frequency of the
external crystal will be an integer multiple of the input /
output clock as specified. Please refer to the Quartz
Crystal section on this page regarding external crystal
requirements.

Input Mux

The Input Mux serves to select between two alternate
input reference clocks. Upon reselection of the input
clock, clock glitches on the output clock will not be

generated due to the “fly-wheel” effect of the VCXO
(the quartz crystal is a high-Q tuned circuit). When the
input clocks are not phase aligned, the phase of the

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A complete description of the recommended crystal
parameters is shown below.

Recommended Crystal Parameters:

Operating Temperature Range

Commercial Applications 0 to 70

Industrial Applications -40 to 85
Initial Accuracy at 25
Temperature Stability ±30 ppm
Aging ±20 ppm
Load Capacitance Note 1
Shunt Capacitance, C0 7 pF Max
C0/C1 Ratio 250 Max
Equivalent Series Resistance 35 Ω Max

Note 1: For crystal frequencies between 13.5MHz and
27MHz the nominal crystal load capacitance
specification should be 14pF. Contact ICS MicroClock
applications at [phone] regarding the use of a
crystal below 13.5MHz.

°C ±20 ppm

°C
°C

MK2058-01

Communications Clock Jitter Attenuator

To obtain a list of qualified crystal devices that meet
these requirements, please contact ICS MicroClock
applications department.

PLL Loop Filter Components

All analog PLL circuits use a loop filter to establish
operating stability. The MK2058-01 uses external loop
filter components for the following reasons:

1) Larger loop filter capacitor values can be used,
allowing a lower loop bandwidth. This enables the use
of lower input clock reference frequencies and also
input clock jitter attenuation capabilities. Larger loop
filter capacitors also allow higher loop damping factors
when less passband peaking is desired.

2) The loop filter values can be user selected to
optimize loop response characteristics for a given
application.

Referencing the External Component Schematic on
this page, the external loop filter is made up of the
components R

, C1 and C2. R

Z

charge pump current and therefore influences loop
filter characteristics.

establishes PLL

SET

External Compon ent Schematic

C

L

Don’t Stuff

(Re fe r to Optio n a l

Crystal Tuning

section)

C

2

X1 X2

VDD
VDD

VDD

VIN

GND

R

Z

GND
GND

C

1

CHGP

ISET

R

Xtal

1
2
3
4
5
6
7
8
9
10

SET

20
19
18
17
16
15
14
13
12
11

C

L

GND
ISEL
ICLK1
ICLK2
SEL0
CLK
NC
SEL1
SEL2

Recommended Loop Filter Values Vs. Output Frequency Range Selection

Crystal

SEL2 SEL1 SEL0

Multiplier

(N)

0 0 0 3072 120 k
0 0 1 16 1.4 M
0 1 0 10 1.4 M

011 6 1.4 MΩ100 k
M 0 0 2048 540 k
M 0 1 1716 540 k
M 1 0 384 1.4 M
M 1 1 128 1.4 M

100 4 1.4 MΩ82 k

101 3 1.4 MΩ68 k

110 2 1.4 MΩ 56 kΩ 0.1 µF 4.7 nF 160 Hz 1

111 1 1.4 MΩ 39 kΩ 0.1 µF 4.7 nF 225 Hz 1

Note: For SEL input pin programming: 0 = GND, 1 = VDD, M = Floating

R

SET

R

Z

C1 C2Loop

Bandwidth

(-3dB point)

750 k

Ω

160 k

Ω

130 k

Ω

1.2 M

Ω

1.1 M

Ω

820 k

Ω

470 k

Ω

0.1 µF 4.7 nF 14 Hz 1

Ω

0.1 µF 4.7 nF 60 Hz 1

Ω

0.1 µF 4.7 nF 75 Hz 1

Ω

0.1 µF 4.7 nF 95 Hz 1

Ω

0.1 µF 4.7 nF 8.5 Hz 1

Ω

0.1 µF 4.7 nF 9 Hz 1

Ω

0.1 µF 4.7 nF 12 Hz 1

Ω

0.1 µF 4.7 nF 20 Hz 1

Ω

0.1 µF 4.7 nF 120 Hz 1

Ω

0.1 µF 4.7 nF 130 Hz 1

Ω

Damping

Factor

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NBW

R

ZICP

× 575×

N

----------------------------------------=

MK2058-01

Communications Clock Jitter Attenuator

A “normalized” PLL loop bandwidth may be calculated
as follows:

The “normalized” bandwidth equation above does not
take into account the effects of damping factor or the
second pole. However, it does provide a useful
approximation of filter performance.

The loop damping factor is calculated as follows:

Damping Factor R

=

625 ICP×

×

-----------------------------------------

Z

C

×

1

N

Where:

= Value of resistor in loop filter (Ohms)

R

Z

= Charge pump current (amps)

I

CP

(refer to Charge Pump Current Table, below)

N = Crystal multiplier shown in the above table

= Value of capacitor C1 in loop filter (Farads)

C

1

As a general rule, the following relationship should be
maintained between components C

and C2 in the loop

1

filter:

C

1

C

----- -

=

2

20

Charge Pump Current Table

Charge Pump Current

R

SET

1.4 MΩ 10 µA
680 kΩ 20 µA
540 kΩ 25 µA
120 kΩ 100 µA

(I

)

CP

1) The loop capacitors should be a low-leakage type to
avoid leakage-induced phase noise. For this reason,
DO NOT use any type of polarized or electrolytic
capacitors.

2) Microphonics (mechanical board vibration) can also
induce output phase noise, especially when the loop
bandwidth is less than 1kHz. For this reason, ceramic
capacitors should have C0G or NP0 dielectric. Avoid
high-K dielectrics like Z5U and X7R. These and some
other ceramics have piezoelectric properties that
convert mechanical vibration into voltage noise that
interferes with VCXO operation.

For larger loop capacitor values such as 0.1 µF or 1 µF,
PPS film types made by Panasonic, or metal poly types
made by Murata or Cornell Dubilier are recommended.

For questions or changes regarding loop filter
characteristics, please contact your sales area FAE, or
ICS MicroClock Applications.

Series Termination Resistor

Clock output traces over one inch should use series
termination. To series terminate a 50Ω trace (a
commonly used trace impedance), place a 33Ω resistor
in series with the clock line, as close to the clock output
pin as possible. The nominal impedance of the clock
output is 20Ω. (The optional series termination resistor
is not shown in the External Component Schematic.)

Decoupling Capacitors

As with any high performance mixed-signal IC, the
MK2058-01 must be isolated from system power
supply noise to perform optimally.

Decoupling capacitors of 0.01µF must be connected
between each VDD and the PCB ground plane. To
further guard against interfering system supply noise,
the MK2058-01 should use one common connection to
the PCB power plane as shown in the diagram on the
next page. The ferrite bead and bulk capacitor help
reduce lower frequency noise in the supply that can
lead to output clock phase modulation.

Special considerations must be made in choosing loop
components C

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and C2:

1

Connection to 3.3V

Power Plane

Ferrite

Bead

Bulk Decoupling Capacitor

(such as 1

µF Tantalum)

VDD Pin

VDD Pin

VDD Pin

0.01

µF D eco upling Capac itors

MK2058-01

Communications Clock Jitter Attenuator

Recommended Power Supply Connection
for Optimal Device Performance

Crystal Load Capacitors

The device crystal connections should include pads for
small capacitors from X1 to ground and from X2 to
ground, shown as C
Schematic. These capacitors are used to adjust the
stray capacitance of the board to match the nominally
required crystal load capacitance. Because load
capacitance can only be increased in this trimming
process, it is important to keep stray capacitance to a

minimum by using very short PCB traces (and no via’s)
been the crystal and device.

In most cases the load capacitors will not be required.
They should not be stuffed on the prototype evaluation
board as the indiscriminate use of these trim capacitors
will typically cause more crystal centering error than
their absence. If the need for the load capacitors is later
determined, the values will fall within the 1-4 pf range.
The need for, and value of, these trim capacitors can
only be determined at prototype evaluation. Please
refer to the Optimization of Crystal Load Capacitors
section for more information.

PCB Layout Recommendations

For optimum device performance and lowest output
phase noise, the following guidelines should be
observed. Pl ease als o refe r to the Re commend ed PCB
Layout drawing on Page 7.

1) Each 0.01µF decoupling capacitor should be
mounted on the component side of the board as close
to the VDD pin as possible. No vias should be used
between decoupling capacitor and VDD pin. The PCB
trace to VDD pin should be kept as short as possible,

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in the External Component

L

as should the PCB trace to the ground via. Distance of
the ferrite bead and bulk decoupling from the device is
less critical.

2) The loop filter components must also be placed
close to the CHGP and VIN pins. C

should be closest

2

to the device. Coupling of noise from other system
signal traces should be minimized by keeping traces
short and away from active signal traces. Use of vias
should be avoided.

3) The external crystal should be mounted just next to
the device with short traces. The X1 and X2 traces
should not be routed next to each other with minimum
spaces, instead they should be separated and away
from other traces.

4) T o minimize EMI the 33Ω series termination resistor ,
if needed, should be placed close to the clock output.

5) An optimum layout is one with all components on the
same side of the board, minimizing vias through other
signal layers (the ferrite bead and bulk decoupling
capacitor can be mounted on the back). Other signal
traces should be routed away from the MK2058-01.
This includes signal traces just underneath the device,
or on layers adjacent to the ground plane layer used by
the device.

The ICS Applications Note MAN05 may also be
referenced for additional suggestions on layout of the
crystal section.

Optimization of Crystal Load Capacitors

The concept behind the optional crystal load capacitors
was introduced previously in this data sheet (see
Crystal Load Capacitor section on Page 5). To
determine the need for and value of these capacitors,
you will need a PCB of your final layout, a frequency
counter capable of less than 10 ppm resolution and
accuracy, two power supplies, and some samples of
the crystals which you plan to use in production, along
with measured initial accuracy for each crystal at the
specified crystal load capaci tance, CL.

To determine the value of the crystal capacitors:

1. Connect VDD to 3.3V. Connect pin 5 to the second
power supply. Adjust the voltage on pin 5 to 0V.
Measure and record the frequency of the CLK output.

Error 106x

f

3.0Vftetarg

–()f0Vf

tetarg

–()+

f

tetarg

------------------------------------------------------------------------------

error

xtal

–=

MK2058-01

Communications Clock Jitter Attenuator

2. Adjust the voltage on pin 5 to 3.3V. Measure and
record the frequency of the same output.

To calculate the centering error:

Where:

= nominal crystal frequency

f

target

error

=actual initial accuracy (in ppm) of the crystal

xtal

being measured

If the centering error is less than ±15 ppm, adjustment
is not needed for most applications. If the cente ring
error is more than 15 ppm negative, the PCB has too

Recommended PCB Layout

much stray capacitance and will need to be redone with
a new layout to reduce stray capacitance. Alternately,
the crystal may be re-specified for a higher lower load
capacitance. Contact ICS MicroClock for details. If the
centering error is more than 15 ppm positive, add
identical fixed centering capacitors from each crystal
pin to ground. The value for each of these caps (in pF)
is given by:

External Capacitor =
2 x (centering error)/(trim sensitivity)
Trim sensitivity is a parameter which can be supplied

by your crystal vendor. If you do not know the value,
assume it is 30 ppm/pF. After any changes, repeat the
measurement to verify that the remaining error is
acceptably low (less than ±15ppm).

For minimum ou tput clock jitter,
device VDD conne ctions should
be made to comm on bulk
decoupling device (see text).

G

G

G

G

1
2
3
4
5

G

6
7
8

G

G

9

G

10

G

20

G

19
18
17
16
15
14
13
12
11

For minimum ou tput clock jitter,
remove ground and power plane
within th is e n tire a rea . A lso ro u te
all other traces awa y from this area.

NC

Legend:

G

= Ground
Co n n ec tion

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Absolute Maximum Ratings

Stresses above the ratings listed below can cause permanent damage to the MK2058-01. These ratings,
which are standard values for ICS commercially rated parts, are stress ratings only . Functional operation of
the device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.

Item Rating

Supply Voltage, VDD 7V

All Inputs and Outputs -0.5V to VDD+0.5V

Ambient Operating Temperature -40 to +85°C

Storage Temperature -65 to +150°C

Junction Temperature 175°C

Soldering Tempe ra tur e 260°C

MK2058-01

Communications Clock Jitter Attenuator

Recommended Operation Conditions

Parameter Min. Typ. Max. Units

Ambient Operating Temperature -40 – +85

Power Supply Voltage (measured in respect to GND) +3.15 +3.3 +3.45 V

DC Electrical Characteristics

Unless stated otherwise, VDD = 3.3V ±5%, Ambient Temperature -40 to +85°C

Parameter Symbol Conditions Min. Typ. Max. Units

Operating Voltage VDD 3.15 3.3 3.45 V

Supply Current IDD Clock outputs

unloaded, VDD = 3.3V
Input High Voltage, SEL2 V
Input Low Voltage, SEL2 V
Input High Voltage, ISEL,

SEL1:0
Input Low Voltage, ISEL,

SEL1:0
Input High Voltage, ICLK1, 2 V
Input Low Voltage, ICLK1, 2 V
Input High Current I
Input Low Current I
Input Capacitance, except X1 C

IH
IL

V

IH

V

IL

IH

IL
IH
IL

V

IH

V

IL

IN

C

°

10 15 m A

–VDD-0.5––V
–––0.5V
–2––V

–––0.8V

–
–––

VDD/2+1

––V

VDD/2-1

V

= VDD -10 – +10 µA

= 0 -10 – +10 µA

––7–pF

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Parameter Symbol Conditions Min. Typ. Max. Units

Output High Voltage (CMOS
Level)

Output High Voltage V
Output Low Voltage V
Short Circuit Current I
VIN, VCXO Control Voltage V
Nominal Output Impedance Z

AC Electrical Characteristics

Unless stated otherwise, VDD = 3.3V ±5%, Ambient Temperature -40 to +85° C

Parameter Symbol Conditions Min. Typ. Max. Units

VCXO Crystal Pull Range f

VCXO Crystal Nominal
Frequency

Input Jitter Tolerance t
Input pulse width (1) t
Output Frequency Error F
Output Duty Cycle (% high

time)
Output Rise Time t
Output Fall Time t
Skew, Input to Output Clock t
Cycle Jitter (short term jitter) t
Timing Jitter, Filtered

500Hz-1.3MHz (OC-3)

Timing Jitter, Filtered
65kHz-1.3MHz (OC-3)

V

OUT

OH

OH
OL

OS

XC

Communications Clock Jitter Attenuator

I

= -4 mA VDD-0.4 V

OH

I

= -8 mA 2.4 V

OH

IOL = 8 mA – – 0.4 V

±50 mA

0VDDV

20

XP

Using Recommended

-115 +115 ppm

Crystal

f

X

pi

OUT

t

OD

OR
OF

IO

ja

t

ji

ICLK = 0 ppm error 0 0 0 ppm
Measured at VDD/2,

=15pF

C

L

0.8 to 2.0V, CL=15pF 1.5 ns

2.0 to 0.8V, CL=15pF 1.5 ns
Rising edges, CL=15pF -5 +5 ns
150 ps p-p

jf

Referenced to

8.5 27 MHz

10 ns

40 – 60 %

210 ps p-p
Mitel/Zarlink MT9045,
Note 2

t

jf

Referenced to

150 ps p-p
Mitel/Zarlink MT9045,
Note 2

MK2058-01

Ω

0.4 UI

Note 1: Minimum high or low time of input clock.
Note 2: Input reference is the 19.44 MHz output from a Mitel/Zarlink MT9045 device in freerun mode

(SEL2:0 = 111, 19.44 MHz external crystal).

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MK2058-01

Communications Clock Jitter Attenuator

Package Outline and Package Dimensions (20 pin SOIC, 300 Mil. Wide Body)

Package dimensions are kept current with JEDEC Publication No. 95

Millimeters Inches

Symbol Min Max Min Max

A -- 2.65 -- 0.104
A1 1.10 -- 0.0040 -­A2 2.05 2.55 0.081 0.100

Ind ex
Area

E

H

B 0.33 0.51 0.013 0.020

C 0.18 0.32 0.007 0.013

D 12.60 13.00 0.496 0.512

E 7.40 7.60 0.291 0.299

e 1.27 Basic 0.050 Basic

H 10.00 10.65 0.394 0.419

h 0.25 0.75 0.010 0.029
L 0.40 1.27 0.016 0.050

α

0

°

8

°

0

°

8

°

A2

A1

12

D

α

Be

h x 45

o

A

C

L

Ordering Information

Part / Order Number Marking Shipping

packaging

MK2058-01SI MK2058-01SI Tubes 20 pin SOIC -40 to +85° C

MK2058-01SITR MK2058-01SI Tape and Reel 20 pin SOIC -40 to +85° C

While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)
assumes no responsibility for either its use or for the infringement of any patent s or other rights of third parties, which would
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any oth er ap pl ic ations such as those req uiri ng extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or
critical medical instruments.

Package Temperature

MDS 2058-01 B 10 Revision 071001
Integrated Circuit Systems, Inc. ● 525 Race St reet, San Jose, CA 9512 6 ● tel [phone] ● www.icst.com