The MIC5219 is an efficient linear voltage regulator with high
peak output current capability, very-low-dropout voltage, and
better than 1% output voltage accuracy. Dropout is typically
10mV at light loads and less than 500mV at full load.
The MIC5219 is designed to provide a peak output current for
start-up conditions where higher inrush current is demanded.
It features a 500mA peak output rating. Continuous output
current is limited only by package and layout.
The MIC5219 can be enabled or shut down by a CMOS or
TTL compatible signal. When disabled, power consumption
drops nearly to zero. Dropout ground current is minimized to
help prolong battery life. Other key features include reversedbattery protection, current limiting, overtemperature shutdown, and low noise performance with an ultra-low-noise
option.
The MIC5219 is available in adjustable or fixed output voltages in the space-saving 6-pin (2mm × 2mm) MLF™,
SOT-23-5 and MM8™ 8-pin power MSOP packages. For
higher power requirements see the MIC5209 or MIC5237.
All support documentation can be found on Micrel’s web
site at www.micrel.com.
Features
• 500mA output current capability
SOT-23-5 package - 500mA peak
××
2mm
×2mm MLF package - 500mA continuous
××
MSOP-8 package - 500mA continuous
• Low 500mV maximum dropout voltage at full load
• Extremely tight load and line regulation
•Tiny SOT-23-5 and MM8™ power MSOP-8 package
•Ultra-low-noise output
• Low temperature coefficient
• Current and thermal limiting
• Reversed-battery protection
• CMOS/TTL-compatible enable/shutdown control
• Near-zero shutdown current
Applications
• Laptop, notebook, and palmtop computers
• Cellular telephones and battery-powered equipment
• Consumer and personal electronics
• PC Card VCC and VPP regulation and switching
• SMPS post-regulator/DC-to-DC modules
•High-efficiency linear power supplies
Typical Applications
MIC5219-5.0BMM
ENABLE
HUTDOWN
V
V
6V
IN
5V
OUT
2.2µF
tantalum
1
2
3
4
470pF
5V Ultra-Low-Noise Regulator
ENABLE
SHUTDOWN
MM8 is a trademark of Micrel, Inc.
MicroLeadFrame and MLF are trademarks of Amkor Technology.
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 474-1000 • fax + 1 (408) 474-1000 • http://www.micrel.com
1. Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating
the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, T
the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient
temperature is calculated using: P
temperature, and the regulator will go into thermal shutdown. See Table 1 and the “Thermal Considerations” section for details.
(max) = (TJ(max) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die
D
2. The device is not guaranteed to function outside its operating rating.
3. Specification for packaged product only.
4. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.
5. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range
from 100µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
6. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential.
7. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load
current plus the ground pin current.
8. V
is the voltage externally applied to devices with the EN (enable) input pin.
EN
9. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line
regulation effects. Specifications are for a 500mA load pulse at VIN = 12V for t = 10ms.
10. C
is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust) pin.
BYP
(max),
J
March 20055M999-031205
Page 6
MIC5219Micrel, Inc.
-100
-80
-60
-40
-20
0
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
PSRR (dB)
FREQUENCY (Hz)
-100
-80
-60
-40
-20
0
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
PSRR (dB)
FREQUENCY (Hz)
0.0001
0.001
0.01
0.1
1
10
1E+1 1E+2 1E+31E+4 1E+51E+6 1E+7
NOISE (µV/√Hz)
FREQUENCY (Hz)
0
100
200
300
400
0100 200 300 400 500
DROPOUT VOLTAGE (mV)
OUTPUT CURRENT (mA)
Typical Characteristics
Power Supply
Rejection Ratio
0
-20
VIN = 6V
V
= 5V
OUT
-40
-60
PSRR (dB)
-80
-100
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
FREQUENCY (Hz)
I
= 100µA
OUT
C
= 1µF
OUT
1k
10k
100k
Power Supply
Rejection Ratio
0
VIN = 6V
V
= 5V
OUT
-20
-40
-60
PSRR (dB)
-80
-100
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
FREQUENCY (Hz)
I
= 100µA
OUT
C
= 2.2µF
OUT
C
= 0.01µF
BYP
1k
10k
100k
1M
1M
10M
10M
Power Supply
Rejection Ratio
0
-20
VIN = 6V
V
= 5V
OUT
-40
-60
PSRR (dB)
-80
-100
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
FREQUENCY (Hz)
I
= 1mA
OUT
C
= 1µF
OUT
1k
10k
100k
Power Supply
Rejection Ratio
0
VIN = 6V
V
= 5V
OUT
-20
-40
-60
PSRR (dB)
-80
-100
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
I
= 1mA
OUT
C
= 2.2µF
OUT
C
= 0.01µF
BYP
1k
10k
FREQUENCY (Hz)
100k
1M
1M
10M
10M
10
10
VIN = 6V
V
OUT
100
VIN = 6V
V
OUT
100
Power Supply
Rejection Ratio
= 5V
I
= 100mA
OUT
C
= 1µF
OUT
1k
10k
100k
Power Supply
Rejection Ratio
= 5V
I
= 100mA
OUT
C
= 2.2µF
OUT
C
= 0.01µF
BYP
1k
10k
100k
1M
1M
10M
10M
Power Supply Ripple Rejection
vs. Voltage Drop
60
50
1mA
40
30
20
10
RIPPLE REJECTION (dB)
10
0.1
0.01
NOISE (µV/√Hz)
0.001
0.0001
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10mA
I
= 100mA
OUT
C
0
00.10.20.30.4
VOLTAGE DROP (V)
OUT
Noise Performance
1
V
C
electrolytic
10
OUT
OUT
100
= 5V
= 10µF
1k
FREQUENCY (Hz)
100mA
1mA
10k 100k1M10M
= 1µF
10mA
Power Supply Ripple Rejection
100
RIPPLE REJECTION (dB)
0.1
0.01
NOISE (µV/√Hz)
0.001
0.0001
vs. Voltage Drop
90
80
1mA
70
60
50
40
10mA
30
20
10
0
00.10.20.30.4
VOLTAGE DROP (V)
Noise Performance
10
1
V
= 5V
OUT
C
= 10µF
OUT
electrolytic
C
= 100pF
BYP
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
FREQUENCY (Hz)
I
OUT
C
= 2.2µF
OUT
C
= 0.01µF
BYP
1mA
10mA
1k
10k 100k1M10M
= 100mA
100mA
Noise Performance
10mA, C
10
1k
100
Dropout Voltage
vs. Output Current
= 1µF
OUT
V
= 5V
OUT
10k 100k 1M 10M
M999-0312056March 2005
Page 7
MIC5219Micrel, Inc.
0
5
10
15
20
25
0123456789
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
Dropout Characteristics
3.5
IL =100µA
3.0
2.5
2.0
1.5
1.0
OUTPUT VOLTAGE (V)
0.5
0
IL=100mA
IL=500mA
0123456789
INPUT VOLTAGE (V)
Ground Current
vs. Output Current
12
10
8
6
4
2
GROUND CURRENT (mA)
0
0100 200 300 400 500
OUTPUT CURRENT (mA)
Ground Current
vs. Supply Voltage
3.0
2.5
2.0
1.5
1.0
0.5
GROUND CURRENT (mA)
0
02468
INPUT VOLTAGE (V)
IL=100 mA
IL=100µA
Ground Current
vs. Supply Voltage
IL=500mA
March 20057M999-031205
Page 8
MIC5219Micrel, Inc.
Block Diagrams
V
IN
C
BYP
(optional)
V
IN
BYP
Bandgap
Ref.
V
REF
EN
Current Limit
Thermal Shutdown
MIC5219-x.xBM5/MM
Ultra-Low-Noise Fixed Regulator
IN
IN
Bandgap
Ref.
V
EN
REF
GND
OUT
OUT
R1
R2
C
OUT
C
(optional)
V
BYP
OUT
V
OUT
C
OUT
Current Limit
Thermal Shutdown
MIC5219BM5/MM [adj.]
GND
Ultra-Low-Noise Adjustable Regulator
M999-0312058March 2005
Page 9
MIC5219Micrel, Inc.
Applications Information
The MIC5219 is designed for 150mA to 200mA output current
applications where a high current spike (500mA) is needed
for short, start-up conditions. Basic application of the device
will be discussed initially followed by a more detailed discussion of higher current applications.
Enable/Shutdown
Forcing EN (enable/shutdown) high (>2V) enables the regulator. EN is compatible with CMOS logic. If the enable/
shutdown feature is not required, connect EN to IN (supply
input). See Figure 5.
Input Capacitor
A 1µF capacitor should be placed from IN to GND if there is
more than 10 inches of wire between the input and the AC
filter capacitor or if a battery is used as the input.
Output Capacitor
An output capacitor is required between OUT and GND to
prevent oscillation. The minimum size of the output capacitor
is dependent upon whether a reference bypass capacitor is
used. 1µF minimum is recommended when C
(see Figure 5). 2.2µF minimum is recommended when C
is 470pF (see Figure 6). For applications < 3V, the output
capacitor should be increased to 22µF minimum to reduce
start-up overshoot. Larger values improve the regulator’s
transient response. The output capacitor value may be increased without limit.
The output capacitor should have an ESR (equivalent series
resistance) of about 1Ω or less and a resonant frequency
above 1MHz. Ultra-low-ESR capacitors could cause oscillation and/or underdamped transient response. Most tantalum
or aluminum electrolytic capacitors are adequate; film types
will work, but are more expensive. Many aluminum electrolytics have electrolytes that freeze at about –30°C, so solid
tantalums are recommended for operation below –25°C.
At lower values of output current, less output capacitance is
needed for stability. The capacitor can be reduced to 0.47µF
for current below 10mA, or 0.33µF for currents below 1mA.
No-Load Stability
The MIC5219 will remain stable and in regulation with no load
(other than the internal voltage divider) unlike many other
voltage regulators. This is especially important in CMOS
RAM keep-alive applications.
Reference Bypass Capacitor
BYP is connected to the internal voltage reference. A 470pF
capacitor (C
) connected from BYP to GND quiets this
BYP
reference, providing a significant reduction in output noise
(ultra-low-noise performance). C
phase margin; when using C
BYP
reduces the regulator
BYP
, output capacitors of 2.2µF
or greater are generally required to maintain stability.
The start-up speed of the MIC5219 is inversely proportional
to the size of the reference bypass capacitor. Applications
requiring a slow ramp-up of output voltage should consider
larger values of C
consider omitting C
. Likewise, if rapid turn-on is necessary,
BYP
.
BYP
is not used
BYP
BYP
Thermal Considerations
The MIC5219 is designed to provide 200mA of continuous
current in two very small profile packages. Maximum power
dissipation can be calculated based on the output current and
the voltage drop across the part. To determine the maximum
power dissipation of the package, use the thermal resistance,
junction-to-ambient, of the device and the following basic
equation.
T maxT
()=−
()
P max
()
D
JA
θ
JA
TJ(max) is the maximum junction temperature of the die,
125°C, and T
is the ambient operating temperature. θJA is
A
layout dependent; Table 1 shows examples of thermal resistance, junction-to-ambient, for the MIC5219.
Package
MM8™ (MM)160°C/W70°C/W30°C/W
SOT-23-5 (M5)220°C/W170°C/W130°C/W
2×2 MLF™ (ML)90°C/W——
θθ
θJA Recommended
θθ
Minimum Footprint2oz. Copper
θθ
θJA 1" Square
θθ
θθ
θ
θθ
JC
Table 1. MIC5219 Thermal Resistance
The actual power dissipation of the regulator circuit can be
determined using one simple equation.
PD = (VIN – V
OUT
) I
OUT
+ VIN I
GND
Substituting PD(max) for PD and solving for the operating
conditions that are critical to the application will give the
maximum operating conditions for the regulator circuit. For
example, if we are operating the MIC5219-3.3BM5 at room
temperature, with a minimum footprint layout, we can determine the maximum input voltage for a set output current.
125 C25 C
°−°
Pmax
()/=
D
()
°
220 C W
PD(max) = 455mW
The thermal resistance, junction-to-ambient, for the minimum footprint is 220°C/W, taken from Table 1. The maximum
power dissipation number cannot be exceeded for proper
operation of the device. Using the output voltage of 3.3V, and
an output current of 150mA, we can determine the maximum
input voltage. Ground current, maximum of 3mA for 150mA
of output current, can be taken from the “Electrical Character-istics” section of the data sheet.
455mW = (VIN – 3.3V) × 150mA + VIN × 3mA
455mW = (150mA) × VIN + 3mA × VIN – 495mW
950mW = 153mA × V
VIN = 6.2V
MAX
IN
Therefore, a 3.3V application at 150mA of output current can
accept a maximum input voltage of 6.2V in a SOT-23-5
package. For a full discussion of heat sinking and thermal
effects on voltage regulators, refer to the “Regulator Thermals”
section of Micrel’s Designing with Low-Dropout Voltage Regu-lators handbook.
March 20059M999-031205
Page 10
MIC5219Micrel, Inc.
Peak Current Applications
The MIC5219 is designed for applications where high startup currents are demanded from space constrained regulators. This device will deliver 500mA start-up current from a
SOT-23-5 or MM8 package, allowing high power from a very
low profile device. The MIC5219 can subsequently provide
output current that is only limited by the thermal characteristics of the device. You can obtain higher continuous currents
from the device with the proper design. This is easily proved
with some thermal calculations.
If we look at a specific example, it may be easier to follow. The
MIC5219 can be used to provide up to 500mA continuous
output current. First, calculate the maximum power dissipation of the device, as was done in the thermal considerations
section. Worst case thermal resistance (θJA = 220°C/W for
the MIC5219-x.xBM5), will be used for this example.
T maxT
()=−
()
P max
()
D
Assuming a 25°C room temperature, we have a maximum
power dissipation number of
P max
()/=
D
PD(max) = 455mW
Then we can determine the maximum input voltage for a 5volt regulator operating at 500mA, using worst case ground
current.
PD(max) = 455mW = (VIN – V
I
= 500mA
OUT
V
= 5V
OUT
I
= 20mA
GND
455mW = (VIN – 5V) 500mA + VIN × 20mA
2.995W = 520mA × V
V max
()
IN
Therefore, to be able to obtain a constant 500mA output
current from the 5219-5.0BM5 at room temperature, you
need extremely tight input-output voltage differential, barely
above the maximum dropout voltage for that current rating.
You can run the part from larger supply voltages if the proper
precautions are taken. Varying the duty cycle using the
enable pin can increase the power dissipation of the device
by maintaining a lower average power figure. This is ideal for
applications where high current is only needed in short
bursts. Figure 1 shows the safe operating regions for the
MIC5219-x.xBM5 at three different ambient temperatures
and at different output currents. The data used to determine
this figure assumed a minimum footprint PCB design for
minimum heat sinking. Figure 2 incorporates the same factors as the first figure, but assumes a much better heat sink.
A 1" square copper trace on the PC board reduces the
thermal resistance of the device. This improved thermal
JA
θ
JA
125 C25 C
° −°
()
°
220 C W
) I
OUT
+ VIN I
GND
2 955W
.
IN
5 683V
.==
OUT
520mA
resistance improves power dissipation and allows for a larger
safe operating region.
Figures 3 and 4 show safe operating regions for the MIC5219x.xBMM, the power MSOP package part. These graphs show
three typical operating regions at different temperatures. The
lower the temperature, the larger the operating region. The
graphs were obtained in a similar way to the graphs for the
MIC5219-x.xBM5, taking all factors into consideration and
using two different board layouts, minimum footprint and 1"
square copper PC board heat sink. (For further discussion of
PC board heat sink characteristics, refer to “Application Hint17, Designing PC Board Heat Sinks” .)
The information used to determine the safe operating regions
can be obtained in a similar manner such as determining
typical power dissipation, already discussed. Determining
the maximum power dissipation based on the layout is the
first step, this is done in the same manner as in the previous
two sections. Then, a larger power dissipation number multiplied by a set maximum duty cycle would give that maximum
power dissipation number for the layout. This is best shown
through an example. If the application calls for 5V at 500mA
for short pulses, but the only supply voltage available is 8V,
then the duty cycle has to be adjusted to determine an
average power that does not exceed the maximum power
dissipation for the layout.
% DC
Avg.P =
455mW =
455mW =
0.274 =
% Duty Cycle Max = 7.4%2
With an output current of 500mA and a three-volt drop across
the MIC5219-xxBMM, the maximum duty cycle is 27.4%.
Applications also call for a set nominal current output with a
greater amount of current needed for short durations. This is
a tricky situation, but it is easily remedied. Calculate the
average power dissipation for each current section, then add
the two numbers giving the total power dissipation for the
regulator. For example, if the regulator is operating normally
at 50mA, but for 12.5% of the time it operates at 500mA
output, the total power dissipation of the part can be easily
determined. First, calculate the power dissipation of the
device at 50mA. We will use the MIC5219-3.3BM5 with 5V
input voltage as our example.
PD × 50mA = (5V – 3.3V) × 50mA + 5V × 650µA
PD × 50mA = 173mW
DIN
% Duty Cycle
V – V IV I
()
100
% DC
8V – 5V 500mA 8V 20mA
()
100
% Duty Cycle
100
100
OUT OUT
1.66W
+
IN
GND
+×
M999-03120510March 2005
Page 11
MIC5219Micrel, Inc.
0
2
4
6
8
10
020406080100
VOLTAGE DROP (V)
DUTY CYCLE (%)
0
2
4
6
8
10
020406080100
VOLTAGE DROP (V)
DUTY CYCLE (%)
0
2
4
6
8
10
020406080100
VOLTAGE DROP (V)
DUTY CYCLE (%)
0
2
4
6
8
10
020406080100
VOLTAGE DROP (V)
DUTY CYCLE (%)
10
8
6
4
400mA
VOLTAGE DROP (V)
2
0
020406080100
DUTY CYCLE (%)
100mA
200mA
300mA
500mA
10
8
6
4
VOLTAGE DROP (V)
2
400mA
0
020406080100
100mA
200mA
300mA
500mA
DUTY CYCLE (%)
100mA
200mA
500mA
400mA
a. 25°C Ambientb. 50°C Ambientc. 85°C Ambient
Figure 1. MIC5219-x.xBM5 (SOT-23-5) on Minimum Recommended Footprint
10
8
6
4
400mA
VOLTAGE DROP (V)
2
0
020406080100
DUTY CYCLE (%)
100mA
200mA
300mA
500mA
10
8
6
4
VOLTAGE DROP (V)
2
400mA
0
020406080100
DUTY CYCLE (%)
100mA
200mA
300mA
500mA
100mA
400mA
500mA
a. 25°C Ambientb. 50°C Ambientc. 85°C Ambient
300mA
200mA
300mA
Figure 2. MIC5219-x.xBM5 (SOT-23-5) on 1-inch2 Copper Cladding
10
8
6
4
400mA
VOLTAGE DROP (V)
2
0
020406080100
500mA
DUTY CYCLE (%)
100mA
200mA
300mA
10
8
6
4
400mA
VOLTAGE DROP (V)
2
0
020406080100
DUTY CYCLE (%)
100mA
200mA
300mA
500mA
100mA
400mA
500mA
a. 25°C Ambientb. 50°C Ambientc. 85°C Ambient
Figure 3. MIC5219-x.xBMM (MSOP-8) on Minimum Recommended Footprint
10
8
6
4
2
VOLTAGE DROP (V)
0
020406080100
400mA
DUTY CYCLE (%)
200mA
300mA
500mA
10
8
6
400mA
4
2
VOLTAGE DROP (V)
0
020406080100
DUTY CYCLE (%)
200mA
300mA
500mA
400mA
500mA
a. 25°C Ambientb. 50°C Ambientc. 85°C Ambient
Figure 4. MIC5219-x.xBMM (MSOP-8) on 1-inch2 Copper Cladding
200mA
300mA
100mA
200mA
300mA
March 200511M999-031205
Page 12
MIC5219Micrel, Inc.
MIC5219-x.x
INOUT
GND
470pF
V
IN
ENBYP
2.2µF
V
OUT
However, this is continuous power dissipation, the actual
on-time for the device at 50mA is (100%-12.5%) or 87.5% of
the time, or 87.5% duty cycle. Therefore, PD must be multiplied by the duty cycle to obtain the actual average power
dissipation at 50mA.
PD × 50mA = 0.875 × 173mW
PD × 50mA = 151mW
The power dissipation at 500mA must also be calculated.
PD × 500mA = (5V – 3.3V) 500mA + 5V × 20mA
PD × 500mA = 950mW
This number must be multiplied by the duty cycle at which it
would be operating, 12.5%.
PD × = 0.125 × 950mW
PD × = 119mW
The total power dissipation of the device under these conditions is the sum of the two power dissipation figures.
P
P
P
= PD × 50mA + PD × 500mA
D(total)
= 151mW + 119mW
D(total)
= 270mW
D(total)
The total power dissipation of the regulator is less than the
maximum power dissipation of the SOT-23-5 package at
room temperature, on a minimum footprint board and therefore would operate properly.
Multilayer boards with a ground plane, wide traces near the
pads, and large supply-bus lines will have better thermal
conductivity.
For additional heat sink characteristics, please refer to Micrel
“Application Hint 17, Designing P.C. Board Heat Sinks”,
included in Micrel’s Databook. For a full discussion of heat
sinking and thermal effects on voltage regulators, refer to
“Regulator Thermals” section of Micrel’s Designing with Low-
Dropout Voltage Regulators handbook.
Fixed Regulator Circuits
IN
MIC5219-x.x
INOUT
ENBYP
GND
V
1µF
OUT
V
Figure 5 shows a basic MIC5219-x.xBMX fixed-voltage regulator circuit. A 1µF minimum output capacitor is required for
basic fixed-voltage applications.
Figure 6. Ultra-Low-Noise Fixed Voltage Regulator
Figure 6 includes the optional 470pF noise bypass capacitor
between BYP and GND to reduce output noise. Note that the
minimum value of C
must be increased when the bypass
OUT
capacitor is used.
Adjustable Regulator Circuits
V
IN
MIC5219
INOUT
ENADJ
GND
R1
R2
V
1µF
OUT
Figure 7. Low-Noise Adjustable Voltage Regulator
Figure 7 shows the basic circuit for the MIC5219 adjustable
regulator. The output voltage is configured by selecting
values for R1 and R2 using the following formula:
R2
R1
1
V1.242V
=+
OUT
Although ADJ is a high-impedance input, for best performance, R2 should not exceed 470kΩ.
V
IN
MIC5219
INOUT
ENADJ
GND
470pF
R1
R2
V
OUT
2.2µF
Figure 8. Ultra-Low-Noise Adjustable Application
Figure 5. Low-Noise Fixed Voltage Regulator
Figure 8 includes the optional 470pF bypass capacitor from
ADJ to GND to reduce output noise.
M999-03120512March 2005
Page 13
MIC5219Micrel, Inc.
Package Information
0.122 (3.10)
0.112 (2.84)
0.036 (0.90)
0.032 (0.81)
0.012 (0.03)
0.0256 (0.65) TYP
1.90 (0.075) REF
0.95 (0.037) REF
3.02 (0.119)
2.80 (0.110)
0.199 (5.05)
0.187 (4.74)
0.120 (3.05)
0.116 (2.95)
0.043 (1.09)
0.038 (0.97)
0.008 (0.20)
0.004 (0.10)
8-Pin MSOP (MM)
1.75 (0.069)
1.50 (0.059)
1.30 (0.051)
0.90 (0.035)
0.012 (0.30) R
5° MAX
0° MIN
3.00 (0.118)
2.60 (0.102)
10°
0°
DIMENSIONS:
INCH (MM)
0.039 (0.99)
0.035 (0.89)
0.021 (0.53)
DIMENSIONS:
MM (INCH)
0.007 (0.18)
0.005 (0.13)
0.012 (0.03) R
0.20 (0.008)
0.09 (0.004)
0.50 (0.020)
0.35 (0.014)
0.15 (0.006)
0.00 (0.000)
SOT-23-5 (M5)
0.60 (0.024)
0.10 (0.004)
March 200513M999-031205
Page 14
MIC5219Micrel, Inc.
TOP VIEWBOTTOM VIEW
Dimensions in
millimeter
6-Pin MLF™ (ML)
SIDE VIEW
Rev. 01
MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify
M999-03120514March 2005
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel for any damages resulting from such use or sale.