Datasheet MIC5219 Datasheet (Micrel)

Page 1
MIC5219 Micrel, Inc.
S
15
2
3
4
2.2µF tantalum
470pF
V
OUT
3.3V
MIC5219-3.3BM5
V
IN
4V
ENABLE
SHUTDOWN
MIC5219
500mA-Peak Output LDO Regulator
General Description
The MIC5219 is an efficient linear voltage regulator with high peak output current capability, very-low-dropout voltage, and better than 1% output voltage accuracy. Dropout is typically 10mV at light loads and less than 500mV at full load.
The MIC5219 is designed to provide a peak output current for start-up conditions where higher inrush current is demanded. It features a 500mA peak output rating. Continuous output current is limited only by package and layout.
The MIC5219 can be enabled or shut down by a CMOS or TTL compatible signal. When disabled, power consumption drops nearly to zero. Dropout ground current is minimized to help prolong battery life. Other key features include reversed­battery protection, current limiting, overtemperature shut­down, and low noise performance with an ultra-low-noise option.
The MIC5219 is available in adjustable or fixed output volt­ages in the space-saving 6-pin (2mm × 2mm) MLF™, SOT-23-5 and MM8™ 8-pin power MSOP packages. For higher power requirements see the MIC5209 or MIC5237.
All support documentation can be found on Micrel’s web site at www.micrel.com.
Features
• 500mA output current capability
SOT-23-5 package - 500mA peak
××
2mm
×2mm MLF package - 500mA continuous
××
MSOP-8 package - 500mA continuous
• Low 500mV maximum dropout voltage at full load
• Extremely tight load and line regulation
•Tiny SOT-23-5 and MM8™ power MSOP-8 package
•Ultra-low-noise output
• Low temperature coefficient
• Current and thermal limiting
• Reversed-battery protection
• CMOS/TTL-compatible enable/shutdown control
• Near-zero shutdown current
Applications
• Laptop, notebook, and palmtop computers
• Cellular telephones and battery-powered equipment
• Consumer and personal electronics
• PC Card VCC and VPP regulation and switching
• SMPS post-regulator/DC-to-DC modules
•High-efficiency linear power supplies
Typical Applications
MIC5219-5.0BMM
ENABLE
HUTDOWN
V
V
6V
IN
5V
OUT
2.2µF
tantalum
1
2
3
4
470pF
5V Ultra-Low-Noise Regulator
ENABLE
SHUTDOWN
MM8 is a trademark of Micrel, Inc.
MicroLeadFrame and MLF are trademarks of Amkor Technology.
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 474-1000 • fax + 1 (408) 474-1000 • http://www.micrel.com
March 2005 1 M999-031205
8
7
6
5
V
IN
EN
MIC5219-x.xBML
1
2
3
Ultra-Low-Noise Regulator
3.3V Ultra-Low-Noise Regulator
V
OUT
6
5
4
C
BYP
(optional)
C
OUT
Page 2
MIC5219 Micrel, Inc.
IN
OUTBYP
EN
LGxx
13
45
2
GND
Part Identification
IN
OUTADJ
EN
LGAA
13
45
2
GND
Ordering Information
Part Number Marking
Standard Pb-Free Standard Pb-Free Volts Temp. Range Package
MIC5219-2.5BMM MIC5219-2.5YMM 2.5V –40°C to +125°C MSOP-8
MIC5219-2.85BMM MIC5219-2.85YMM 2.85V –40°C to +125°C MSOP-8
MIC5219-3.0BMM MIC5219-3.0YMM 3.0V –40°C to +125°C MSOP-8
MIC5219-3.3BMM MIC5219-3.3YMM 3.3V –40°C to +125°C MSOP-8
MIC5219-3.6BMM MIC5219-3.6YMM 3.6V –40°C to +125°C MSOP-8
MIC5219-5.0BMM MIC5219-5.0YMM 5.0V –40°C to +125°C MSOP-8
MIC5219BMM MIC5219YMM Adj. –40°C to +125°C MSOP-8
MIC5219-2.5BM5 MIC5219-2.5YM5 LG25 LG25* 2.5V –40°C to +125°C SOT-23-5
MIC5219-2.6BM5 MIC5219-2.6YM5 LG26 LG26 2.6V –40°C to +125°C SOT-23-5
MIC5219-2.7BM5 MIC5219-2.7YM5 LG27 LG27 2.7V –40°C to +125°C SOT-23-5
MIC5219-2.8BM5 MIC5219-2.8YM5 LG28 LG28 2.8V –40°C to +125°C SOT-23-5
MIC5219-2.8BML MIC5219-2.8YML G28 G28* 2.8V –40°C to +125°C 6-Pin 2×2 MLF
MIC5219-2.85BM5 MIC5219-2.85YM5 LG2J LG2J 2.85V –40°C to +125°C SOT-23-5
MIC5219-2.9BM5 MIC5219-2.9YM5 LG29 LG29 2.9V –40°C to +125°C SOT-23-5
MIC5219-3.1BM5 MIC5219-3.1YM5 LG31 LG31 3.1V –40°C to +125°C SOT-23-5
MIC5219-3.0BM5 MIC5219-3.0YM5 LG30 LG30 3.0V –40°C to +125°C SOT-23-5
MIC5219-3.0BML MIC5219-3.0YML G30 G30* 3.0V –40°C to +125°C 6-Pin 2×2 MLF
MIC5219-3.3BM5 MIC5219-3.3YM5 LG33 LG33 3.3V –40°C to +125°C SOT-23-5
MIC5219-3.3BML MIC5219-3.3YML G33 G33* 3.3V –40°C to +125°C 6-Pin 2×2 MLF
MIC5219-3.6BM5 MIC5219-3.6YM5 LG36 LG36 3.6V –40°C to +125°C SOT-23-5
MIC5219-5.0BM5 MIC5219-5.0YM5 LG50 LG50 5.0V –40°C to +125°C SOT-23-5
MIC5219BM5 MIC5219YM5 LGAA LGAA Adj. –40°C to +125°C SOT-23-5
Other voltages available. Consult Micrel for details. *Overbar symbol (_) may not be to scale. Physical symbol is after Pin 1 identifier.
_
_
_
_
Pin Configuration
EN
1
IN
2
OUT
3
BYP
4
MIC5219-x.xBMM
MM8™ MSOP-8
Fixed Voltages
(Top View)
EN
1
IN
2
OUT
3
ADJ
4
MIC5219YMM MIC5219BMM
MM8™ MSOP-8
Adjustable Voltage
(Top View)
M999-031205 2 March 2005
GND
8
GND
7
GND
6
GND
5
GND
8
GND
7
GND
6
GND
5
1EN
GND
2
IN
3
MIC5219-x.xBML
6-Pin 2mm
6 BYP
NC
5
OUT
4
××
× 2mm MLF™ (ML)
××
(Top View)
MIC5219-x.xBM5
SOT-23-5
Fixed Voltages
(Top View)
MIC5219BM5
SOT-23-5
Adjustable Voltage
(Top View)
Page 3
MIC5219 Micrel, Inc.
Pin Description
Pin No. Pin No. Pin No. Pin Name Pin Function
MLF™-6 MSOP-8 SOT-23-5
321 IN Supply Input.
2 5–8 2 GND Ground: MSOP-8 pins 5 through 8 are internally connected.
435OUT Regulator Output.
113 EN Enable (Input): CMOS compatible control input. Logic high = enable; logic
low or open = shutdown.
64 (fixed) 4 (fixed) BYP Reference Bypass: Connect external 470pF capacitor to GND to reduce
output noise. May be left open.
5(NC) 4 (adj.) 4 (adj.) ADJ Adjust (Input): Feedback input. Connect to resistive voltage-divider network.
EP GND Ground: Internally connected to the exposed pad. Connect externally to
GND pin.
March 2005 3 M999-031205
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MIC5219 Micrel, Inc.
Absolute Maximum Ratings
(1)
Supply Input Voltage (VIN) ............................ –20V to +20V
Power Dissipation (P Junction Temperature (T
) ............................ Internally Limited
D
) ....................... –40°C to +125°C
J
Storage Temperature (TS) ....................... –65°C to +150°C
Operating Ratings
Supply Input Voltage (VIN) ........................... +2.5V to +12V
Enable Input Voltage (V
Junction Temperature (TJ) ....................... –40°C to +125°C
Package Thermal Resistance ......................... see Table 1
(2)
) .................................. 0V to V
EN
Lead Temperature (Soldering, 5 sec.) ...................... 260°C
(6)
(3)
= 100µA; TJ = 25°C, bold values indicate –40°C TJ +125°C; unless noted.
OUT
–1 1 %
–2 2 %
(7, 8)
(8)
OUT
+ 1V to 12V 0.009 0.05 %/V
OUT
= 100µA to 500mA, Note 5 0.05 0.5 %
OUT
I
= 100µA1060mV
OUT
I
= 50mA 115 175 mV
OUT
I
= 150mA 175 300 mV
OUT
I
= 500mA 350 500 mV
OUT
VEN 3.0V, I
V
3.0V, I
EN
V
3.0V, I
EN
V
3.0V, I
EN
= 100µA80130 µA
OUT
= 50mA 350 650 µA
OUT
= 150mA 1.8 2.5 mA
OUT
= 500mA 12 20 mA
OUT
VEN 0.4V 0.05 3 µA
VEN 0.18V 0.10 8 µA
= 0V 700 1000 mA
OUT
I
= 50mA, C
OUT
I
= 50mA, C
OUT
= 2.2µF, C
OUT
= 2.2µF, C
OUT
= 0 500
BYP
= 470pF 300
BYP
VEN = logic high (regulator enabled) 2.0 V
0.4V 0.01 –1 µA
ENL
V
0.18V 0.01 –2 µA
ENL
V
2.0V 2 5 20 µA
ENH
0.1
0.7
80
250
400
600
170
900
3.0
25
nV/ Hz
nV/ Hz
0.18
25
Electrical Characteristics
VIN = V
Symbol Parameter Conditions Min Typical Max Units
V
OUT
V
OUT
V
OUT/VOUT
V
OUT/VOUT
V
– V
IN
I
GND
PSRR Ripple Rejection f = 120Hz 75 dB
I
LIMIT
V
OUT
e
no
ENABLE Input
V
ENL
I
ENL
I
ENH
+ 1.0V; C
OUT
= 4.7µF, I
OUT
Output Voltage Accuracy variation from nominal V
/T Output Voltage Note 4 40 ppm/°C
Temperature Coefficient
Line Regulation VIN = V
Load Regulation I
OUT
Dropout Voltage
Ground Pin Current
Ground Pin Quiescent Current
Current Limit V
/P
Thermal Regulation Note 9 0.05 %/W
D
Output Noise
(10)
Enable Input Logic-Low Voltage VEN = logic low (regulator shutdown) 0.4 V
Enable Input Current V
IN
M999-031205 4 March 2005
Page 5
MIC5219 Micrel, Inc.
Notes:
1. Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, T the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: P temperature, and the regulator will go into thermal shutdown. See Table 1 and the “Thermal Considerations” section for details.
(max) = (TJ(max) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die
D
2. The device is not guaranteed to function outside its operating rating.
3. Specification for packaged product only.
4. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.
5. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 100µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
6. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differen­tial.
7. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current.
8. V
is the voltage externally applied to devices with the EN (enable) input pin.
EN
9. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 500mA load pulse at VIN = 12V for t = 10ms.
10. C
is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust) pin.
BYP
(max),
J
March 2005 5 M999-031205
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MIC5219 Micrel, Inc.
-100
-80
-60
-40
-20
0
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
PSRR (dB)
FREQUENCY (Hz)
-100
-80
-60
-40
-20
0
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
PSRR (dB)
FREQUENCY (Hz)
0.0001
0.001
0.01
0.1
1
10
1E+1 1E+2 1E+31E+4 1E+51E+6 1E+7
NOISE (µV/√Hz)
FREQUENCY (Hz)
0
100
200
300
400
0 100 200 300 400 500
DROPOUT VOLTAGE (mV)
OUTPUT CURRENT (mA)
Typical Characteristics
Power Supply
Rejection Ratio
0
-20
VIN = 6V V
= 5V
OUT
-40
-60
PSRR (dB)
-80
-100
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
FREQUENCY (Hz)
I
= 100µA
OUT
C
= 1µF
OUT
1k
10k
100k
Power Supply
Rejection Ratio
0
VIN = 6V V
= 5V
OUT
-20
-40
-60
PSRR (dB)
-80
-100
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
FREQUENCY (Hz)
I
= 100µA
OUT
C
= 2.2µF
OUT
C
= 0.01µF
BYP
1k
10k
100k
1M
1M
10M
10M
Power Supply
Rejection Ratio
0
-20
VIN = 6V V
= 5V
OUT
-40
-60
PSRR (dB)
-80
-100
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
FREQUENCY (Hz)
I
= 1mA
OUT
C
= 1µF
OUT
1k
10k
100k
Power Supply
Rejection Ratio
0
VIN = 6V V
= 5V
OUT
-20
-40
-60
PSRR (dB)
-80
-100
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
I
= 1mA
OUT
C
= 2.2µF
OUT
C
= 0.01µF
BYP
1k
10k
FREQUENCY (Hz)
100k
1M
1M
10M
10M
10
10
VIN = 6V V
OUT
100
VIN = 6V V
OUT
100
Power Supply
Rejection Ratio
= 5V
I
= 100mA
OUT
C
= 1µF
OUT
1k
10k
100k
Power Supply
Rejection Ratio
= 5V
I
= 100mA
OUT
C
= 2.2µF
OUT
C
= 0.01µF
BYP
1k
10k
100k
1M
1M
10M
10M
Power Supply Ripple Rejection
vs. Voltage Drop
60
50
1mA
40
30
20
10
RIPPLE REJECTION (dB)
10
0.1
0.01
NOISE (µV/Hz)
0.001
0.0001
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10mA
I
= 100mA
OUT
C
0
0 0.1 0.2 0.3 0.4
VOLTAGE DROP (V)
OUT
Noise Performance
1
V C electrolytic
10
OUT
OUT
100
= 5V = 10µF
1k
FREQUENCY (Hz)
100mA
1mA
10k 100k1M10M
= 1µF
10mA
Power Supply Ripple Rejection
100
RIPPLE REJECTION (dB)
0.1
0.01
NOISE (µV/√Hz)
0.001
0.0001
vs. Voltage Drop
90 80
1mA 70 60
50 40
10mA 30 20
10
0
00.10.20.3 0.4
VOLTAGE DROP (V)
Noise Performance
10
1
V
= 5V
OUT
C
= 10µF
OUT
electrolytic C
= 100pF
BYP
1E+11E+2 1E+31E+4 1E+51E+6 1E+7
10
100
FREQUENCY (Hz)
I
OUT
C
= 2.2µF
OUT
C
= 0.01µF
BYP
1mA
10mA
1k
10k 100k1M10M
= 100mA
100mA
Noise Performance
10mA, C
10
1k
100
Dropout Voltage
vs. Output Current
= 1µF
OUT
V
= 5V
OUT
10k 100k 1M 10M
M999-031205 6 March 2005
Page 7
MIC5219 Micrel, Inc.
0
5
10
15
20
25
0123456789
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
Dropout Characteristics
3.5 IL =100µA
3.0
2.5
2.0
1.5
1.0
OUTPUT VOLTAGE (V)
0.5
0
IL=100mA
IL=500mA
0123456789
INPUT VOLTAGE (V)
Ground Current
vs. Output Current
12
10
8
6
4
2
GROUND CURRENT (mA)
0
0 100 200 300 400 500
OUTPUT CURRENT (mA)
Ground Current
vs. Supply Voltage
3.0
2.5
2.0
1.5
1.0
0.5
GROUND CURRENT (mA)
0
02468
INPUT VOLTAGE (V)
IL=100 mA
IL=100µA
Ground Current
vs. Supply Voltage
IL=500mA
March 2005 7 M999-031205
Page 8
MIC5219 Micrel, Inc.
Block Diagrams
V
IN
C
BYP
(optional)
V
IN
BYP
Bandgap
Ref.
V
REF
EN
Current Limit
Thermal Shutdown
MIC5219-x.xBM5/MM
Ultra-Low-Noise Fixed Regulator
IN
IN
Bandgap
Ref.
V
EN
REF
GND
OUT
OUT
R1
R2
C
OUT
C (optional)
V
BYP
OUT
V
OUT
C
OUT
Current Limit
Thermal Shutdown
MIC5219BM5/MM [adj.]
GND
Ultra-Low-Noise Adjustable Regulator
M999-031205 8 March 2005
Page 9
MIC5219 Micrel, Inc.
Applications Information
The MIC5219 is designed for 150mA to 200mA output current applications where a high current spike (500mA) is needed for short, start-up conditions. Basic application of the device will be discussed initially followed by a more detailed discus­sion of higher current applications.
Enable/Shutdown
Forcing EN (enable/shutdown) high (>2V) enables the regu­lator. EN is compatible with CMOS logic. If the enable/ shutdown feature is not required, connect EN to IN (supply input). See Figure 5.
Input Capacitor
A 1µF capacitor should be placed from IN to GND if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input.
Output Capacitor
An output capacitor is required between OUT and GND to prevent oscillation. The minimum size of the output capacitor is dependent upon whether a reference bypass capacitor is used. 1µF minimum is recommended when C (see Figure 5). 2.2µF minimum is recommended when C is 470pF (see Figure 6). For applications < 3V, the output capacitor should be increased to 22µF minimum to reduce start-up overshoot. Larger values improve the regulator’s transient response. The output capacitor value may be in­creased without limit.
The output capacitor should have an ESR (equivalent series resistance) of about 1or less and a resonant frequency above 1MHz. Ultra-low-ESR capacitors could cause oscilla­tion and/or underdamped transient response. Most tantalum or aluminum electrolytic capacitors are adequate; film types will work, but are more expensive. Many aluminum electrolyt­ics have electrolytes that freeze at about –30°C, so solid tantalums are recommended for operation below –25°C.
At lower values of output current, less output capacitance is needed for stability. The capacitor can be reduced to 0.47µF for current below 10mA, or 0.33µF for currents below 1mA.
No-Load Stability
The MIC5219 will remain stable and in regulation with no load (other than the internal voltage divider) unlike many other voltage regulators. This is especially important in CMOS RAM keep-alive applications.
Reference Bypass Capacitor
BYP is connected to the internal voltage reference. A 470pF capacitor (C
) connected from BYP to GND quiets this
BYP
reference, providing a significant reduction in output noise (ultra-low-noise performance). C phase margin; when using C
BYP
reduces the regulator
BYP
, output capacitors of 2.2µF
or greater are generally required to maintain stability.
The start-up speed of the MIC5219 is inversely proportional to the size of the reference bypass capacitor. Applications requiring a slow ramp-up of output voltage should consider larger values of C consider omitting C
. Likewise, if rapid turn-on is necessary,
BYP
.
BYP
is not used
BYP
BYP
Thermal Considerations
The MIC5219 is designed to provide 200mA of continuous current in two very small profile packages. Maximum power dissipation can be calculated based on the output current and the voltage drop across the part. To determine the maximum power dissipation of the package, use the thermal resistance, junction-to-ambient, of the device and the following basic equation.
T max T
()=−
()
P max
()
D
JA
θ
JA
TJ(max) is the maximum junction temperature of the die, 125°C, and T
is the ambient operating temperature. θJA is
A
layout dependent; Table 1 shows examples of thermal resis­tance, junction-to-ambient, for the MIC5219.
Package
MM8™ (MM) 160°C/W 70°C/W 30°C/W
SOT-23-5 (M5) 220°C/W 170°C/W 130°C/W
2×2 MLF™ (ML) 90°C/W
θθ
θJA Recommended
θθ
Minimum Footprint 2oz. Copper
θθ
θJA 1" Square
θθ
θθ
θ
θθ
JC
Table 1. MIC5219 Thermal Resistance
The actual power dissipation of the regulator circuit can be determined using one simple equation.
PD = (VIN – V
OUT
) I
OUT
+ VIN I
GND
Substituting PD(max) for PD and solving for the operating conditions that are critical to the application will give the maximum operating conditions for the regulator circuit. For example, if we are operating the MIC5219-3.3BM5 at room temperature, with a minimum footprint layout, we can deter­mine the maximum input voltage for a set output current.
125 C 25 C
° °
Pmax
()/=
D
()
°
220 C W
PD(max) = 455mW
The thermal resistance, junction-to-ambient, for the mini­mum footprint is 220°C/W, taken from Table 1. The maximum power dissipation number cannot be exceeded for proper operation of the device. Using the output voltage of 3.3V, and an output current of 150mA, we can determine the maximum input voltage. Ground current, maximum of 3mA for 150mA of output current, can be taken from the “Electrical Character- istics” section of the data sheet.
455mW = (VIN – 3.3V) × 150mA + VIN × 3mA
455mW = (150mA) × VIN + 3mA × VIN – 495mW
950mW = 153mA × V
VIN = 6.2V
MAX
IN
Therefore, a 3.3V application at 150mA of output current can accept a maximum input voltage of 6.2V in a SOT-23-5 package. For a full discussion of heat sinking and thermal effects on voltage regulators, refer to the “Regulator Thermals” section of Micrel’s Designing with Low-Dropout Voltage Regu- lators handbook.
March 2005 9 M999-031205
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MIC5219 Micrel, Inc.
Peak Current Applications
The MIC5219 is designed for applications where high start­up currents are demanded from space constrained regula­tors. This device will deliver 500mA start-up current from a SOT-23-5 or MM8 package, allowing high power from a very low profile device. The MIC5219 can subsequently provide output current that is only limited by the thermal characteris­tics of the device. You can obtain higher continuous currents from the device with the proper design. This is easily proved with some thermal calculations.
If we look at a specific example, it may be easier to follow. The MIC5219 can be used to provide up to 500mA continuous output current. First, calculate the maximum power dissipa­tion of the device, as was done in the thermal considerations section. Worst case thermal resistance (θJA = 220°C/W for the MIC5219-x.xBM5), will be used for this example.
T max T
()=−
()
P max
()
D
Assuming a 25°C room temperature, we have a maximum power dissipation number of
P max
()/=
D
PD(max) = 455mW
Then we can determine the maximum input voltage for a 5­volt regulator operating at 500mA, using worst case ground current.
PD(max) = 455mW = (VIN – V
I
= 500mA
OUT
V
= 5V
OUT
I
= 20mA
GND
455mW = (VIN – 5V) 500mA + VIN × 20mA
2.995W = 520mA × V
V max
()
IN
Therefore, to be able to obtain a constant 500mA output current from the 5219-5.0BM5 at room temperature, you need extremely tight input-output voltage differential, barely above the maximum dropout voltage for that current rating.
You can run the part from larger supply voltages if the proper precautions are taken. Varying the duty cycle using the enable pin can increase the power dissipation of the device by maintaining a lower average power figure. This is ideal for applications where high current is only needed in short bursts. Figure 1 shows the safe operating regions for the MIC5219-x.xBM5 at three different ambient temperatures and at different output currents. The data used to determine this figure assumed a minimum footprint PCB design for minimum heat sinking. Figure 2 incorporates the same fac­tors as the first figure, but assumes a much better heat sink. A 1" square copper trace on the PC board reduces the thermal resistance of the device. This improved thermal
JA
θ
JA
125 C 25 C
° °
()
°
220 C W
) I
OUT
+ VIN I
GND
2 955W
.
IN
5 683V
.==
OUT
520mA
resistance improves power dissipation and allows for a larger safe operating region.
Figures 3 and 4 show safe operating regions for the MIC5219­x.xBMM, the power MSOP package part. These graphs show three typical operating regions at different temperatures. The lower the temperature, the larger the operating region. The graphs were obtained in a similar way to the graphs for the MIC5219-x.xBM5, taking all factors into consideration and using two different board layouts, minimum footprint and 1" square copper PC board heat sink. (For further discussion of PC board heat sink characteristics, refer to “Application Hint 17, Designing PC Board Heat Sinks” .)
The information used to determine the safe operating regions can be obtained in a similar manner such as determining typical power dissipation, already discussed. Determining the maximum power dissipation based on the layout is the first step, this is done in the same manner as in the previous two sections. Then, a larger power dissipation number mul­tiplied by a set maximum duty cycle would give that maximum power dissipation number for the layout. This is best shown through an example. If the application calls for 5V at 500mA for short pulses, but the only supply voltage available is 8V, then the duty cycle has to be adjusted to determine an average power that does not exceed the maximum power dissipation for the layout.
% DC
Avg.P =
455mW =
455mW =
0.274 =
% Duty Cycle Max = 7.4%2
With an output current of 500mA and a three-volt drop across the MIC5219-xxBMM, the maximum duty cycle is 27.4%.
PD × 50mA = (5V – 3.3V) × 50mA + 5V × 650µA
PD × 50mA = 173mW
 
DIN
% Duty Cycle
V – V I V I
()
100
% DC
  
8V – 5V 500mA 8V 20mA
()
 
100
% Duty Cycle
  
100
100
OUT OUT
1.66W
 
+
IN
GND
M999-031205 10 March 2005
Page 11
MIC5219 Micrel, Inc.
0
2
4
6
8
10
020406080100
VOLTAGE DROP (V)
DUTY CYCLE (%)
0
2
4
6
8
10
020406080100
VOLTAGE DROP (V)
DUTY CYCLE (%)
0
2
4
6
8
10
020406080100
VOLTAGE DROP (V)
DUTY CYCLE (%)
0
2
4
6
8
10
020406080100
VOLTAGE DROP (V)
DUTY CYCLE (%)
10
8
6
4
400mA
VOLTAGE DROP (V)
2
0
020406080100
DUTY CYCLE (%)
100mA
200mA
300mA
500mA
10
8
6
4
VOLTAGE DROP (V)
2
400mA
0
020406080100
100mA
200mA
300mA
500mA
DUTY CYCLE (%)
100mA
200mA
500mA
400mA
a. 25°C Ambient b. 50°C Ambient c. 85°C Ambient
Figure 1. MIC5219-x.xBM5 (SOT-23-5) on Minimum Recommended Footprint
10
8
6
4
400mA
VOLTAGE DROP (V)
2
0
020406080100
DUTY CYCLE (%)
100mA
200mA
300mA
500mA
10
8
6
4
VOLTAGE DROP (V)
2
400mA
0
020406080100
DUTY CYCLE (%)
100mA
200mA
300mA
500mA
100mA
400mA
500mA
a. 25°C Ambient b. 50°C Ambient c. 85°C Ambient
300mA
200mA
300mA
Figure 2. MIC5219-x.xBM5 (SOT-23-5) on 1-inch2 Copper Cladding
10
8
6
4
400mA
VOLTAGE DROP (V)
2
0
020406080100
500mA
DUTY CYCLE (%)
100mA
200mA
300mA
10
8
6
4
400mA
VOLTAGE DROP (V)
2
0
020406080100
DUTY CYCLE (%)
100mA
200mA
300mA
500mA
100mA
400mA
500mA
a. 25°C Ambient b. 50°C Ambient c. 85°C Ambient
Figure 3. MIC5219-x.xBMM (MSOP-8) on Minimum Recommended Footprint
10
8
6
4
2
VOLTAGE DROP (V)
0
020406080100
400mA
DUTY CYCLE (%)
200mA
300mA
500mA
10
8
6
400mA
4
2
VOLTAGE DROP (V)
0
020406080100
DUTY CYCLE (%)
200mA
300mA
500mA
400mA
500mA
a. 25°C Ambient b. 50°C Ambient c. 85°C Ambient
Figure 4. MIC5219-x.xBMM (MSOP-8) on 1-inch2 Copper Cladding
200mA
300mA
100mA
200mA
300mA
March 2005 11 M999-031205
Page 12
MIC5219 Micrel, Inc.
MIC5219-x.x
IN OUT
GND
470pF
V
IN
EN BYP
2.2µF
V
OUT
However, this is continuous power dissipation, the actual on-time for the device at 50mA is (100%-12.5%) or 87.5% of the time, or 87.5% duty cycle. Therefore, PD must be multi­plied by the duty cycle to obtain the actual average power dissipation at 50mA.
PD × 50mA = 0.875 × 173mW
PD × 50mA = 151mW
The power dissipation at 500mA must also be calculated.
PD × 500mA = (5V – 3.3V) 500mA + 5V × 20mA
PD × 500mA = 950mW
This number must be multiplied by the duty cycle at which it would be operating, 12.5%.
PD × = 0.125 × 950mW
PD × = 119mW
The total power dissipation of the device under these condi­tions is the sum of the two power dissipation figures.
P
P
P
= PD × 50mA + PD × 500mA
D(total)
= 151mW + 119mW
D(total)
= 270mW
D(total)
The total power dissipation of the regulator is less than the maximum power dissipation of the SOT-23-5 package at room temperature, on a minimum footprint board and there­fore would operate properly.
Multilayer boards with a ground plane, wide traces near the pads, and large supply-bus lines will have better thermal conductivity.
For additional heat sink characteristics, please refer to Micrel “Application Hint 17, Designing P.C. Board Heat Sinks”, included in Micrel’s Databook. For a full discussion of heat sinking and thermal effects on voltage regulators, refer to
“Regulator Thermals” section of Micrel’s Designing with Low- Dropout Voltage Regulators handbook.
Fixed Regulator Circuits
IN
MIC5219-x.x
IN OUT
EN BYP
GND
V
1µF
OUT
V
Figure 5 shows a basic MIC5219-x.xBMX fixed-voltage regu­lator circuit. A 1µF minimum output capacitor is required for basic fixed-voltage applications.
Figure 6. Ultra-Low-Noise Fixed Voltage Regulator
Figure 6 includes the optional 470pF noise bypass capacitor between BYP and GND to reduce output noise. Note that the minimum value of C
must be increased when the bypass
OUT
capacitor is used.
Adjustable Regulator Circuits
V
IN
MIC5219
IN OUT
EN ADJ
GND
R1
R2
V
1µF
OUT
Figure 7. Low-Noise Adjustable Voltage Regulator
Figure 7 shows the basic circuit for the MIC5219 adjustable regulator. The output voltage is configured by selecting values for R1 and R2 using the following formula:
R2
R1
1
 
V 1.242V
=+
OUT
  
Although ADJ is a high-impedance input, for best perfor­mance, R2 should not exceed 470kΩ.
V
IN
MIC5219
IN OUT
EN ADJ
GND
470pF
R1
R2
V
OUT
2.2µF
Figure 8. Ultra-Low-Noise Adjustable Application
Figure 5. Low-Noise Fixed Voltage Regulator
Figure 8 includes the optional 470pF bypass capacitor from ADJ to GND to reduce output noise.
M999-031205 12 March 2005
Page 13
MIC5219 Micrel, Inc.
Package Information
0.122 (3.10)
0.112 (2.84)
0.036 (0.90)
0.032 (0.81)
0.012 (0.03)
0.0256 (0.65) TYP
1.90 (0.075) REF
0.95 (0.037) REF
3.02 (0.119)
2.80 (0.110)
0.199 (5.05)
0.187 (4.74)
0.120 (3.05)
0.116 (2.95)
0.043 (1.09)
0.038 (0.97)
0.008 (0.20)
0.004 (0.10)
8-Pin MSOP (MM)
1.75 (0.069)
1.50 (0.059)
1.30 (0.051)
0.90 (0.035)
0.012 (0.30) R
5° MAX
0° MIN
3.00 (0.118)
2.60 (0.102)
10°
0°
DIMENSIONS:
INCH (MM)
0.039 (0.99)
0.035 (0.89)
0.021 (0.53)
DIMENSIONS:
MM (INCH)
0.007 (0.18)
0.005 (0.13)
0.012 (0.03) R
0.20 (0.008)
0.09 (0.004)
0.50 (0.020)
0.35 (0.014)
0.15 (0.006)
0.00 (0.000)
SOT-23-5 (M5)
0.60 (0.024)
0.10 (0.004)
March 2005 13 M999-031205
Page 14
MIC5219 Micrel, Inc.
TOP VIEW BOTTOM VIEW
Dimensions in
millimeter
6-Pin MLF™ (ML)
SIDE VIEW
Rev. 01
MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify
M999-031205 14 March 2005
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel for any damages resulting from such use or sale.
© 2003 Micrel, Incorporated.
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