Datasheet M48T559Y Datasheet (SGS Thomson Microelectronics)

Page 1
M48T559Y
64 Kbit (8Kb x8) TIMEKEEPER® SRAM
with ADDRESS/DATA MULTIPLEXED
SOFTWARE and HARDWARE RESET for
WATCHDOG T IM ER
TIMEKEEPER SRAM
ADDRESS/DATA MULTIPL EXED I/O PINS
WATCHDOG TIMER - MONITORS OUT of
CONTROL PROCESSOR or HUNG BU S
ALARM with WAKE-UP in BATTERY MODE
INTEGRATED ULTRA LOW POWER SRAM,
REAL TIME CLOCK, POWER-FAIL CONTROL CIRCUIT and BATTERY
FREQUENCY TEST OUTPUT for REAL TIME
CLOCK
AUTOMATIC POWER-FAIL CHIP DESELECT
and WRITE PROTECTION
WRITE PROTECT VOLTAGE
(V
= Power-fail Deselect Voltage):
PFD
– M48T559Y: 4.2V V
PACKAGING INCLU DES a 28- L EAD SOIC
and SNAPHAT
®
TOP
PFD
4.5V
(to be Ordered Separately)
SOIC PACKAGE PROVIDES D IREC T
CONNECTION for a SNAPHAT TOP CONTAINS the BATTERY and CRYSTAL
MICROPROCESSOR POWER-ON RESET
(Valid even during battery back-up mode)
PROGRAMM ABLE A L A R M O U TPUT ACTIVE
in the BATTERY BACK-UP MODE
SNAPHAT (SH)
Battery/Crystal
28
1
SOH28 (MH)
Figure 1. Logic Diagram
V
CC
AS0 AS1
W
R
RSTIN1
M48T559Y
8
AD0-AD7
RST IRQ/FT
DESCRIPTION
The M48T559Y TI MEKEEPER
®
RAM is an 8K x 8 non-volatile static RAM and real time clock. The monolithic chip is available in the SNAPHAT pack­age to provide a highly integrated battery backed­up memory and real time clock solution.
The 28 pin 330mil SOIC provides sockets with gold plated contacts at both ends for direct con­nection to a separate SNAPHAT housing cont ain­ing the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC package after the completion of the surface mount process.
RSTIN2
WDI
E
V
SS
AI01674B
1/18February 2000
Page 2
M48T559Y
Figure 2. SOIC Connections
RST V
WDI RSTIN1 RSTIN2
DU NC NC NC
NC AD0 AD1
V
SS SS
1 2 3 4 5 6 7
M48T559Y
8 9 10 11 12 13 14
AI01675B
28 27 26 25 24 23 22 21 20 19 18 17 16 15
CC
W IRQ/FT DU DU AS1 AS0 R E AD7 AD6 AD5AD2 AD4 AD3V
Table 1. Signal Names
AD0-AD7 Address/Data AS0
-AS1 Address Strobes W R E WDI Watchdog Input RSTIN1
RST
IRQ V
V NC Not Connected Internally
DU
-RSTIN2 Reset Input
/FT
CC SS
Write Enable Read Enable Chip Enable
Power Fail Reset Output (Open Drain)
Interrupt / Frequency Test Output (Open Drain)
Supply Voltage Ground
Don’t Use must be connected
or V
to V
CC
SS
Table 2. Absolute Maximum Ratings
Symbol Parameter Value Unit
T
A
T
STG
V
IO
V
CC
I
O
P
D
Note: Stress es greate r than t hose listed unde r "Absolute Maxi m um Ratings" may c ause perm anent damage to the device. This is a stress
rating onl y and fun ct i onal oper at i on of the device at these or any other conditions above t hose indicated in the operat i onal section of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may affect reliability.
CAUTION: Negative undershoo ts bel ow –0.3V are not allowed on any pi n while in the B at tery Back- up mode. CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
Ambient Operating Temperature 0 to 70 °C Storage Temperature (VCC Off, Oscillator Off) Input or Output Voltages –0.3 to 7 V Supply Voltage –0.3 to 7 V Output Current 20 mA Power Dissipation 1 W
–40 to 85 °C
Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal damage due to the high temperatures required for device sur­face-mounting. The SNAPHAT housing is keyed to prevent reverse insertion.
The SOIC and battery/crystal packages are shipped separately in plastic anti-static tubes or in Tape & Reel form. For t he 2 8 le ad S OIC , t he ba t­tery/crystal package (i.e. SNAPHAT) part number is "M4T28-BR12SH1".
Caution: Do not place the SNAPHAT battery/crys­tal top in conductive foam, as this will drain the lith­ium button-cell battery.
As Figure 3 shows, the static memory array and the quartz controlled clock oscillator of the M48T559Y are integrated on one silicon chip. The
2/18
two circuits are interconnected at the up per eight memory locations to provide user accessible
BYTEWIDE™ clock information in the by tes with addresses 1FF8h-1FFFh. The clock locations contain the year, month, date, day, ho ur, minute, and second in 24 hour BCD format. Corrections for 28, 29 (leap year), 30, and 31 day months are made automatically. Byte 1FF8h is the clock con­trol register. This byte controls us er ac cess to t he clock information and also stores the clock calibra­tion setting.
The eight clock bytes are not the actual clock counters themselves; they are memory locations consisting of BiPORT™ read/write memory cells.
The M48T559Y includes a clock control circuit which updates the clock bytes with current infor-
Page 3
Figure 3. Block Diagram
M48T559Y
IRQ/FT
OSCILLATOR AND
CLOCK CHAIN
32,768 Hz CRYSTAL
POWER
LITHIUM
CELL
VOLTAGE SENSE
AND
SWITCHING
CIRCUITRY
RSTIN1
V
CC
Table 3. Operating Modes
Mode
V
CC
RSTIN2
(1)
Deselect Write
4.5V to 5.5V
Read Read Deselect
Deselect
Note: 1. X = VIH or VIL; VSO = Battery Back-up Swit ch ov er Volta ge.
2. See Table 7 for details.
3. AD0-AD7, AS0
V
to V
SO
PFD
V
SO
, AS1 active when E is high and VCC > V
(min)
(2)
V
PFD
RST
E R W AD0-AD7 Power
V
IH
V
IL
V
IL
V
IL
X X X High Z CMOS Standby X X X High Z Battery Back-up Mode
PFD
16 x 8 BiPORT SRAM ARRAY
8176 x 8
SRAM ARRAY
V
SS
E
X X High Z
V
IH
V
IL
V
IH
.
V
IL
V
IH
V
IH
DATA
TRANSCEIVER
UPPER
ADDRESS
LATCH
LOWER
ADDRESS
LATCH
AD0-AD7
Standby
D
D
OUT
IN
Active Active
High Z Active
W R
AS1
AS0
AI01676B
(3)
mation once per second. The information can be accessed by the user i n t he sa me m anner as any other location in the static memory array.
The M48T559Y also has its own Power-fail Detect circuit. The control circuitry constantly monitors the single 5V supply for an out of tolerance condi­tion.
When VCC is out of tolerance, the circuit write pro­tects the SRAM, providing a h igh degree of data security in the midst of unpredictable system oper­ation brought on by low V
. As VCC falls be low
CC
approximately 3V, the control circuitry connects the battery which maintains data and clock opera­tion until valid power returns.
3/18
Page 4
M48T559Y
Table 4. AC Measurement Conditions
Input Rise and Fall Times 5ns
Figure 4. AC Testing Load Circuit
5V
Input Pulse Voltages 0 to 3V Input and Output Timing Ref. Voltages 1.5V
Note that Output Hi-Z is defined as the point where data is no longer driven.
Table 5. Capacitance
= 25 °C, f = 1 MHz)
(T
A
(1, 2)
DEVICE
UNDER
TEST
1k
CL includes JIG capacitance
1.9k
OUT
CL = 100pF
Symbol Parameter Test Condition Min Max Unit
V
V
IN
OUT
= 0V
= 0V
10 pF 10 pF
C
IN
C
IO
Note: 1. Effectiv e capacitance measured with power suppl y at 5V .
2. Sampled only, not 100% tested.
3. Outputs deselected.
Input Capacitance
(3)
Input / Output Capacitance
AI01673
Table 6. DC Characteristics
= 0 to 70 °C; VCC = 4.5V to 5.5V)
(T
A
Symbol Parameter Test Condition Min Max Unit
(1)
Input Leakage Current
I
LI
(1)
I
LO
I
LRST
I
I
CC1
I
CC2
V
IL
V
Output Leakage Current
(2)
Input Leakage Current Supply Current Outputs open 50 mA
CC
Supply Current (Standby) TTL
(3)
Supply Current (Standby) CMOS
(4)
Input Low Voltage –0.3 0.8 V Input High Voltage 2.2
IH
Output Low Voltage
V
OL
Output Low Voltage (IRQ
(6)
V
OH
Note: 1. Outputs deselected.
Output High Voltage
2. Input leakage current on input RESET p i ns.
3. AD0-AD7, AS0
4. Ne ga t i ve spik e s of –1V allo wed for up t o 10 ns once pe r cycle .
5. The IRQ
6. Measured with Control Bits set as follows: R = '1'; W, ST , FT = '0'.
, AS1 active when E is high and VCC > V
pins is Open Drain.
/FT)
(5)
PFD
0V V
0V V
0V V
E
.
V
IN
CC
V
OUT
V
IN
CC
E
= V
IH
= VCC – 0.2V
I
= 2.1mA
OL
IOL = 10mA I
= –1mA
OH
CC
±1 µA ±5 µA
100 µA
10 mA
7mA
V
+ 0.3
CC
0.4 V
0.4 V
2.4 V
V
4/18
Page 5
M48T559Y
Table 7. Power Down/Up Trip Points DC Characteristics
(1)
(TA = 0 to 70 °C)
Symbol Parameter Min Typ Max Un it
V
PFD
V
SO
t
DR
Note: 1. All voltages referenced to VSS.
2. At 25°C.
Power-fail Deselect Voltage 4.2 4.35 4.5 V Battery Back-up Switchover Voltage 3.0 V
(2)
Expected Data Retention Time 7 YEARS
Table 8. Power Down/Up AC Characteristics
(T
= 0 to 70 °C)
A
Symbol Parameter Min Max Unit
t
PD
(1)
t
F
(2)
t
FB
t
R
t
RB
t
REC
Note: 1. V
2. V
PFD
es V
PFD
E at VIH before Power Down
V
(max) to V
PFD
V
(min) to VSS VCC Fall Time
PFD
V
(min) to V
PFD
VSS to V V
(max) to V
(min).
PFD
(min) to VSS fall time of less than tFB may cause corruption of RAM data.
PFD
(max) to RST High
PFD
(min) fall time of less than tF may result in deselection/write protection not occurring until 200µs after VCC pass-
PFD
(min) VCC Fall Time
PFD
(max) VCC Rise Time
PFD
(min) VCC Rise Time
0 µs
300 µs
10 µs 10 µs
s
40 200 ms
Figure 5. Power Down/Up Mode AC Waveforms
V
CC
V
(max)
PFD
V
(min)
PFD
VSO
tF
tFB
RST
INPUTS
OUTPUTS
VALID VALID
(PER CONTROL INPUT)
tDR
tRB
DON'T CARE
HIGH-Z
tR
tRECtPD
RECOGNIZEDRECOGNIZED
(PER CONTROL INPUT)
AI01384D
5/18
Page 6
M48T559Y
Table 9. AC Characteristics
(T
= 0 to 70 °C; VCC = 4.5V to 5.5V)
A
Symbol Parameter
t
AS
t
AH
t
DS
t
DH
t
RLDV
t
RLRH
t
RHDZ
t
WLWH
t
ELEH
t
ASLASH
t
ASHRL
t
ASHWL
t
ELRL
t
EHDZ
t
ELWL
Address Setup Time 20 ns Address Hold Time 0 ns Data Setup Time 60 ns Data Hold Time 0 ns Read Enable Access Time 70 ns R Pulse Width Low 70 ns Read Enable High to Output High Z 25 ns W Pulse Width Low 50 ns E Pulse Width Low 50 ns AS0, AS1 Pulse Width Low 15 ns AS0, AS1 High to R Low 15 ns AS0, AS1 High to W Low 15 ns Chip Enable Low to Read Enable Low 0 ns Chip Enable High to Data Output Hi-Z 0 ns Chip Enable Low to Write Enable Low 0 ns
M48T559Y
Unit
Min Max
RAM OPERATION
Four control signals, AS0
, AS1, R and W, ar e us ed to access the M48T559Y. The address latches are loaded from the address/data b us in respon se to rising edge signals applied to the Address Strobe 0 (AS0
) and Address Strobe 1 (AS1) signals. AS0 is used to latch the lower 8 b its of address, and AS1
is used to latch the upper 5 bits of address.
It is not however necessary to follow any particular order. The inputs are in parallel for the two ad­dress bytes (upper and lower) and can be latched in any order as long as the correct strobe is used. It is necessary to meet the set-up and hold times given in the AC specifications with valid address information in order to properly latch the address. If the upper and/or lower order addresses are cor­rect from a prior cycle, it is not necessary to repeat the address latching sequence.
A write operation requires valid dat a to be placed on the bus (AD0-AD7), followed by the activation of the Write Enabl e (W
) line. Data on t he bus wi ll be written to the RAM, provided that the write tim­ing specific ations are met. During a read cycl e, the Read Enable (R
) signal is driven active. Data from the RAM will become valid on the bus provided that the RAM read access timing specifications are met.
The W
and R signals should never be active at the
same time. In addition, E
must be active before any control line is recognized (except for AD0-AD7 and AS0
, AS1).
RESET INPUT
The M48T559Y provides two debounced inputs which can generate an output Reset. The duration and function of the Reset output is identical to a Reset generated by a power cycle. Pulses shorter than t
and tR2 will not generate a Reset condi-
R1
tion (see Table 12 and Figure 13).
DATA RETENTION MODE
Should the supply voltage decay, the RAM will au­tomatically power-fail deselect, write protecting it­self w hen V
falls within the V
CC
PFD
(max), V
PFD
(min) window. All outputs become high imped­ance, and all inputs are treated as "don't care."
Note: A power failure during a write cycle may cor­rupt data at the currently addressed location, but does not jeopardize the rest of the RAM's content. At voltages below V
(min), the user can be as-
PFD
sured the memory will be in a write protected state, provided the V
fall time is no t les s than tF.
CC
6/18
Page 7
Figure 6. Read Mode AC Waveforms
E
M48T559Y
tELEH
tASLASH
AS0
AS1
R
tAS tAH
AD0-AD7
LOW ADDRESS VALID
Note: AD5-AD 7 are don’t care when latchi ng upper address.
Figure 7. Write Mode AC Waveform
tASLASH
tAS tAH
UPPER ADDRESS VALID
tRLDV
tELRL
tRLRHtASHRL
DATA OUT
VALID
tEHDZ
tRHDZ
AI01671B
E
tASLASH
AS0
AS1
W
tAS tAH
AD0-AD7
LOW ADDRESS VALID
Note: AD5-AD 7 are don’t care when latchi ng upper address.
tASLASH
tAS tAH
UPPER ADDRESS VALID
tELEH
tELWL
tDS
DATA IN VALID
tEHDZ
tWLWHtASHWL
tDH
AI01672B
7/18
Page 8
M48T559Y
Table 10. Register Map
Address
Data
D7 D6 D5 D4 D3 D2 D1 D0
1FFFh 10 Years Year Year 00-99 1FFEh 0 0 0 10 M Month Month 01-12 1FFDh 0 0 10 Date Date Date 01-31 1FFCh 0 FT 0 0 0 Day Day 01-07 1FFBh 0 0 10 Hours Hours Hour 00-23
1FFAh 0 10 Minutes Minutes Minutes 00-59
1FF9h ST 10 Seconds Seconds Seconds 00 -59
1FF8h W R S Calibration Control
1FF7h WDS BMB4 BMB3 BMB2 BMB1 BMB0 RB1 RB0 Watchdog
1FF6hAFEYABEYYYYYInterrupts
1FF5h RPT4 Y Al. 10 Date Alarm Date Alarm Date 01-31
1FF4h RPT3 Y Al. 10 Hours Alarm Hours Alarm Hours 00-23
1FF3h RPT2 Alarm 10 Minutes Alarm Minutes Alarm Minutes 00-59
Function/Rang e
BCD Format
1FF2h RPT1 Alarm 10 Seconds Alar m Seco nds Alarm Secon ds 00-59
1FF1hYYYYYYYY Unused
1FF0hWDFAFZBLZZZZ Flags
Keys: S = SIGN Bit
FT = FREQUENCY TEST Bit R = READ Bit W = WRITE Bit ST = STOP Bit 0 = Must be set to zero Y = ’1’ or ’0’ Z = ’0’ and ar e Read only AF = Alarm Flag
The M48T559Y may respond to transient noise spikes on V during the time the device is sampling V
that reach into the deselect window
CC
. There-
CC
fore, decoupling of the power supply lines is rec-
BL = Battery Low WDS = Watch dog Steering Bit BMB0-BMB4 = Watchdog M ultiplier Bits RB0-RB1 = Wat chdog R e s o l ution Bits AFE = Alarm Flag Enable ABE = Alarm in Battery Back-up Mode Enable RPT1- R PT4 = Alarm Repeat Mode Bits WDF = Watchdog Flag
nal V reaches V
. Write protection continues until V
CC
(max) plus t
PFD
. For more i nforma-
REC
tion on Battery Storage Life refer to the Application Note AN1012.
ommended. When V
drops below VSO, the control circuit
CC
switches power to the internal battery which pre­serves data and powers the clock. The internal button cell will maintain da ta in t he M 48T559Y for an accumulated period of at least 7 years when
is less than VSO. As system power returns
V
CC
and V
rises above VSO, the battery is discon-
CC
nected, and the power supply is switched to exter-
POWER-ON RESET
The M48T559Y continuously monitors V V
falls to the power fail detect trip point, the RST
CC
pulls low (open drain) and remains low on power­up for 40ms to 200m s after V external pull-up resistor to V
passes V
CC
is required (1k re-
CC
sistor is recommended). The reset pulse remains active with V
at VSS.
CC
. When
CC
PFD
CC
. An
8/18
Page 9
M48T559Y
CLOCK OPERATIONS Reading the Clock
Updates to the TIMEKEEPER registers should be halted before clock data is read to prevent reading data in transition. Because the BiPORT TIME­KEEPER cel ls in th e RAM array a r e on ly data r e g­isters, and not the actual clock counters, updating the registers can be halted without disturbing the clock itself.
Updating is halted when a '1' is written to the READ bit, D6 in the Control register (1FF8h). As long as a '1' remains in that position , updating is halted.
After a halt is issued, the registers reflect the count; that is, the day, date, and the time that were current at the moment the halt command was is­sued.
All of the TIMEKEEPER registers are updated si­multaneously. A halt will not interrupt an update in progress. Updating is within a second after the bit is reset to a '0'.
Setting the Clock
Bit D7 of the Control register (1FF8h) is the WRITE bit. Setting the WR ITE bit to a '1', like the READ bit, halts update s to the TIMEKEEPER reg­isters. The user can then loa d them with the cor­rect day, date, and time data in 24 hour BCD format (see Table 9). Resetting the WRITE bit t o a '0' then transfers the values of all time registers (1FF9h-1FFFh) to the actual TIMEKEEPER counters and allows normal operation to re sume. After the WRITE bit is reset, the next clock update will occur in one second.
See the Application Note AN923 "TIMEKEEPER rolling into the 21st century" for information on Century Rollover.
Stopping and Starting the Oscillator
The oscillator may be stopped at any time. If the device is going to spend a significant amount of time on the shelf, the oscillator can be turned off to minimize current drain on the battery. The STOP bit is the MSB of the seconds register. Setting it to a ’1’ stops the oscillator. The M48T559Y is shipped from STMicroelectronics with the STOP bit set to a ’1’. When reset to a ’0’, the M48T559Y oscillator starts within one second.
Calib ratin g t h e C lock
The M48T559Y is driven by a quartz controlled os­cillator with a nominal frequency of 32,768Hz. The devices are tested not to exceed 35 ppm (parts per
million) oscillator frequency error at 25° C, which equates to about ±1.53 m inutes per month. With the calibration bits properly set, the accuracy of each M48T559Y improves to b etter than ±4 ppm at 25°C.
The oscillation rate of any crystal changes with temperature (see Figure 10). Most clock chips compensate for crystal frequency and tempera­ture shift error with cumbersome trim capacitors. The M48T559Y design, however, employs period­ic counter correction. The calibration circuit adds or subtracts counts from the oscillator divider cir­cuit at the divide by 256 stage, as shown in Figure
9. The number of times pulses are bl anked (sub­tracted, negative calibration) or split (ad ded, pos i­tive calibration) depends upon the value loaded into the five bit Calibration byte found in the Con­trol Register. Adding count s speeds the clock up, subtracting counts slows the clock down.
Figure 8. Clock Calibration
NORMAL
POSITIVE CALIBRATION
NEGATIVE CALIBRATION
AI00594B
9/18
Page 10
M48T559Y
Figure 9. Crystal Accuracy Across Temperature
ppm
20
0
-20
-40
F
= -0.038 (T - T
-60
-80
-100 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70
F
ppm
2
C
T0 = 25 °C
The Calibration byte occupies the five lower order bits (D4-D0) in the Control r egister (1FF8h). These bits can be set to represent any value between 0 and 31 in binary form. Bit D5 is a Sign bit; ’1’ indi­cates positive calibration, ’0’ indicates negative calibration. Calibration occurs within a 64 m inute cycle. The first 62 m inutes i n t he c ycle m ay , onc e per minute, have one second either shortened by 128 or lengthened by 256 oscillator cycles.
If a binary ’1’ is loaded into the register, only the first 2 minutes in the 64 minute cycle will be modi­fied; if a binary 6 is loaded, the first 12 will be af­fected, and so on.
Therefore, each cal ibration step has the effect of adding 512 or subtracting 256 oscillator cycles for every 125,829,120 actual oscillator cycles, that is, +4.068 or -2.034 ppm of adjustment per calibration step in the calibration register. Assuming that the oscillator is in fact running at exactly 32,768Hz, each of the 31 in crements in the Calibration by te would represent +10.7 or -5.35 seconds per month which corresponds to a total range of +5.5 or - 2.75 minutes per month.
Two methods are available for ascertaining how much calibration a given M48T559 Y may require.
)2 ± 10%
0
°C
AI02124
The first involves simply setting the clock, letting it run for a month and comparing it to a known accu­rate reference (like WWV broadcasts). While that may seem crude, it allows the designer to give the end user the ability to calibrate his clock as his en­vironment may require, even after the final product is packaged in a non-user serviceable enclosure. All the designer has to do is provide a simple utility that accesses the Calibration byte.
The second approach is better suit ed to a manu­facturing environment, and involves the use of the
/FT pin. The pin will toggle at 512Hz when the
IRQ Stop bit (D7 of 1FF9h) is ’0’, the FT bit (D6 of 1FFCh) is ’1’, the AFE bit (D7 of 1FF6h) is ’0’, and the Watchdog Steering bit (D7 of 1FF7h) is ’1’ or the Watchdog Register is reset (1FF7h = 0).
Any deviation from 512Hz indicates the degree and direction of oscillator frequency shift at the test temperature. For example, a reading of 512.01024 Hz would indicate a +20 ppm oscillator frequency error, requiring a -10 (WR001010) to be loaded into the Calibration Byte for correction. Not e that setting or changing the Calibration Byte does not affect the Frequency test output frequency.
The FT bit is cleared on power-down.
10/18
Page 11
M48T559Y
For more information on calibration, see the Appli­cation Note AN934 "TIMEKEEPER Calibration".
The IRQ
/FT pin is an open drain out put which re­quires a pull-up resistor for proper operation. A 500-10k resistor is recommended in order to control the rise time.
SETTING ALARM CLOCK
Registers 1FF5h-1FF2h contain the alarm set­tings. The alarm can be configured to go off at a prescribed time on a specific day of the month or repeat every day, hour, minute, or sec ond. It can also be programmed to go off while the M48T559Y is in the battery back-up mode of operation to serve as a system wake-up call.
RPT1-RPT4 put the alarm in the repeat mode of operation. Table 11 shows the possible configura­tions. Codes not listed in the table default to the once per second mode t o qu ick ly alert t he user of an incorrect alarm setting.
Note: User must transition address (or toggle chip enable) to see Flag bit change.
When the clock information matches the alarm clock settings based on the m atch criteria d efined by RPT1-RPT4, AF (Alarm Flag) is set. If AFE (Alarm Flag Enable) is also set, the alarm condi­tion activa tes the IRQ
/FT pin. To disable alarm,
write ’0’ to the Alarm Date registers and RPT1-4. The alarm flag and the I RQ
/FT output are cleared
by a read to the Flags register as shown in Figure
11.
Note: If an alarm cond ition occurs while t he flags register address is latched into the address buffer, the alarm flag will not be set until an address other than the flags register (1FF0h) is latched into the address buffer. This will insure that the alarm flag will not be inadvertently reset while reading the flag register. To properly check to see if an alarm condition has occurred while readin g the f lag reg­ister, the user is requ ired to latch, read or write to an alternate address and then re-read t he alarm flag.
The IRQ tery back-up mode. The IRQ
/FT pin can also be activated in the bat-
/FT will go low if an alarm occurs and both ABE (Alarm in Battery Back-up Mode Enable) and AFE are set. The ABE and AFE bits are reset during power-up, therefore an alarm generated during power-up will only set AF. The user can read the Flag Register at syst em boot-up to determine if an alarm was generated while the M48T559Y was in the deselect mode during power-up. Figure 12 illustrates the back-up mode alarm timing.
Table 11. Alarm Repeat Mode
RPT4 RPT3 RPT2 RPT1 Alarm Activated
1 1 1 1 Once per Second 1 1 1 0 Once per Minute 1 1 0 0 Once per Hour 1 0 0 0 Once per Day
Figure 10. Interrupt Reset Waveforms
AD0-AD7
R
ACTIVE FLAG BIT
IRQ/FT
0 0 0 0 Once per Month
ADDRESS 1FF0h
AI01677B
11/18
Page 12
M48T559Y
Figure 11. Back-up Mode Alarm Waveforms
V
CC
V
(max)
PFD
V
(min)
PFD
V
SO
AFE bit in Interrupt Register
AF bit in Flags Register
IRQ/FT
tREC
HIGH-Z
WATCHD OG TI M E R
The watchdog timer can be used to detect an out­of-control microprocessor. The user programs the watchdog timer by setting the desired amount of time-out into the eight bit Watchdog Reg ister (Ad­dress 1FF7h). The five bits (BMB4-BMB0) store a binary multiplier and the two lower order bits (RB1­RB0) select the resol ution, where 00 = 1/16 sec ­ond, 01 = 1/4 second, 10 = 1 second, an d 11 = 4 seconds. The amount of time-out is then deter­mined to be the mult iplication of the f ive bit multi­plier value with the resolution. (For example: writing 00001110 in the Watchdog Register = 3 x 1 or 3 seconds).
Note: Accuracy of timer is within ± the selected resolution.
If the processor does not reset the timer within the specified period, the M48T559Y sets the WDF (Watchdog Flag) and generates a watchdog inter­rupt or a microprocessor reset. WDF is reset by reading the Flags Register (Address 1FF0h).
The most significant bit of the Watchdog Register is the Watchdog Steering Bit. When set to a '0', the watchdog will activate the IRQ
/FT pin when timed­out. When WDS is set to a '1', the watchdog will output a negative pulse on the RST
pin for a dura­tion of 40ms to 200ms. The Watchdog register will reset to a '0' at the end of a watchdog time-out when the WDS bit is set to a '1'.
HIGH-Z
AI01678C
The watchdog timer can be reset by two methods: – a transition (high-to-low or low-to-high) can be
applied to the Watchdog input pin (WDI) or – the microprocessor can perform a write of the
Watchdog Register. The time-out period then
starts over The WDI pin contains a pull-up resis-
tor and therefore can be left unconnected if not
used. The watchdog timer will be reset on each transition
(edge) seen by the WDI pin. In order t o pe rform a software reset of the Watchdog timer, the original time-out period can be written into the Watchdog Register, effectively restarting the count-down cy­cle.
Should the watchdog timer time-out, and the WDS bit is programmed to output an interrupt, a value of 00h needs to be written to the Watchdog Register in order to clear the IRQ
/FT pin. This will also dis­able the watchdog function until it is again pro­grammed correctly. A rea d of the Flags Register will reset th e Watchdog Fl ag (D7; R egister MSB-
15). The watchdog function is automatically disabled
upon power-down and the Watchd og Register is cleared. If the watchdog function is set to output to the IR Q
/FT pin and the frequency tes t function is activated, the watchdog or alarm function prevails and the frequency test function is denied.
12/18
Page 13
Figure 12. Reset Timing Waveforms
RSTIN1
RSTIN2
RST
tR2
Hi-Z
M48T559Y
Hi-Z
tR1 tR1HRZ
Table 12. Reset AC Characteristics (T
Symbol Parameter Min Max Unit
t
R1
t
R2
t
R1HRZ
t
R2HRZ
RSTIN1 Low to RST Low 50 200 ns RSTIN2 Low to RST Low 20 100 ms RSTIN1 High to RST Hi-Z 40 200 ms RSTIN2 High to RST Hi-Z 40 200 ms
BATTERY LOW WARNING
The M48T559Y checks its battery voltage on pow­er-up. The BL (Battery Low) bit (D4 of 1FF 0h) wi ll be set on power-up if the battery voltage is less than 2.5V (typical).
POWER-ON DEFAULTS
Upon application of power to the de vice, the fol­lowing register bits are set to a ’0’ state: WDS; BMB0-BMB4 ; RB0 - R B1 ; AFE; ABE; W; R; FT.
= 0 to 70°C; VCC = 4.5V to 5.5V)
A
ative voltage spikes on V below V
by as much as one Volt. These nega-
SS
tive spikes can cause data corruption in the SRAM while in battery backup mode. To protect from these voltage spikes, it is recommended to con­nect a schottky diode from V connected to V
CC
1N5817 is recommended for through hole and MBRS120T3 is recommended for surface mount.
Figure 13. Supply Voltage Protection
, anode to VSS). Schottky diode
tR2HRZ
AI01679
that drive it to values
CC
to VSS (cathode
CC
POWER SUPPLY DECOUPLING and UNDERSHOOT PROTECTION
transients, including those produced by output
I
CC
switching, can produce voltage fluctuations, re­sulting in spikes on the V
bus. These transients
CC
V
CC
V
CC
can be reduced if capacitors are used to store en­ergy, which stabilizes the V stored in the bypass capacitors will be released as
bus. The energy
CC
0.1µF DEVICE
low going spikes are generated or energy will be absorbed when overshoots occur. A ceramic by-
pass capacitor value of 0.1µF (as shown in Figure
V
SS
14) is recommended in order to provide the need­ed filtering.
In addition to transients that are caused by normal SRAM operation, power cycling can generate neg-
AI02169
13/18
Page 14
M48T559Y
Table 13. Ordering Information Scheme
Example: M48T559Y MH 1 TR
Device Type
M48T
Supply Voltage and Write Protect Voltage
559Y = V
Package
(1)
MH
Temperature Range
1 = 0 to 70 °C
Shipping Method for SOIC
blank = Tubes TR = Tape & Reel
= 4.5V to 5.5V; V
CC
= SOH28
= 4.2V to 4.5V
PFD
Note: 1. The SOIC package (SOH28) requires the battery/crystal package (SNAPHAT) which is ordered separately under the part number
"M48T28-BR12SH1" in plastic tube or "M4T28-BR12SH1TR" in Tape & Reel form.
Caution: Do not place the SNAPHAT battery/crystal pac kage "M4T28-BR12SH1" in c onductive foam since will drai n the lithium butt on-cell
battery.
For a list of available options (Speed, Pac kage, etc...) or for furthe r information on any aspect of this de­vice, please contact the ST Sales Office nearest to you.
Table 14. Revision History
Date Revision Details
June 1998 F irst Issue
Description Paragraph changed Setting Alarm Clock paragraph changed
02/07/00
M4T28-BR12SH SNAPHAT Housing for 48mAh Battery & Crystal Package added (Table 16) Power Down/Up Mode AC Waveforms changed (Figure 5) Back-up Mode Alarm Waveforms changed (Figure 11)
14/18
Page 15
M48T559Y
Table 15. SOH28 - 28 lead Plastic Small Outline, 4-socket battery SNAPHAT, Package Mechanical Data
Symb
Typ Min Max Typ Min Max
A 3.05 0.120 A1 0.05 0.36 0.002 0.014 A2 2.34 2.69 0.092 0.106
B 0.36 0.51 0.014 0.020
C 0.15 0.32 0.006 0.012
D 17.71 18.49 0.697 0.728
E 8.23 8.89 0.324 0.350
e 1.27 0.050
eB 3.20 3.61 0.126 0.142
H 11.51 12.70 0.453 0.500
L 0.41 1.27 0.016 0.050
α
N 28 28
mm inches
CP 0.10 0.004
Figure 14. SOH28 - 28 lead Plastic Small Outline, 4-socket battery SNAPHAT, Package Outline
A2
A
C
Be
eB
CP
D
N
E
H
LA1 α
1
SOH-A
Drawing is not to scale.
15/18
Page 16
M48T559Y
Tab l e 16 . M4T28- BR12SH SNAPHAT Ho u sing for 4 8mAh Batter y & Cr ystal, Pack ag e Mechanic al Data
Symb
Typ Min Max Typ Min Max
A 9.78 0.385 A1 6.73 7.24 0.265 0.285 A2 6.48 6.99 0.255 0.275 A3 0.38 0.015
B 0.46 0.56 0.018 0.022
D 21.21 21.84 0.835 0.860
E 14.22 14.99 0.560 0.590 eA 15.55 15.95 0.612 0.628 eB 3.20 3.61 0.126 0.142
L 2.03 2.29 0.080 0.090
mm inches
Figure 15. M4T28-BR12SH SNAPHAT Housing for 48mAh Battery & Crystal, Package Outline
A2
A3
L
eA
D
A1
A
B
eB
E
SHTK-A
Drawing is not to scale.
16/18
Page 17
M48T559Y
Table 17. M4T28-BR12SH SNAPHAT Housing for 120mAh Battery & Crystal, Package Mechanical Data
Symb
Typ Min Max Typ Min Max
A 10.54 0.415 A1 8.00 8.51 0.315 0.335 A2 7.24 8.00 0.285 0.315 A3 0.38 0.015
B 0.46 0.56 0.018 0.022
D 21.21 21.84 0.835 0.860
E 17.27 18.03 0.680 0.710 eA 15.55 15.95 0.612 0.628 eB 3.20 3.61 0.126 0.142
L 2.03 2.29 0.080 0.090
mm inches
Figure 16. M4T28-BR12SH SNAPHAT Housing for 120mAh Battery & Crystal, Package Outline
A2
A3
L
eA
D
A1
A
B
eB
E
SHTK-A
Drawing is not to scale.
17/18
Page 18
M48T559Y
.
Information furnished is believed to be ac curate and reliable. However, STMicroelectro ni cs assumes no resp onsibility for the cons equences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implic ation or otherwise under any patent or pat ent rights of STMicroelectronics. Specifications mentioned in thi s publicati on are s ubject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as cri tical comp onents in life support devi ces or systems without express written approv al of STMicroel ectronics.
The ST log o i s registered trademark of STMicroelectronics
1998 STMicroel e ctronics - All Rights Reserved
All other names are the property of their respective ow ners.
Australi a - Brazil - Chi na - Finland - F rance - Germ any - Hong K ong - India - It al y - Japan - Ma la ys i a - Malta - Morocco -
Singapor e - Spain - Sweden - Switzerl and - United Kingdom - U .S .A.
STMicroelect ro n ics GRO UP OF COMPANI ES
http://www.st.com
18/18
Loading...