Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6519
Issued Date : 1993.01.15
Revised Date : 2001.10.15
Page No. : 1/3
HSB564A
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSB564A is designed for general purpose low frequency power
amplifier applications.
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 800 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -30 V
VCEO Collector to Emitter Voltage..................................................................................... -25 V
VEBO Emitter to Base Voltage............................................................................................ -5 V
IC Collector Current ............................................................................................................. -1 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -30 - - V IC=-100uA, IE=0
BVCEO -25 - - V IC=-10mA. IB=0
BVEBO -5 - - V IE=-100uA, IC=0
ICBO - - -100 nA VCB=-30V, IE=0
*VCE(sat) - - -0.5 V IC=-1A, IB=-100mA
*VBE(sat) - - -1.2 V IC=-1A, IB=-100mA
*hFE 70 - 400 VCE=-1V, IC=-100mA
fT - 110 - MHz VCE=-6V, IC=-10mA, f=100MHz
Cob - 18 - pF VCB=-6V, f=1MHz
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE
Rank O Y GR
Range 70-140 120-240 200-400
HSB564A HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6519
Issued Date : 1993.01.15
Revised Date : 2001.10.15
Page No. : 2/3
1000
100
hFE
10
0.1 1 10 100 1000
Current Gain & Collector Current
VCE=1V
Collecto r Cur r e nt ( mA)
Capcitance & Rev erse-Bi ased Voltage
100
10000
1000
100
Saturat ion Vol t age (m V)
10
1
Saturation Voltage & Collector Current
BE(sat)
V
CE(sat)
V
0.1 1 10 100 1000
Collect or Cur rent (mA)
@ IC=10I
@ IC=10I
B
B
Cutoff Frequency & Collector Current
1000
Cob
10
Capacitan c e (pF)
1
0.1 1 10 100
Rev ers e Biased Voltage (V)
Safe Operating Area
10000
1000
Collecto r Cur r e nt ( mA)
PT=1ms
PT=100ms
PT=1s
100
10
VCE=6V
100
Cutoff Frequency (MHz)
10
1 10 100 1000
Collecto r Cur rent (mA)
Power Derating
900
800
700
600
500
400
300
Power Dissipation-PD(mW)
200
100
1
1 10 100
Forward Voltage ( V)
0
0 50 100 150 200
Ambient T em perat ure-Ta(oC)
HSB564A HSMC Product Specification
Page 3
HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6519
Issued Date : 1993.01.15
Revised Date : 2001.10.15
Page No. : 3/3
B
C
α2
A
31
2
α3
D
H
I
α1
G
Marking:
HSMC Logo
Part Number
Date Code
HSMC Logo
Part Number
Style: Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Fac tory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSB564A HSMC Product Specification
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