
MICROWAVE CORPORATION
GaAs MMIC SMT FREQUENCY DOUBLER 0.85 - 2.0 GHz INPUT
HMC187MS8
FEBRUARY 2001
Features
CONVERSION LOSS: 16 dB
Fo, 3Fo, 4Fo ISOLATION: 40 dB
INPUT DRIVE LEVEL: 10 to 20 dBm
3
MULTIPLIERS
SMT
V01.0800
General Description
The HMC187MS8 is a miniature frequency
doubler in a plastic 8-lead MSOP package.
The suppression of the undesired fundamental and higher order harmonics is typically 40 to 50 dB with respect to input signal
levels. The doubler uses same diode/balun
structures used in Hittite MMIC mixers. The
doubler is ideal for high volume applications
where frequency doubling of a lower frequency is more economical than directly
generating a higher frequency. The passive
Schottky diode doubler technology contributes no measurable additive phase noise
onto the multiplied signal.
GuaranteedPerformance, 50 Ohm system -40 to +85 deg C
Typical Electrical Performance vs. Drive Level
10 dBm 15 dBm 20 dBm Units
Input Frequency Range 1.25-1.75 1.0-1.75 0.85-2.0 GHz
Output Frequency Range 2.5-3.5 2.0-3.5 1.7-4.0 GHz
Conversion Loss 20 15 16 dB
Performance for Input Signals in the 1.0 - 1.75 GHz Band (+15dBm Drive)
Min. Typ. Max. Units
Fo Isolation (with respect to input level) 35 45 dB
3Fo Isolation (with respect to i nput level) 46 52 dB
4Fo Isolation (with respect to i nput level) 33 40 dB
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com
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MICROWAVE CORPORATION
HMC187MS8 SMT FREQUENCY DOUBLER 0.85 - 2.0 GHz INPUT
HMC187MS8
V01.0800
Conversion Loss @ +15 dBm
Drive Level
0
-5
-10
-15
-20
-25
CONVERSION GAIN (dB)
-30
-35
123456
OUTPUT FREQUENC Y (GHz)
+85 C
-40 C+25 C
Input Return Loss
vs. Drive Level
0
-5
-10
-15
-20
INPUT RETUR N LOS S (dB)
-25
-30
0.5 1 1.5 2 2.5 3
15 dBm
INPUT FREQUENCY (GHz)
10 dBm
13 dBm
17 dBm
FEBRUARY 2001
Isolation @ +15 dBm
Drive Level *
0
-10
-20
1FO
-30
-40
ISOLATIO N (dB )
-50
-60
-70
024681012
4FO
3FO
FREQUENCY (GHz)
* With respect to input level
Output Return Loss for
Several Input Frequencies
0
1GHz
-5
-10
-15
-20
OUTPUT RETURN LOSS (dB)
-25
1.75 GHz
2.5 GHz
012345678910
OUTPUT FREQUENC Y (GHz)
3
MULTIPLIERS
SMT
Note: Output return loss measured at 2fo, with +10 dBm,
+15 dBm, and +20 dBm drive levels on input of doubler.
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com
3 - 27

MICROWAVE CORPORATION
HMC187MS8 SMT FREQUENCY DOUBLER 0.85 - 2.0 GHz INPUT
HMC187MS8
FEBRUARY 2001
Conversion Gain@ 25 Deg C
vs. Drive Level
3
Conversion Gain @ -40 Deg C
vs. Drive Level
MULTIPLIERS
SMT
0
-5
17 dBm
-10
-15
-20
-25
CONVERSION G AIN (dB)
-30
-35
123456
0
-5
17 dBm
-10
-15
-20
-25
CONV ERSIO N G AIN (dB)
-30
-35
123456
15 dBm
13 dBm
OUTPUT FREQUENCY (GHz)
15 dBm
11 dBm
OUTPUT FREQUENC Y (GHz)
11 dBm
20 dBm
9dBm
20 dBm
13 dBm
9dBm
V01.0800
Output Return Loss with
1 GHz Input
0
15 dBm
-5
-10
-15
OUTPUT RETURN LOSS (dB0
-20
17 dBm
10 dBm
0 0.6 1.2 1.8 2.4 3 3.6 4.2 4.8 5 .4 6
OUTPUT FREQUENC Y (GHz)
Output Return Loss with
1.75 GHz Input
0
10 dBm
-5
-10
17 dBm
-15
OUTPUT RETURN LOSS (dB)
-20
0123456
15 dBm
OUTPUT FREQUENC Y (G Hz)
Conversion Gain @ +85 Deg C
vs. Drive Level
0
-5
17 dBm
-10
-15
-20
-25
CONVERSION G AIN (dB)
-30
-35
123456
15 dBm
11 dBm
13 dBm
9dBm
OUTPUT FREQUENCY (GHz)
20 dBm
Output Return Loss with
2.5 GHz Input
0
10 dBm
-5
-10
17 dBm
-15
OUTPUT RETURN LOSS (dB)
-20
0123456
15 dBm
OUTPUT FREQUENC Y (GHz)
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com
3 - 28

MICROWAVE CORPORATION
HMC187MS8 SMT FREQUENCY DOUBLER 0.85 - 2.0 GHz INPUT
HMC187MS8
V01.0800
Schematic
RF OUT RF IN
(PIN 2) (PIN 7)
Outline Drawing
0.116/ 0.120
(2.95/ 3.05)
OUT
0.116/ 0.120
(2.95/ 3.05)
HMC
187
0.188/ 0.196
(4.78/ 4.98)
FEBRUARY 2001
Absolute Maximum Ratings
evirDtupnImBd72+
erutarepmeTegarotSC.ged051+ot56-
erutarepmeTgnitarepOC.ged58+otc04-
LOT NUMBER
XXXX
YYWW
3
MULTIPLIERS
SMT
DATE CODE
YY= YEAR
PIN 1
0.038/ 0.042
(0.96/ 1.07)
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Web Site: www.hittite.com
0.0256 TYP
(0.65)
IN
0.032/ 0.036
(0.81/ 0.91)
0 to 5 DEG
0.012 TYP
(0.30)
1. MATERIAL:
A) PACKAGE BODY - LOW STRESS INJECTION-MOLDED
PLASTIC, SILICA & SILICONE IMPREGNATED.
B) LEADFRAME MATERIAL : COPPER ALLOY
2. PLATING: LEAD - TIN SOLDER PLATE
3. DIMENSIONS ARE IN INCHES (MILLIMETERS). UNLESS
OTHERWISE SPECIFIED ALL TOLERANCES ARE
±0.005(±0.13).
4. ALL UNLABELED LEADS ARE GROUND.
0.021 MIN TYP
(0.53)
WW= WEEK
PIN 1 (REF)
0.005/ 0.007
(0.13/ 0.18)
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