The HD74ALVC162834A is an 18-bit universal bus driver designed for 2.3 V to 3.6 V VCC operation.
Data flow from A to Y is controlled by the output enable (OE). The device operates in the transparent mode
when the latch enable (LE) is low. When LE is low, the A data is latched if the clock (CLK) input is held
at a high or low logic level. If the LE is high, the A data is stored in the latch/flip flop on the low to high
transition of CLK. When OE is high, the outputs are in the high impedance state.
To ensure the high impedance state during power up or power down, OE should be tied to VCC through a
pullup registor; the minimum value of the registor is determined by the current sinking capability of the
driver.
All outputs, which are designed to sink up to 12 mA, include series dumping resistors to reduce overshoot
and undershoot.
• Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C)
• Typical VOH undershoot > 2.0 V (@VCC = 3.3 V, Ta = 25°C)
• High output current ±12 mA (@VCC = 3.0 V)
• All outputs have series dumping resistors, so no external resistors are required
• tpd (CLK to Y) = 3.5 ns (Max) (@VCC = 3.3±0.3 V, CL = 50 pF, Ta = 0 to 85°C)
• tpd (CLK to Y) = 2.5 ns (Max) (@VCC = 3.3±0.3 V, CL = 30 pF, Ta = 0 to 85°C)
Page 2
HD74ALVC162834A
Function Table
Inputs
OELECLKAOutput Y
HXXX Z
LLXLL
LLXHH
LH↑LL
LH↑HH
LHL or HXY
H :High level
L :Low level
X :Immaterial
Z :High impedance
↑ :Low to high transition
Note:1. Output level before the indicated steady-state input conditions were established.
Supply voltage rangeV
Input voltage range
Output voltage range
*1
*1, 2
Input clamp currentI
Output clamp currentI
Continuous output currentI
VCC, GND current / pinICC or I
Maximum power dissipation
at Ta = 55°C (in still air)
*3
CC
V
I
V
O
IK
OK
O
GND
P
T
Storage temperature rangeTstg–65 to 150°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the
device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “recommended operating condition” is not implied. Exposure to absolutemaximum-rated conditions for extended periods may affect device reliability.
Notes: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp
current ratings are observed.
2. The input and output positive-voltage ratings may be exceeded up to 4.6 V if the input and output
clamp-current ratings are observed.
3. The maximum power dissipation is calculated using a junction temperature of 150°C and board
trace length of 750 mils.
–0.5 to 4.6V
–0.5 to 4.6V
–0.5 to VCC+0.5V
–50mAVI < 0
2. Waveform – A is for an output with internal conditions such that the output is low except
when disabled by the output control.
3.Waveform – B is for an output with internal conditions such that the output is high except
when disabled by the output control.
4.The output are measured one at a time with one transition per measurement.
V
≈V
V
V
≈V
2.7 V
3.0 V
GND
IH
GND
OH1
OL
OH
OL1
12
Page 13
IV Characteristics for Register Output (Measured value)
Weak condition HIGH
Vcc = 3.0 V, Ta = 85°C
V (V)
OH
0.00.51.01.52.02.53.0
0
-20
-40
OH
I (mA)
-60
-80
HD74ALVC162834A
-100
Strong condition HIGH
Vcc = 3.6 V, Ta = 0°C
V (V)
OH
0.00.51.01.52.02.53.03.54.0
0
-30
-60
OH
I (mA)
-90
-120
-150
13
Page 14
HD74ALVC162834A
120
100
80
60
OL
I (mA)
40
20
0
0.00.51.01.52.02.53.0
Weak condition LOW
Vcc = 3.0 V, Ta = 85°C
V (V)
OL
Strong condition LOW
Vcc = 3.6 V, Ta = 0°C
150
120
90
OL
I (mA)
60
30
0
0.00.51.01.52.02.53.03.54.0
14
V (V)
OL
Page 15
Package Dimensions
14.00
+0.3
–0.1
HD74ALVC162834A
Unit : mm
2956
+0.3
–0.1
6.10
128
+0.1
0.20
–0.05
0.50
0.08
M
0.40 Max
0.10
0.05 Min
1.20 max
8.10 ± 0.3
0.15 ± 0.05
Hitachi code
JEDEC code
EIAJ code
10° Max
0.50 ± 0.1
TTP-56D
—
—
15
Page 16
HD74ALVC162834A
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore): http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH
Electronic components Group
Dornacher Straße 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
16
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX