This shift register features parallel inputs, parallel outputs, J-K serial inputs, Shift/Load control input, and a
direct overriding clear. This shift register can operate in two modes: Parallel load; Shift from Q0 towards
Q3.
Parallel loading is accomplished by applying the four bits of data, and taking the PE Input low. The data is
loaded into the associated flip-flops and appears at the outputs after the positive transition of the CP input.
During parallel loading, serial data flow is inhibited. Serial shifting occurs synchronously when the PE
input is high. Serial data for this mode is entered at the J-K inputs. These inputs allow the first stage to
perform as a J-K or toggle flip-flop as shown in the function table.
Asynchronous ResetLXXXXXLLL LH
Shift, Set First StageHHHHXHq0q1q
Shift, Reset First StageHHLLXLq0q1q
Shift, Toggle First StageHHHLXq0q0q1q
Shift, Retain First StageHHLHXq0q0q1q
Parallel LoadHLXXdnd0d1d2d
H :HIGH Voltage Level
L :LOW Voltage Level
X :Immaterial
Lower case letters indicate the state of the referenced input (or output) one setup time prior to the LOW-to-
HIGH transition.
:LOW-to-HIGH clock transition.
3
2
2
2
2
3
Q
3
q
2
q
2
q
2
q
2
d
3
3
Page 4
HD74AC195
Logic Diagram
D
3D2D1D0
PE
CP
MR
DC Characteristics (unless otherwise specified)
K
VCCJ
V
CC
Q0Q1Q2Q3Q3
ItemSymbol MaxUnitCondition
Maximum quiescent supply currentI
CC
80µAV
= VCC or ground, VCC = 5.5 V,
IN
Ta = Worst case
Maximum quiescent supply currentI
CC
8.0µAV
= VCC or ground, VCC = 5.5 V,
IN
Ta = 25°C
4
Page 5
AC Characteristics: HD74AC195
HD74AC195
ItemSymbolV
Maximum clockf
max
Ta = +25°C
C
= 50 pF
L
(V)*1MinTypMaxMinMaxUnit
CC
3.375——65—MHz
Ta = –40°C to +85°C
CL = 50 pF
frequency5.0100——85—
Propagation delayt
CP to Qn or Q
3
Propagation delayt
CP to Qn or Q
2
Propagation delayt
MR to Q
2
Propagaion delayt
MR to Q
n
PLH
PHL
PLH
PHL
3.31.09.013.01.015.0ns
5.01.05.510.01.011.5
3.31.09.013.01.015.0ns
5.01.06.510.01.011.5
3.31.07.510.51.012.0ns
5.01.05.58.01.09.5
3.31.06.09.01.010.5ns
5.01.05.07.01.08.0
Note:1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
AC Operating Requirements: HD74AC195
Ta = –40°C
Ta = +25°C
C
= 50 pF
L
ItemSymbolV
Setup time, HIGH or LOWt
su
(V)*1TypGuaranteed MinimumUnit
CC
3.33.05.57.0ns
J, K or Dn to CP5.02.04.05.0
Hold time, HIGH or LOWt
h
3.3–0.52.03.6ns
J, K or Dn to CP5.00.51.52.0
Setup time, HIGH or LOWt
su
3.33.55.07.0ns
PE to CP5.02.54.05.0
Hold time, HIGH or LOWt
h
3.3–2.00.00.0ns
PE to CP5.0–1.50.00.0
Recovery timet
rec
3.3–1.50.50.5ns
MR to CP5.0–1.00.50.5
Pulse widtht
w
3.3–3.05.57.0ns
5.0–3.04.55.0
Note:1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
to +85°C
CL = 50 pF
5
Page 6
HD74AC195
Capacitance
ItemSymbolTypUnitCondition
Input capacitanceC
Power dissipation capacitanceC
IN
PD
4.5pFVCC = 5.5 V
125pFVCC = 5.0 V
6
Page 7
19.20
20.00 Max
169
1.3
Unit: mm
6.30
7.40 Max
81
1.11 Max
2.54 ± 0.25
0.48 ± 0.10
5.06 Max
2.54 Min
0.51 Min
Hitachi Code
JEDEC
EIAJ
Weight
7.62
+ 0.13
0.25
– 0.05
0° – 15°
(reference value)
DP-16
Conforms
Conforms
1.07 g
Page 8
16
Unit: mm
10.06
10.5 Max
9
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
+ 0.20
– 0.30
1.15
0° – 8°
FP-16DA
—
Conforms
0.24 g
Page 9
16
Unit: mm
9.9
10.3 Max
9
1
1.27
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.25
+ 0.11
– 0.04
0.14
0.15
3.95
1.75 Max
M
6.10
1.08
0.20 ± 0.03
*0.22 ± 0.03
+ 0.67
0.60
– 0.20
Hitachi Code
JEDEC
EIAJ
Weight
+ 0.10
– 0.30
0° – 8°
(reference value)
FP-16DN
Conforms
Conforms
0.15 g
Page 10
169
18
+ 0.08
*0.22
– 0.07
0.20 ± 0.06
5.00
5.30 Max
0.65 Max
0.65
0.13
Unit: mm
4.40
1.0
M
6.40 ± 0.20
0.10
1.10 Max
*Dimension including the plating thickness
Base material dimension
0.15 ± 0.04
*0.17 ± 0.05
+0.03
–0.04
0.07
0° – 8°
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
0.50 ± 0.10
TTP-16DA
—
—
0.05 g
Page 11
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
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(America) Inc.
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Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
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Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
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Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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7/F., North Tower, World Finance Centre,
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Tel: <852> (2) 735 9218
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