Datasheet HCPL-2631, HCPL-2630, HCPL-4661, HCPL-2611, HCPL-2601 Datasheet (HP)

...
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H
High CMR, High Speed TTL Compatible Optocouplers
Technical Data
6N137 HCNW137 HCNW2601 HCNW2611 HCPL-0600 HCPL-0601 HCPL-0611 HCPL-0630
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
Features
• 5 kV/µs Minimum Common
Mode Rejection (CMR) at VCM= 50 V for HCPL-X601/ X631, HCNW2601 and 10 kV/µs Minimum CMR at VCM = 1000 V for HCPL­X611/X661, HCNW2611
• High Speed: 10 MBd Typical
• LSTTL/TTL Compatible
• Low Input Current Capability: 5 mA
• Guaranteed ac and dc Performance over Temper­ature: -40°C to +85°C
• Available in 8-Pin DIP, SOIC-8, Widebody Packages
• Strobable Output (Single Channel Products Only)
• Safety Approval
UL Recognized - 2500 V rms
for 1 minute and 5000 V rms*
for 1 minute per UL1577 CSA Approved VDE 0884 Approved with
V
IORM
= 630 V peak for HCPL-2611 Option 060 and V
IORM
= 1414 V peak for HCNW137/26X1
BSI Certified
(HCNW137/26X1 Only)
• MIL-STD-1772 Version Available (HCPL-56XX/ 66XX)
Functional Diagram
*5000 V rms/1 Minute rating is for HCNW137/26X1 and Option 020 (6N137, HCPL-2601/11/30/31, HCPL-4661) products only.
Applications
• Isolated Line Receiver
• Computer-Peripheral Interfaces
• Microprocessor System Interfaces
• Digital Isolation for A/D,
D/A Conversion
• Switching Power Supply
• Instrument Input/Output Isolation
• Ground Loop Elimination
• Pulse Transformer Replacement
• Power Transistor Isolation in Motor Drives
• Isolation of High Speed Logic Systems
Description
The 6N137, HCPL-26XX/06XX/ 4661, HCNW137/26X1 are optically coupled gates that combine a GaAsP light emitting diode and an integrated high gain photo detector. An enable input allows the detector to be strobed. The output of the detector IC is
A 0.1 µF bypass capacitor must be connected between pins 5 and 8.
1
2
3
4
8
7
6
5
CATHODE
ANODE
GND
V
V
CC
O
1
2
3
4
8
7
6
5
ANODE
2
CATHODE
2
CATHODE
1
ANODE
1
GND
V
V
CC
O2
V
E
V
O1
6N137, HCPL-2601/2611
HCPL-0600/0601/0611
HCNW137/2601/2611
HCPL-2630/2631/4661 HCPL-0630/0631/0661
NC
NC
LED ON
OFF ON OFF ON OFF
ENABLE
H H L
L NC NC
OUTPUT
L H H H L H
TRUTH TABLE
(POSITIVE LOGIC)
LED ON
OFF
OUTPUT
L H
TRUTH TABLE
(POSITIVE LOGIC)
SHIELD SHIELD
5965-3594E
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an open collector Schottky­clamped transistor. The internal shield provides a guaranteed common mode transient immunity specification of 5,000 V/µs for the HCPL-X601/X631 and HCNW2601, and 10,000 V/µs for the HCPL-X611/X661 and HCNW2611.
This unique design provides maximum ac and dc circuit isolation while achieving TTL compatibility. The optocoupler ac and dc operational parameters are guaranteed from -40°C to +85°C allowing troublefree system performance.
The 6N137, HCPL-26XX, HCPL­06XX, HCPL-4661, HCNW137, and HCNW26X1 are suitable for high speed logic interfacing, input/output buffering, as line receivers in environments that conventional line receivers cannot tolerate and are recom­mended for use in extremely high ground or induced noise environments.
Selection Guide
Widebody
Minimum CMR 8-Pin DIP (300 Mil) Small-Outline SO-8 (400 Mil) Hermetic
Input Single
On- Single Dual Single Dual Single and Dual
dV/dt VCMCurrent Output Channel Channel Channel Channel Channel Channel
(V/µs) (V) (mA) Enable Package Package Package Package Package Packages
NA NA 5 YES 6N137 HCPL-0600 HCNW137
NO HCPL-2630 HCPL-0630
5,000 50 YES HCPL-2601 HCPL-0601 HCNW2601
NO HCPL-2631 HCPL-0631
10,000 1,000 YES HCPL-2611 HCPL-0611 HCNW2611
NO HCPL-4661 HCPL-0661
1,000 50 YES HCPL-2602
[1]
3, 500 300 YES HCPL-2612
[1]
1,000 50 3 YES HCPL-261A
[1]
HCPL-061A
[1]
NO HCPL-263A
[1]
HCPL-063A
[1]
1,000
[2]
1,000 YES HCPL-261N
[1]
HCPL-061N
[1]
NO HCPL-263N
[1]
HCPL-063N
[1]
1,000 50 12.5
[3]
HCPL-193X
[1]
HCPL-56XX
[1]
HCPL-66XX
[1]
Notes:
1. Technical data are on separate HP publications.
2. 15 kV/µs with VCM = 1 kV can be achieved using HP application circuit.
3. Enable is available for single channel products only, except for HCPL-193X devices.
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Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2611#XXX
020 = 5000 V rms/1 minute UL Rating Option* 060 = VDE 0884 V
IORM
= 630 Vpeak Option** 300 = Gull Wing Surface Mount Option† 500 = Tape and Reel Packaging Option
Option data sheets available. Contact Hewlett-Packard sales representative or authorized distributor for information.
*For 6N137, HCPL-2601/11/30/31 and HCPL-4661 (8-pin DIP products) only. **For HCPL-2611 only. Combination of Option 020 and Option 060 is not available. †Gull wing surface mount option applies to through hole parts only.
Schematic
SHIELD
8
6
5
2+
3
V
F
USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 5).
I
F
I
CC
V
CC
V
O
GND
I
O
V
E
I
E
7
6N137, HCPL-2601/2611
HCPL-0600/0601/0611
HCNW137, HCNW2601/2611
SHIELD
8
7
+
2
V
F1
I
F1
I
CC
V
CC
V
O1
I
O1
1
SHIELD
6
5
4
V
F2
+
I
F2
V
O2
GND
I
O2
3
HCPL-2630/2631/4661 HCPL-0630/0631/0661
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1.080 ± 0.320
(0.043 ± 0.013)
2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
5° TYP.
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
HP XXXXZ
YYWW
DATE CODE
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
OPTION CODE*
UL RECOGNITION
UR
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED.
Package Outline Drawings
8-pin DIP Package** (6N137, HCPL-2601/11/30/31, HCPL-4661)
8-pin DIP Package with Gull Wing Surface Mount Option 300 (6N137, HCPL-2601/11/30/31, HCPL-4661)
**JEDEC Registered Data (for 6N137 only).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.194 (0.047)
1.194 (0.047)
1.778 (0.070)
9.398 (0.370)
9.906 (0.390)
4.826
(0.190)
TYP.
0.381 (0.015)
0.635 (0.025)
PAD LOCATION (FOR REFERENCE ONLY)
1.080 ± 0.320
(0.043 ± 0.013)
4.19
(0.165)
MAX.
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
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Small-Outline SO-8 Package (HCPL-0600/01/11/30/31/61)
8-Pin Widebody DIP Package (HCNW137, HCNW2601/11)
XXX
YWW
8765
4321
5.842 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.381 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSG
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
45° X
0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER (LAST 3 DIGITS)
DATE CODE
0.305
(0.012)
MIN.
DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.152 ± 0.051
(0.006 ± 0.002)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
1.78 ± 0.15
(0.070 ± 0.006)
5.10
(0.201)
MAX.
1.55
(0.061)
MAX.
2.54 (0.100) TYP.
DIMENSIONS IN MILLIMETERS (INCHES).
7° TYP.
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
11.00
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
MAX.
10.16 (0.400) TYP.
HP 
HCNWXXXX
YYWW
DATE CODE
TYPE NUMBER
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
3.10 (0.122)
3.90 (0.154)
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8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW137, HCNW2601/11)
Note: Use of nonchlorine activated fluxes is highly recommended.
Solder Reflow Temperature Profile (HCPL-06XX and Gull Wing Surface Mount Option 300 Parts)
240
T = 115°C, 0.3°C/SEC
0
T = 100°C, 1.5°C/SEC
T = 145°C, 1°C/SEC
TIME – MINUTES
TEMPERATURE – °C
220 200 180 160 140 120 100
80 60 40 20
0
260
123456789101112
1.00 ± 0.15
(0.039 ± 0.006)
7° NOM.
12.30 ± 0.30
(0.484 ± 0.012)
0.75 ± 0.25
(0.030 ± 0.010)
11.00
(0.433)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
9.00 ± 0.15
(0.354 ± 0.006)
1.3
(0.051)
12.30 ± 0.30
(0.484 ± 0.012)
6.15
(0.242)
TYP.
0.9
(0.035)
PAD LOCATION (FOR REFERENCE ONLY)
1.78 ± 0.15
(0.070 ± 0.006)
4.00
(0.158)
MAX.
1.55
(0.061)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).  LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
MAX.
Page 7
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Regulatory Information
The 6N137, HCPL-26XX/06XX/ 46XX, and HCNW137/26XX have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE 0884/06.92. (HCPL-2611 Option 060 and HCNW137/26X1 only)
BSI
Certification according to BS415:1994 (BS EN60065:1994), BS7002:1992 (BS EN60950:1992) and EN41003:1993 for Class II applications. (HCNW137/26X1 only)
Insulation and Safety Related Specifications
8-pin DIP Widebody
(300 Mil) SO-8 (400 Mil)
Parameter Symbol Value Value Value Units Conditions
Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals Air Gap (External to output terminals, shortest Clearance) distance through air.
Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals Tracking (External to output terminals, shortest Creepage) distance path along body.
Minimum Internal 0.08 0.08 1.0 mm Through insulation distance, Plastic Gap conductor to conductor, usually (Internal Clearance) the direct distance between the
photoemitter and photodetector inside the optocoupler cavity.
Minimum Internal NA NA 4.0 mm Measured from input terminals Tracking (Internal to output terminals, along Creepage) internal cavity.
Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index)
Isolation Group IIIa IIIa IIIa Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Page 8
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VDE 0884 Insulation Related Characteristics (HCPL-2611 Option 060 Only)
Description Symbol Characteristic Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage 300 V rms I-IV for rated mains voltage 450 V rms I-III
Climatic Classification 55/85/21 Pollution Degree (DIN VDE 0110/1.89) 2 Maximum Working Insulation Voltage V
IORM
630 V
peak
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = VPR, 100% Production Test with tm = 1 sec, V
PR
1181 V
peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = VPR, Type and sample test, V
PR
945 V
peak
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage* (Transient Overvoltage, t
ini
= 10 sec) V
IOTM
6000 V
peak
Safety Limiting Values
(Maximum values allowed in the event of a failure, also see Figure 16, Thermal Derating curve.)
Case Temperature T
S
175 °C
Input Current I
S,INPUT
230 mA
Output Power P
S,OUTPUT
600 mW
Insulation Resistance at TS, VIO = 500 V R
S
10
9
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884), for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
VDE 0884 Insulation Related Characteristics (HCNW137/2601/2611 Only)
Description Symbol Characteristic Units
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage 600 V rms I-IV for rated mains voltage 1000 V rms I-III
Climatic Classification (DIN IEC 68 part 1) 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 Maximum Working Insulation Voltage V
IORM
1414 V
peak
Input to Output Test Voltage, Method b*
V
IORM
x 1.875 = VPR, 100% Production Test with tm = 1 sec, V
PR
2651 V
peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
IORM
x 1.5 = VPR, Type and sample test, V
PR
2121 V
peak
tm = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage* (Transient Overvoltage, t
ini
= 10 sec) V
IOTM
8000 V
peak
Safety Limiting Values
(Maximum values allowed in the event of a failure, also see Figure 16, Thermal Derating curve.)
Case Temperature T
S
150 °C
Input Current I
S,INPUT
400 mA
Output Power P
S,OUTPUT
700 mW
Insulation Resistance at TS, VIO = 500 V R
S
10
9
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884), for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.
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Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter Symbol Package** Min. Max. Units Note
Storage Temperature T
S
-55 125 °C
Operating Temperature† T
A
-40 85 °C
Average Forward Input Current I
F
Single 8-Pin DIP 20 mA 2
Single SO-8
Widebody
Dual 8-Pin DIP 15 1, 3
Dual SO-8
Reverse Input Voltage V
R
8-Pin DIP, SO-8 5 V 1
Widebody 3
Input Power Dissipation P
I
Widebody 40 mW
Supply Voltage V
CC
7V
(1 Minute Maximum) Enable Input Voltage (Not to V
E
Single 8-Pin DIP VCC + 0.5 V Exceed VCC by more than Single SO-8 500 mV) Widebody
Enable Input Current I
E
5mA
Output Collector Current I
O
50 mA 1
Output Collector Voltage V
O
7V1 (Selection for Higher Output Voltages up to 20 V is Available.)
Output Collector Power P
O
Single 8-Pin DIP 85 mW
Dissipation Single SO-8
Widebody
Dual 8-Pin DIP 60 1, 4
Dual SO-8
Lead Solder Temperature T
LS
8-Pin DIP 260°C for 10 sec.,
(Through Hole Parts Only) 1.6 mm below seating plane
Widebody 260°C for 10 sec.,
up to seating plane
Solder Reflow Temperature SO-8 and See Package Outline Profile (Surface Mount Parts Only) Option 300 Drawings section
*JEDEC Registered Data (for 6N137 only). **Ratings apply to all devices except otherwise noted in the Package column. †0°C to 70°C on JEDEC Registration.
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Input Current, Low Level IFL* 0 250 µA Input Current, High Level
[1]
IFH** 5 15 mA
Power Supply Voltage V
CC
4.5 5.5 V
Low Level Enable Voltage† V
EL
0 0.8 V
High Level Enable Voltage† V
EH
2.0 V
CC
V
Operating Temperature T
A
-40 85 °C
Fan Out (at RL = 1 k)
[1]
N 5 TTL Loads
Output Pull-up Resistor R
L
330 4 k
*The off condition can also be guaranteed by ensuring that VFL 0.8 volts. **The initial switching threshold is 5 mA or less. It is recommended that 6.3 mA to 10 mA be used for best performance and to permit at least a 20% LED degradation guardband. †For single channel products only.
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Electrical Specifications
Over recommended temperature (TA = -40°C to +85°C) unless otherwise specified. All Typicals at VCC = 5 V, TA = 25°C. All enable test conditions apply to single channel products only. See note 5.
Parameter Sym. Package Min. Typ. Max. Units Test Conditions Fig. Note
High Level Output IOH* All 5.5 100 µAVCC = 5.5 V, VE = 2.0 V, 1 1, 6, Current V
O
= 5.5 V, IF = 250 µA19
Input Threshold I
TH
Single Channel 2.0 5.0 mA VCC = 5.5 V, VE = 2.0 V, 2, 3 19
Current Widebody V
O
= 0.6 V,
Dual Channel 2.5 I
OL
(Sinking) = 13 mA
Low Level Output VOL* 8-Pin DIP 0.35 0.6 V VCC = 5.5 V, VE = 2.0 V, 2, 3, 1, 19 Voltage SO-8 I
F
= 5 mA, 4, 5
Widebody 0.4 I
OL
(Sinking) = 13 mA
High Level Supply I
CCH
Single Channel 7.0 10.0* mA VE = 0.5 V VCC = 5.5 V 7
Current 6.5 V
E
= V
CCIF
= 0 mA
Dual Channel 10 15 Both
Channels
Low Level Supply I
CCL
Single Channel 9.0 13.0* mA VE = 0.5 V VCC = 5.5 V 8
Current 8.5 V
E
= V
CCIF
= 10 mA
Dual Channel 13 21 Both
Channels
High Level Enable I
EH
Single Channel -0.7 -1.6 mA VCC = 5.5 V, VE = 2.0 V
Current Low Level Enable IEL* -0.9 -1.6 mA VCC = 5.5 V, VE = 0.5 V 9
Current High Level Enable V
EH
2.0 V 19
Voltage Low Level Enable V
EL
0.8 V
Voltage Input Forward V
F
8-Pin DIP 1.4 1.5 1.75* V TA = 25°CIF = 10 mA 6, 7 1
Voltage SO-8 1.3 1.80
Widebody 1.25 1.64 1.85 T
A
= 25°C
1.2 2.05
Input Reverse BVR* 8-Pin DIP 5 V IR = 10 µA1 Breakdown SO-8 Voltage Widebody 3 IR = 100 µA, TA = 25°C
Input Diode VF/ 8-Pin DIP -1.6 mV/°C IF = 10 mA 7 1 Temperature T
A
SO-8
Coefficient Widebody -1.9 Input Capacitance C
IN
8-Pin DIP 60 pF f = 1 MHz, VF = 0 V 1
SO-8
Widebody 70
*JEDEC registered data for the 6N137. The JEDEC Registration specifies 0°C to +70°C. HP specifies -40°C to +85°C.
Page 11
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Switching Specifications (AC)
Over Recommended Temperature (TA = -40°C to +85°C), VCC = 5 V, I
F
= 7.5 mA unless otherwise specified.
All Typicals at TA = 25°C, VCC = 5 V.
Parameter Sym. Package** Min. Typ. Max. Units Test Conditions Fig. Note
Propagation Delay t
PLH
20 48 75* ns TA = 25°CRL = 350 8, 9, 1, 10,
Time to High 100 C
L
= 15 pF 10 19
Output Level Propagation Delay t
PHL
25 50 75* ns TA = 25°C 1, 11, Time to Low 100 19 Output Level
Pulse Width |t
PHL
- t
PLH
| 8-Pin DIP 3.5 35 ns 8, 9, 13, 19
Distortion SO-8 10,
Widebody 40 11
Propagation Delay t
PSK
40 ns 12, 13,
Skew 19 Output Rise t
r
24 ns 12 1, 19
Time (10-90%) Output Fall t
f
10 ns 12 1, 19
Time (90-10%) Propagation Delay t
ELH
Single Channel 30 ns RL = 350 , 13, 14
Time of Enable C
L
= 15 pF, 14
from V
EH
to V
EL
VEL = 0 V, VEH = 3 V
Propagation Delay t
EHL
Single Channel 20 ns 15 Time of Enable from V
EL
to V
EH
*JEDEC registered data for the 6N137. **Ratings apply to all devices except otherwise noted in the Package column.
Parameter Sym. Device Min. Typ. Units Test Conditions Fig. Note
Logic High |CMH| 6N137 10,000 V/µs|VCM| = 10 V VCC = 5 V, IF = 0 mA, 15 1, 16, Common HCPL-2630 V
O(MIN)
= 2 V, 18, 19
Mode HCPL-0600/0630 R
L
= 350 , TA = 25°C
Transient HCNW137 Immunity HCPL-2601/2631 5,000 10,000 |V
CM
| = 50 V HCPL-0601/0631 HCNW2601 HCPL-2611/4661 10,000 15,000 |V
CM
| = 1 kV HCPL-0611/0661 HCNW2611
Logic Low |CML| 6N137 10,000 V/µs|VCM| = 10 V VCC = 5 V, IF = 7.5 mA, 15 1, 17, Common HCPL-2630 V
O(MAX)
= 0.8 V, 18, 19
Mode HCPL-0600/0630 R
L
= 350 , TA = 25°C
Transient HCNW137 Immunity HCPL-2601/2631 5,000 10,000 |V
CM
| = 50 V HCPL-0601/0631 HCNW2601 HCPL-2611/4661 10,000 15,000 |V
CM
| = 1 kV HCPL-0611/0661 HCNW2611
Page 12
1-157
Package Characteristics
All Typicals at TA = 25°C.
Parameter Sym. Package Min. Typ. Max. Units Test Conditions Fig. Note
Input-Output I
I-O
* Single 8-Pin DIP 1 µA 45% RH, t = 5 s, 20, 21
Insulation Single SO-8 V
I-O
= 3 kV dc, TA = 25°C
Input-Output V
ISO
8-Pin DIP, SO-8 2500 V rms RH 50%, t = 1 min, 20, 21
Momentary With- Widebody 5000 T
A
= 25°C 20, 22
stand Voltage** OPT 020† 5000 Input-Output R
I-O
8-Pin DIP, SO-8 10
12
V
I-O
= 500 V dc 1, 20,
Resistance Widebody 10
12
10
13
TA = 25°C23
10
11
TA = 100°C
Input-Output C
I-O
8-Pin DIP, SO-8 0.6 pF f = 1 MHz, TA = 25°C 1, 20,
Capacitance Widebody 0.5 0.6 23 Input-Input I
I-I
Dual Channel 0.005 µA RH 45%, t = 5 s, 24
Insulation V
I-I
= 500 V
Leakage Current Resistance R
I-I
Dual Channel 10
11
24
(Input-Input) Capacitance C
I-I
Dual 8-Pin DIP 0.03 pF f = 1 MHz 24
(Input-Input) Dual SO-8 0.25
*JEDEC registered data for the 6N137. The JEDEC Registration specifies 0°C to 70°C. HP specifies -40°C to 85°C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.” †For 6N137, HCPL-2601/2611/2630/2631/4661 only.
Notes:
1. Each channel.
2. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does not exceed 20 mA.
3. Peaking circuits may produce transient input currents up to 50 mA, 50 ns maximum pulse width, provided average current does not exceed 15 mA.
4. Derate linearly above 80°C free-air temperature at a rate of 2.7 mW/°C for the SOIC-8 package.
5. Bypassing of the power supply line is required, with a 0.1 µF ceramic disc capacitor adjacent to each optocoupler as illustrated in Figure 17. Total lead length between both ends of the capacitor and the isolator pins should not exceed 20 mm.
6. The JEDEC registration for the 6N137 specifies a maximum IOH of 250 µA. HP guarantees a maximum IOH of 100 µA.
7. The JEDEC registration for the 6N137 specifies a maximum I
CCH
of 15 mA. HP guarantees a maximum I
CCH
of 10 mA.
8. The JEDEC registration for the 6N137 specifies a maximum I
CCL
of 18 mA. HP guarantees a maximum I
CCL
of 13 mA.
9. The JEDEC registration for the 6N137 specifies a maximum IEL of –2.0 mA. HP guarantees a maximum IEL of -1.6 mA.
10. The t
PLH
propagation delay is measured from the 3.75 mA point on the falling edge of the input pulse to the 1.5 V point on the
rising edge of the output pulse.
11. The t
PHL
propagation delay is measured from the 3.75 mA point on the rising edge of the input pulse to the 1.5 V point on the
falling edge of the output pulse.
12. t
PSK
is equal to the worst case difference in t
PHL
and/or t
PLH
that will be seen between units at any given temperature and specified
test conditions.
13. See application section titled “Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew” for more information.
14. The t
ELH
enable propagation delay is measured from the 1.5 V point on the falling edge of the enable input pulse to the 1.5 V
point on the rising edge of the output pulse.
15. The t
EHL
enable propagation delay is measured from the 1.5 V point on the rising edge of the enable input pulse to the 1.5 V point
on the falling edge of the output pulse.
16. CMH is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state (i.e., VO > 2.0 V).
17. CML is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i.e., VO < 0.8 V).
18. For sinusoidal voltages, (|dVCM | / dt)
max
= πfCMVCM(p-p).
Page 13
1-158
I
OH
– HIGH LEVEL OUTPUT CURRENT – µA
-60
0
TA – TEMPERATURE – °C
100
10
15
-20
5
20
V
CC
= 5.5 V
V
O
= 5.5 V
V
E
= 2.0 V*
I
F
= 250 µA
60
-40 0 40 80
* FOR SINGLE CHANNEL PRODUCTS ONLY
19. No external pull up is required for a high logic state on the enable input. If the VE pin is not used, tying VE to VCC will result in improved CMR performance. For single channel products only.
20. Device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together.
21. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage 3000 V rms for one second (leakage detection current limit, I
I-O
5 µA). This test is performed before the 100% production test for partial discharge
(Method b) shown in the VDE 0884 Insulation Characteristics Table, if applicable.
22. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 6000 V rms for one second (leakage detection current limit, I
I-O
5 µA). This test is performed before the 100% production test for partial discharge
(Method b) shown in the VDE 0884 Insulation Characteristics Table, if applicable.
23. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. For dual channel products only.
24. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. For dual channel products only.
Figure 2. Typical Output Voltage vs. Forward Input Current.
Figure 3. Typical Input Threshold Current vs. Temperature.
Figure 1. Typical High Level Output Current vs. Temperature.
1
6
2
3
4
5
123456
I
F
– FORWARD INPUT CURRENT – mA
RL = 350
RL = 1 K
RL = 4 K
0
0
VCC = 5 V
T
A
= 25 °C
V
O
– OUTPUT VOLTAGE – V
8-PIN DIP, SO-8
1
6
2
3
4
5
123456
I
F
– FORWARD INPUT CURRENT – mA
RL = 350
RL = 1 K
RL = 4 K
0
0
VCC = 5 V
T
A
= 25 °C
V
O
– OUTPUT VOLTAGE – V
WIDEBODY
VCC = 5.0 V V
O
= 0.6 V
6
3
-60 -20 20
60
100
T
A
– TEMPERATURE – °C
2
80400-40
0
I
TH
– INPUT THRESHOLD CURRENT – mA
RL = 350 K
1
4
5
RL = 1 K
RL = 4 K
8-PIN DIP, SO-8
VCC = 5.0 V V
O
= 0.6 V
6
3
-60 -20 20
60
100
T
A
– TEMPERATURE – °C
2
80400-40
0
I
TH
– INPUT THRESHOLD CURRENT – mA
RL = 350
1
4
5
RL = 1 K
RL = 4 K
WIDEBODY
Page 14
1-159
VCC = 5.0 V V
E
= 2.0 V*
V
OL
= 0.6 V
70
60
-60 -20 20
60
100
T
A
– TEMPERATURE – °C
50
80400-40
20
I
OL
– LOW LEVEL OUTPUT CURRENT – mA
40
IF = 10-15 mA
IF = 5.0 mA
* FOR SINGLE CHANNEL PRODUCTS ONLY
0.8
0.4
-60 -20 20
60
100
T
A
– TEMPERATURE – °C
0.2
80400-40
0
V
OL
– LOW LEVEL OUTPUT VOLTAGE – V
IO = 16 mA
0.1
0.5
0.7
IO = 6.4 mA
WIDEBODY
VCC = 5.5 V V
E
= 2.0 V
I
F
= 5.0 mA
0.3
0.6
IO = 12.8 mA
IO = 9.6 mA
Figure 7. Typical Temperature Coefficient of Forward Voltage vs. Input Current.
Figure 4. Typical Low Level Output Voltage vs. Temperature. Figure 5. Typical Low Level Output
Current vs. Temperature.
Figure 6. Typical Input Diode Forward Characteristic.
0.8
0.4
-60 -20 20
60
100
T
A
– TEMPERATURE – °C
0.2
80400-40
0
V
OL
– LOW LEVEL OUTPUT VOLTAGE – V
IO = 16 mA
0.1
0.5
0.7
IO = 6.4 mA
8-PIN DIP, SO-8
VCC = 5.5 V V
E
= 2.0 V*
I
F
= 5.0 mA
0.3
0.6
IO = 12.8 mA
IO = 9.6 mA
* FOR SINGLE CHANNEL PRODUCTS ONLY
I
F
– FORWARD CURRENT – mA
1.1
0.001
VF – FORWARD VOLTAGE – V
1.0
1000
1.3
0.01
1.51.2 1.4
0.1
T
A
= 25 °C
10
100
8-PIN DIP, SO-8
I
F
+ –
V
F
1.6
I
F
– FORWARD CURRENT – mA
1.2
0.001
VF – FORWARD VOLTAGE – V
1.0
110
1.4
0.01
1.61.3 1.5
0.1
10
100
WIDEBODY
I
F
+
V
F
1.7
T
A
= 25 °C
dV
F
/dT – FORWARD VOLTAGE 
TEMPERATURE COEFFICIENT – mV/°C
0.1 1 10 100 I
F
– PULSE INPUT CURRENT – mA
-1.4
-2.2
-2.0
-1.8
-1.6
-1.2
-2.4
8-PIN DIP, SO-8
dV
F
/dT – FORWARD VOLTAGE 
TEMPERATURE COEFFICIENT – mV/°C
0.1 1 10 100 I
F
– PULSE INPUT CURRENT – mA
-1.9
-2.2
-2.1
-2.0
-1.8
-2.3
WIDEBODY
Page 15
1-160
VCC = 5.0 V I
F
= 7.5 mA
40
30
-20 20
60
100
T
A
– TEMPERATURE – °C
20
80400-40
PWD – PULSE WIDTH DISTORTION – ns
10
RL = 350
RL = 1 k
RL = 4 k
0
-60
-10
Figure 8. Test Circuit for t
PHL
and t
PLH
.
Figure 9. Typical Propagation Delay vs. Temperature.
Figure 10. Typical Propagation Delay vs. Pulse Input Current.
Figure 11. Typical Pulse Width Distortion vs. Temperature.
Figure 12. Typical Rise and Fall Time vs. Temperature.
VCC = 5.0 V T
A
= 25°C
105
90
5913
I
F
– PULSE INPUT CURRENT – mA
75
15117
30
t
P
– PROPAGATION DELAY – ns
60
45
t
PLH
, RL = 4 K
t
PLH
, RL = 1 K
t
PLH
, RL = 350
t
PHL
, RL = 350
1 K 4 K
OUTPUT V MONITORING NODE
O
+5 V
7
5
6
8
2
3
4
1
PULSE GEN.
Z = 50
t = t = 5 ns
O
f
I
F
L
R
R
M
CC
V
0.1µF BYPASS
*C
L
GND
INPUT
MONITORING
NODE
r
SINGLE CHANNEL
OUTPUT V MONITORING NODE
O
+5 V
7
5
6
8
2
3
4
1
PULSE GEN.
Z = 50
t = t = 5 ns
O
f
I
F
L
R
R
M
CC
V
0.1µF BYPASS
C
L
*
GND
INPUT
MONITORING
NODE
r
DUAL CHANNEL
1.5 V
t
PHL
t
PLH
I
F
INPUT
O
V
OUTPUT
I = 7.50 mA
F
I = 3.75 mA
F
*CL IS APPROXIMATELY 15 pF WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE.
VCC = 5.0 V I
F
= 7.5 mA
100
80
-60 -20 20
60
100
T
A
– TEMPERATURE – °C
60
80400-40
0
t
P
– PROPAGATION DELAY – ns
40
20
t
PLH
, RL = 4 K
t
PLH
, RL = 1 K
t
PLH
, RL = 350
t
PHL
, RL = 350
1 K 4 K
t
r
, t
f
– RISE, FALL TIME – ns
-60
0
T
A
– TEMPERATURE – °C
100
300
-20
40
20 60-40 0 40 80
60
290
20
VCC = 5.0 V I
F
= 7.5 mA
R
L
= 4 k
RL = 1 k
RL = 350 Ω, 1 k, 4 k
t
RISE
t
FALL
RL = 350
Page 16
1-161
OUTPUT V  MONITORING  NODE
O
1.5 V
t
EHL
t
ELH
V
E
INPUT
O
V
OUTPUT
3.0 V
1.5 V
+5 V
7
5
6
8
2
3
4
1
PULSE GEN.
Z = 50
t = t = 5 ns
O
f
I
F
L
R
CC
V
0.1 µF BYPASS
*C
L
*C IS APPROXIMATELY 15 pF WHICH INCLUDES  PROBE AND STRAY WIRING CAPACITANCE.
L
GND
r
7.5 mA
INPUT VE MONITORING NODE
Figure 13. Test Circuit for t
EHL
and t
ELH
.
Figure 14. Typical Enable Propagation Delay vs. Temperature.
Figure 15. Test Circuit for Common Mode Transient Immunity and Typical Waveforms.
V
O
0.5 V
O
V (MIN.)
5 V
0 V
SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 7.5 mA
F
CM
V
H
CM
CM
L
O
V (MAX.)
CM
V (PEAK)
V
O
t
E
– ENABLE PROPAGATION DELAY – ns
-60
0
TA – TEMPERATURE – °C
100
90
120
-20
30
20 60-40 0 40 80
60
VCC = 5.0 V V
EH
= 3.0 V
V
EL
= 0 V
I
F
= 7.5 mA
t
ELH
, RL = 4 k
t
ELH
, RL = 1 k
t
EHL
, RL = 350 Ω, 1 kΩ, 4 k
t
ELH
, RL = 350
+5 V
7
5
6
8
2
3
4
1
CC
V
0.1 µF BYPASS
GND
OUTPUT V MONITORING NODE
O
PULSE
GENERATOR
Z = 50
O
+
I
F
B A
V
FF
CM
V –
R
L
SINGLE CHANNEL
+5 V
7
5
6
8
2
3
4
1
CC
V
0.1 µF BYPASS
GND
OUTPUT V  MONITORING  NODE
O
PULSE
GENERATOR
Z = 50
O
+
I
F
B
A
V
FF
CM
V –
R
L
DUAL CHANNEL
Page 17
1-162
Figure 16. Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per VDE 0884.
Figure 17. Recommended Printed Circuit Board Layout.
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
TS – CASE TEMPERATURE – °C
17550
400
12525 75 100 150
600
800
200 100
300
500
700
PS (mW) I
S
(mA)
HCNWXXXX
GND BUS (BACK)
VCC BUS (FRONT)
ENABLE
0.1µF
10 mm MAX.
(SEE NOTE 5)
OUTPUT
NC
NC
SINGLE CHANNEL DEVICE ILLUSTRATED.
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
TS – CASE TEMPERATURE – °C
20050
400
12525 75 100 150
600
800
200 100
300
500
700
PS (mW) I
S
(mA)
HCPL-2611 OPTION 060
175
Page 18
1-163
V
CC1
5 V
GND 1
D1*
SHIELD
DUAL CHANNEL DEVICE
CHANNEL 1 SHOWN
8
7
5
390
0.1 µF BYPASS
1
2
+
5 V
GND 2
V
CC2
2
470
1
I
F
V
F
*DIODE D1 (1N916 OR EQUIVALENT) IS NOT REQUIRED FOR UNITS WITH OPEN COLLECTOR OUTPUT.
V
CC1
5 V
GND 1
D1*
I
F
V
F
SHIELD
SINGLE CHANNEL DEVICE
8
6
5
390
0.1 µF BYPASS
2
3
+
5 V
GND 2
V
CC2
2
470
1
7
V
E
Figure 18. Recommended TTL/LSTTL to TTL/LSTTL Interface Circuit.
Page 19
1-164
Propagation Delay, Pulse­Width Distortion and Propagation Delay Skew
Propagation delay is a figure of merit which describes how quickly a logic signal propagates through a system. The propaga­tion delay from low to high (t
PLH
) is the amount of time required for an input signal to propagate to the output, causing the output to change from low to high. Similarly, the propagation delay from high to low (t
PHL
) is the amount of time required for the input signal to propagate to the output causing the output to change from high to low (see Figure 8).
Pulse-width distortion (PWD) results when t
PLH
and t
PHL
differ in value. PWD is defined as the difference between t
PLH
and t
PHL
and often determines the maximum data rate capability of a transmission system. PWD can be expressed in percent by dividing the PWD (in ns) by the minimum pulse width (in ns) being transmitted. Typically, PWD on the order of 20-30% of the minimum pulse width is tolerable; the exact figure depends on the particular application (RS232, RS422, T-l, etc.).
Propagation delay skew, t
PSK
, is an important parameter to consider in parallel data applica-
tions where synchronization of signals on parallel data lines is a concern. If the parallel data is being sent through a group of optocouplers, differences in propagation delays will cause the data to arrive at the outputs of the optocouplers at different times. If this difference in propagation delays is large enough, it will determine the maximum rate at which parallel data can be sent through the optocouplers.
Propagation delay skew is defined as the difference between the minimum and maximum propagation delays, either t
PLH
or
t
PHL
, for any given group of optocouplers which are operating under the same conditions (i.e., the same drive current, supply voltage, output load, and operating temperature). As illustrated in Figure 19, if the inputs of a group of optocouplers are switched either ON or OFF at the same time, t
PSK
is the difference between the shortest propagation delay, either t
PLH
or
t
PHL
, and the longest propagation
delay, either t
PLH
or t
PHL
.
As mentioned earlier, t
PSK
can determine the maximum parallel data transmission rate. Figure 20 is the timing diagram of a typical parallel data application with both the clock and the data lines being sent through optocouplers. The figure shows data and clock
signals at the inputs and outputs of the optocouplers. To obtain the maximum data transmission rate, both edges of the clock signal are being used to clock the data; if only one edge were used, the clock signal would need to be twice as fast.
Propagation delay skew repre­sents the uncertainty of where an edge might be after being sent through an optocoupler. Figure 20 shows that there will be uncertainty in both the data and the clock lines. It is important that these two areas of uncertainty not overlap, otherwise the clock signal might arrive before all of the data outputs have settled, or some of the data outputs may start to change before the clock signal has arrived. From these considerations, the absolute minimum pulse width that can be sent through optocouplers in a parallel application is twice t
PSK
. A cautious design should use a slightly longer pulse width to ensure that any additional uncertainty in the rest of the circuit does not cause a problem.
The t
PSK
specified optocouplers offer the advantages of guaranteed specifications for propagation delays, pulsewidth distortion and propagation delay skew over the recommended temperature, input current, and power supply ranges.
Page 20
1-165
Figure 19. Illustration of Propagation Delay Skew - t
PSK
.
Figure 20. Parallel Data Transmission Example.
50%
1.5 V
I
F
V
O
50%I
F
V
O
t
PSK
1.5 V
DATA
t
PSK
INPUTS
CLOCK
DATA
OUTPUTS
CLOCK
t
PSK
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