Page 1
PREPARED BY: DATE:
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7-a Usda
APPROVED BY:
Ji”! 1 /t/ PS .
FKL.,+ /
DATE: ELECTRO~C coh4PONENTS GROUP
DEVICE SPECIFICATION FOR
w ISSUE J&16/99
SHARP CORPORATION
SPECIFICATION
SPEC.No.
PAGE
REPRESENTATIVE DIVISION:
Opto-Electronic Devices Division
Light Emitting Diode
MODEL No.
GL5ZV44
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
DG99f5040
10 Pages
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal) * Measuring equipment
* Tooling machines * Computers
L
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals
* Other safety equipment
L
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment * AMedical equipment
C
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
‘DATE:
BY:
* Gas leakage sensor breakers * Rescue and security equipment
DATE:
PRESENTED BY:
M.Katoh,
Department General Manager of
Engineering DeptJII
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
c2-L.i //8/
c%..mJ
I
1
1
099
Page 2
MODEL No.
GL5ZV44 Snecification
1. Application
‘l”h.k spxi.fication applies to the light emitting dicde &vice Model No. GL5ZV44.
[AlGahP (dicing or scribe/brake type)
Amber LED device]
DG996040
GL5ZV44
Jun/16/99
PAGE
l/10
2. Outline dimensions and pin connections
3. Ratings and characteristics
3-l. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability
4-l. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
5. Incoming inspection
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifxa of defect
.,.....................................................
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 2.
Refer to the attached sheet Page 3-4.
Refer to the attached sheet Page 5.
Refer to the attached sheet Page 6.
6. Supplement
6-l. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
6-4. Environment
7 ~ecau~onsforuse.............‘...............’.............’...
7-1. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
.7-4. For cleaning
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...*
Refer to the attached sheet Page 7-8.
Refer to the attached sheet Page 9- 10.
Page 3
MODEL No.
I
DG996040
GLSZV44
Jun/l6/W
PAGE
310
‘d
$1
ln
0’
I
9.
kA.bte) Unspecified tol. to be *O&KU
(Note) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product.
unit
mal
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Matelial
Finish
Lead : Sn plated or wave soldering
Pin connectioIls
Q. Anode
0. cathode
Drawing No.
51106021
Page 4
3. Ratings and characteristics
(Note 1) Duty ratio=1/1O,Pulse width=&lms
(Note 2) At the position of 1.6mm from the bottom resin package
J?G996040
I Jun/16/99
1 PAGE
GL5ZV44 I 3/10
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak Forward Current Derating Curve
120
3
h 100
g 80
z
2 60
2
g 40
b
: 20
?Y
Lz
01 ’ ’
-25 0 25 50 75 85100 125
Ambient Temperature Ta(“CI
I
I
Forward Current Derating Curve
Ambient Temperature TarC)
Page 5
MODEL No.
I
DG996040
GL5ZV44
JunA6/99
PAGE
1 4110
Peak Forward Current vs. Duty Ratio
l/l00 l/10
Duty Raito DR
1 10
3-4. Characteristics Diagram(m) (Note 1)
Forward Current vs.Forward Voltage
(Ta=25”C)
(Ta=25"C)
Relative Luminous Intensity
vs. Ambient Temperature
( I F=2Orn4)
1 1.2
Relative Luminous Intensity vs. Froward Voltage
1.4 1.6 1.8 2 2.2 2.4 2.6
Forward Voltage VFW
-60 -40
CTa=25”C)
1000
.$
.-
100
I
2
10
ii
Oh
.E B
9 1
.J
e
.- 0. 1
z
.-
B
0.01
0. 1
1 10 loo
Forward Current IFhA)
(Note 1) Above characteristic data are typical data and not a guarantteed data.
0 20 40 60 80
-20
Ambient Temprature Ta("C)_
100 120
Page 6
4. Reliability
The reliability of products shall be satisfied with items listed below.
MODEL No.
I
DG996040
GL5ZV44 5110
JunJ16/!w
PAGE
4-1. Test items and test conditions
Test items Test conditions
Solderability
Soldering
temperature
Mechanical shock
Variable frequency 2OOm/s*, 100 to
vibration ,&imesk.X,~Y,fZ direction
Terminal strength
(Tension)
Terminal strength
(Bend&9
Temperature cycling -40@C(3Omin)~+100”C(3Omin),30 cycles
II&h temp’ and high
humidity storage
I Iigh temperature storage Ta=lOO”c, t=lOOOh
230f5”C, 5s
Prior disposition : Dip in rosin flux
26O+sC, 5s 20
15 OOOm/s*, 0.5ms,
3times 1 kX+Y Sz direction
2 000 to lOOHz./sweep for 4min.
Weight:lON, Ss/each terminal n=ll, C=O 20
Weight:SN,O” + 90” + 0% -90” + 0”
/each terminal
Ta=+60”C, 9O%RH, t=looOh n=22, C=O 10
Confidence level: 90%
Samples (n) LTPD
Defective (C)
n=ll, C=O 20
n=ll, C=O
n=ll, C=O 20
n=lI, C=O 20
n=ll, c=O 20
n=22, C=O
I
n=22, C==O 10
I
(%I
10
L
AW temperature storage Ta=-40”C, t=lOOOh
Operation life
4
1-2. ! Measurement items and Failure judgement criteria * 1
Measurement
Forward voltage
Reverse current
Luminous intensity
% Solderability : Solder shall be adhere at the area of 95% or more of dipped portion.
Z Terminal strength : Package is not destroyed, and terminal is not slack
* 1: Measuring condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
*3: IF MAX.is shown by forward current of absolute maximum ratings.
I
Ta=25”C, IF MAX, t=lOOOh *3
I
Symbol Failure judgement criteria *2
VF
IR
Iv
Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
v, > U.S.L. x 1.2
Ia > U.S.L. x 2.0
I
I
n=22, C=O
n=22, C==O I 10
10
I
Page 7
MODELNo.
5. Incoming inspection
5-l. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling plan,normal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items, judgement criteria and classifica of defect
DGW6040
GL5ZV44
Junl16l99
PAGE
6/10
1
No. Test items judgement criteria
q
1
2
3 Reverse terminal
4 Outline dimensions
DiscoMection
Position of Cutting off
rim
Characteristics
Cut off the rim
Not satisfy outline specification
Over the limit value of specification at Vr, I,, and Iv
Not emit light
Different from dimension
Different from dimension
Exceed -0.2mm
White point : Exceed d 0.3mm (on top view)
Foreign substance
Black point : Exceed $0.3mm (on top view)
String form : Exceed 3.Omm (on top view)
Scratch
Void
Uneven density of
mated for scattering
Exceed d 0.3mm or O.lmm x l.Omm (on top view)
Exceed 4 0.3mm (on top view)
Extremely uneven density
:lassifica of defec
Major defect
Minor defect
11 Unbalanced center
12 Burr
Insertion position of
13
terminal
Exceed fo.25mm from package center
Exceed +0.2mm againstprovided dimension
Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No.
14 Chapped the surface
15 Hollow the surface
L
Test items
The surface chapped is striking for see the lamp top
The surface hollow is striking for see the lamp top
judgement criteria
classifica of defect
Minor defect
Page 8
6. Supplement
6-1. Packing
6-l-l. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One ProducfTyp.)
(Indication label sample)
SHIPHENT TABLE
PART No. GL5ZV44
QUANTITY 250
LOT No. KA99B19
O-O c-- Luminous intensity rank
SHARP’
MADE IN JAPAN
0 Production plant code(to be indicated alphabetically)
@ Support code
@ Year of production(the last two figures of the year)
@ Month of production
0 Date of production(01 N 3 1)
- Model number
- Quantity of products
+Lotnumber*
dominant wavelength rank
+ Production country
(to be indicated alphabetically with January corresponding to A)
MODEL No.
GL5ZV44
*cl Cl q ocln[7
- ---
0 O@ 0
a
PAGE
7110
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width: 14Omm, Depth: 225n~n, l-light: 9omm
6-2.Luminous intensity rank (Note 1) (T.a=25”c)
I
Rank I
(Note 1) Tolerance:flS%
In regard to Iurninous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
En case of the distribution of the Iuminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
6-3.Dominant wavelength rank (Note 2)
Rank
I
H 581.0 - 584.5 ;
I
J
K 588.5 -
L 591.0 - 594.5
(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
Dominant wavelength 1 Unit 1 Condition
I
583.5 - 587.0
586.0 - 589.5
592.0
Ml
(Ta=25@C )
I- -- .
1~2urIlA
1
\
Page 9
6-4. Environment
64 1. Ozonosphere destructive chemicals.
(1) The device doesn’t contain following substance.
(2)
The device doesn’t have a production line whose process requires following substance.
Restricted part: c2FCsJlalones,CCt,Trichloroethane(Methyc~~fo~)
642. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,.PBBs)
Do996040
MODEL. No. PAGE
GLSZV44 8110
Junl16l99
Page 10
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-2-l installation on a P W B
When mounting an LED lamp on a PWB,do not apply
physical stress to the lead pins.
*The lead pin pitch should match the PWEI pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l
lhen positioning an LED lamp,basically employ
an LED with tie-bar cut or use a spacer.
7-2-2 When an LED 1 is mounted directly on a P WB
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins may be subjected to physical stress
due to PWB warp,cutting or clinching of lead
pins. Prior to use, be sure to check that no
disconnection inside of the resin or damage to
resin etc,,is found-When an LED lamp is mounted
on a double-sided PWB,the heat during soldering
affects the resin;therefore,keep the LED lamp
more that 1.6mm afloat above the PWB.
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
used.a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.d hole of the case should
be designed not to subject the inside of resin
to any undue stress.
MODEL No.
I
DB96040
GLSZV44
~
Jun/16/99
PAGE
g/10
NG
Good
1
0
n
L 611
Page 11
MODEL No.
I
Jx996040
GL5ZV44
Juld16/9!I
PAGE
I lo/lo
7 - 3.
S oldering Conditions
Solder thi _~ --.e lead pins under the following conditions
1 Type of Soldering
l.Manual soldering
2. Wave soldering
3. Auto soldering
!
_ _--- -A- . . . -
1
295T*5C,
1 260°C +YC. within 5 seconds
Preheating ‘fU”C tc
Conditions
wlthin 3 seconds
. mm”-
) 8O’C, within 30 seconds
Soldering 245”ct5”c, within 5 seconds
(Note> Avoid dipping resin into soldering bath
Avoid applying stress to lead pins while they are heated-For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
ins iron
I
7 - 4. For cleaning
(1) Solvent cleaning : Solvent temperature 45°C or less
( 2 > Ultrasonic cleaning
Immersion for 3
The effect to device by ultrasonic cleaning differs
min or less
by cleaning bath size,ultrasonic power
output, cleaning time,PlRB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent
Ethyl alcohol, Yethyl alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
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