Page 1
PREPARED BY: DATE:
Ln /dJfS
ti eds
APPROVED BY: DATE: ELECTRON-X COMPONENTS GROUP
SHARP CORPORATION
SPECIFICATION
37 KLA3-E
‘ IAh
7
QtV’1,
DEVICE SPECIFICATION FOR
Light Emitting Diode
MODEL No.
1 SPECNo. Do996034
ISSUE
PAGE
REPRESENTATIVE DIVISION:
Opto-Electronic Devices Division
Jun/16/99
10
pages
I
GL5ZV43
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharps consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal)
* Tooling machines * Computers
r
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals
* Other safety equipment
C
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment * Medical equipment
I
(4) Please contact and consult witha Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
* Gas leakage sensor breakers
* Measuring equipment
I
* Rescue and security equipment
I
1
CUSTOMER’S APPROVAL
DATE:
BY:
DATE: J-i4x-4~/ f?ry
PRESENTED BY:
,
72Lazz
M.Katoh,
Department General Manager of
Engineering Dept.,IlI
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
Page 2
MODEL No.
GL52Y43 Snecification
1. Application
This specification applies to the light emitting diode &vice Model No. GL5ZV43.
[AlGaInP (dicing or scribe/brake type) Amber LED device]
DG996034 Jlln/16/%
PAGE
GL5ZV43
l/10
2. Outline dimensions and pin connections
3. Ratings and characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 2.
Refer to the attached sheet Page 3-4.
3-l. Absolute maximum ratings
3-2. Eleciro-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 5.
4- 1. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
5. Incoming inspection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 6.
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifxa of defect
6. Supplement
.,...,................................*..............,
6- 1. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
6-4. Environment
7*lrecau~onsforuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7-1. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
74.
For cleaning
Refer to the attached sheet Page 7-8.
Refer to the attached sheet Page 9- 10.
Page 3
MODEL No.
I
DC2996034
GL5ZV43
Jun/16i!W
PAGE
I 2/10
2 outline dimensions and pin
Colorless transparency
co~ections
unspec*ed to1. to be
Cold rblkd steel. leads
unit
Lead : (Fe) Cold rolled steel
mm
Package : Epoxy resin
+0.2Mll
are plated with but
Material
.
Finish
Lead : Sn plated or wave soldering
Pin coMectiona
0. Lode
0. cathode
’ this part of the product
Drawing No.
51106015
Page 4
3.
I
Ratings and characteristics
3-
1. Absolute maximum ratings
Parameter
Symbol Value
Power dissipation P 130
Continuous forward current
Peak forward current(Note 1)
Derating factor/ DC
Pulse
Reverse voltage
Operating temperature
IF
IFhi
! !
I I
Vll
Topr -40 - 85 T
50
100
0.67
1.33
5
Storage temperature Tstg -40 - 100 OC
Soldering temperature(Note 2) Tsol
260(within5seconds)
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2) At the position of 1.6mm from the bottom resin package
MODEL No.
(Ta=25”C)
Unit
mW
mA
mA
!mApcl
“C
DG996034
I Jun/l6/!39
1 PAGE
GL5ZV43 3110
I
Terminal capacitance
Viewing Angle
Ct V=OV,f=lMHz - 60 - pF
281/2
lF=2omA
(Note 3) Refer to the suplement item 6. regarding the standard of rank classifidation.
I
3-3.
Derating Curve
Peak Forward Current Derating Curve Forward Current Derating Curve
120
a
.5
100
Z
-
2 80
2
2 60
-25 0 25 50 75 OJIOO 125
3
!A
-
60
50
40
30
20
10
0
-25
0
-
25 50
8 - deg.
7585100 125
Ambient Temperature Ta(“CI
Ambient Temperature Ta(“C)
Page 5
MODEL No.
I
DG996034
GL5ZV43
Jun/16/99
PAGE
4/10
Peak Forward Current vs. Duty Ratio
I I I /Ii//II I I I /I/j/l I i I lll[
10
l/100 l/10
Duty Raito DR
1 10
3-4. Characteristics Diagram(m) (Note 1)
Forward Current vs.Forward Voltage
0. 1
1 1.2 1.4 1.6 1.6 2 2.2 2.4 2.6
Forward Voltage VF(V)
cTa=250C1
(Ta=25%)
1oDo
$
.-
E
;
2 100
Oh
.f E
5
A
z
.-
CI
m
2
ot 10
Relative Luminous Intensity
vs. Ambient Temperature
(IF=2OmA)
-60-40-20 0 20 40 60 80 100120
Ambient Temprature Ta("C)
Relative Luminous Intensity vs. Frorard Voltage
0.01 1 I I l(l!/l/ I I lllllli I I l!illjJ
0. 1 1 10 100
Forward Current IFhA)
(Note 1) Above characteristic data are typical data and
'a=25'C)
not a
guarantteed data.
Page 6
4. Reliability
The reliability of products shah be satisfied with items listed below.
DG996034
MODEL No. PAGE
I
GL5ZV43
Jud16/99
s/10
4-l. Test items and test conditions
Test items Test conditions
Solderability
Soldering
temperature
Mechanical shock
Variable frequency
vibration
Terminal strength
(Tension)
Terminal strength
(Bendma /each terminal
Temperature cycling
High temp* and high
humidity storage
H :igh temperature storage Ta=lOO”c, t=lOOOh
230*5C, 5s
Prior disposition : Dip in rosin flux
26Oir5”c. 5s
15 00&1/s*, 05ms,
3times / 3XkY,kZ direction
2OOm/s*, 100 to 2 Ooo to lOOHz/sweep for 4min.
.4timesiH~Y,EZ direction
Weight:lUN , 3 - ^-- -s/each terminal
I
WeightzSN.0” -90” ---f 0O-t -90’ -0”
-4O”c(30mirt)~+l~C(3~in).30 cycles
I
Ta=+60”C, 9O%RH, t=lOOOh
Confidence level: 90%
Samples (n) LTPD
Defective (C)
n=ll, C=O 20
n=ll, C=O 20
n=ll, C=O 20
n=ll, C=O 20
n=ll, C=O
I
n=ll, C=O
I
n=22, C=O
I
n=22, C=O 10
n=22, C=O 10
I
I
.I I
(%)
10
ow temperature storage Ta=-40”C, t=lOOOh
L
Operation life
4-2. Measurement items and Failure judgement criteria * 1
Measurement
Forward voltage
Reverse current
Luminous intensity Iv
z Solderability : Solder shall be adhere at the area of 95% or more of dipped portion.
s Terminal strength : Package is not destroyed, and terminal is not slack.
*l: Measuring condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
*3: I, MAX.is shown by forward current of absolute maximum ratings.
Ta=25”C, IrMAX, t=lOOOh *3
Splbd
VF
IR
Iv > The first stage valueX 2.0 or The first stage value X 0.5 > Iv
Failure judgement criteria *2
v, > U.S.L. x 1.2
Ia > U.S.L. x 2.0
n=22, C=O 10
n=22, C=O 10
Page 7
MODEL No.
I
5. Incoming inspection
5- 1. Applied standard : IS0 2859- 1
5-2. Sampling method and level : A single sampling plan,.nonnal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items. iudeement criteria and classifica of defect
- -. ---_ ___-__. __ _- ___- -------- --- --- ---- - -- -_--_
DG996034
GL5ZV43
JuId16/99
PAGE
6/10
No.
1
2
3 Reverse terminal Different from dimension
4
5
6 Cut off the rim
7
8
9 Void
10
Test items judgement criteria
Disconnection Not emit light
Position of Cutting off
rim
Outline dimensions Not satisfy outline specification
characteristics
Foreign substance Black point : Exceed 4 0.3mm (on top view)
Scratch Exceed 4 0.3mm or O.lmm x I.Omm (on top view)
Uneven density of
material for scattering
Over the limit value of specification at V,, I,, and
White point : Exceed @ 0.3mm (on top view)
String form : Exceed 3.Omm (on top view)
Different from dimension
Exceed -0.2mm
Exceed 4 0.3mm (on top view)
Extremely uneven density
classifica of defer
Major defect
Iv
Minor defect
11 Unbalanced center
12 Burr
Insertion position of
13
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No. Test items judgement criteria
14
15
terminal
Chapped the surface The surface chapped is striking for see the lamp top Minor defect
Hollow the surface The surface hollow is striking for see the lamp top
Exceed
Exceed
M.25mm from package center
+0.2mm againstprovided dimension
Insertion position of terminal
classifica of defer
Page 8
DG996034
MODEL No.
I
6. Supplement
6- 1. Packing
6- 1 - 1. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One Product,Typ.)
(Indication label sample)
SHIPENT TABLE
PART No. GLSZV43
CJlJAhT1l-Y 250
LOT No. KA99B19
u-u+- Luminous intensity rank
SHARP\
1
0 Production plant code(to be indicated alphabetically)
@ Support code
@ Year of production(the last two figures of the year)
@ Month of production (to be indicated alphabetically with January corresponding to A)
@ Date of production(Ol-31)
WE IN JAPAN
+ Model
- Quantity of products
tLotnumber*
dominant wavelength rank
- Production country
number
GLSZV43
*cl El clclclclcl
- ----
0 0 CD@ 0
1 Jun/16/99
1 PAGE
1 7110
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width : 14Omm. Depth : 225mm, Hight : 9Omm
(Note 1) Tolerance:flS%
ln regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
6-3.Dominant wavelength rank (Note 2) (Ta=25”C)
Rank Dominant wavelength Unit
Condition
H 581.0 - 584.5
(Note 2) The condition of measurement : The measurement of the light em&on from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
Page 9
6-4. Environment
641. Ozonosphere destructive chemicals.
(1) The &vice doesn’t contain following substance.
(2) The &vice doesn’t have a production line whose process requires following substance.
Restricted part: CFCs,halones,CC&,Trichloroetbane(Methychloroform)
642. Bromic non-burning materiah
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
DG996034 JIud16/99
MODEL No. PAGE
GL5ZV43
8110
Page 10
7.
Precautions for use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be forned before soldering
7 - 2. Notice of installation
7-2-l installation on a P WB
When mounting an LED lamp on a PVB,do not apply
physical stress to the lead pins.
l
The lead pin pitch should match the PWB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l
When positioning an LED lamp,basically employ
an LED with tie-bar cut or use a spacer.
7-2-2 When an LED 1 is mounted directly on a P W B
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins may be subjected to physical stress
due to PTB warp, cutting or clinching of lead
pins. Prior to use, be sure to check that no
disconnection inside of the resin or damage to
resin etc., is found. when an LED lamp is mounted
on a double-sided PWB,the heat during soldering
affects the resin;therefore,keep the LED lamp
more that 1.6mm afloat above the Pm.
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat.mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure-A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
MODEL No.
I
L
IX996034
GL5ZV43
0
I
I
1 PAGE
I.611
Jun/16/!w
9110
NG
Aih
Page 11
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Type of S oldering
1. Manual soldering
2. Wave soldering
3. Auto soldering
295Tk5T, within 3 seconds
2603c r5”C. within 5 seconds
P reheating 70°C to 8O”c, within 30 seconds
Conditions
Soldering 245”ci:5”c, within 5 seconds
(Note) Avoid dipping resin into soldering bath.
Avoid applying stress to lead pins while they are heated. For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
MODEL No.
DC996034 Jun/16/!B
PAGE
GL5ZV43
lo/lo
7-4
(1)
(2)
(3)
For cleaning
Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
Ultrasonic cleaning : The effect to device by-ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time. PIB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
Applicable solvent : Ethyl alcohoLMethyl alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
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