Datasheet GL5ZS44 Datasheet (Sharp)

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ELECTRONIC COMPONENTS GROUP

x ',, / /d / $5 SHARP CORPORATION

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SPECIFICATION

Opto-Electronic Devices Division

f

DEVICE SPECIFICATION FOR

Emitting Diode

MODEL No.

GL5ZS44

1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.

2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.

(Precautions)

(1) This products is designed for use in the following application areas:

* OA equipment * Audio visual equipment
* Telecommunication equipment (‘Terminal)

* Tooling machines * Computers

L

If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions given in those respective paragraphs.

(2) Appropriate measures, such as fail-safe design and redundant design considering

the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;

* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment
* Other safety equipment

[

(3) Please do not use this product for equipment which require extremely high reliability

and safety in function and precision, such as ;

* Space equipment
* Nuclear power control equipment * Medical equipment

C

(4) PIease contact and consult with a Sharp sales representative if there are any questions

regarding interpretation of the above three paragraphs.

3. Please contact and consult with a Sharp sales representative for any questions about this product.

* Telecommunication equipment (for trunk lines)

* Home appliance

* Measuring equipment

I

I

CUSTOMER’S APPROVAL

‘DATE:

BY:

DATE:
PRESENTED BY:

M.Katoh,
Department General Manager of
Engineering DeptJII
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION

-

MODEL No.

GL5ZS44 Snecification

1. Application
This specification applies to the light emitting diode device Model No. GL5ZS44.

[AlGaInP (dicing or m-ii/brake type) Sunset-orange LED device]

DG996041

Juni16/9!I

PAGE

GL5ZS44 l/10

2. Outline dimensions and pin

3. Ratings and characteristics

COMedOnS

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Refer to the attached sheet Page 2.

Refer to the attached sheet Page 3-4.
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram

4. Reliability

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Refer to the attached sheet Page 5.

4- 1. Test items and test conditions
4-2. Measurement items and Failure judgement criteria

5. Incoming inspection

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Refer to the attached sheet Page 6.

5- 1. Applied standard

5-2. Sampling method and level
5-3. Test items, judgement criteria and classifrca of defect
5-4. Test items the surface is be applied for flat type, judgement criteria and clakfica of defect

6. Supplement

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6-l. Packing
6-2. Luminous intensity rank
6-3.

Dominant

wavelength rank

6-4. Environment

7. Precautions for use

. . . . . . . ..*.....................................

7-l. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions

,7-k For cleaning

Refer to the attached sheet Page 7-8.

Refer to the attached sheet Page g-10.

Colotless ttrnsp8reney

“I

k

MODEL No.

DG996041

GL5ZS44

Jun/16/99

PAGE

2ilO

Vote) Unspecified tol. to be CO.2mm

Vote) Coldxolled steel leads are plated with but the tie-bar cut portions ha\, no plating do not sol&r this part of the product

unit

mm

Material
Lead : (Fe) Cold rolled steel
Package : Epoxy resin

Finish

Lead : So plated or wave soldering

Drawing No.

51106022

3. Ratings and characteristics

(Note 1) Duty ratio=l/lO,Pulse width=O. lms
(Note 2) At the position of 1.6mm from the bottom resin package

MODEL No.

I

DG99604 I

GL5ZS44

Jun116/99

PAGE

I 3110

3-2. Electra-optical characteristics

I

Parameter

Forward voltage

r

Luminous intensity (Note 3)
Peak emission wavelength
Dominant wavelength

Spectrum radiation bandwidth
Reverse current

Symbol

!

vF

Iv

J.P

1.d 1

A ;1

IR

Terminal capacitance ct
Viewing Angle 281/2

Conditions

IF=2OmA

VR4V

V=OV,f=lMHz

rF=2OmA

MIN. TYP. h&4x. unit

-

(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.

3-3. Derating Curve

Peak Forward Current Derating Curve

120
a
9

e 100

Forward Current Derating Curve

60

50

2.1 2.6

-

(Ta=25”C)

V

mcd

run

s 80

z

2 60
7

g 40
2

: 20

2

a

0

-25 0 25 50 75 a51OO 125

Ambient Temperature Ta("C)

40

30

20

10

0

-25 0 25 50

Ambient Temperature Ta("C)

7585100 125

MODEL No.

GL5ZS44

DC5996041

Junl16/!w

PAGE

4110

Peak Forward Current vs. Duty Ratio

1000

f
2

10

l/100

3-4. Characteristics Diagram&p) (Note 1)

Forward Current vs.Forward Voltage

l/10 1

Duty Raito DR

(Ta=2573

10

(Ta=25"C)

Relative Luminous intensity

vs. Ambient Temperature

( I F=2OmA)

(I! I,,

Ii ii ii

1 1.21.41.61.8 2 2.22.42.6

Relative Luminour Intensity vs. Frorard Voltage

1000

5.

Y

z 100

2

10

2
Ea

.- v

5

-I
:

.- 0. 1

:

2

1

0. 01

0. 1
Forward Current IFhA)

i IAI

Forward Voltage VF(V)

1 10 100

, , ,

I I I I I I I

(TaKZ@C)

2

Oh

.r E
3

ii’ i i//i’

100

-J--Ji I 1 ! i ! !

‘-60 -40 -20 0 20 40 60 80

Ambient Temprature TarC)

100 120

(Note 1) Above characteristic data are typical data and not a smttced data.

DG99604 1

MODEL No.

GL5ZS44 5110

4. Reliability
The reliability of products shall be satisfied with items listed below.

4-l. Test items and test conditions Confidence level: 909

Test items

Solderability

Soldering

temperature

Mechanical shock

Variable frequency

vibration

Terminal strength

(Tension)

Terminal strength

(Bending)

Test conditions

23025°C. 5s

Prior disposition : Dip in rosin flux

26025°C. 5s n=ll. C=O
15 OOOm/s2, 0.5ms.

3times / kX,*Y,kZ direction

2oom/s2, 100 to 2 Ooo to lOOHz/sweep for 4mi.n.

,4times/fX,ltY,fZ direction

Weight:lON, S/each terminal n=ll, C=O 20

Weight:SN, 0” : 90” + 0% -90” -0”

/each terminal

Samples (n) LTPD

Defective (C)

(%I

n=l l? C=O 20

20

n=ll, C=O 20

n=ll, C=O

20

n=ll, C=O 20

Jud16/99

PAGE

Temperature cycling -4O”c(3Omin)~+lOO”c(3Omirt).3O cycles n=22. C=O
High temp. and high

humidity storage

High temperature storage Ta=lOO”C, t=lOOOh

Low temperature storage Ta=-QO”C , t=lOOOh

Operation life

Ta=+6O”C, 9O%RH. t=lOOOh n=22, C=O 10

n=22. C=O 10

n=22, C=O

Ta=25”C, IrMAX, t=lOOOh *3 n=22, C=O 10

4-2. Measurement items and Failure judgement criteria * 1

Measurement Symbol Failure judgement criteria *2

Forward voltage

Reverse current

Luminous intensity

VF

IR

Iv Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv

VF > u.sL. x 1.2

IR > U.S.L. x 2.0

% Solderability : Solder shall be adhere at the area of 95% or more of dipped portion.
% Terminal strength : Package is not destroyed, and terminal is not slack.
*l: Measuring condition is in accordance with specification.
*2: U.S .L. is shown by Upper Specification Limit.
*3: IF w.is shown by forward current of absolute maxirnum ratings.

10

10

5. Incoming inspection

5-1. Applied standard : IS0 2859-l

5-2. Sampling method and level : A single sampling plan,normal inspection level II

: AQL Major defect : 0.065%

Minor defect : 0.4%

5-3. Test items, judgement criteria and classifica of defect

No. Test items

1 Disconnection Not emit light

I

judgement criteria

:lassifica of defec

Position of Cutting off

2

3 Reverse terminal

4 Outline dimensions

5

6 Cut off the rim

7 Foreign substance

8 Scratch

9 Void

10

material for scattering

11 Unbalanced center Exceed M.25nun from package center

12 Burr

Insertion position of

13

I I

rim

Characteristics

Uneven density of

.--:--l I

Over the limit value of specification at Vr. IR, and Iv

.White point : Exceed Q 0.3mm (on top view)

Black point : Exceed 4 0.3rnm (on top view)

Shim form : Exceed 3.Omm (on too view)

Exceed $I 0.3mm or O.lmm x l.Omm (on top view)

Exceed +0.2mm againstprovided dimension

Different from dimension

Different from dimension

Not satisfy outline specification

Exceed -0.2rnm

Exceed @ 0.3mm (on top view)

Extremely uneven density

Insertion position of terminal

Major defect

Minor defect

5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect

No. Test items judgement criteria

14 Chapped the surface

Hollow the surface The surface hollow is striking for see the lamp top

15

The surface chapped is striking for see the lamp top

classifica of defec

Minor defect

DG996041

MODEL No.

GL5ZS44 1 7110

6. Supplement
6-1. Packing

6-l-l. Inner package

Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One Product,Typ.)

(Indication label sample)

SHIPMENT TABLE

PART No. GLSZS44

QUANTITY 250

LOT No. KA99B19

- Model numher

- Quantity of products
+ Lot number *

*cl cl 00000

- ---

0’ 0 QOQ

@-Cl t- Luminous intensity rank

SHARP’

MADE IN JAPAN

dominant wavelength rank

+ Production country

0 Production plant code(to he indicated alphabetically)
@ Support code
@ Year of production(the last two figures of the year)
@ Month of production (to he indicated alphabetically with January corresponding to A)

@ Date of production(Ol-31)

Junh6/99

PAGE

6-l-2. Outer package

Put 8 packs (the same luminous intensity rank) into outer package.

(approximately 670g per one outer package)

6- 1-3. Outer package out line dimension

Width: 14Omm. Depth : 225mm, Hight : 9Omm

6-2luminous intensity rank (Note 1) (Ta=25”c )

ci

(Note 1) Tolerance:~lS%

In regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not he pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.

6-3.Dominant wavelength rank (Note 2)

Rank Dominant wavelength Unit

:Ta=25”c )

Condition

0 598.5 y- 602.0

P 601.0 - 604.5

Q 603.5 - 607.0 run

IF2cTnA

R 606.0 - 609.5

S 608.5 - 612.0

(Note 2) The condition of measurement : The measurement oft

slightemission from the front side of lamp.

This rank value is the setting value of when that classifies it the rank and be not a guarantee value.

Also I shall not ask the delivery ratio of each rank.

I

6-4. Environment

6-4-l. Ozonosphere destmctive chemicals.

(1) The device doesn’t contain following substance.

(2) The device doesn’t have a production line whose process requires following substance.

Restricted part: CFCs,halones,CCl,,,Trichloroethane(Methychloroform)

642. Bromic non-burning mate&s
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)

MODEL No.

I

DG996041 Jun/16/!39

PAGE

GL5ZS44 g/10

7 - 1. Lead forming method

Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering

7 - 2. Notice of installation

7-Z-l installation on a P WB

!Jhen mounting an LED lamp on a PYB, do not apply

physical stress to the lead pins.

.

The lead pin pitch should match the PWB pin-hole

pitch:absolutely avoid widening or narrowing
the lead pins.

.

lhen positioning an LED lamp,basically employ
an LED with tie-bar cut or use a spacer.

7-2-2 when an LED 1 is mounted directly on a PWB

If the bottom face of an LED lamp is mounted
directly on single-sided P’R the base of the
lead pins may be subjected to physical stress
due to PWB warp,cutting or clinching of lead
pins.Prior to use.be sure to check that no

disconnection inside of the resin or damage to

resin etc., is found. When an LED lamp is mounted
on a double-sided PW.the heat during soldering
affects the resin;therefore,keep the LED lamp
more that 1.6mm afloat above the P’JB.

7-2-3 Installation using a holder

During an LED lamp posiIioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.

(Note)Pay attention to the thermal expansion coefficient

of the material used for the holder.Since the
holder expands and contracts due to preheat and

soldering heat, mechanical stress may be applied to
the lead pins,

resulting in disconnection.

7-2-4 Installation to the case

Do not fix part C with adhesives when fixed to the
case as shown in Figure..\ hole of the case should
be designed not to subject the inside of resin
to any undue stress.

MODEL No.

IX996041

GL5ZS44

Jun/16/99

PAGE

9/10

Good

7 -

3.

S oldering Conditions

Solder the lead pins under the following conditions

Type of Soldering

1.

Manual soldering

2. Wave soldering

3. Auto soldering

295°C +5”c, within 3 seconds
260”ct5”C. within 5 seconds

Preheating 70°C to 8O”c, within 30 seconds

Conditions

Soldering 245”ck5”c, within 5 seconds

(Note) Avoid dipping resin into soldering bath.

Avoid applying stress to lead pins while they are heated.For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.

MODELNo.

I

DG996041

Judl6/!39

PAGE

GL5ZS44 1 lO/lO

Soldering iron

7 - 4. For cleaning

(1) Solvent cleaning : Solvent telsperature 45°C or less

Immersion for 3 min or less

( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs

by cleaning bath size.ultrasonic power
output,cleaning time,PYB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting

the ultrasonic cleaning

( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol

In case when the other solvent is us&there are cases that
the packaging resin is eroded.

Please use the other solvent

after thorough confirmation is performed in actual using condition.