Page 1
PREPARED BY:
Cleda
APPROVED BY: DATE:
Jian
DATE:
/16/‘jj
Lt /l&/45
3 XlkU~
DEVICE SPECIFICATION FOR
ELECTRONK COMPONENTS GROUP
SHARP CORPORATION
‘1 SPECIFICATION
SPEC.No.
ISSUE
PAGE 10 pages
REPRESENTATIVE DIVISION:
Opto-Electronic Devices Division
Light Emitting Diode
MODEL No.
GL52R44
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
DG!wo43
Jun/16/99
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal) * Measuring equipment
* Tooling machines
L
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers
* Other safety equipment
[_
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment
* Nuclear power control equipment
i
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S APPROVAL
* Computers
* Rescue and security equipment
* Telecommunication equipment (for trunk lines)
* Medical equipment
DATE:
PRESENTED BY:
1
1
1
DATE:
BY:
M.Katoh,
Department General Manager of
Engineering Dept.,III
Optc-Electronic Devices Division
Electronic Components Group
SHARP COlZPORATlON
/
Page 2
MODEL No.
GL5ZR44 Stxxitication
1. Application
This specification applies to the light emitting diode &vice Model No. GL5ZR44.
[AlGalnP (dicing or scribe/brake type> Red LED device]
DG996043
Jun/16/9!I
PAGE
GL5ZR44 l/10
2. Outline dimensions and pin connections
3. Ratings and characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . ..o
Refer to the attached sheet Page 2.
Refer to the attached sheet Page 3-4.
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Cwe
3-4. Characteristics Diagram
4. Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 5.
4-l. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
5. Incoming inspection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..a
Refer to the attached sheet Page 6.
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifka of defect
6. Supplement
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6-l. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
6-4. Environment
7 precau~omforuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7- 1. Lead forming method
7-2. Notice of installation
7-3. Soldering conditions
7-4. For cleaning
Refer to the attached sheet Page 7-8.
Refer to the attached sheet Page 9- 10.
Page 3
-2Outlhe
dimensions and pin eons
l+lorless transp8rencY
MODEL No.
DG9!%043
i;L5zR44
Juni16i99
PAGE
2/10
i
pin COMtXtiOIls
(ore) Unspecified tol. to be +0.2mm
Joti> Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not sol&r this part of the product.
unit
Material
Finish
Drawing No.
Lead : (Fe) Cold rolled steel
mm
Package : Epoxy reek
Lead : Sn plated or wave soldering
51106024
Page 4
MODEL No.
DG996043
Jun/16/99~
PAGE
I
3. Ratings and characteristics
3- 1. Absolute maximum ratings
Parameter Symbol Value unit
Power dissipation P 130 mW
(Note I) Duty ratio=l/lO&he width=O.lms
(Note 2) At the position of 1.6mm from the bottom resin package
(Ta=25”C)
GL5ZR44 I 3110
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak Forward Current Derating Curve Forward Current Derating Curve
120
3
h 100
$ 80
,”
2 60
7
z 4o
5 20
:
0.
0
-25 0 25 50 75 *%nl 125
Ambient Temperature Ta (“cl
60
2 5 50
L
; 40
c
2
L. 30
d
‘: 20
L
B 10
0
-25 0
25 50 7585 100 125
Ambient Temperature Ta (“C)
Page 5
DG996043 Jun/16/99
MODEL No. PAGE
GL5ZR44
4110
Peak Forward Current vs. Duty Ratio
10
l/100 l/10
Duty Raito DR
1 10
3-4. Characteristics Diagramttyp) (Note 1)
(Ta=25”C)
Relative Luminous Intensity
vs. Ambient Temperature Forward Current vs.Forward Voltage
(Ta=25"C) (IF=2Om4)
1 1.2 1.4 1.6 1.8 2 2.22.42.6
Forward Voltage VF(v)
Relativs Lumitmus Intsmity vs. Frowmrd Voltrga
1000
$
.-
100
it
0
1
1
.-
B
0.01
0. 1 1
Forward Current IFhN
10
(Ta=25’=C)
100
-60 -40 -20 0 20 40 60 80 100 120
(Note 1) Above characteristic data are typical data and not a guarantteed data.
Ambient Temprature TarC)-
Page 6
4.
Reliability
The reliability of products shall be satisfied with items listed below.
MODEL No.
DG996043
GL5ZR44
I Jun/16/!39
1 PAGE
5110
4- 1. Test items and test conditions
Temperature cycling -4O”c(3Omin)~+lOO”c(3Omin),3O cycles
High temp* and high
humidity storage
Ta=+6O”c, 9O%RH, t=lOOOh
Confidence level: 904
n=22,c=O
n=22,c=o
10
10
High temperature storage Ta=l 00°C , t= lOOOh n=22, C=O 10
Low temperature storage Ta=-4O’C. t=lOOOh n=22, C=O
10
b
Operation life
Ta=25”C, IrMAX. t=lOOOh *3
n=22, C=O 10
4-2. Measurement items and Failure judgement criteria * 1
Measurement SylIlbOl
Forward voltage
Reverse current
VF
IR
Failure judgement criteria *2
VF > U.S.L. x 1.2
IR >u.s.L.x 2.0
Luminous intensity Iv Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
Z Solderability : Sol&r shah be adhere at the area of 95% or more of dipped portion.
z Terminal strength : Package is not destroyed, and terminal is not slack
*l: Measuring condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
*3: IF MAX.is shown by forward current of absolute maximum ratings.
L
Page 7
DG996043
IMODEL No.
5. Incoming inspection
5- 1. Applied standard : IS0 2859- 1
5-2. Sampling method and level : A single sampling plannormal inqection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items, judgement criteria and classifica of defect
GL5ZR44
Juni16l99
PAGE
6110
No. Test items
1
2
3 Reverse terminal
4
DiscoMection
Position of Cutting off
rim
Outline dimensions
5 I characteristics
6
7 Foreign substance Black point : Exceed 4 0.3mm (on top view)
8 Scratch
9 Void Exceed $0.3mm (on top view)
10
Cut off the rim
I
Uneven density of
material
for scattering
I
Over the limit value of specification at V,, I,, and Iv
I
I
White point : Exceed 4 0.3mm (on top view)
Sing form : Exceed 3.Omm (on top view)
Exceed 4 0.3mm or O.lmm x l.Omm (on top view)
judgement criteria
Not emit light
Different from dimension
Different from dimension
Not satisfy outline specification
Exceed -0.2mm
Extremely uneven density
:lassifica
ofdefec
Major defect
Minor defect
11
Unbalanced center
12
I
13
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No. Test items
14 Chapped the surface The surface chapped is striking for see the lamp top
15 1 Hollow the surface 1
Burr
Insertion position of
terminal
I
I
Exceed fo25mm from package center
Exceed +0.2mrn againstprovided dimension
Insertion position of terminal
judgement criteria
The surface hollow is striking for see the lamp top
Minor defect
Page 8
DC996043
MODEL No.
I
6. Supplement
61. Packing
6-l-l. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One Product,Typ.)
(kiication label sample)
SHIPBENT TABLE
PART No. GL5ZR44
QUANTITY 250
LOT No. KA99B19
@-0 c- Luminous intensity rank
SHARP’
MADE IN JAPAN
@ Production plant code(to be indicated alphabetically)
@ Support code
@) Year of production(the last two figures of the year)
@ Month of production (to be indicated alphabetically with January corresponding to A)
@ Date of production(Ol-31)
+ Model number
+ Quantity of products
+ Lot number *
dominant wavelength rank
+ Production country
GL5ZR44 1 7110
*&l cl tlclclclcl
a 0
Junll6/99
PAGE
00 0
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width: 14Omm, Depth: 225mrn, Hight: 9Omm
(Note 1) Tolerance:flS%
In regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
6-3Dominant wavelength rank (Note 2) (Ta=25”c )
Rank
I
Y
I
z
1 634.5 -
2 637.5 - 641.5
3 640.5 -
(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
Dominant wavelength
I
1 628.5 - 632.5 1
631.5 - 635.5
638.5 run IF2OmA
644.5
1 Unit 1 Condition
Page 9
6-4. Environment
641. Ozonosphere destructive chemicals.
(1) The &vice doesn’t contain following substance.
(2) The &vice doesn’t have a production line whose process requires following substance.
Restricted part: CFCs~ones,CCb,T~c~o~~~e~ych)
642. Bromic non-bun&g materials
The device doesn’t contain bromic non-burning materiak@BBOs,PBBs)
MODEL No.
DG996043
GL5ZR44 8/10
Jun/16/99
PAGE
Page 10
7. prtcautions for use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin b&se as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be forwed before soldering.
7 - 2. Notice of installation
7-Z-l installation on a P WB
When mounting an LED lamp on a PIB, do not apply
physical stress to the lead pins.
*The lead pin pitch should match the PBB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l
when positioning an LED lamp,basicaIly employ
an LED with tie-bar cut or use a spacer.
7-Z-Z when an LED 1 is mounted directly on a P W B
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins may be subjected to physical stress
due to PWB warp, cutting or clinching of lead
pins.Prior to use,be sure to check that no
disconnection inside of the resin or damage to
resin etc.,is found.When an LED lamp is mounted
on a double-sided PWB,the heat during soldering
affects the resin;therefore,keep the LED lamp
more that 1.6mm afloat above the PW.
7-Z-3 Installation using a holder
During an LED lamp positioning,when a holder is
used, a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-Z-4 Installation to the case
Do not fix part C with- adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
DG996043
MODEL No. PAGE
GL5ZR44 9110
Jun/16/!8
Goal
Page 11
MODEL No.
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Type of S oldering Conditions
1. Manual soldering
295°C -+S”c. within 3 seconds
2. Wave soldering 260°C + 5°C. vi thin 5 seconds
3. Auto soldering Preheating 70°C to 8O”c, within 30 seconds
Soldering 245”c+5”c, within 5 seconds
(Note) Avoid d’
ipping resin into soldering bath
Avoid applying stress to lead pins while they are heated.For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
DG996043 Jun/16/99
PAGE
GL5ZR44 lo/lo
i ran
7 - 4. For cleaning
(1) Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
(2 > Ultrasonic cleaning : The effect to device by ultrasonic
cleaning
by cleaning bath size,ultrasonic power
output,cleaning time,PWB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol. Methyl alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
differs
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