Page 1
PREPARED BY:
DATE:
T&n / c 6/ qY
(A 4 Cl&
APPROVED BY: DATE:
J&l
mq&za
/ /b/P9 HARP CORPORATION
DEVICE SPECIFICATION FOR
ELECTRONIC COMPONENTS GROUP
SPECIFICATION
SPECNo. Ix5996031
ISSUE Jun/16/99
PAGE
REPRESENTAlIVE DIVISION:
Opto-Ekctronic Devices Division
Light Emitting Diode
MODEL No.
GL5ZR302BOS
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment
* Telecommunication equipment (Terminal) * Measuring equipment
* Tooling machines * Computers
r
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such aa fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traftic signals
* Other safety equipment
[
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment
* Nuclear power control equipment * Medical equipment
C
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
* Audio visual equipment * Home appliance
* Gas leakage sensor breakers * Rescue and security equipment
* Telecommunication equipment (for trutk lines)
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10
pages
3. Please contact and consult with a Sharp sales representative for any questions about this product.
J(.l/YL /IS/ m
CUSTOMER’S APPROVAL
‘DATE:
BY:
DATE:
PRESENIED BY:
M.Katoh,
Department General Manager of
Engineering Dcpt.,BI
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
/
Page 2
MODEL No.
GL5ZR302BOS
GL5ZR302BOS Soecification
1. Application
This specification applies to the light emitting diode device Model No. GL5ZR302BOS.
[AlGalnP (dicing or scribe/brake type)
Red LED &vice]
DG!39603 1 Jud16/99
PAGE
l/10
2. Cuthne dimensions and pm
3. Ratings and characteristics
co~e%!tions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 2.
Refer to the attached sheet Page 3-4.
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . ..*...........................
Refer to the attached sheet Page 5.
4-l. Test items and test conditions
4-2. Measurement items and Faihue judgement criteria
5. Incoming inspection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 6.
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifxa of defect
54. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
6. Supplement
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6-1. Packing
6-2. Luminous intensity rank
6-3.
Dominant
wavelength rank
6-4. Environment
7. Precautions for use
. . . . . . ..I......................................
7- 1. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
‘7-4. For cleaning
Refer to the attached sheet Page 7-8.
Refer to the attached’sheet Page 9- 10.
Page 3
2. Outline dimensions and pin cormeetions
00 1
0r 18~s
trvinqare~Y
MODEL No.
DC89603 1
Jun/l6/99
PAGE
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iti.
lt--lr -
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0. 5 +o. 1
pin connections
0. Anode
0: cathode
p4ote) Umpecified tol. to be f0.2mm
mote) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not sol&r this part of the product.
unit
mm
Material
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Fiih
Lead : Sn plated or wave soldering 51106012
Drawing No.
Page 4
MODEL No.
lx99603 1
Jun/16/9
PAGE
3. Ratings and characteristics ’
(Note 1) Duty ratio=1/1O,FUse width=O.lms
(Note 2) At the position of 1.6mm from the bottom resin package
GL5ZR302BOS
3/10
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak Forward Current Derating Curve Forward Current Derating Curve
120
a
.5
100
e
z 80
t!
2 60
-25 0 25 50 75 a510C 125 -25 0 25 50
Ambient Temperature TarC)
60
50
40
30
20
10
Ambient Temperature Ta (“C)
75--100 125
Page 5
\
MODEL No.
GL5ZR302BOS
DG99603 1
Jurl/16/99
PAGE
4110
Peak Forward Current vs. Duty Ratio
10
l/100 l/10
Duty
Raito
1 10
OR
3-4. Characteristics Diagram&p) (Note 1)
Forward Current vs.Forward Voltage
loo t
(Ta=25”C)
(Ta=25”C)
Relative Luminous Intensity
vs. Ambient Temperature
( I F=2OmA)
1000
1 1.2 1.4 1.6 1.8
Forward Voltage M(V)
Relative Lminour Intensity VS. Frowrrd Voltage
1000
5,
2
ii 100
z
10
u:
ea
.a v
5 1
-l
>”
.- % 0. 1
2
0. 01
0. 1
1 10
Forward Current IFhA)
2 2.22.4 2.6
(Ta=25”C)
100
-60 -40 -20 0 20 40 60 80 100 120
(Note 1) Above characteristic data are typical data and not a gmrantteed data.
Ambient Temprature TarC).
Page 6
4. Reliability
The reliability of products shall be satisfied with items listed below.
L
Cl. Test items and test conditions
Test items Test conditions
Solderability
Soldering
temperature
Mechanical shock
230t5”C, 5s
Prior disposition : Dip in rosin flux
260f5”C; 5s
15 OOOm/sz, 05ms,
3times I 33SYptZ direction
Variable frequency 2OOm/s*, 100 to 2 000 to lOOHz/sweep for 4min.
vibration
Terminal strength
(Tension)
Terminal strength
,4times/S&Y&Z direction
Weight: ION, S/each terminal
Weight:SN,O” + 90” --) O”* -90” + 0”
(Bending) /each terminal
DG99603 1
MODEL No. PAGE
JLud16/9!I
GL5ZR302BOS 5110
Confidence level: 90’
Samples (n) LTPC
Defective (C)
@IO)
n=ll, C=O 20
n=ll, C=O 20
n=ll, C=O
20
n=ll.C=O 20
n=ll,C=O 20
n=ll, C=O 20
Temperature cycling 40~(3Omin)~+100”c(3Omin),30 cycles
High temp. and high
humidity storage
I!
Iigh temperature storage Ta=lOO”C, t=lOOOh
L
ow temperature storage Ta=4O”c, t=lOOOh
Operation life
Ta=+60”C, 9O%RH, t=lOOOh
Ta=25”c, IF MAX. t=lOOOh *3
4-2. Measurement items and Failure judgement criteria * 1
Measurement Symbol
Forward voltage
Reverse current
Luminous intensity Iv
vF
IR
Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
Failure judgement criteria *2
VF > U.S.L. x 1.2
IR > U.S.L. x 2.0
s Solderability : Solder shall be adhere at the area of 95% or more of dipped potion.
g Terminal strength : Package is not destroyed, and terminal is not slack.
* 1: Measuring condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
*3: IF MAXis shown by forward current of absolute maximum ratings.
n=22, C=O 10
n=22. C=O 10
n=22, C=O
n=22, C=O
10
10
n=22, C=O 10
Page 7
MODEL No.
5. Incoming inspection
5-1. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling plannormal inspection level II
: AQI.. Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items, judgement criteria and classilica of defect
No. Test items
judgement criteria
DG99603 1
GL5ZR302BOS 6110
:lassifica of deft
Jud16/95
PAGE
1
2
31
4
5
6 Cut off the rim
I I
7 Foreign substance Black point : Exceed d 0.3mm (on top view)
8 Scratch
9
10
11 Unbalanced center
12 BUlT
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13
Disconnection
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Position of Cutting off
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material for scattering
Insertion position of
A- l
Reverse terminal
Outline dimensions
characteristics
Void Exceed @ 0.3mm (on top view)
Uneven density of
terminal
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Over the limit value of specification at V,, Ia, and Iv
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White point : Exceed $J 0.3mm (on top view)
String form: Exceed 3.Omm (ontopview)
Exceed Q 0.3mm or O.lmm x l.Omm (on top view)
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Not satisfy outline specification
Exceed MZrnm from package center
Exceed +0.2mm againstprovided dimension
Insertion position of terminal
Not emit light
Different from dimension
Different from dimension
Exceed -0.2mm
Extremely uneven density
Major defect
Minor defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No. Test items
14 Chapped the surface
15 Hollow the surface
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The surface chapped is striking for see the lamp top
The surface hollow is striking for see the lamp top
judgement criteria
classifica of defec
Minor defect
--J
Page 8
6. Supplement
6-l. Packing
6-l-l. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One Product,Typ.)
(Indication label sample)
SHIPMENT TABLE
PART No.
QUANTITY
LOT No. KA99B19
0 Production plant code(to be indicated alphabetically)
@ Support code
@) Year of production(the last two figures of the year)
@ Month of production
@ Date of production(01 u 3 1)
GL5ZR302BOS -
250 - Quantity of products
Cl-0 t- Luminous intensity rank
SHARP’
MADE IN JAPAN
Modelnumber
*Lotnumber*
dominant wavelength rank
+ Production country
(to be indicated alphabetically with January corresponding to A)
DG99603 1
MODEL No.
I
GL5ZR302BOS
*o q q uuuu
0 0
05 0
Jun/16/99
PAGE
1 7110
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width: 14Omm, Depth: 225mm, I-I@: 9Omm
6-2.Luminous intensity rank (Note 1)
Rank
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1
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K I 383 - 746
1. 552 - ( 1075 1
(Note 1) Tolerance:flS%
6-3.Dominant wavelength rank (Note 2)
Rank
: Y 1 628.5 -
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In regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
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Luminous intensity
185 -
266 -
Dominant wavelength
360 1
518 1
632.5
(Ta=ZpC)
1 Unit 1 Condition
mcd
(Ta=2pC )
Unit
Condition
3 1 640.5 -
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(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp.
This rank value is the setting value of when that ‘classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
b44.5 1
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Page 9
6-4. EnviromIlent
641. Ozonosphere destructive chemicals.
(1) The device doesn’t contain following substance.
(2)
The device doesn’t have a production line whose process requires following substance.
Restricted part: CFCs~ones,C~,Trichloroethane(Methych
642. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
MODEL No.
GL5ZR302BOS 8/10
Ix996031
Jun/16/9!3
PAGE
Page 10
7. Pnxautions for use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-2-l installation on a P W B
Vhen mounting an LED lamp on a PIB,do not apply
physical stress to the lead pins.
l
The lead pin pitch should match the PIB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l
Ihen positioning an LED lamp, basically employ
an LED with tie-bar cut or use a spacer.
7-2-2 When an LED 1 is mounted directly on a P W B ’
If the bottom face of an LED lamp is mounted
directly on single-sided PW,the base of the
lead pins may be subjected to physical stress
due to PYB warp,cutting or clinching of lead
pins.Prior to use,be sure to check that no
disconnection inside of the resin or damage to
resin etc.,is found-Then an LED lamp is mounted
on a double-sided PWB,the heat during soldering
affects the resin;therefore.keep the LED lamp
more that l.6mm afloat above the PWB.
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-Z-4 Installation to the-case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
MODEL No.
DG996031
0
n
fib
- ~
JunA6/99 1
PAGE
NG
Good
. 611
Page 11
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Type of Soldering
1. Manual soldering
2. Wave soldering 26O“C+5”c. within 5 seconds
3. Auto soldering
I
(Note) Avoid dipping resin into soldering bath.
Avoid applying stress to lead pins while they are heated.For example
when the LED lamp is moved with the heat applied to the lead pins dur
manual soldering or solder repair,disconnection may occur.
295”c+YC, within 3 seconds
Preheating 7O’c to 8O“C, within 30 seconds
1 Soldering 245”ct-5”c, within 5 seconds
Conditions
DG99603 1 Jud16/99
MODEL No. PAGE
I
GL5ZR302BOS
1
Lg
I lo/lo
7 - 4. For cleaning
( 1) Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
(2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output,cleaning time,PW size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent Ethyl alcohol. Methyl alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed-in actual using condition.
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