Page 1
PREPARED BY: DATE:
Ln
lt6/4Y
7-t uedl
APPROVED BY: DATE: ELECTRONIC COMPONENTS GROUP REPRESENTATIVE DIVISIOON:
T / /t/sf SHARP coRPORATION
‘ qkc
F sd.A*
DEVICE SPECIFICATION FOR
s#@#ARp i ISSUE
SPECIFICATION
SPEC.No. DG996042
J&16/99
PAGE
Opto-Electronic Devices Division
10 Pages
Light Emitting Diode
I
I
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2.
When using this
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal) * Measuring equipment
* Tooling machines * Computers
II
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment
* Other safety equipment
[
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment * Medical equipment
C
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
MODEL No.
GL5ZJ44
product, please observe the absolute maximum ratings and the instructions for use outlined
1
1
1
-
CUSTOMERS APPROVAL
‘DATE:
BY:
Department General Manager of
Engineering Dept..III
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
Page 2
GL5ZJ44 Sneeification
MODEL No.
DG996042
GL5ZJ44
Jun/16/99
PAGE
l/10
/
1. Application
This specification applies to the light emitting diode device Model No. GL5a44.
[AlGaIS (dicing or scribe/brake type) Orange LED device]
2. Outline dimensions and pin connections
3. Ratings and characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 2.
Refer to the attached sheet Page 3-4.
3-l. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 5.
4- 1. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
5. Incoming inspection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 6.
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
6. Supplement
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6-l. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
6-4. Environment
7. Precautions for use
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*..............
7-l. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
.7-k For cleaning
Refer to the attached sheet Page 7-8.
Refer to the attached sheet Page 9- 10.
Page 3
2. Outline dimensions and pin conmctions
MODEL No.
DG996042
GL5ZT44
JunA6/9!
PAGE
2/10
LO.1
,O.S
r
0
:
1
pin COMCCtiOllS
CD. Anode
0. cathode
rote) Unspecified tol. to be +0.2mm
rote) Cold.rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product.
unit
mm
Material
Lead : (Fe) Cold rolled steel
Package : Epoxy
resin
Fiih
Lead : Sn plated or wave soldering
Drawing No.
51106023
Page 4
3. Ratings and characteristics
3- 1. Absolute maximum ratings
Parameter S)lTdJOl Value
Power dissipation
Continuous forward current
Peak forward current(Note 1)
Derating factor
IReverse voltage
Operating temperature Topr 40 - 85
Storage temperature Tstg -40 - 100
Soldering temperature(Note 2) Tsol
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2)
At
the position of 1.6mm from the bottom resin package
DC
Pulse
P 130 mW
1,
IN
I Va I 5 I v I
260 (within 5 seconds)
50 mA
100 mA
0.67
1.33
MODEL No.
(Ta=25OC)
unit
“C
“C
“C
DG996042 Jul/16/!I!
PAGE
GL5ZJ44 3110
Terminal capacitance
Viewing Angle 261/2 I IP=2OmA
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak Forward Current Derating Curve Forward Current Derating Curve
60
0
-25 0 25 50 75 =lOO 125
Ct
V=OV,f=lMHz - 60 - pF
I
60
-
‘:i
-25 0 25 50 75
15 - deg.
85
100 125
Ambient Temperature ia
Ambient Temperature TarC)
Page 5
MODEL No.
I
DG996042
GL5ZJ44
Juld16/94
PAGE
I 4110
Peak Forward Current vs. Duty Ratio
loo
10
l/100 l/10 1
Duty Raito DR
3-4. Characteristics Diagram(typ) (Note 1)
Forward Current vs.Forward Voltage
100
(Ta=25"C)
10
(Ta=25%)
Relative Luminous Intensity
vs. Ambient Temperature
(lF=2OmA)
10
1
0. 1
1 1.2 1.4 1.6 1.8 2 2.22.42.6
Forward Voltage VFW
Relative Luminous Intensity vs. Frorard Voltage
1000
100
10
-
-60 -40-20 0 20 40 60 80 100 120
Ambient Temprature Ta("C)
(Ta=25"C)
0. 1
1 10
Forward Current IFhA)
loo
(Note 1) Above characteristic data are typical data and not a gmrantteed data.
Page 6
4. Reliability
The reliability of products shall be satisfied with items listed below.
DG996042
MODEL No. PAGE
JlJd16/99
GL5ZJ44
5110
4- 1. Test items and test conditions
Test items Test conditions
Solderability
Soldering
temperature
Mechanical shock
230*5”c, 5s
Prior disposition : Dip in rosin flux
260f5”C, 5s
15 OOOm/s2, 05ms,
3times I kX,*Yp!Z direction
Variable frequency 200m/s2, 100 to 2 000 to 1OOHJsweep for 4min.
vibration
Terminal strength
(Tension)
Terminal strength
(Bending)
Temperature cycling
High temp. and high
humidity storage
,4timeslfX,fY,&Z direction
Weight: lON, S/each terminal
Weight:SN,O” -90” * O”-+-90” -0”
/each terminal
40~(3Omin)~+1OO”c(3Omin).30 cycles
Ta=+6O”C, 9O%RH, t=lOOOh
High temperature storage Ta=lOO”C, t=lOOOh
Low temperature storage Ta=AO”C, t=lOOOh
Confidence level: 90:
Samples (n) LTF’D
Defective (C)
(o/o)
n=ll, C=O 20
n=ll,C=O 20
n=ll, C=O 20
n=ll. C=O 20
n=ll, C=O 20
n=ll,C=O 20
n=22, C=O 10
n=22, C=O 10
n=22, C=O 10
n=22, C=O 10
Operation life
Ta=25”c, IF MAX, t=lOOOh *3
4-2. Measurement items and Failure judgement criteria * 1
Measurement Symbol
Forward voltage
Reverse current
vF
IR
Luminous intensity Iv
Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
Failure judgement criteria *2
v, > U.S.L. x 1.2
IR > u.sL. x 2.0
z Solderability : Solder shall be adhere at the area of 95% or more of dipped portion.
z Terminal strength : Package is not destroyed, and terminal is not slack.
* 1: Measuring condition is in accordance with speciiication.
*2: U.S.L. is shown by Upper Specification Limit.
*3: IF m.is shown by forward current of absolute maximum ratings.
n=22, C=O 10
Page 7
DG996042
MODEL No.
5. Incoming inspection
5-1. Applied standard : IS0 2859-1
5-2. Sampling method and level : A single sampling plan,nonnal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
Different from dimension
GL5ZJ44
Jun/16/99
PAGE
6110
Outline dimensions
8 Scratch
9
10
material for scattering
11 Unbalanced center
12 Burr Exceed +0.2mm againstprovided dimension
Insertion position of
13
Void Exceed Q, 0.3mrn (on top view)
Uneven density of
terminal
Exceed 4 0.3mm or O.lmm x l.Omm (on top view)
Extremely uneven density
Exceed ti.25mrn from package center
Insertion position of terminal
Minor defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defbct
No. Test items
14 Chapped the surface
Hollow the surface
15
judgement criteria
The surface chapped is striking for see the lamp top
The surface hollow is striking for see the lamp top
classifica of defer:
Minor defect
Page 8
6. Supplement
6-l. Packing
6-l- 1. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One Product,Typ.)
(Indication label sample)
SHIPMENT TABLE
I
PART No.
QUANTITY
LOT No.
SHARP
4
0 Production plant code(to be indicated alphabetically)
@ Support code
@ Year of production(the last two figures of the year)
@ Month of production
0 Date of production(01 N 3 1)
!dADE IN JAPAN
GL5ZJ44
250
M99819
r3-Cl Luminous intensity rank
+ Model number
- Quantity of products
+ Lot number *
dominant wavelength rank
- Production country
(to be indicated alphabetically with January corresponding to A)
DG996042
MODEL No. PAGE
I
GL5ZJ44 I 7110
*cl cl q 00clcl
- ---
0 0 00 0
JunJ16/99
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width: 14Omm, Depth: 225mm, Hight: 9Omm
~l
(Note 1) Tolerance:flS%
In regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
In case of the distribution of the lurninous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
6-3.Dominar-n wavelength rank (Note 2)
Rank Dominant wavelength
.
T 613.5 - 617.0
U 616.0 - 619.5
V 618.5 - 622.0
W 1 621.0 - 624.5
c
X i 623.5 - 627.0
(Note 2) The condition of measurement : The measurement of 1
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
unit
nm
:Ta=25”C)
Condition
IF2omA
1
: light emission from the front side of lamp.
Page 9
6-4. Environment
641. Ozonosphere destructive chemicals.
(1) The device doesn’t contain following substance.
(2) The device doesn’t have a production line whose process requires following substance.
Restricted part
642. Bromic non-burning materials
The device doesu’t contain bromic non-burning materials(PBBOs,PBBs)
CFCs,halones,C~,TrichLoroethane(Methychloroforn)
MODEL No.
I
Do996042
GL5ZJ44 8110
Jud16/99
PAGE
Page 10
7.
Precautions
7 -
1.
Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
for use
MODEL No.
DC396042
GLSZJ44
Jun/16/99
PAGE
g/10
7 - 2.
Notice of installation
7-Z-l installation on a PWB
Yhen mounting an LED lamp on a PW, do not apply
physical stress to the lead pins.
l
The lead pin pitch should match the P’#B pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l
When positioning an LED lamp.basically employ
an LED with tie-bar cut or use a spacer.
7-Z-2 When an LED 1 is mounted directly on a P WB
If the bottom face of an LED lamp is mounted
directly on single-sided PWB, the base of the
lead pins may be subjected to physical stress
due to PYB warp,cutting or clinching of lead
pins.Prior to use,be sure to check that no
disconnection inside of the resin or damage to
resin etc., is found. Bhen an LED lamp is mounted
on a double-sided PW,the heat during soldering
affects the resin;therefore.keep the LED lamp
more that 1.6mm afloat above the P!B.
7-2-3
Installation using a holder
During an LED lamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder-since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure..1 hole of the case should
be designed not to subject the ins
to any undue stress.
NG
I
Gooc
I
I
I
I
in ide of res
c&Se
;’ ,: I:,
‘; ; /c-
0
I ,,’
,,, ’ I,
.’
YE
,, ,..
C
Page 11
7 - 3. Soldering Conditions
Solder the lead pins under the following conditions
Type of Soldering Conditions
1. Manual soldering 29SC+5”c, within 3 seconds
2. Wave soldering 26O”c+5”c. within 5 seconds
3. Auto soldering
P reheating 70°C to 80°C. vithin 30 seconds
Soldering 245”c*YC, within 5 seconds
(Note) Avoid dipping resin into soldering bath.
Avoid applying stress to lead pins while they are heated-For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
MODEL No. PAGE
I
DG996042 Jud16/99
GL5ZT44
I lo/lo
7 - 4. For cleaning
( 1) Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 ruin or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time,PBB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol. Yethyl alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
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