Page 1
PREPARED BY:
TTti /(6/?7
DATE:
7-I LLdLl
APPROVED BY: DATE:
*_I;,* /I&/ 97,
DEVICE SPECIFICATION FOR
MODEL No.
~E~TRONIC COMPONENTS GROUP
SHARP CORPORATION
SPEC~CATIO~J
Light Emitting Diode
1 Opto-Electronic Devices Division
GL5ZJ302BOS
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment
* Telecommunication equipment (Terminal) * LMeasuring equipment
* Tooling machines * Computers
L
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
* Audio visual equipment
* Home appliance
A
1
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, &ain. automobile etc.)
* Traffic signals
* Other safety equipment
[I
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment * Medical equipment
L-
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMERS APPROVAL
‘DATE:
BY:
* Gas leakage sensor breakers
* Rescue and security equipment
M.Katoh,
Department General Manager of
Engineering Dept.,IH
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPOR4TION
1
1
Page 2
MODEL No.
GLSZJ302BOS l/10
GL5ZT302BOS StAfication
1. Application
This specification applies to the light emitting diode device Model No. GL5ZJ302BOS.
[AlGaIS (dicing or scribe/brake ty-pe)
Orange IED device]
DG996030 Juni16iW
PAGE
2. Guthne dimensions and pin
3. Ratings and characteristics
co~ections
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 2.
Refer to the attached sheet Page 3-4.
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability
.,.....................................................
Refer to the attached sheet Page 5.
4-l. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
5. Incoming inspection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 6.
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifrca of defect
6. Supplement
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6-l. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
6-4. Environment
7. Precautions for use
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7-1. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
.7-4. For cleaning
Refer to the attached sheet Page 7-8.
Refer to the attached sheet Page 9- 10.
Page 3
2. Outline dimensions aud-pin connections
MODEL No.
I
DG!396030
GLZJ302BOS
Jud16199
PAGE
I 2/10
Colorless
+nspare~Y
i
I
I
I
$‘:i:
t i t
i i i
i i i Q
:-I ~;~
i i i -;
’ !
-I
I I
i i z;
i i C;
I _
.
* /
w
0
o oi
.
4
z
z
0
ti
0. 5 20. 1 C-J
i i
LL
L.
54NOM 1
(Note) Unspecified tol. to be k0.21~1
(Note) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product
unit
mm
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Material
4
I
2. 4
L-J
Finish
Lead : Sn plated or wave soldering
y.
pin connections
0. Anode
0. cathode
Drawing No.
51106011
Page 4
3. Ratings and characteristics
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2) At the position of 1.6mm from the bottom resin package
MODEL No.
DG996030
GL5ZJ302BOS
Jun/16/9!
PAGE
3110
Terminal capacitance
Ct
Viewing Angle 261/2 IF=2OmA
V=OV,f=lMHz - 60 - pF
-
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak Forward Current Derating Curve Forward Current Derating Curve
120
z
.5
iz 100
g 80
,m
3 60
-25 0 25 50 75 85 100 125
Amb i ent Temperature Ta (“cl
-25 0 25 50 75”*100 125
Ambient Temperature TarC)
30 - deg.
Page 5
MODEL No.
GLZJ302BOS
DG996030
Jun/16/%
PAGE
4110
Peak Forward CurrFnt vs. Duty Ratio
1000
I I/lil/ll
I
II /llllllll
I ““‘I//
I /II/
I i I /lllll
loo
l/100 l/10
Duty Raito DR
1 10
3-4. Characteristics Diagram(typ) (Note 1)
Forward Current vs.Forward Voltage
100
(Ta?Z!?C)
III!1
I I
i II
(Ta=25”C)
Relative Luminous Intensity
vs. Ambient Temperature
( I F=2GmA)
10
I I I , I I
1
1;: ‘,‘,:;,,,I
1 / , ,I / ! / ! 4 /
I I I /I I I
0. 1
Relative Luminous Intensity vs. Frorard Voltage Relative Luminous Intensity vs. Frorard Voltage
1000 1000
100 100
10 10
1 1
0. 1 0. 1
I I I I! I I
1 1.2 1.4 1.6 1.8
Forward Voltage VFW
2 2.2
I I
I I I I.
2.4 2.6
(Ta= (Ta=
Q5”c)
-
-60 -40-20 0 20 40 60 80
Ambient Temprature Ta("C)-
100 120
0.01 0.01
0. 1 0. 1 1 1 10 10 100 100
Forward Current IFhA)
(Note 1) Above characteristic &ta are typical data ad not a guarantteed &u.
Page 6
4. Reliability
The reliability of products shall be satisfied with items listed below.
A
l-1. Test items and test conditions
Test items Test conditions
Solderability
Soldering
temperature
Mechanical shock
Variable frequency
230*5”c. 5s
Prior disposition : Dip in rosin flux
260tPC,
5s
15 OOOm/sz, OSms,
3times / iSgtY,kZ direction
2OOm/s*, 100 to 2 Ooo to lOOHz/sweep for 4min.
vibration .4times/fX+Y,iZ direction
Terminal strength
(Tension)
Terminal strength
(Bending)
Weight:lON, S/each terminal
Weight:SN, 0” - 90” -+ O”* -90” + 0”
/each terminal
MODEL No.
GL5a302BOS S/10
DC3996030
Confidence level: 909
Samples (n) LTPD
Defective (C)
(Q/o)
n=ll, C=O 20
n=ll,C=O 20
n=ll. C=O 20
n=ll, C=O 20
n=ll, C=O 20
n=ll,C=O 20
Junl16/94
PAGE
6
3
Temperature cycling -4O”c(3Omin)~+lOO”c(3~in),3O cycles
High temp. and high
humidity storage
Ta=+60%, 9O%RH, t=lOOOh
tigh temperature storage Ta=lOO”C, t=lOOOh
x)w temperature storage Ta=-40”C, t=lOOOh
Operation life
Ta=25”c. IF MAX, t=1000h *3
n=22, C=O 10
n=22, C=O 10
n=22, C=O 10
n=22, C=O 10
n=22, C=O 10
4-2. Measurement items and Failure judgement criteria * 1
Measurement SpbOl Failure judgement criteria *2
Forward voltage
Reverse current
vF
IR
v, > U.S.L. x 1.2
I, > U.S.L. x 2.0
Luminous intensity Iv Iv > The fist stage value X 2.0 or The first stage value X 0.5 >
Z Solderability : Sol&r shall be adhere at the area of 95% or more of dipped portion.
z Terminal strength : Package is not destroyed, and terminal is not slack.
* 1: Measuring condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
*3: IF MAX.is shown by forward current of absolute maximum ratings.
Iv
Page 7
DG996030
MODEL No.
5. Incoming inspection
5-1. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling plan,notmal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items, judgement criteria and class&a of defect
GL5ZJ302BOS
Jun/W!X
PAGE
6/10
No. Test items
judgement criteria
1 Disconnection Not emit light
Position of Cutting off
2
rim
Different from dimension
3 Reverse terminal Different from dimension
4 Outline dimensions Not satisfy outline specification
5 Characteristics Over the limit value of specification at V,, Ia, and I,,
6 Cut off the rim Exceed -0.2mm
White pint : Exceed 4 0.3mm (on top view)
7 Foreign substance Black point : Exceed 4 0.3mm (on top view)
String fotm : Exceed 3.Omm (on top view)
8
Scratch Exceed o 0.3mm or O.lmm x l.Omm (on top view)
9 Void Exceed Q 0.3mm (on top view)
Uneven density of
LO
material for scattering
Extiemely
uneven
density
11 Unbalanced center Exceed M.25mrn from package center
classifica of deft
Major defect
Minor defect
12 Burr
Insertion position of
13
terminal
Exceed +0.2mm againstprovided dimension
Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No. Test items judgement criteria
14
Chapped the surface
15
Hollow the surface
The surface chapped is striking for see the lamp top Minor defect
The surface hollow is striking for see the lamp top
classifica of defect
Page 8
DG996030
MODEL No. PAGE
GLEZJ302BOS
6. Supplement
61. Packing
6-l-l. Inner package
Put 25Cpcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One Roduct.Typ.)
(Indication label
SHIPMEHT TABLE
PART No. GLJ~J~O~BOS * Model
QUANTITY
LOT No.
SHARP’
MADE IN JAP.4N
0 Production plant code(to be indicated alphabetically)
@ Support code
@ Year of production(the last two figures of the year)
@ Month of production (to be indicated alphabetically with January corresponding to
@ Date of production(0 1 w 3 1)
sample)
250
KA99B19
G-C t- Luminous intensity rank
+-- Quantity of products
* Lot number *
dominant wavelength rank
+ Production country
number
*cl cl cloonn
- ---
0 0
Juni16/9!
7110
@co 0
A)
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width: 14Omm, Depth : 225rnm, Hight: 9Omm
6-2.Luminous intensity rank (Note 1)
Rank Luminous intensity
K 383 - 746
L 552 - 1075
M 795 - 1548
(Note 1) Tolerance:fl5%
In regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
unit
mcd
(Ta=25”c )
Condition
It92OnLA
X
1
(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp.
1 623.5 - 627.0 1
This rank value is the setting value of when that classities it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
I
I
Page 9
-6-4. Environment
641. Ozonosphere destructive chemicals.
(1) The device doesn’t contain following substance.
(2) The device doesn’t have a production line whose process requires following substance.
Restricted part: CFCsJlalones,CC&,Trichloroetha&Methychlorofom@
642. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
MODEL No.
I
DG996030
GL5a302BOS 8/10
Jun/16/94
PAGE
Page 10
7.
Precautions for use
7 -
1.
Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering
‘7 -
2.
Notice of installation
7-2-l installation on a P W B
When mounting an LED lamp on a PwB,do not apply
physical stress to the lead pins.
l
The lead pin pitch should match the PIB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l
When positioning an LED lamp,basically employ
an LED with tie-bar cut or use a spacer.
7-2-2 ‘#hen an LED 1 is mounted directly on a P W B
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins may be subjected to physical stress
due to P’#B warp, cutting or clinching of lead
pins. Prior to use. be sure to check that no
disconnection inside of the resin or damage to
resin etc.,is found-when an LED lamp is mounted
on a double-sided PIB,the heat during soldering
affects the resin;therefore.keep the LED lamp
more that 1.6mm afloat above the PIVB.
7-2-3
Installation using a holder
During an LED lamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat,mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to-the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
MODEL, No.
GLZJ302BOS
DG996030
Juni16i99
PAGE
9110
NG
Good
Page 11
7 7 3. S oldering Conditions
Solder the lead pins under the following conditions
Type of Soldering
1.
Manual soldering
2. Wave soldering
3. Auto soldering
295’C*5”c, within 3 seconds
260°C t5”c. within 5 seconds
Preheating 70°C to 8O”C, within 30 seconds
Conditions
Soldering 245”c*S”c, within 5 seconds
(Note) Avoid dipping resin into soldering bath
Avoid applying stress to lead pins while they are heated-For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection way occur.
MODEL, No.
GL5ZJ302BOS
DG996030
Junl16/99
PAGE
lO/lO
iron
7 -
4.
For cleaning
(1)
Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time,PIB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 1 Applicable solvent
Ethyl alcohoLYethy1 alcohol, Isopropyl alcohol
In case when the other solvent is used,there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
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