Page 1
FYV0203S/DN/DP/DS
FYV0203S/DN/DP/DS
3
Y
3
B
1
Connection Diagram
3
3
1
1
2 FY V0203DN
1
SOT-23
2
1
Marking
FYV0203S = YB1 FYV0203DP = YB3
FYV0203DN = YB2 FYV0203DS = YB4
2
1
1
FYV0203S
3
Schottky Diode
Absolute Maximum Ratings
Symbol Parameter Value Units
V
RRM
I
F(AV)
I
FSM
Maximum Repetitive Reverse Voltage 30 V
Average Rectified Forward Current 0.2 A
Non-repetitive Peak Surge Current
Pulse Width = 1.0s
T
STG
T
J
Storage Temperature Range -65 to +150 °C
Operating Junction Temperature 150 °C
Thermal Characteristics
Symbol Parameter Value Units
R
θJA
Thermal Resistance, Junction to Ambient 430 °C/W
Electrical Characteristics
Symbol Parameter Min. Typ. Max. Units
V
F
*
I
R
*
C
T
t
rr
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
Forward Voltage Drop
I
I
I
I
I
I
Reverse Current
@ Rated V
Total Capacitance
= 1V , f = 1.0 MHz - - 10
V
R
Reverse Recovery Time
= IR = 10mA, I
I
F
TA=25°°°°C unless otherwise noted
TA=25°°°°C unless otherwise noted
= 0.1mA
F
= 1mA
F
= 10mA
F
= 30mA
F
= 100mA
F
= 200mA
F
R
RR
TA = 25 °C
T
= 125 °C
A
= 1mA, RL = 100Ω --5
0.6 A
-
-
-
-
-
-
-
-
210
270
340
390
485
600
0.2
130
240
320
400
500
800
1000
2
-
2 FYV0203DP
3
2 FYV 0203DS
mV
uA
pF
ns
©2001 Fairchild Semiconductor Corporation
Rev. A, September 2001
Page 2
Typical Characteristics
FYV0203S/DN/DP/DS
0.1
[A]
F
0.01
TJ=125 oC
0.001
Forward Current, I
0.0001
0.0 0.2 0.4 0.6 0.8 1.0
TJ=75 oC
TJ=25 oC
Forward Voltage Drop, VF[V]
Figure 1. Typical Forward Volta ge C haracteristics
12
11
10
[pF]
T
9
8
7
6
5
4
3
2
Total Diode Capacitance, C
1
012345678910
Reverse Voltage, VR[V]
TJ=25 oC
1000
100
]
㎂
[
R
10
1
Reverse Current, I
0.1
0.01
0102030
TJ=125 oC
TJ=75 oC
TJ=25 oC
Reverse Voltage, VR[V]
Figure 2. Typical Reverse Current
vs. Reverse Voltage
Figure 3. Total Diode Capacitance
©2001 Fairchild Semiconductor Corporation
Rev. A, September 2001
Page 3
Package Dimensions
0.40
±0.03
FYV0203S/DN/DP/DS
SOT-23
0.20 MIN
0.45~0.60
0.95
2.90
±0.03
1.90
±0.10
0.95
±0.03
±0.03
±0.10
0.40
±0.03
0.97REF 1.30
0.508REF
±0.10
2.40
0.96~1.14
0.03~0.10
0.38 REF
+0.05
0.12
–0.023
©2001 Fairchild Semiconductor Corporation
Dimensions in Millimeters
Rev. A, September 2001
Page 4
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intended to be an exhaustive list of all such trademarks.
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Bottomless™
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CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
2
CMOS™
E
EnSigna™
FACT™
FACT Quiet Series™
STAR*POWER is used under license
®
FAST
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
®
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SLIENT SWITCHER
SMART START™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TruTranslation™
TinyLogic™
UHC™
®
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VCX™
®
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
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NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
INTERNATIONAL.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Obsolete Not In Production This datasheet contains specifications on a product
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H4©2001 Fairchild Semiconductor Corporation
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