Datasheet FUSB3301MPX Datasheet

Page 1
FUSB3301
USB Type-C Controller for Mobile Chargers and Power Adapters
The FUSB3301 is an autonomous Source only TypeC controller optimized for mobile chargers and power adapters. It broadcasts the available current of the charger over CC1/CC2 using the USB Type−C standard and prevents VBUS from being asserted until a valid connection has been verified. It can be used for up to 15 W charging using Type−C protocols. The FUSB3301 has very low standby power consumption and is packaged in a 0.5 mm pitch MLP to accommodate power adapter PCBs.
Features
Fully Autonomous TypeC Controller
Supports TypeC Version 1.2
Fixed Source Mode
Low Standby Power: I
= 5 mA (Typical)
CC
VBUS Switch Control
Advertises Three Standard TypeC VBUS Current Levels
(900 mA, 1.5 A, 3.0 A)
2 kV HBM ESD Protection
10 Lead MLP Package
V
Operating Range, 3.0 V 5.5 V
DD
Applications
USB TypeC Power Ports
Mobile Chargers
Power Adapters
ACDC Adapters
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WDFN
10 LEAD
CASE 511DM
MARKING DIAGRAM
NZ
NZ = Specific Device Marking
PIN ASSIGNMENT
CC1 NC1 NC2 NC3
HOST1
(Top View)
CC2 VDD GND SW HOST2
© Semiconductor Components Industries, LLC, 2015
March, 2018 Rev. 2
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of this data sheet.
1 Publication Order Number:
FUSB3301/D
Page 2
FUSB3301
ORDERING INFORMATION
Part Number Top Mark Operating Temperature Range Package Packing Method
FUSB3301MPX NZ 40 to 85°C 10Lead, MLP, 3 mm x 3 mm Tape and Reel
VBUS _IN
FUSB 3301
Source
State Machine
VDD
GND
LOAD
SWITCH
CC Switches ,
I(Rp)/Rd &
Comparators Block
HOST1
VBUS _OUT
SW
CC1
CC2
HOST 2
Figure 1. Block Diagram
Vo
LOAD
SWITCH
SW
FUSB3301
Secondary Side
Controller
VBUS
TYPE−C
GND
RX1+TX1+ RX1TX1
VBUS
RFU1CC1
VBUS
TX2RX2 TX2+RX2+
GND
DD+
D+D
CC2RFU2
TYPE−C
GND
RX1+TX1+ RX1TX1
VBUS
RFU1CC1
DD+
D+D
CC2RFU2
VBUS
TX2RX2
TX2+RX2+
GND
Figure 2. Typical Application
Table 1. PIN DESCRIPTIONS
Pin # Name Type Description
1 CC1 Input/Output TypeC Configuration Channel
2 NC1 (Note 1) NC No Connect
3 NC2 (Note 1) NC No Connect
4 NC3 (Note 1) NC No Connect
5 HOST1 Input Host Current Select Pin with Internal Pullup
6 HOST2 Input Host Current Select Pin with Internal Pullup
7 SW Output Open Drain output to control the VBUS load switch
8 GND Power Ground
9 VDD Power Power Supply
10 CC2 Input/Output TypeC Configuration Channel
1. No connect pins can float or can be tied to ground.
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FUSB3301
Table 2. CONNECTION STATE TABLE
CC1 CC2 SW Description
NC NC HiZ No Attach
Rd NC L Attach to UFP (Sink)
NC Rd L Attach to UFP (Sink)
Rd Rd HiZ No Attach
Ra NC HiZ No Attach
NC Ra HiZ No Attach
Ra Ra HiZ No Attach
Host Current
Table 3. HOST INPUT TRUTH TABLE
HOST2 HOST1
GND / LOW GND / LOW 330 3.0
GND / LOW FLOAT / HIGH 180 1.5
FLOAT / HIGH GND / LOW 180 1.5
FLOAT / HIGH FLOAT / HIGH 80 0.9
CC Current (mA)
Host Current (A)
Unattached SOURCE
Attach Detected for
tCCDebounce?
YES
Attached SOURCE
SW = LOW
Figure 3. Source Attach Flowchart
NO
SW = HiZ
YES
Not Attached for
tPDDebounce?
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Page 4
FUSB3301
Table 4. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
V
DD
V
CCX
T
STORAGE
T
J
T
L
ESD IEC 6100042 System ESD Connector Pins
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
Table 5. RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Ty p Max Unit
V
DD
T
A
T
J
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
Supply Voltage −0.5 6.0 V
CC pins when configured as HOST 0.5 6.0 V
Storage Temperature Range −65 +150 °C
Maximum Junction Temperature +150 °C
Lead Temperature (Soldering, 10 seconds) +260 °C
kV
kV
Human Body Model, JEDEC JESD22A114
(VBUS, CC1 & CC2)
Contact 8
Connector Pins (VBUS, CC1 and CC2) 4
Air Gap 15
Others 2
Charged Device Model, JEDEC
All Pins 1 kV
JESD22C101
Supply Voltage 3.0 5.0 5.5 V
Operating Ambient Temperature −40 +85 °C
Operating Junction Temperature −40 +125 °C
Table 6. DC AND TRANSIENT CHARACTERISTICS All typical values are at T
=25°C unless otherwise specified.
A
TA = 40 to +855C
=40 to +1255C
T
J
Symbol
I
80_CCX
I
180_CCX
I
330_CCX
Source 80 mA CC Current (Default) HOST2=VDD, HOST1=VDD
Source 180 mA CC Current (1.5 A) HOST2=VDD, HOST1=GND or HOST2=GND, HOST1=VDD
Source 330 mA CC Current (3 A) HOST2=GND, HOST1=GND
Parameter
zOPEN CC Resistance for Disabled State 126
Min Typ Max
64 80 96
166 180 194
304 330 356
Unit
mA
mA
mA
kW
vRaSRCdef Ra Detection Threshold for CC Pin for Source for Default Current on VBUS 0.15 0.20 0.25 V
vRaSRC1.5A Ra Detection Threshold for CC pin for Source for 1.5 A Current on VBUS 0.35 0.40 0.45 V
vRaSRC3A Ra Detection Threshold for CC Pin for Source for 3 A Current on VBUS 0.75 0.80 0.85 V
vRdSRCdef Rd Detection Threshold for Source for Default Current (HOST2/1=VDD/VDD) 1.50 1.60 1.65 V
vRdSRC1.5A Rd detection threshold for Source for 1.5 A Current (HOST2/1=GND/VDD or VDD/GND) 1.50 1.60 1.65 V
vRdSRC3A Rd Detection Threshold for Source for 3 A Current (HOST2/1=GND/GND) 2.45 2.60 2.75 V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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FUSB3301
Table 7. CURRENT CONSUMPTION
TA = 40 to +855C
=40 to +1255C
T
J
Symbol Parameter Conditions VDD (V)
Istby Unattached Source Nothing attached, Host Pins = VDD,
3.0 to 5.5 5 20
GND, Float.
Iattach Attach Current
Attached, Host Pins=VDD, GND, Float. 3.0 to 5.5 10 15
(Less Host Current)
Table 8. TIMING PARAMETERS
Symbol Parameter
tCCDebounce Time from CC Voltage Detection until SW goes LOW 100 150 200 ms
tPDDebounce Time from CC Voltage Not Detected until SW goes to High−Z 10 15 20 ms
Table 9. IO SPECIFICATIONS
Symbol Parameter Conditions VDD (V)
V
OLSW
V
ILHOST
V
IHHOST
SW Output Low Voltage IOL=4 mA 3.0 to 5.5 0.4 V
HOST1/2 LowLevel Input Voltage 3.0 to 5.5 0.3V
HOST1/2 HighLevel Input Voltage 3.0 to 5.5 0.7V
Min Typ Max
T
= 40 to +855C
A
=40 to +1255C
T
J
Min Typ Max
TA = 40 to +855C
=40 to +1255C
T
J
Min Typ Max
DD
DD
Unit
mA
mA
Unit
Unit
V
V
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Page 6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN10 3x3, 0.5P
CASE 511DM
ISSUE O
DATE 31 AUG 2016
2X
0.80 MAX
0.10
0.08
PIN #1 IDENT
0.10
C
C
0.05
0.00
C
SEATING PLANE
0.5 1
3.0
TOP VIEW
SIDE VIEW
0.30
0.20
A
3.0
2X
B
0.10 C
0.20
0.78
2.33
0.23
0.02
D
10 6
2.25
2.20 0.55
2.00
0.50 15
1.55 3.10
2.00
0.25
LAND PATTERN RECOMMENDATION
C
NOTES:
A. CONFORMS TO JEDEC REGISTRATION
5
0.38
1.60
1.50
3.10
2.90
MO229, VARIATION WEED−5 B. DIMENSIONS ARE IN MILLIMETERS C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009 D. LAND PATTERN DIMENSIONS ARE NOMINAL REFERENCE VALUES ONLY
0.45
0.35
2.30
2.20
3.10
2.90
2.0
610
M
0.10
0.05
CAB
M
C
BOTTOM VIEW
DOCUMENT NUMBER:
DESCRIPTION:
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
98AON13631G
WDFN10 3X3, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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