Datasheet FPF1107, FPF1108 Datasheet (Fairchild)

FPF1107 / FPF1108 Advance Load Management Switch

FPF1107 / FPF1108 — Advance Load Management Switch

November 2009

Features

 1.2V to 4V Input Voltage Operating Range  Typical R

- 35mΩ at V

- 55mΩ at V

- 85mΩ at V

 Slew Rate Control with t

DS(ON)

:

=3.3V

IN

=1.8V

IN

=1.2V

IN

: 130µs

R

 Output Discharge Function on FPF1108  Low <1µA Quiescent Current at V

ON=VIN

 ESD Protected: Above 4000V HBM, 2000V CDM  GPIO/CMOS-Compatible Enable Circuitry

Applications

 Mobile Devices and Smart Phones  Portable Media Devices  Digital Cameras  Advanced Notebook, UMPC, MID  Portable Medical Devices  GPS and Navigation Equipment

Description

The FPF1107/08 are low RDS P-channel MOSFET load switches of the IntelliMAX™ family. Integrated slew-rate control prevents inrush current from glitch supply rails with capacitive loads common in power applications.

The input voltage range operates from 1.2V to 4V to fulfill today's lowest ultra-portable device supply requirements. Switch control is by a logic input (ON-pin) capable of interfacing directly with low-voltage CMOS control signals and GPIOs in embedded processors.

Ordering Information

Part

Number

FPF1107 QC 55mΩ CMOS NA

FPF1108 QD 55mΩ CMOS 65Ω

For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.

Part

Marking

Switch (Typical) At 1.8V

IN

Input

Buffer

Output

Discharge

ON Pin

Activity

Active

HIGH

Active

HIGH

Eco

t

R

Status

130µs Green

Package

4-Ball, Wafer-Level Chip-Scale Package (WLCSP), 1.0 x 1.0mm,

0.5mm Pitch

Application Diagram

FPF1107 / FPF1108 — Advance Load Management Switch

C

IN

Notes:

1. C

2. C

=1μF, X5R, 0603, for example Murata GRM185R60J105KE26

IN

=1μF, X5R, 0805, for example Murata GRM216R61A105KA01

OUT

Block Diagram

V

IN

FPF1107/FPF1108

ONOFF ON

GND

Figure 1. Typical Application

V

OUT

C

OUT

To Load

FPF1107/8

Figure 2. Block Diagram (Output Discharge for FPF1108 Only)

A2A

A

Pin Configurations

Figure 3. 1 x 1mm WLCSP Bumps Facing Down Figure 4. 1 x 1mm WLCSP Bumps Facing Up

1

V

OUT

A1 A2

V

IN

V

OUT

FPF1107 / FPF1108 — Advance Load Management Switch

GND

Figure 5. Pin Assignments (Top View) Figure 6. Pin

B1 B2

ON

Pin Definitions

Pin # Name Description

A1 V

A2 VIN Supply Input: Input to the Power Switch.

B1 GND Ground

B2 ON ON/OFF Control, Active HIGH

Switch Output

OUT

ON

B2 B1

ssignments (Bottom View)

GND

FPF1107 / FPF1108 — Advance Load Management Switch

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.

Symbol Parameter Min. Max. Unit

VIN VIN, V

ISW Maximum Continuous Switch Current 1.2 A

PD Power Dissipation at TA=25°C 1.0 W

T

Storage Junction Temperature -65 +150 °C

STG

TA Operating Temperature Range -40 +85 °C

ΘJA

ESD Electrostatic Discharge Capability

Thermal Resistance, Junction-to-Ambient

, VON to GND -0.3 4.2 V

OUT

1S2P with 1 Thermal Via 95

1S2P without Thermal Via 187

Human Body Model, JESD22-A114

Charged Device Model, JESD22-C101

4

2

°C/W

kV

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol Parameter Min. Max. Unit

VIN Supply Voltage 1.2 4.0 V

TA Ambient Operating Temperature -40 +85 °C

FPF1107 / FPF1108 — Advance Load Management Switch

Electrical Characteristics

Unless otherwise noted, VIN=1.2 to 4.0V, TA=-40 to +85°C, typical values are at VIN=3.3V and TA=25°C.

Symbol Parameter Conditions Min. Typ. Max. Units

Basic Operation

VIN Supply Voltage 1.2 4.0 V

I

Off Supply Current VON=GND V

Q(OFF)

I

Off Switch Current VON=GND V

SD(OFF)

I

=0mA, VON=VIN 1

IQ Quiescent Current

OUT

I

=0mA, VON < VIN 3

OUT

=3.3V, I

V

IN

VIN=1.8V, I

RON On Resistance

VIN=1.5V, I

VIN=1.2V, I

VIN=1.8V, I

=3.3V, VON=0V, I

V

RPD Output Discharge R

PULL DOWN

IN

T

=25°C, FPF1108

A

VIH On Input Logic High Voltage VIN=1.2V to 4.0V 1.1 V

VIL On Input Logic Low Voltage VIN=1.2V to 4.0V 0.35 V

ION On Input Leakage VON=VIN or GND -1 1 μA

Dynamic Characteristics

t

Turn-On Delay

DON

tR V

t

ON

t

Turn-On Delay

DON

tR V

t

ON

Rise Time

OUT

Turn-On Time

Rise Time

OUT

Turn-On Time

(4)

(4,6)

(4)

(4,6)

(4)

VIN=3.3V, RL=10Ω, CL=0.1µF,

=25°C, FPF1107/8

T

A

(4)

VIN=3.3V, RL=500Ω, CL=0.1µF,

=25°C, FPF1107/8

T

A

FPF1107

t

Turn-Off Delay

DOFF

tF V

t

Turn-Off

OFF

t

Turn-Off Delay

DOFF

tF V

t

Turn-Off

OFF

FPF1108

t

Turn-Off Delay

DOFF

tF V

t

Turn-Off

OFF

t

Turn-Off Delay

DOFF

tF V

t

Turn-Off

OFF

Fall Time

OUT

Fall Time

OUT

(5)

Fall Time

OUT

Fall Time

OUT

(4)

2.2 μs

(4,7)

4.2 μs

(4)

110 μs

(4,7)

117 μs

(4)

1.9 μs

(4,7)

3.9 μs

(4)

10.6 μs

(4,7)

13.1 μs

=3.3V, RL=10Ω, CL=0.1µF,

V

IN

=25°C

T

A

=3.3V, RL=500Ω, CL=0.1µF,

V

IN

=25°C

T

A

=3.3V, RL=10Ω, CL=0.1µF,

V

IN

R

=65Ω, TA=25°C

PD

VIN=3.3V, RL=500Ω, CL=0.1µF,

=65Ω, TA=25°C

R

PD

Notes:

3. This parameter is guaranteed by design and characterization; not production tested.

4. t

DON/tDOFF/tR/tF

are defined in Figure 7.

5. Output discharge path is enabled during off.

=Open, VIN=4V 1 μA

OUT

=GND 1 μA

OUT

=200mA, TA=25°C 35 50

OUT

=200mA, TA=25°C 55 70

OUT

=200mA, TA=25°C 70

OUT

=200mA, TA=25°C 85 150

OUT

=200mA, TA=85°C

OUT

FORCE

=20mA,

(3)

65 100

65 110 Ω

80 μs

130 μs

210 μs

70 95 μs 95 120 μs

165 215 μs

2.0 2.5 μs

7.0 μs

2.0 2.5 μs

2.5 μs

μA

mΩ

V

Timing Diagram

FPF1107 / FPF1108 — Advance Load Management Switch

Notes:

6. t

ON=tR

7. t

OFF=tF

+ t

DON

DOFF

OUT

10%

90%

t

R

90%

10%

t

F

3.3V

50%

V

ON

50%

90%

t

DON

10%

t

DOFF

V

OUT

.

Figure 7. Timing Diagram

μ

Typical Performance Characteristics

FPF1107 / FPF1108 — Advance Load Management Switch

0.30

A)

0.25

μ

0.20

0.15

0.10

SHUTDOWN CURRENT (

0.05

IN

V

0.00

-40 -15 10 35 60 85

, JUNCTION TEMPERATURE (°C)

T

J

VON = V

VIN= 4.0V

VIN = 3.3V

VIN = 1.2V

OUT

= 0V

0.25

A)

μ

0.20

0.15

0.10 85°C

SHUTDOWN C U R RENT (

0.05

IN

V

0.00

1.0 1.5 2.0 2.5 3.0 3.5 4.0

SUPPLY VOLTAGE (V)

VON=V

25°C

OUT

-40°C

Figure 8. Shutdown Current vs. Temperature Figure 9. Shutdown Current vs. Supply Voltage

0.10

0.09

A)

0.08

0.07

0.06

0.05

OFF SUPPLY CURRENT (

0.04

0.03

0.02

0.01

VIN = 3.3V

VIN = 1.2V

0.00

-40 -15 10 35 60 85

, JUNCTION TEMPERATURE (°C)

T

J

VON= 0V

VIN= 4.0V

0.07

VON = 0V

0.06

A)

0.05

0.04

0.03

85°C

0.02

OFF SUPPLY CURRENT (

0.01

-40°C 25°C

0.00

1.01.52.02.53.03.54.0

SUPPLY VOLTAGE (V)

=0V

Figure 10. Off Supply Current vs. Temperature

(FPF1107, VOUT is Floating)

0.050

0.045

0.040

A)

0.035

0.030

0.025

0.020

0.015

SUPPLY CURRENT (

0.010

VIN = 3.3V

0.005

0.000

-40 -15 10 35 60 85

, JUNCTION TEMPERATURE (°C)

T

J

VON = V

VIN = 4.0V

VIN= 1.2V

Figure 12. Quiescent Current vs. Temperature

(VON=VIN)

IN

Figure 11. Off Supply Current vs. Supply Voltage

(FPF1107, VOUT is Floating)

0.40 VON = V

IN

-40°C

25°C

85°C

1.01.52.02.53.03.54.0

SUPPLY VOLTAGE (V)

A)

SUPPLY CURRENT (

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

Figure 13. Quiescent Current vs. Supply Voltage

Y

V

(V)

T

Typical Performance Characteristics

FPF1107 / FPF1108 — Advance Load Management Switch

3.00

VON = 0.75 x V

2.50

A)

μ

2.00

1.50

1.00

SUPPLY CURRENT (

0.50

0.00

-40 -15 10 35 60 85

, JUNCTION TEMPERATURE (°C)

T

J

VIN = 4.0V

VIN = 3.3V

VIN = 1.2V

Figure 14. Quiescent Current vs. Temperature

(VON=0.75 x VIN)

120

100

)

Ω

80

60

40

ON RESISTANCE (m

20

0

-40 -15 10 35 60 85

, JUNCTION TEMPERATURE (°C)

T

J

VIN = 1.2V

VIN = 3.3V

VIN = 4.0V

VON = V I

= 200mA

OUT

IN

2.50

2.00

1.50

1.00

0.50

SUPPLYC URRENT (µA)

0.00

1.0 1.5 2.0 2.5 3.0 3.5 4.0

+85°C

-40°C

SUPPLY VOLTAGE (V)

+25°C

Figure 15. Quiescent Current vs. Supply Voltage

at VON=1.2V

300

IN

250

)

Ω

200

150

ON RESISTANCE (m

100

85°C

25°C

50

0

-40°C

1.0 1.52.02.53.

OLT AG E

SUPPL

VON=V

IN

I

=200mA

OU

03.54.0

Figure 16. RONvs. Temperature Figure 17. RONvs. Supply Voltage

1.00 25°C

0.90

0.80

0.70

0.60

0.50

0.40

INPUT LOGIC VOLTAGE (V)

ON

0.30

V

0.20

1.0 1.5 2.0 2.5 3.0 3.5 4.0

Figure 18. ON-Pin Threshold vs. V

V

IH

V

IL

SUPPLY VOLTAGE (V)

IN

R

5

T

,

NTE

M

E(°C)

V

C

R

V

,

)

J

,

O

NTE

E

(°C)

V

y

V

y

Typical Performance Characteristics

FPF1107 / FPF1108 — Advance Load Management Switch

1000

s)

µ

t

100

VIN=3.3V C

L

R

L

10

RISE/F ALL TIME (

t

F

1

-40 -15 10 35 60 85

T

, JUNC TION TEMPERATUR E (°C)

J

Figure 19.

Rise and Fall Time vs. Temperature

OUT

at RL=10Ω

120

110

t

s)

100

µ

90

F

t

R

80

70

RIS E/F A L L TIME (

60

50

-40 -15 10 35 60 85

JUNCTION TEMPERATURE(°C

T

Figure 21.

Rise and Fall Time vs. Temperature

OUT

VIN=3.3V C

L

R

L

at RL=500Ω

=0.1μF =10

=0.1μF =500

1000

Ω

s)

µ

100

t

DON

=3.3V

IN

=0.1μF

L

=10

L

Ω

10

ON /OF F DELAYT IME (

t

DOFF

1

-40 -15 10 35 60 8

Figure 20.

JUNCTIO

Turn-On and Turn-Off Delayvs.

OUT

PERATUR

Temperature at RL=10Ω

100

90 80

s)

Ω

µ

70

t

DON

60 50 40 30

ON/OFF DELAYTIME (

20 10

t

DOFF

0

-40 -15 10 35 60 85

Figure 22.

JUN CTI

T

Turn-On and Turn-Off Dela

OUT

MPERATUR

VIN=3.3V C

=0.1μF

L

=500

R

L

Ω

vs. Temperature at RL=500Ω

160

140

120

100

80

60

40

RISE / DELAY TIM E [µs]

20

10 100 1000

OUTPUT LO AD [ ]

Figure 23.

Turn-On and Turn-Off Dela

OUT

vs. Output Load at VIN=3.3V

t

R

t

DON

Typical Performance Characteristics

FPF1107 / FPF1108 — Advance Load Management Switch

Figure 24. Turn-On Response

(VIN=3.3V, CIN=1µF, C

=0.1µF, RL=10Ω)

OUT

Figure 26. Turn-On Response

(VIN=3.3V, CIN=1µF, C

=0.1µF, RL=500Ω)

OUT

Figure 25. Turn-Off Response

(VIN=3.3V, CIN=1µF, C

=0.1µF, RL=10Ω)

OUT

Figure 27. Turn-Off Response

(FPF1107 – No Output Pull-Down Resistor)

(VIN=3.3V, CIN=1µF, C

=0.1µF, RL=500Ω)

OUT

Application Information

FPF1107 / FPF1108 — Advance Load Management Switch

Input Capacitor

The IntelliMAXTM switch doesn’t require input capacitor. To reduce device inrush current effect, a 0.1µF ceramic capacitor, C higher value of C

, is recommended close to the VIN pin. A

IN

can be used to further reduce the

IN

voltage drop experienced as the switch is turned on into a large capacitive load.

Output Capacitor

The IntelliMAXTM switch works without an output capacitor. However, if parasitic board inductance forces

below GND when switching off, a 0.1µF capacitor,

V

OUT

, should be placed between V

C

OUT

and GND.

OUT

Fall Time

Device output fall time can be calculated based on RC constant of external components as follows:

2.2CRt

××=

LLF

where t C

is 90% to 10% fall time, RL is output load and

F

is output capacitor.

L

(1)

The same equation works for a device with a pull-down output resistor, then RL is replaced by a parallel connected pull-down and external output resistor combination, as follows:

RR

×

t

=

F

where t R

=65Ω is output pull-down resistor, and CL is the

PD

PDL

RR

+

PDL

is 90% to 10% fall time, RL is output load,

F

2.2C

××

L

(2)

output capacitor.

Resistive Output Load

If resistive output load is missing, the IntelliMAXTM switch without pull-down output resistor is not discharging output voltage. Output voltage drop depends, in that case, mainly on external device leaks.

Recommended Land Pattern and Layout

FPF1107 / FPF1108 — Advance Load Management Switch

For best thermal performance and minimal inductance and parasitic effects, it is recommended to keep input and output traces short and capacitors as close to the

device as possible. Below is a recommended layout for this device to achieve optimum performance.

Figure 28. Recommended Land Pattern and Layout

Physical Dimensions

FPF1107 / FPF1108 — Advance Load Management Switch

2X

PIN A1 AREA

0.05

0.03 C

E

TOP VIEW

C

D

0.50

2

1

BOTTOM VIEW

F

A

B

D

0.03

2X

0.06 C

0.625

0.539

SEATING PLANE

0.005 CAB

Ø0.315±0.025 4X

B

(Y)±0.018

A

(X)±0.018

0.50

C

(Ø0.250) Cu Pad

(Ø0.350) Solder Mask

RECOMMENDED LAND PATTERN

(NSMD PAD TYPE)

0.332±0.018

0.250±0.025

SIDE VIEWS

NOTES:

A. NO JEDEC REGISTRATION APPLIES.

B. DIMENSIONS ARE IN MILLIMETERS.

F

C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994.

D. DATUM C IS DEFINED BY THE SPHERICAL

CROWNS OF THE BALLS.

E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS

±43 MICRONS (539-625 MICRONS).

F. FOR DIMENSIONS D, E, X, AND Y SEE

PRODUCT DATASHEET.

G. DRAWING FILENAME: MKT-UC004ABrev2.

Figure 29. 4 Ball, 1.0 x 1.0mm Wafer Level Chip Scale WLCSP Packaging

Product-Specific Dimensions

Product D E X Y

FPF1107 960µm ± 30µm 960µm ± 30µm 0.230mm 0.230mm

FPF1108 960um ± 30µm 960um ± 30µm 0.230mm 0.230mm

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/

.

FPF1107 / FPF1108 — Advance Load Management Switch

Datasheet FPF1107, FPF1108 Datasheet (Fairchild) [ru]

Specifications and Main Features

Frequently Asked Questions

User Manual