Page 1
FPF1103 / FPF1104
Advance Load Management Switch
FPF1103 / FPF1104 — Advance Load Management Switch
November 2009
Features
1.2V to 4V Input Voltage Operating Range
Typical R
- 35mΩ at V
- 55mΩ at V
- 85mΩ at V
Slew Rate Control with t
DS(ON)
:
=3.3V
IN
=1.8V
IN
=1.2V
IN
: 65µs
R
Output Discharge Function on FPF1104
Low <1µA Quiescent Current at V
ON=VIN
ESD Protected: Above 4000V HBM, 2000V CDM
GPIO/CMOS-Compatible Enable Circuitry
Applications
Mobile Devices and Smart Phones
Portable Media Devices
Digital Cameras
Advanced Notebook, UMPC, MID
Portable Medical Devices
GPS and Navigation Equipment
Description
The FPF1103/04 are low RDS P-channel MOSFET load
switches of the IntelliMAX™ family. Integrated slew-rate
control prevents inrush current from glitch supply rails
with capacitive loads common in power applications.
The input voltage range operates from 1.2V to 4V to
fulfill today's lowest ultra-portable device supply
requirements. Switch control is by a logic input (ON-pin)
capable of interfacing directly with low-voltage CMOS
control signals and GPIOs in embedded processors.
Ordering Information
Part
Number
FPF1103 Q9 55mΩ CMOS NA
FPF1104 QA 55mΩ CMOS 65Ω
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© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1
Part
Marking
Switch
(Typical)
At 1.8V
IN
Input
Buffer
Output
Discharge
ON Pin
Activity
Active
HIGH
Active
HIGH
t
R
65µs Green
65µs Green
Eco
Status
Package
4-Ball, Wafer-Level ChipScale Package (WLCSP),
1.0 x 1.0mm, 0.5mm Pitch
Page 2
Application Diagram
FPF1103 / FPF1104 — Advance Load Management Switch
C
IN
Notes:
1. C
2. C
=1μF, X5R, 0603, for example Murata GRM185R60J105KE26
IN
=1μF, X5R, 0805, for example Murata GRM216R61A105KA01
OUT
Block Diagram
V
IN
FPF1103/FPF1104
ONOFF ON
GND
Figure 1. Typical Application
V
OUT
C
OUT
To Load
FPF1103/4
Figure 2. Block Diagram (Output Discharge for FPF1104 Only)
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 2
Page 3
A1A
A2A
Pin Configurations
FPF1103 / FPF1104 — Advance Load Management Switch
Figure 3. 1 x 1mm WLCSP Bumps Facing Down Figure 4. 1 x 1mm WLCSP Bumps Facing Up
1
V
ON
IN
B2 B1
V
OUT
GND
Figure 5. Pin Assignments (Top View) Figure 6. Pin Assignments (Bottom View)
B1 B2
2
V
IN
ON
V
GND
OUT
Pin Definitions
Pin # Name Description
A1 V
A2 VIN Supply Input: Input to the Power Switch
B1 GND Ground
B2 ON ON/OFF Control, Active High
Switch Output
OUT
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 3
Page 4
FPF1103 / FPF1104 — Advance Load Management Switch
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol Parameter Min. Max. Unit
VIN VIN, V
ISW Maximum Continuous Switch Current 1.2 A
PD Power Dissipation at TA=25°C 1.0 W
T
Storage Junction Temperature -65 +150 °C
STG
TA Operating Temperature Range -40 +85 °C
ΘJA
ESD Electrostatic Discharge Capability
Thermal Resistance, Junction-to-Ambient
, VON to GND -0.3 4.2 V
OUT
1S2P with 1 Thermal Via 95
1S2P without Thermal Via 187
Human Body Model,
JESD22-A114
Charged Device Model,
JESD22-C101
4
2
°C/W
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol Parameter Min. Max. Unit
VIN Supply Voltage 1.2 4.0 V
TA Ambient Operating Temperature -40 +85 °C
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 4
Page 5
Electrical Characteristics
Unless otherwise noted, VIN=1.2 to 4.0V, TA=-40 to +85°C; typical values are at VIN=3.3V and TA=25°C.
Symbol Parameter Conditions Min. Typ. Max. Units
Basic Operation
VIN Supply Voltage 1.2 4.0 V
I
Off Supply Current VON=GND, V
Q(OFF)
I
Off Switch Current VON=GND, V
SD(OFF)
=0mA, VON=VIN 1
I
IQ Quiescent Current
OUT
I
=0mA, VON < VIN 3
OUT
VIN=3.3V, I
VIN=1.8V, I
RON On-Resistance
VIN=1.5V, I
VIN=1.2V, I
VIN=1.8V, I
RPD Output Discharge R
PULL DOWN
VIN=3.3V, VON=0V, I
T
=25°C, FPF1104
A
VIH ON Input Logic High Voltage VIN=1.2V to 4.0V 1.1 V
VIL ON Input Logic Low Voltage VIN=1.2V to 4.0V 0.35 V
ION ON Input Leakage VON=VIN or GND -1 1 μA
Dynamic Characteristics
t
Turn-On Delay
DON
tR V
t
ON
t
Turn-On Delay
DON
tR V
t
ON
Rise Time
OUT
Turn-On Time
Rise Time
OUT
Turn-On Time
(4)
(4,6)
(4)
(4,6)
=3.3V, RL=10Ω, CL=0.1µF,
(4)
V
IN
T
=25°C
A
=3.3V, RL=500Ω, CL=0.1µF,
(4)
V
IN
T
=25°C
A
FPF1103
t
Turn-Off Delay
DOFF
tF V
t
Turn-Off
OFF
t
Turn-Off Delay
DOFF
tF V
t
Turn-Off
OFF
FPF1104
t
Turn-Off Delay
DOFF
tF V
t
Turn-Off
OFF
t
Turn-Off Delay
DOFF
tF V
t
Turn-Off
OFF
Fall Time
OUT
Fall Time
OUT
(5)
Fall Time
OUT
Fall Time
OUT
(4)
(4)
2.2 μs
(4,7)
4.2 μs
(4)
(4)
110 μs
(4,7)
117 μs
(4)
(4)
1.9 μs
(4,7)
3.9 μs
(4)
(4)
10.6 μs
(4,7)
13.1 μs
=3.3V, RL=10Ω, CL=0.1µF,
V
IN
T
=25°C
A
=3.3V, RL=500Ω, CL=0.1µF,
V
IN
T
=25°C
A
=3.3V, RL=10Ω, CL=0.1µF,
V
IN
R
=65Ω, TA=25°C
PD
=3.3V, RL=500Ω, CL=0.1µF,
V
IN
R
=65Ω, TA=25°C
PD
Notes:
3. This parameter is guaranteed by design and characterization; not production tested.
4. t
DON/tDOFF/tR/tF
are defined in Figure 7.
5. Output discharge path is enabled during off.
=Open, VIN=4V 1 μA
OUT
=GND 1 μA
OUT
=200mA, TA=25°C 35 50
OUT
=200mA, TA=25°C 55 70
OUT
=200mA, TA=25°C 70
OUT
=200mA, TA=25°C 85 150
OUT
=200mA, TA=85°C
OUT
FORCE
=20mA,
(3)
65 100
65 110 Ω
35 μs
65 μs
100 μs
30 50 μs
40 55 μs
70 105 μs
2.0 2.5 μs
7.0 μs
2.0 2.5 μs
2.5 μs
μA
mΩ
FPF1103 / FPF1104 — Advance Load Management Switch
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 5
Page 6
Timing Diagram
V
OUT
FPF1103 / FPF1104 — Advance Load Management Switch
90%
10%
t
R
3.3V
50%
V
ON
t
10%
DON
V
OUT
50%
90%
t
DOFF
10%
t
F
90%
Notes:
6. tON=tR + t
7. t
OFF=tF
+ t
DON
DOFF
.
.
Figure 7. Timing Diagram
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 6
Page 7
μ
μ
(
μ
)
V
Typical Performance Characteristics
FPF1103 / FPF1104 — Advance Load Management Switch
0.30
A)
0.25
μ
0.20
0.15
0.10
SHUTDOWN CURRENT (
0.05
IN
V
0.00
-40 -15 10 35 60 85
T
, JUNCTION TEMPERATURE (°C)
J
VON = V
VIN= 4.0V
VIN = 3.3V
VIN = 1.2V
OUT
= 0V
0.25
μ A)
0.20
0.15
0.10
85°C
SHUTDOWN CURRENT (
0.05
IN
V
0.00
1.0 1.5 2.0 2.5 3.0 3.5 4.0
SUPPLY VOLTAGE (V)
25°C
ON=VOUT
Figure 8. Shutdown Current vs. Temperature Figure 9. Shutdown Current vs. Supply Voltage
0.10
0.09
A)
0.08
μ
0.07
0.06
0.05
0.04
0.03
0.02
OFF SUPPLY CURRENT (
0.01
0.00
-40 -15 10 35 60 85
, JUNCTION TEMPERATURE (°C)
T
J
VIN = 3.3V
VIN = 1.2V
VON= 0V
VIN= 4.0V
0.07
VON = 0V
0.06
A)
0.05
0.04
0.03
85°C
0.02
OFF SUPPLY CURRENT (
0.01
-40°C
25°C
0.00
1.01.52.02.53.03.54.0
SUPPLY VOLTAGE (V)
=0V
-40°C
Figure 10. Off Supply Current vs. Temperature
(FPF1103, V
0.050
0.045
0.040
A)
0.035
0.030
0.025
0.020
0.015
SUPPLY CURRENT (
0.010
0.005
0.000
-40 -15 10 35 60 85
, JUNCTION TEMPERATURE (°C)
T
J
is floating)
OUT
VIN = 3.3V
VON = V
VIN = 4.0V
VIN= 1.2V
Figure 12. Quiescent Current vs. Temperature
(VON=VIN)
IN
Figure 11. Off Supply Current vs. Supply Voltage
(FPF1103, V
0.40
VON = V
IN
1.01.52.02.53.03.54.0
A
SUPPLY CURREN T
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
is Floating)
OUT
-40°C
85°C
SUPPLY VOLTAGE (V)
25°C
Figure 13. Quiescent Current vs. Supply Voltage
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 7
Page 8
μ
L
YVO
)
Typical Performance Characteristics
FPF1103 / FPF1104 — Advance Load Management Switch
3.00
VON = 0.75 x V
2.50
A)
2.00
1.50
1.00
SUPPLY CURRENT (
0.50
0.00
-40 -15 10 35 60 85
, JUNCTION TEMPERATURE (°C)
T
J
VIN = 4.0V
VIN = 3.3V
VIN = 1.2V
Figure 14. Quiescent Current vs. Temperature
(VON=0.75 x VIN)
120
100
)
Ω
80
60
40
ON RESISTANCE (m
20
0
-40 -15 10 35 60 85
T
J
VIN = 1.2V
VIN = 3.3V
VIN = 4.0V
, JUNCTION TEMPERATURE (°C)
VON = V
I
= 200mA
OUT
IN
2.50
2.00
1.50
1.00
0.50
SUPPLY CURRENT(µA)
0.00
1.0 1.5 2.0 2.5 3.0 3.5 4.0
+85°C
-40°C
SUPPLY VOLTAGE (V)
+25°C
Figure 15. Quiescent Current vs. Supply Voltage at
VON=1.2V
IN
300
VON=V
I
250
OUT
200
150
100
ON RESISTAN CE(m )
85°C
25°C
50
0
-40°C
1.0 1.5 2.0 2.5 3.0 3.5 4.0
SUPPLY VOLTAGE (V)
IN
=200mA
Figure 16. RON vs. Temperature Figure 17. RON vs. Supply Voltage
1.00
0.90
0.80
0.70
0.60
0.50
0.40
INPUT LO GIC VOLTAGE (V)
ON
V
0.30
0.20
1.0 1 .5 2.0 2 .5 3 .0 3.5 4.0
Figure 18. ON-Pin Threshold vs. VIN
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 8
SUPP
V
IH
V
IL
LTAGE(V
Page 9
-
-
T
C
T
T
t
t
V
=
=
1
5
T
J
A
T
t
t
V
N
3
0
4
5
T
J
)
T
µ
VIN=
3.3
L
=
0.1
=500
T
C
T
N
=
=
=
Typical Performance Characteristics
FPF1103 / FPF1104 — Advance Load Management Switch
10
1
IME (µ s)
RISE/FALL
1
Figure 19. V
60
50
s)
0
IME (
30
C
µF
R
-40 -1
RISE/FALL
20
10
R
F
=3.3
IN
C
0.1µ
L
R
10
L
151368
JUN
IO NTEMPERATURE (°C)
J
Rise and Fall Time vs. Temperature
OUT
at RL=10Ω
t
R
t
F
10 35 60 85
JUNCTIONTEMPERATURE(°C
100
DON
10
ON/OFF DELAYTIME (µs)
-40 -1
DOFF
10 35 60 85
JUNCTIONTEMPER
Figure 20. V
Turn-On and Turn-Off Delay vs.
OUT
Temperature at RL=10Ω
60
50
40
30
20
10
ON/OFF DELAY TIME (µs)
0
-40 -50 10 35 60
JUN
J
t
DON
t
DOFF
IO NTEMPERATURE (°C)
CL=0.1µF
R
URE (°C)
V
I
C
L
R
L
=3.
I
=10
L
3.3
0.1µF
500
5
Figure 21. V
90
80
70
60
50
40
30
RISE/DELAY TIME (μ s)
20
10
0
10 100 1000
Figure 23. tR/t
Rise and Fall Time vs. Temperature
OUT
at RL=500Ω
t
R
t
DON
R
OUTPUT LOAD (Ω )
LOAD
vs. Output Load at VIN=3.3V
DON
Figure 22. V
Turn-On and Turn-Off Delay vs.
OUT
Temperature at RL=500Ω
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 9
Page 10
Typical Performance Characteristics
FPF1103 / FPF1104 — Advance Load Management Switch
(VIN=3.3V, CIN=1µF, C
(VIN=3.3V, CIN=1µF, C
Figure 24. Turn-On Response
=0.1µF, RL=10Ω)
OUT
Figure 26. Turn-On Response
=0.1µF, RL=500Ω)
OUT
Figure 25. Turn-Off Response
(VIN=3.3V, CIN=1µF, C
OUT
Figure 27. Turn-Off Response
(VIN=3.3V, CIN=1µF, C
OUT
=0.1µF, RL=10Ω)
=0.1µF, RL=500Ω)
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 10
Page 11
Application Information
FPF1103 / FPF1104 — Advance Load Management Switch
Input Capacitor
An IntelliMAXTM switch doesn’t require an input
capacitor. To reduce device inrush current effect, a
0.1µF ceramic capacitor, C
the VIN pin. A higher value of C
, is recommended close to
IN
can be used to further
IN
reduce the voltage drop experienced as the switch is
turned on into a large capacitive load.
Output Capacitor
An IntelliMAXTM switch works without an output
capacitor. However, if parasitic board inductance forces
V
below GND when switching off, a 0.1µF capacitor,
OUT
C
, should be placed between V
OUT
and GND.
OUT
Fall Time
Device output fall time can be calculated based on RC
constant of the external components as follows:
2.2CRt
××=
LLF
where t
C
is 90% to 10% fall time, RL is output load, and
F
is output capacitor.
L
(1)
The same equation works for a device with a pull-down
output resistor. R
is replaced by a parallel connected
L
pull-down and an external output resistor combination,
as follows:
RR
×
t
=
F
PDL
RR
+
PDL
2.2C
××
L
(2)
where tF is 90% to 10% fall time, RL is output load,
R
=65Ω.is output pull-down resistor, and CL is the
PD
output capacitor.
Resistive Output Load
If resistive output load is missing, the IntelliMAXTM
switch without a pull-down output resistor is not
discharging the output voltage. Output voltage drop
depends, in that case, mainly on external device leaks.
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 11
Page 12
Recommended Land Pattern and Layout
For best thermal performance and minimal
inductance and parasitic effects, it is recommended
to keep input and output traces short and capacitors
FPF1103 / FPF1104 — Advance Load Management Switch
as close to the device as possible. Below is a
recommended layout for this device to achieve
optimum performance.
Figure 28. Recommended Land Pattern and Layout
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 12
Page 13
Physical Dimensions
FPF1103 / FPF1104 — Advance Load Management Switch
Figure 29. 4 Ball, 1.0 x 1.0mm Wafer-Level Chip-Scale Packaging (WLCSP)
Product-Specific Dimensions
Product D E X Y
FPF1103 960µm ± 30µm 960µm ± 30µm 0.230mm 0.230mm
FPF1104 960um ± 30µm 960um ± 30µm 0.230mm 0.230mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Pl ease note the revision and/or date on t he drawing and contact a Fairchild Semiconductor representative t o verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsem i.com/p ackagi ng/
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 13
.
Page 14
FPF1103 / FPF1104 — Advance Load Management Switch
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1103 / FPF1104 • Rev. 1.0.1 14
Page 15
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