Datasheet FPF1004, FPF1003 Datasheet (Fairchild Semiconductor)

Page 1
tm
April 2007
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
1.2 to 5.5V Input Voltage Range
R
R
ESD Protected, above 2000V HBM
= 30 m @ VIN = 5.5V
DS(ON)
= 35 m @ VIN = 3.3V
DS(ON)
Applications
PDAs
Cell Phones
GPS Devices
MP3 Players
Digital Cameras
Peripheral Ports
Hot Swap Supplies
RoHS Compliant
ON
ON
GND
GND
General Description
The FPF1003 & FPF1004 are low RDS P-Channel MOSFET load switches with controlled turn-on. The input voltage range operates from 1.2V to 5.5V to fulfill today's Ultra Portable Device's supply requirement. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. In FPF1004, 120 on-chip load resistor is added for output quick discharge when switch is turned off.
Both FPF1003 & FPF1004 are available in a space-saving
1.0x1.5 mm
Pin 1
V
V
IN
IN
V
V
V
IN
IN
V
OUT
OUT
V
V
OUT
OUT
2
chip scale package, 1.0X1.5CSP-6.
BOTTOM
TOP
Typical Application Circuit
TO LOAD
V
IN
V
OUT
FPF1003/4
-
OFF ON ON
GND
Ordering Information
Part Switch Input buffer Output Discharge ON Pin Activity Top Mark
FPF1003 30m, PMOS Schmitt NA Active HI 3
FPF1004 30m, PMOS Schmitt 120 Active HI 4
©2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FPF1003-FPF1004 Rev. H
Page 2
Functional Block Diagram
V
IN
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
Turn-On Slew Rate Controlled Driver
ON
Pin Configuration
CONTROL
LOGIC
ESD protection
FPF1003/4
A2
A1
Output Discharge (Optional)
GND
V
OUT
Pin Description
Pin Name Function
A2, B2 V
C2 ON ON Control Input
A1, B1 V
C1 GND Ground
FPF1003-FPF1004 Rev. H
IN
OUT
B2
1.0 x 1.5 CSP Bottom View
Supply Input: Input to the power switch and the supply voltage for the IC
Switch Output: Output of the power switch
B1
C1C2
2 www.fairchildsemi.com
Page 3
Absolute Maximum Ratings
Parameter Min Max Unit
VIN, V
Power Dissipation @ T
Maximum Continuous Switch Current 2.0 A
Operating Temperature Range -40 125 °C
Storage Temperature -65 150 °C
Thermal Resistance, Junction to Ambient 85 °C/W
Electrostatic Discharge Protection HBM 2000 V
, ON to GND -0.3 6 V
OUT
= 25°C (Note 1) 1.2 W
A
MM 200 V
Recommended Operating Range
Parameter Min Max Unit
V
IN
Ambient Operating Temperature, T
A
1.2 5.5 V
-40 85 °C
Electrical Characteristics
VIN = 1.2 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C.
Parameter Symbol Conditions Min Typ Max Units
Basic Operation
Operating Voltage V
Quiescent Current I
Off Supply Current I
Off Switch Current I
IN
Q
Q(off)
SD(off)
I
= 0mA, VIN = Von 1 µA
OUT
VON = GND, OUT = open 1 µA
VON = GND, V
= GND, V
V
ON
= 0 @ VIN = 5.5V, TA = 85°C 1 µA
OUT
OUT
= 0 @ V
= 3.3V, TA = 25°C 10 100 nA
IN
VIN = 5.5V, TA = 25°C 20 30
= 3.3V, TA = 25°C 25 35
V
On-Resistance R
Output Pull Down Resistance R
ON Input Logic High Voltage V
ON Input Logic Low Voltage V
ON
PD
IH
IL
ON Input Leakage V
IN
= 1.5V, TA = 25°C 50 75
V
IN
= 1.2V, TA = 25°C 95 150
V
IN
VIN = 3.3V, VON = 0V, TA = 25°C, FPF1004 75 120
VIN = 2.7V to 5.5V 2
= 1.2V 0.8
V
IN
VIN = 2.7V to 5.5V 0.8
= 1.2V 0.35
V
IN
= VIN or GND 1 µA
ON
Dynamic
Turn on delay t
VIN = 3.3V, RL = 500Ω, CL = 0.1uF, TA = 25°C 13 µs
ON
VIN = 3.3V, RL = 500Ω, CL = 0.1uF, T
= 25°C, FPF1003
Turn off delay t
V
Rise Time t
OUT
OFF
A
V
= 3.3V, RL = 500Ω, CL = 0.1uF,
IN
R
= 120, TA = 25°C, FPF1004
L_CHIP
VIN = 3.3V, RL = 500Ω, CL = 0.1uF,
R
T
= 25°C
A
VIN = 3.3V, RL = 500Ω, CL = 0.1uF, T
= 25°C, FPF1003
V
Fall Time t
OUT
A
F
V
= 3.3V, RL = 500Ω, CL = 0.1uF,
IN
R
= 120, TA = 25°C, FPF1004
L_CHIP
Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board.
1.2 5.5 V
m
45 µs
15 µs
13 µs
113 µs
10 µs
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
V
V
FPF1003-FPF1004 Rev. H
3 www.fairchildsemi.com
Page 4
Typical Characteristics
0
6
V
6
)
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
10
8
6
4
SUPPLY CURRENT (nA)
2
0
1234567891
SUPPLY VOLTAGE (V)
Figure 1. Quiescent Current vs.V
16
14
12
10
8
6
4
SUPPLY CURRENT (nA)
2
0
-40 -15 10 35 60 85
, JUNCT ION TEMPERATURE (oC)
T
J
VON = V
IN
VON = 0V
IN
VIN = 5.5V
VIN = 3.3V
2.5
2.0
1.5
1.0
ON THRESHOLD (V)
0.5
0.0 12345
Figure 2. ON Threshold vs. V
10
8
6
4
SUPPLY CURRENT (nA)
2
0
-40 -15 10 35 60 85
T
MAX LIMIT
TYPICAL
SUPPLY VOLTAGE (V)
IN
VIN = 5.5V
, JUNCTION TEMPERATURE (oC)
J
VIN = 3.3V
Figure 3. Quiescent Current vs. Temperature Figure 4. Quiescent Current (off) vs. Temperature
1600
1400
1200
1000
800
600
400
SUPPLY CURRENT (nA)
200
0
-50 -25 0 25 50 75 100
Figure 5. I
T
, JUNCTI ON TEMPERATURE (oC)
J
SWITCH-OFF
Current vs. Temperature Figure 6. I
V
= 5.5
IN
VIN = 3.3V
FPF1003-FPF1004 Rev. H
160
140
120
100
80
60
40
SUPPLY CURRENT ( nA)
20
0
12345
SUPPLY VOLTAGE (V
SWITCH-OFF
Current vs. V
IN
4 www.fairchildsemi.com
Page 5
Typical Characteristics
7
)
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
250
I
= 1A
OUT
200
150
100
ON RESISTANCE (mOhms)
50
0
0123456
Figure 7. R
100
SUPPLY VOLTAGE (V
FPF1003 T
OFF
ON
vs. V
IN
VIN = 3.3V
R
= 500Ω
L
R
= 120Ω, FPF1004
L_CHIP
C
= 0.1uF
L
1.5
VIN = 3.3V
I
= 1A
OUT
1.3
1.1
, (mOhms)
0.9
ON NORMALIZE D
R
0.7
0.5
-50 -25 0 25 50 75 100
, JUNCTION TEMPERATURE (oC)
T
J
Figure 8. RON vs. Temperature
1000
100
FPF1003 T
FALL
VIN = 3.3V
R
= 500Ω
L
R
= 120Ω, FPF1004
L_CHIP
C
= 0.1uF
L
FPF1004 T
TURN ON/OFF TIME (uS)
10
-50-250 255075100
Figure 9. T
V 2V/DIV
I 10mA/DIV
V 2V/DIV
ON
OUT
OUT
OFF
T
ON
, JUNCTION TEMPERATURE (oC)
T
J
vs. Temperature Figure 10. T
ON/TOff
VIN=3.3V C
IN
C
OUT
R
=500
L
=1µF
=0.1µF
T
RISE
10
RISE / FALL TIME (uS)
1
-50-250 255075100
V 2V/DIV
I
OUT
10mA/DIV
V
ON
OUT
FPF1004 T
VIN=3.3V C
=1µF
IN
C
OUT
R
=500
L
FALL
, JUNCTION TEMPERATURE (oC)
T
J
RISE/TFALL
vs. Temperature
=0.1µF
2V/DIV
Figure 11. FPF1003 T
FPF1003-FPF1004 Rev. H
50µs/DIV 50µs/DIV
Response Figure 12. FPF1003 T
ON
Response
OFF
5 www.fairchildsemi.com
Page 6
Typical Characteristics
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
V 2V/DIV
I
ON
OUT
200mA/DIV
V 2V/DIV
OUT
Figure 13. FPF1003 T
V 2V/DIV
I 10mA/DIV
ON
OUT
VIN=3.3V C
=1µF
IN
C
=0.1µF
OUT
R
=10
L
V 2V/DIV
I
ON
OUT
VIN=3.3V C
=1µF
IN
C
=0.1µF
OUT
R
=10
L
200mA/DIV
V 2V/DIV
OUT
50µs/DIV 2µs/DIV
Response Figure 14. FPF1003 T
ON
VIN=3.3V C
=1µF
IN
C
=0.1µF
OUT
R
=500
L
V 2V/DIV
I
ON
OUT
VIN=3.3V C
=1µF
IN
C
=0.1µF
OUT
R
=500
L
10mA/DIV
Response
OFF
V 2V/DIV
OUT
50µs/DIV
Figure 15. FPF1004 T
V 2V/DIV
I 200mA/DIV
V 2V/DIV
ON
OUT
VIN=3.3V C
=1µF
IN
C
=0.1µF
OUT
R
OUT
=10
L
50µs/DIV
Figure 17. FPF1004 T
V 2V/DIV
OUT
50µs/DIV
Response Figure 16. FPF1004 T
ON
V 2V/DIV
I
ON
OUT
200mA/DIV
V 2V/DIV
Response Figure 18. FPF1004 T
ON
OUT
2µs/DIV
Response
OFF
VIN=3.3V C C R
Response
OFF
=1µF
IN
OUT
=10
L
=0.1µF
FPF1003-FPF1004 Rev. H
6 www.fairchildsemi.com
Page 7
Description of Operation
The FPF1003 & FPF1004 are low R switches with controlled turn-on. The core of each device is a 30m P-Channel MOSFET and a controller capable of functioning over a wide input operating range of 1.2-5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. In FPF1004, 120 on-chip load resistor is added for output quick discharge when switch is turned off.
P-Channel load
DS(ON)
Application Information
Typical Application
V
IN
V
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
TO LOAD
OUT
Battery
1.2V-5.5V
OFF ON ON
-
C1 = 1µF
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between V close to the pins is usually sufficient. Higher values of C
and GND. A 1µF ceramic capacitor, CIN, placed
IN
IN
can
be used to further reduce the voltage drop.
Output Capacitor
A 0.1µF capacitor, C GND. This capacitor will prevent parasitic board inductance from forcing V the integral body diode in the PMOS switch, a C C
is highly recommended. A C
OUT
cause V This could result in current flow through the body diode from V
to VIN.
OUT
OUT
to exceed VIN when the system supply is removed.
OUT
, should be placed between V
OUT
OUT
and
below GND when the switch turns-off. Due to
greater than
IN
greater than CIN can
OUT
FPF1003/4
GND
C2 = 0.1µF
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for V minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance.
, V
IN
and GND will help
OUT
R1 = 499
FPF1003-FPF1004 Rev. H
7 www.fairchildsemi.com
Page 8
Dimensional Outline and Pad Layout
)
)
1.0 ± 0.10
1.0 ± 0.10
INDEX
INDEX
INDEX
SLOT
SLOT
SLOT
1.0 ± 0.10
1.50 ± 0.10
1.50 ± 0.10
1.50 ± 0.10
OUT
OUT
OUT
Ø0.25
Ø0.25
Ø0.25
GND
GND
GND
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
IN
IN
0.50
0.50
0.50
IN
ON
ON
ON
1.00
1.00
1.00
2
2
0.50
0.50
0.50
2
1
1
1
A
A
A
B
B
B
C
C
C
0.65 M AX
0.65 M AX
0.65 M AX
0.28
0.28
0.28
0.28
0.22
0.22
0.22
0.22
TOP VIEW
TOP VIEW
SIDE VIEW
SIDE VIEW
SOLDER
SOLDER
SOLDER BALL
BALL
BALL
Ø0.30
Ø0.30
Ø0.30
Ø0.30
RECOMM ENDED
RECOMM ENDED
LAND PATTERN
LAND PATTERN
A
A
A
A
B
B
B
B
C
C
C
C
BOTTOM VIEW
BOTTOM VIEW
BOTTOM VIEW
0.50
0.50
0.50
0.50
12
12
12
12
0.50
0.50
0.50
0.50
IN D E X
IN D E X
IN D E X
IN D E X
SLOT
SLOT
SLOT
SLOT
1.00
1.00
1.00
1.00
FPF1003-FPF1004 Rev. H
NOTES:
NOTES:
ALL DIM EN SIO NS AR E IN M ILLIM ETE R S .
ALL DIM EN SIO NS AR E IN M ILLIM ETE R S .
A
A
8 www.fairchildsemi.com
Page 9
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
®
ACEx Across the board. Around the world.™ ActiveArray™ Bottomless™ Build it Now™ CoolFET™ CROSSVOLT™ CTL™ Current Transfer Logic™ DOME™
2
E
CMOS™
EcoSPARK
®
EnSigna™ FACT Quiet Series™
®
FACT
®
FAST FASTr™ FPS™
®
FRFET GlobalOptoisolator™
GTO™ HiSeC™ i-Lo™ ImpliedDisconnect™ IntelliMAX™ ISOPLANAR™ MICROCOUPLER™ MicroPak™ MICROWIRE™ Motion-SPM™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC OPTOPLANAR
®
®
PACMAN™ PDP-SPM™ POP™ Power220
®
Power247 PowerEdge™ PowerSaver™ Power-SPM™ PowerTrench Programmable Active Droop™ QFET QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ ScalarPump™ SMART START™ SPM STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8
®
®
®
SyncFET™ TCM™ The Power Franchise
TinyBoost™ TinyBuck™ TinyLogic
®
®
TINYOPTO™ TinyPower™ TinyWire™ TruTranslation™ µSerDes™
®
UHC
®
UniFET™ VCX™ Wire™
FPF1003-FPF1004 IntelliMAX™ Advanced Load Management Products
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In Design
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data; supplementary data will be
Preliminary First Production
published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
No Identification Needed Full Production
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.
This datasheet contains specifications on a product that has been
Obsolete Not In Production
discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I26
FPF1003-FPF1004 Rev. H
9 www.fairchildsemi.com
Loading...