Datasheet FDC6325L Datasheet (Fairchild Semiconductor)

Page 1
FDC6325L Integrated Load Switch
General Description Features
This device is particularly suited for compact power management in portable electronic equipment where
2.5V to 8V input and 1.8A output current capability are needed. This load switch integrates a small N-Channel power MOSFET (Q1) which drives a large P-Channel power MOSFET (Q2) in one tiny SuperSOTTM-6 package.
V
DROP
V
DROP
V
DROP
SuperSOTTM-6 package design using copper lead frame for superior thermal and electrical capabilities.
=0.2V @ VIN=5V, IL=1.5A. R =0.2V @ VIN=3.3V, IL=1.2A. R =0.2V @ VIN=2.5V, IL=1A. R
August 1998
= 0.13
(ON)
= 0.16
(ON)
= 0.18Ω.
(ON)
SOT-23
SuperSOTTM-6
SuperSOTTM-8
SO-8
SOT-223
SOIC-16
IN
ON/OFF
EQUIVALENT CIRCUIT
V
DROP
+
-
Vout,C1
Q1
3
2
1
Vout,C1
R2
.325
1
pin
SuperSOT -6
Absolute Maximum Ratings T
TM
Vin,R1
4
ON/OFF
= 25°C unless otherwise noted
R1,C1
5
6
See Application Circuit
Q2
Symbol Parameter FDC6325L Units
V V I
L
IN
ON/OFF
Input Voltage Range 2.5 - 8 V On/Off Voltage Range 1.5 - 8 V Load Current - Continuous (Note 1) 1.8 A
- Pulsed (Note 1 & 3) 5
P
D
TJ,T ESD Electrostatic Discharge Rating MIL-STD-883D Human Body
Maximum Power Dissipation (Note 2) 0.7 W Operating and Storage Temperature Range -55 to 150 °C
STG
6 kV
Model (100pf/1500Ohm)
THERMAL CHARACTERISTICS
R
θJA
R
θJC
Thermal Resistance, Junction-to-Ambient (Note 2) 180 °C/W Thermal Resistance, Junction-to-Case (Note 2) 60 °C/W
OUT
© 1998 Fairchild Semiconductor Corporation
FDC6325L Rev.D1
Page 2
Electrical Characteristics (T
= 25°C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS
I
FL
Forward Leakage Current VIN = 8 V, V
= 0 V 1 µA
ON/OFF
ON CHARACTERISTICS (Note 3)
V
DROP
R
(ON)
Conduction Voltage Drop
VIN = 5 V, V VIN = 3.3 V, V VIN = 2.5 V, V
= 3.3 V, IL = 1.5 A
ON/OFF
= 3.3 V, IL = 1.2 A
ON/OFF
= 3.3 V, IL = 1 A
ON/OFF
Q2 - Static On-Resistance VGS = -5 V, ID = -1.8 A
VGS = -3.3 V, ID = -1.6 A VGS = -2.5 V, ID = -1.5 A
I
L
Notes:
1. VIN=8V, V
2. R of the drain pins. R
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
Load Current
=8V, TA=25oC
ON/OFF
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface
JA
θ
is guaranteed by design while R
JC
θ
is determined by the user's board design.
CA
θ
V
= 0.13 V, VIN = 5 V, V
DROP
V
= 0.16 V, VIN = 3.3 V, V
DROP
V
= 0.2 V, VIN = 2.5V, V
DROP
ON/OFF
ON/OFF
ON/OFF
= 3.3 V
= 3.3 V
= 3.3 V
0.15 0.2 V
0.145 0.2
0.13 0.2
0.115 0.13
0.13 0.16
0.155 0.18 1 A 1 1
FDC6325L Load Switch Application
APPLICATION CIRCUIT
Q2
IN OUT
C1
LOAD
Co
ON/OFF
Ci
R1
Q1
R2
External Component Recommendation
For Co £ 1uF applications: First select R2, 100 - 1kW, for Slew Rate control. C1 £ 1000pF can be added in addition to R2 for further In-rush current control. Then select R1 such that R1/R2 ratio maintains between 10 - 100. R1 is required to turn Q2 off. For SPICE simulation, users can download a "FDC6325L.MOD" Spice model from Fairchild Web Site at www.fairchildsemi.com
FDC6325L Rev.D1
Page 3
Typical Electrical Characteristics (T
= 25 OC unless otherwise noted )
A
0.5
0.4
0.3
DROP
0.2
V , (V)
0.1
0
0 1 2 3 4
T = 125°C
A
I ,(A)
L
T =25°C
A
V = 5V
IN ON/OFF
V = 1.5 - 8V PW =300us, D≤ 2%
Figure 1. Conduction Voltage Drop
Variation with Load Current.
0.5
T = 125°C
0.4
0.3
DROP
0.2
V , (V)
0.1
0
0 1 2 3 4
A
T =25°C
A
V =2.5V
IN
ON/OFF
V = 1.5 - 8V PW =300us, D≤ 2%
I ,(A)
L
0.5
0.4
0.3
DROP
0.2
V , (V)
0.1
0
0 1 2 3 4
T = 125°C
A
I ,(A)
L
T =25°C
A
V =3.3V
IN ON/OFF
V = 1.5 - 8V PW =300us, D≤ 2%
Figure 2. Conduction Voltage Drop
Variation with Load Current.
0.6
0.5
0.4
ON
0.3
0.2
DROP
V ,(V) / R ,(Ohm)
0.1
0
1 2 3 4 5
V ,(V)
IN
T =125°C
A
T = 25°C
A
I = 1A
L
V = 1.5 - 8V
ON/OFF
PW =300us, D≤ 2%
Figure 3. Conduction Voltage Drop
Variation with Load Current.
Figure 4. On-Resistance Variation
with Input Voltage.
1
D = 0.5
0.5
R (t) = r(t) * R
JA
0.2
0.1
0.05
0.02
r(t), NORMALIZED EFFECTIVE
0.01
TRANSIENT THERMAL RESISTANCE
0.005
0.2
0.1
0.05
0.02
0.01 Single Pulse
θ
R = See Note 2
JA
θ
P(pk)
t
1
t
2
T - T = P * R (t)
J
Duty Cycle, D = t / t
JAA
θ
1
0.00001 0.0001 0.001 0.01 0.1 1 10 100 300 t , TIME (sec)
1
Figure 5. Transient Thermal Response Curve.
Thermal characterization performed on the conditions described in Note 2. Transient thermal response will change depends on the circuit board design.
JA
θ
2
FDC6325L Rev.D1
Page 4
SuperSOT-6 (FS PKG Code 31, 33)
[
]
1 : 1
Scale 1:1 on letter size paper
Dimens i ons sho w n below ar e in:
Part Weight per unit (gram): 0.0158
inches
millimeters
1998 Fairchild Semiconductor Corporation
9/98 Rev A
Page 5
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACEx™ CoolFET™ CROSSVOLT™ E2CMOS
TM
FACT™ FACT Quiet Series™
®
FAST FASTr™ GTO™ HiSeC™
ISOPLANAR™ MICROWIRE™ POP™ PowerTrench™ QS™ Quite Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 TinyLogic™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The data sheet is printed for reference information only.
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