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DS14C241
Single Supply TIA/EIA-2324x5Driver/Receiver
General Description
The DS14C241 is four driver,fivereceiverdevicewhichconforms totheTIA/EIA-232-Estandard and CCITT V.28recommendations. This device eliminates
±
12V supplies by employing an internal DC–DC converter to generate the
necessary output levels from a single +5V supply. Driver
slew rate control and receiver noise filtering have also been
internalized to eliminate the need for external slew rate control and noise filtering capacitors. With the addition of TRISTATE
®
receiver outputs and a shutdown mode, device
power consumption is kept to a minimum.
Features
n Conforms to TIA/EIA-232-E and CCITT V.28
n Internal DC–DC converter
n Operates with single +5V supply
n Low power requirement— I
CC
10 mA max
n Shutdown mode—I
CX
10 µA max
n Internal driver slew rate control
n Receiver noise filtering
n Operates above 120 kbits/sec
n TRI-STATE receiver outputs
n Direct replacement for MAX241
Connection Diagram Functional Diagram
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
DS011281-1
Order Number DS14C241WM
See NS Package Number M28B
DS011281-2
May 1998
DS14C241 Single Supply TIA/EIA-2324x5Driver/Receiver
© 1998 National Semiconductor Corporation DS011281 www.national.com
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +6V
V
+
Pin (VCC− 0.3V) to +15V
V
−
Pin +0.3V to −15V
Driver Input Voltage −0.3V to (V
CC
+ 0.3V)
Driver Output Voltage (V
+
+ 0.3V) to (V−− 0.3V)
Receiver Input Voltage
±
30V
Receiver Output Voltage −0.3V to (V
CC
+ 0.3V)
Junction Temperature +150˚C
Maximum Package Power Dissipation
@
+25˚C (Note 6)
WM Package 1520 mW
Storage Temperature Range −65˚C to +150˚C
Lead Temperature (Soldering, 4
sec.) +260˚C
Short Circuit Duration (D
OUT
) continuous
ESD Rating (HBM, 1.5 kΩ, 100
pF) ≥ 2.0 kV
Recommended Operating
Conditions
Min Max Units
Supply Voltage (V
CC
) 4.5 5.5 V
Operating Free Air Temp. (T
A
)
DS14C241 0 +70 ˚C
Electrical Characteristics (Note 2)
Over recommended operating conditions, unless otherwise specified
Symbol Parameter Conditions Min Typ Max Units
DEVICE CHARACTERISTICS
V
+
Positive Power Supply RL=3kΩ, C1–C4 = 1.0 µF, DIN= 0.8V 9.0 V
V
−
Negative Power Supply RL=3kΩ, C1–C4 = 1.0 µF, DIN= 2.0V −8.0 V
I
CC
Supply Current (VCC) No Load 8.5 10 mA
I
CX
Supply Current Shutdown RL=3kΩ,SD=V
CC
1.0 10 µA
V
IH
High Level Enable Voltage SD 2.4 V
CC
V
V
IL
Low Level Enable Voltage GND 0.8 V
I
IH
High Level Enable Current −10 +10 µA
I
IL
Low Level Enable Current −10 +10 µA
DRIVER CHARACTERISTICS
V
IH
High Level Input Voltage D
IN
2.0 V
CC
V
V
IL
Low Level Input Voltage GND 0.8 V
I
IH
High Level Input Current VIN≥ 2.0V −10 +10 µA
I
IL
Low Level Input Current VIN≤ 0.8V −10 +10 µA
V
OH
High Level Output Voltage RL=3kΩ 5.0 7.5 V
V
OL
Low Level Output Voltage −6.5 −5.0 V
I
OS
+ Output High Short Circuit Current VO= 0V, VIN= 0.8V −30 −15 −5.0 mA
I
OS
− Output Low Short Circuit Current VO= 0V, VIN= 2.0V 5.0 12 30 mA
R
O
Output Resistance −2V ≤ VO≤ +2V, VCC= GND = 0V 300 Ω
RECEIVER CHARACTERISTICS
V
TH
Input High Threshold Voltage 1.9 2.4 V
V
TL
Input Low Threshold Voltage 0.8 1.5 V
V
HY
Hysteresis 0.2 0.4 1.0 V
R
IN
Input Resistance 3.0 4.5 7.0 kΩ
I
IN
Input Current VIN= +15V 2.14 3.8 5.0 mA
V
IN
= +3V 0.43 0.6 1.0 mA
V
IN
= −3V −1.0 −0.6 −0.43 mA
V
IN
= −15V −5.0 −3.8 −2.14 mA
V
OH
High Level Output Voltage VIN= −3V, IO= −3.2 mA 3.5 4.6 V
V
IN
= −3V, IO= −20 µA 4.0 4.9 V
V
OL
Low Level Output Voltage VIN= +3V, IO= +2.0 mA 0.25 0.4 V
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Electrical Characteristics (Note 2) (Continued)
Over recommended operating conditions, unless otherwise specified
Symbol Parameter Conditions Min Typ Max Units
RECEIVER CHARACTERISTICS
V
IH
High Level Input Voltage EN 2.0 V
CC
V
V
IL
Low Level Input Voltage GND 0.8 V
I
IH
High Level Input Current VIN≥ 2.0V −10 +10 µA
I
IL
Low Level Input Current VIN≤ 0.8V −10 +10 µA
I
OZ
Output Leakage Current EN = VCC,0V≤R
OUT
≤ V
CC
−10 +10 µA
Switching Characteristics (Note 4)
Over recommended operating conditions, unless otherwise specified
Symbol Parameter Conditions Min Typ Max Units
DRIVER CHARACTERISTICS
t
PLH
Propagation Delay LOW to HIGH RL=3kΩ 0.7 4.0 µs
t
PHL
Propagation Delay HIGH to LOW CL= 50 pF 0.6 4.0 µs
t
SK
Skew |t
PLH–tPHL
|(
Figures 1, 2
) 0.1 1.0 µs
SR1 Output Slew Rate R
L
=3kΩto7kΩ,CL= 50 pF 4.0 15 30 V/µs
SR2 Output Slew Rate R
L
=3kΩ,CL= 2500 pF 3.0 5.0 V/µs
RECEIVER CHARACTERISTICS
t
PLH
Propagation Delay LOW to HIGH Input Pulse Width>10 µs
C
L
=50pF
(
Figures 3, 4
)
2.0 6.5 µs
t
PHL
Propagation Delay HIGH to LOW 2.8 6.5 µs
t
SK
Skew |t
PLH–tPHL
| 0.8 2.0 µs
t
PLZ
(
Figures 5, 7
) 0.1 2.0 µs
t
PZL
0.6 2.0 µs
t
PHZ
(
Figures 5, 6
) 0.2 2.0 µs
t
PZH
0.6 2.0 µs
t
NW
Noise Pulse Width Rejected (
Figures 3, 4
) 2.5 1.0 µs
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Currentinto device pins is defined as positive. Current out of device pins is defined as negative.All voltages are referenced to ground unless otherwise specified.
Note 3: I
OS
+ and IOS− values are for one output at a time. If more than one output is shorted simultaneously, the device power dissipation may be exceeded.
Note 4: Receiver AC input waveform for test purposes: t
r=tf
= 200 ns, VIH=3V,VIL=−3V,f=64kHz(128 kbits/sec). Driver AC input waveform for test purposes:
t
r=tf
≤10 ns, VIH=3V,VIL=0V,f=64kHz(128 kbits/sec).
Note 5: All typicals are given for V
CC
= 5.0V and TA= +25˚C.
Note 6: Ratings apply to ambient temperature at +25˚C. Above this temperature derate: WM package 14.3 mW/˚C.
Parameter Measurement Information
DS011281-4
FIGURE 1. Driver Load Circuit
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Parameter Measurement Information (Continued)
DS011281-5
FIGURE 2. Driver Switching Waveform
DS011281-6
FIGURE 3. Receiver Load Circuit
DS011281-7
FIGURE 4. Receiver Propagation Delays and Noise Rejection
DS011281-8
FIGURE 5. Receiver Disable Load Circuit
DS011281-9
FIGURE 6. Receiver TRI-STATE Timing (t
PHZ,tPZH
)
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Parameter Measurement Information (Continued)
Pin Descriptions
VCC(pin 11) —Power supply pin for the device,
+5V (
±
10%).
V
+
(pin 13) —Positive supply for TIA/EIA-232-E drivers.
Recommended external capacitor: C4 = 1.0 µF (6.3V). This
supply is not intended to be loaded externally.
V
−
(pin 17) —Negative supply for TIA/EIA-232-E drivers.
Recommended external capacitor: C3 = 1.0 µF (16V). This
supply is not intended to be loaded externally.
C1
+
,C1−(pins 12 and 14) — External capacitor connection
pins. Recommended capacitor— 1.0 µF (6.3V).
C2
+
,C2−(pins 15 and 16) — External capacitor connection
pins. Recommended capacitor— 1.0 µF (16V).
EN (pin 24) — Controls the Receiver output TRI-STATECir-
cuit. A HIGH level on this pin will disable the Receiver Output.
SHUTDOWN (SD) (pin 25) — A High on the SHUTDOWN
pin will lower the total I
CC
current to less than 10 µA. Provid-
ing a low power state.
D
IN
1–4 (pins 7, 6, 20 and 21) —Driver input pins are TTL/
CMOS compatible. Inputs of unused drivers may be left
open, an internal pull-up resistor (500 kΩ minimum, typically
5MΩ) pulls input to V
CC
. Output will be LOW for open inputs.
D
OUT
1–4 (pins 2, 3, 1 and 28) — Driver output pins con-
form to TIA/EIA-232-E levels.
R
IN
1–5 (pins 9, 4, 27, 23 and 18) — Receiver input pins ac-
cept TIA/EIA-232-E input voltages (
±
15V). Receivers feature a noise filter and guaranteed hysteresis of 200 mV. Unused receiver input pins may be left open. Internal input
resistor (5 kΩ) pulls input LOW, providing a failsafe HIGH
output.
R
OUT
1–5 (pins 8, 5, 26, 22 and 19) — Receiver output pins
are TTL/CMOS compatible. Receiver output HIGH voltage is
specified for both CMOS and TTL load conditions.
GND (pin 10) —Ground pin.
Typical Performance Characteristics
DS011281-10
FIGURE 7. Receiver TRI-STATE Timing (t
PLZ,tPZL
)
Slew Rate vs Cap. Load vs V
CC
(Four Drivers)
DS011281-11
Slew Rate vs Temperature vs
Cap. Load (Four Drivers Switching)
DS011281-12
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Typical Performance Characteristics (Continued)
Slew Rate vs Cap. Load vs V
CC
(One Driver)
DS011281-13
Slew Rate vs Temperature vs
Cap. Load (One Driver Switching)
DS011281-14
Driver Slew Rate vs Cap. Load
vs Number of Drivers
DS011281-15
DS011281-16
FIGURE 8. Driver Shutdown (SD) Delay Test Circuit
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Typical Performance Characteristics (Continued)
Typical data only.
Symbol Parameter Conditions Typ Units
t
PHS
Propagation Delay High to SD VCC= 5V (Notes 7, 8) 124 µs
t
PLS
Propagation Delay Low to SD TA= 25˚C 110 µs
t
PSH
Propagation Delay SD to High 114 µs
t
PSL
Propagation Delay SD to Low 97 µs
Note 7: Sample size = 10 parts; 3 different datecodes.
Note 8: All drivers are loaded as shown in
Figure 8
.
DS011281-17
FIGURE 9. Driver Shutdown (SD) Delay Timing Waveforms
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Physical Dimensions inches (millimeters) unless otherwise noted
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can
be reasonably expected to result in a significant injury
to the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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Tel: 1-800-272-9959
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Tel: 81-3-5620-6175
Fax: 81-3-5620-6179
Order Number DS14C241WM
NS Package Number M28B
DS14C241 Single Supply TIA/EIA-2324x5Driver/Receiver
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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