Datasheet CGY2021G Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

CGY2021G

DCS/PCS 2 W power amplifier

Preliminary specification
Supersedes data of 1996 Oct 15
File under Integrated Circuits, IC17

1997 Apr 03

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

FEATURES

• Power Amplifier (PA) overall efficiency 50% (DCS)

• 34 dB gain

• 0 dBm input power

• Gain control range >50 dB

• Integrated power sensor driver

• Low output noise floor of PA <−121 dBm/Hz in

DCS/PCS RX band

• Wide operating temperature range −20 to +85 °C

• LQFP 48-pin package

• Compatible with power ramping controller PCA5077 and

GaAs PA power modulator UBA1710.

APPLICATIONS

• Hand-held transceivers for DCS/PCS applications
(DCS: 1710 to 1785 MHz and PCS:
1850 to 1910 MHz)

• 1800 MHz Time Division Multiple Access (TDMA)
systems.

GENERAL DESCRIPTION

The CGY2021G is a DCS/PCS class 1 GaAs Monolithic
Microwave Integrated Circuit (MMIC) power amplifier
specifically designed to operate at 4.8 V battery supply.

The chip also includes a power sensor driver so that no
directional coupler is required in the power control loop.

The PA requires only a simple low-pass filter to comply
with the DCS/PCS transmit spurious specification. It can
be switched off and its power controlled by monitoring the
actual drain voltage applied to the amplifier stages.

QUICK REFERENCE DATA

SYMBOL PARAMETER

V

DD

I

DD

P

o(max)

T

amb

positive supply voltage − 4.5 − V
positive peak supply current − 1.4 − A
maximum output power − 34 − dBm
operating ambient temperature −20 − +85 °C

(1)

MIN. TYP. MAX. UNIT

Note

1. For conditions, see Chapters “AC characteristics” and “DC characteristics”.

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

CGY2021G LQFP48 plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2

1997 Apr 03 2

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

BLOCK DIAGRAM

handbook, full pagewidth

RFI

(1) Ground pins 1 to 5, 9 to 17, 20 to 26, 28, 30, 32, 34 to 41 and 43 to 48.

V

DD1

29 33 42

27

(1)

GND

V

GG1

31

V

DD2

CGY2021G

Fig.1 Block diagram.

V

DD3

V

GG2

SENSOR

DRIVER

6,7,8

19

18

DETO/V

DD5

RFO/V

DD4

MGD771

PINNING

SYMBOL PIN DESCRIPTION

GND 1 to 5 ground
RFO/V

DD4

6 to 8 PA output and fourth stage supply voltage
GND 9 to 17 ground
DETO/V
V

GG2

DD5

18 power sensor output and supply voltage

19 third and fourth stage negative gate supply voltage
GND 20 to 26 ground
RFI 27 PA input
GND 28 ground
V

DD1

29 first stage supply voltage
GND 30 ground
V

GG1

31 first and second stage negative gate supply voltage
GND 32 ground
V

DD2

33 second stage supply voltage
GND 34 to 41 ground
V

DD3

42 third stage supply voltage
GND 43 to 48 ground

1997 Apr 03 3

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

handbook, full pagewidth

RFO/V
RFO/V

RFO/V

GND

GND

GND

GND

GND

DD4
DD4

DD4

GND

GND

GND

GND

GND

DD3

V

GND
43

42

18

19

DD5

GG2

V

DETO/V

GND
41

20

GND

GND
40

21

GND

GND
39

22

GND

GND
38

23

GND

GND

24 37

GND

36
35
34
33
32
31
30
29
28
27
26
25

MGD770

GND
GND
GND
V

DD2

GND
V

GG1

GND
V

DD1

GND
RFI
GND
GND

GND

GND
47

14

GND

46

15

GND

GND

GND

45

44

CGY2021G

16

17

GND

GND
48

1
2
3
4
5
6
7
8

9
10
11
12

13

GND

Fig.2 Pin configuration.

1997 Apr 03 4

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

FUNCTIONAL DESCRIPTION
Operating conditions

The CGY2021G is designed to meet the European

The amplifier bias is set by using a negative voltage
applied at pins V

GG1

and V

. This negative voltage must

GG2

be present before the supply voltage is applied to the
drains to avoid current overstress of the amplifier.

Telecommunications Standards Institute (ETSI) DCS
documents, the ETS 300 577 specification, which are
defined as follows:

• t

= 542.8 µs

on

• T = 4.3 ms

• Duty cycle = 1/8.

This amplifier is specifically designed for pulse operation
allowing the use of a LQFP48 plastic package.

Power sensor driver

The power sensor driver is a buffer amplifier that delivers
an output signal at the DETO pin which is proportional to
the amplifier power. This signal can be detected by
external diodes for power control purpose. As the sensor
signal is taken from the input of the last stage of the PA,
it is isolated from disturbances at the output by the reverse
isolation of the PA output stage. An impedance mismatch
at the PA output therefore does not significantly influence

Power amplifier

The Power Amplifier (PA) consists of four cascaded gain
stages with an open-drain configuration. Each drain has to
be loaded externally by an adequate reactive circuit which

the signal delivered by the power sensor as this normally
occurs when power sense is made using a directional
coupler. Consequently, the cost and space of using a
directional coupler are saved.

also has to be a DC path to the supply.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); general operating conditions applied.

SYMBOL PARAMETER MIN. MAX. UNIT

V

DD

V

GG

T

j(max)

T

stg

P

tot

positive supply voltage − 7V
negative supply voltage −−10 V
maximum operating junction temperature − 150 °C
IC storage temperature − 150 °C
total power dissipation − 1.3 W

THERMAL CHARACTERISTICS

General operating conditions applied.

SYMBOL PARAMETER VALUE UNIT

R

th j-c

thermal resistance from junction to case; note 1 45 K/W

Note

1. This thermal resistance is a typical value and is measured under DCS/PCS pulse conditions.

1997 Apr 03 5

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

DC CHARACTERISTICS

V

= 4.5 V; T

DD

specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

=25°C; peak current values during burst; general operating conditions applied; unless otherwise

amb

Pins RFO/V

V

DD

I

DD

Pins V

GG1

V

GG1

V

GG2

I

GG1+IGG2

DD4,VDD3

and V

, V

, V

DD2

and DETO/V

DD1

positive supply voltage − 4.5 − V
positive peak supply current − 1.4 − A

GG2

negative supply voltage note 1 −−1.6 − V
negative supply voltage note 1 −−1.6 − V
negative peak supply current −−2mA

Note

1. The negative bias V

must be applied 10 µs before the power amplifier is switched on, and must remain applied

GG

until the power amplifier has been switched off.

DD5

1997 Apr 03 6

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

AC CHARACTERISTICS

V

= 4.5 V; T

DD

Measured and guaranteed on CGY2021G evaluation board.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Power amplifier

P

i

S

11

f

RF

P

o(max)

η efficiency DCS; at P

R

S

C

S

P

o(off)

N

RX

H2 2nd harmonic level −−40 − dBc
H3 3rd harmonic level −−35 − dBc
Stab stability note 2 −−−50 dBc

=25°C; general operating conditions applied; unless otherwise specified.

amb

input power −2 − +2 dBm
input return loss 50 Ω source; note 1 −−−10 dB
RF frequency range DCS 1710 − 1785 MHz

PCS 1850 − 1910 MHz

maximum output power T

=25°C; VDD= 4.5 V 33 34 − dBm

amb

= −20 to +85 °C; VDD= 4.2 V 31 −−dBm

T

amb

40 50 − %

− 47 − %

PCS; at P

o(max)
o(max)

optimum series load resistance − 6 −Ω
optimum series load

− 11 − pF

capacitance
isolation PA OFF; Pi= 0 dBm −−50 − dBm
output noise in RX band −−−121 dBm/Hz

Power sensor driver

P

o(DET)

sensor driver output power RL= 100 Ω; relative to PA output

−−25 − dBc

power into 50 Ω load

Notes

1. Including the 82 Ω resistor connected in parallel at the power amplifier input on the evaluation board.

2. The device is adjusted to provide nominal value of load power into a 50 Ω load. The device is switched off and a 6 : 1
load replaces the 50 Ω load. The device is switched on and the phase of the 6 : 1 load is varied
360 electrical degrees during a 60 seconds test period.

1997 Apr 03 7

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

APPLICATION INFORMATION

handbook, full pagewidth

PA

output

(3)

C1

10 pF

C2

TRL1

(3)C3(3)

(1)

48 47 46 45 44 43 42 41 40 39 38 37

V

1
2
3
4
5
6
7

RFO/V

8

9
10
11
12

13 14 15 16 17 18

DD4

12 pF

DD3

CGY2021G

V

DETO

GG2

19 20 21 22 23 24

12 pF

100 Ω

nH

6

V

V

V

DD2

GG1

DD1

RFI

10
pF

36
35
34
33
32
31
30
29
28
27
26
25

22pF1

10
pF

100

TRL2

82

Ω

nF

47 Ω

1 nF

pF

V

GG

−1.6 V

PA

(2)

input

1.5
pF

39 Ω

180 Ω

V

control

0.8 to 3 V

All capacitors are type: SMD0603.
Thickness: 0.8 mm; substrate: FR4; εr= 4.7.
(1) TRL1: width = 0.3 mm; length = 16 mm.
(2) TRL2: width = 0.5 mm; length = 10 mm.
(3) the component values are:

SYSTEM C1 (pF) C2 (pF)

BSR14

560 Ω

DCS 2.2 1.8 2.2
PCS 1.5 1.5 2.2

V

bat

3.6 V

V

PHP109

DD

1.8

10 nF

C3 (pF)

1.2

V

diode

1 kΩ

BAS70

Fig.3 Evaluation board schematic.

1997 Apr 03 8

1.25 V

BAS70

1 nF

1 kΩ

1 kΩ

39 pF

MGD772

−90 µA

DC output

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

PACKAGE OUTLINE

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm

c

y

X

36

37

pin 1 index

48

25

Z

24

E

e

w M

b

p

13

A

H

E

E

A

2

A

SOT313-2

Q

(A )

A

1

L

L

3

θ

p

1

e

DIMENSIONS (mm are the original dimensions)

mm

OUTLINE
VERSION

SOT313-2

A

A1A2A3bpcE

max.

0.20

0.05

1.45

1.35

IEC JEDEC EIAJ

1.60

UNIT

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

b

p

0.25

w M

D

H

D

0.27

0.17

12

Z

D

B

0 2.5 5 mm

(1)

(1) (1)(1)

D

0.18

0.12

7.1

7.1

6.9

6.9

REFERENCES

v M

v M

scale

eH

H

9.15

0.5

8.85

D

A

B

9.15

8.85

detail X

LLpQZywv θ

E

0.69

0.75

0.45

0.59

0.12 0.10.21.0

EUROPEAN

PROJECTION

Z

D

0.95

0.95

0.55

0.55

ISSUE DATE

93-06-15
94-12-19

E

o

7

o

0

1997 Apr 03 9

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all LQFP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

(order code 9398 652 90011).

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 Apr 03 10

Philips Semiconductors Preliminary specification

DCS/PCS 2 W power amplifier CGY2021G

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Short-form specification The data in this specification is extracted from a full data sheet with the same type

number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Apr 03 11

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© Philips Electronics N.V. 1997 SCA54
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Printed in The Netherlands 437027/1200/02/pp12 Date of release: 1997 Apr 03 Document order number: 9397 750 02022