Page 1
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU2522AX
GENERAL DESCRIPTION
New generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in
horizontal deflection circuits of high resolution monitors. Features improved RBSOA performance and is suitable for
use in horizontal deflection circuits of pc monitors.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V
CESM
V
CEO
I
C
I
CM
P
tot
V
CEsat
I
Csat
t
f
PINNING - SOT399 PIN CONFIGURATION SYMBOL
Collector-emitter voltage peak value VBE = 0 V - 1500 V
Collector-emitter voltage (open base) - 800 V
Collector current (DC) - 10 A
Collector current peak value - 25 A
Total power dissipation Ths ≤ 25 ˚C - 45 W
Collector-emitter saturation voltage IC = 6.0 A; IB = 1.2 A - 5.0 V
Collector saturation current f = 64 kHz 6.0 - A
Fall time I
= 6.0 A; f = 64 kHz 0.16 0.22 µs
Csat
PIN DESCRIPTION
case
c
1 base
2 collector
b
3 emitter
case isolated
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CESM
V
CEO
I
C
I
CM
I
B
I
BM
-I
B(AV)
-I
BM
P
tot
T
stg
T
j
Collector-emitter voltage peak value VBE = 0 V - 1500 V
Collector-emitter voltage (open base) - 800 V
Collector current (DC) - 10 A
Collector current peak value - 25 A
Base current (DC) - 6 A
Base current peak value - 9 A
Reverse base current average over any 20 ms period - 150 mA
Reverse base current peak value
1
Total power dissipation Ths ≤ 25 ˚C - 45 W
Storage temperature -55 150 ˚C
Junction temperature - 150 ˚C
THERMAL RESISTANCES
123
e
-6A
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
R
th j-hs
R
th j-a
1 Turn-off current.
Junction to heatsink with heatsink compound - 2.8 K/W
Junction to ambient in free air 35 - K/W
September 1997 1 Rev 2.300
Page 2
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU2522AX
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
isol
C
isol
STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
CES
I
CES
I
EBO
BV
EBO
V
CEOsust
V
CEsat
V
BEsat
h
FE
h
FE
Repetitive peak voltage from all R.H. ≤ 65 % ; clean and dustfree - 2500 V
three terminals to external
heatsink
Capacitance from T2 to external f = 1 MHz - 22 - pF
heatsink
Collector cut-off current
2
VBE = 0 V; VCE = V
VBE = 0 V; VCE = V
Tj = 125 ˚C
CESMmax
; - - 2.0 mA
CESMmax
- - 0.25 mA
Emitter cut-off current VEB = 7.5 V; IC = 0 A - - 0.25 mA
Emitter-base breakdown voltage IB = 1 mA 7.5 13.5 - V
Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA; 800 - - V
L = 25 mH
Collector-emitter saturation voltage IC = 6.0 A; IB = 1.2 A - - 5.0 V
Base-emitter saturation voltage IC = 6.0 A; IB = 1.2 A - - 1.3 V
DC current gain IC = 1 A; VCE = 5 V - 10 -
IC = 6 A; VCE = 5 V 5 7 8
DYNAMIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
C
c
t
s
t
f
Collector capacitance IE = 0 A; VCB = 10 V; f = 1 MHz 115 - pF
Switching times (64 kHz line I
deflection circuit) Cfb = 5.4 nF;I
= 6.0 A; LC = 170 µH;
Csat
B(end)
= 0.7 A;
LB = 0.6 µH; -VBB = 2 V;
(-dIB/dt= 3.33A /µs)
Turn-off storage time 1.7 2.0 µs
Turn-off fall time 0.12 0.25 µs
2 Measured with half sine-wave voltage (curve tracer).
September 1997 2 Rev 2.300
Page 3
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU2522AX
30-60 Hz
IC / mA
250
200
100R
6V
Fig.1. Test circuit for V
100-200R
Horizontal
Oscilloscope
Vertical
1R
.
CEOsust
+ 50v
ICsat
90 %
IC
10 %
IB
ts
IBend
tf
- IBM
Fig.4. Switching times definitions.
+ 150 v nominal
adjust for ICsat
Lc
t
t
100
0
VCE / V
Fig.2. Oscilloscope display for V
TRANSISTOR
DIODE
6.5 us5 us
16 us
V
I
I
CE
C
B
min
VCEOsust
CEOsust
ICsat
I end
B
Fig.3. Switching times waveforms (64 kHz).
IBend
-VBB
.
t
t
t
IBend
-VBB
Fig.6. Test Circuit RBSOA. VCC = 140 V; -VBB = 4 V;
LB
Fig.5. Switching times test circuit
LB
T.U.T.
LC
VCC
T.U.T.
Cfb
.
VCL
CFB
LC = 100 - 400 µH; VCL ≤ 1500 V; LB = 3 µH;
CFB = 1 - 2.2 nF; IB(end) = 1.6 - 2 A
September 1997 3 Rev 2.300
Page 4
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU2522AX
h
FE
100
10
1
0.01 0.1 1 10 100
Tj = 85 C
Tj = 25 C
Tj = -40 C
IC / A
BU2522A
Fig.7. Typical DC current gain. hFE = f (IC)
VCE = 5 V
VBESAT / V BU2522A
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
0.4
0.1 1 10
Tj = 85 C
Tj = 25 C
IC/IB =
3
5
IC / A
Fig.8. Typical base-emitter saturation voltage.
VBEsat = f (IC); parameter IC/I
B
1.2
Tj = 85 C
1.1
1
0.9
0.8
0.7
0.6
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Tj = 25 C
IB / A
BU2522AVBESAT / V
IC =
7A
6A
5A
Fig.10. Typical base-emitter saturation voltage.
VBEsat = f (IB); parameter I
PTOT / W
100
10
1
0 0.5 1 1.5 2
IB / A
C
BU2522AF/DF/AX/DX
Ths = 25 C
Ths = 85 C
Fig.11. Typical turn-off losses. Tj = 85˚C
Poff = f (IB); parameter IC = 6 A; f = 64 kHz
BU2522AF
VCESAT / V
10
Tj = 85 C
Tj = 25 C
1
IC/IB =35
0.1
0.01
0.1 10
IC / A
BU2522A
1001
Fig.9. Typical collector-emitter saturation voltage.
VCEsat = f (IC); parameter IC/I
B
ts, tf / us
4
3.5
3
2.5
2
1.5
1
0.5
0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
5A
IC =
6A
IB / A
Fig.12. Typical collector storage and fall time.
ts = f (IB); tf = f (IB); parameter IC = 6A; Tj = 85˚C;
f = 64 kHz
September 1997 4 Rev 2.300
Page 5
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU2522AX
PD%
120
110
100
90
80
70
60
50
40
30
20
10
0
0 20 40 60 80 100 120 140
Normalised Power Derating
with heatsink compound
Ths / C
Fig.13. Normalised power dissipation.
PD% = 100⋅PD/P
Zth / (K/W)
10
0.5
1
0.2
0.1
0.05
0.1
0.02
D 25˚C
= f (Ths)
100
10
0.1
1
ICM
ICDC
BU2520AFIC / A
tp =
= 0.01
30 us
100 us
Ptot
1 ms
10 ms
DC
t
t
p
P
0.01
D = 0
0.001
1E-06 1E-04 1E-02 1E+00
D
t / s
p
D =
T
t
T
Fig.14. Transient thermal impedance.
Z
= f(t); parameter D = tp/T
th j-hs
30
20
10
IC / A
0
0
500 1000 1500
VCE / V
BU2522AF
Fig.15. Reverse bias safe operating area. Tj ≤ T
jmax
0.01
1 10 100 1000
VCE / V
Fig.16. Forward bias safe operating area. Ths = 25 ˚C
I
& ICM = f(VCE); ICM single pulse; parameter t
CDC
Second-breakdown limits independant of temperature.
p
Mounted with heatsink compound.
September 1997 5 Rev 2.300
Page 6
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU2522AX
MECHANICAL DATA
Dimensions in mm
Net Mass: 5.88 g
4.5
16.0 max
10.0
0.7
3.3
5.8 max
3.0
27
max
22.5
max
18.1
min
5.45 5.45
Fig.17. SOT399; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
3. Leads Ni plated and solder coated.
Typical solder composition - Tin 63%, lead 34%, Bismuth 3%.
25
25.1
25.7
5.1
2.2 max
4.5
1.1
0.4 M
2
0.95 max
3.3
September 1997 6 Rev 2.300
Page 7
Philips Semiconductors Product specification
Silicon Diffused Power Transistor BU2522AX
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
September 1997 7 Rev 2.300
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