Datasheet BTW67-800, BTW67-600, BTW67-1200 Datasheet (SGS Thomson Microelectronics)

Page 1
BTW67 and BTW69 Series
STANDARD 50A SCRs
MAIN FEATURES:
Symbol Value Unit
I
T(RMS)
V
DRM/VRRM
I
GT
50 A
600to1200 V
80 mA
DESCRIPTION
Available in high power packages, the BTW67 / BTW69 Series is suitable in applications where power handling and power dissipation are critical, such as solid state relays, welding equipment, high power motor c ontrol.
RD91
(BTW67)
TOP3
(BTW69)
Based on a clip assembly technology, they offer a superior performance in surge current handling capabilities. Thanks to their internal ceramic pad, they provide high voltage insulation (2500V RMS), com plying with UL standards (file ref: E81734).
ABSOLUTE RATINGS (limiting values)
Symbol Parameter Value Unit
I
T(RMS)
I
T(AV)
I
TSM
²
I
tI
dI/dt
I
GM
P
G(AV)
T
stg
Tj
V
RGM
RMS on-state current (180° conduction angle)
Average on-state current (180° conduction angle)
Non repetitivesurge peakon-statecurrent tp = 8.3 ms
²
t Value for fusing
Critical rate of rise of on-state current I
,tr100 ns
2xI
GT
Peak gate current tp = 20 µs Tj = 125°C 8 A Average gate power dissipation Tj = 125°C 1 W Storage junction temperature range
Operating junction temperature range Maximum peak reverse gate voltage 5 V
=
G
RD91 Tc = 70°C
50 A
TOP3 Ins. Tc = 75°C
RD91 Tc = 70°C
32 A
TOP3 Ins. Tc = 75°C
610
Tj = 25°C
tp = 10 ms 580
Tj = 25°C 1680
F = 60 Hz Tj = 125°C 50 A/µs
-40to+150
-40to+125
A
2
A
S
°C
April 2001 - Ed: 4
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Page 2
BTW67 and BTW69 Series
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
Symbol Test Conditions Value Unit
I
GT
VD=12V RL=33
V
GT
V
GD
I
H
I
L
dV/dt V
V
TM
V
t0
R
d
I
DRM
I
RRM
VD=V
DRMRL
=3.3k IT=500mA Gateopen IG=1.2I
=67%V
D
GT
DRM
Gate open
ITM=100A tp=380µs Threshold voltage Tj = 125°C MAX. 1.0 V Dynamic resistance Tj = 125°C MAX. 8.5 m
V
DRM=VRRM
Tj = 125°C MIN.
Tj = 125°C MIN. 1000 V/µs
Tj = 25°C MAX. 1.9 V
Tj = 25°C MAX. 10 µA
Tj = 125°C 5 mA
THERMAL RESISTANCES
Symbol Parameter Value Unit
R
th(j-c)
R
th(j-a)
Junction to case (DC) RD91 (Insulated) 1.0 °C/W
Junction to ambient
MIN. 8 MAX. 80 MAX. 1.3 V
0.2 V
MAX. 150 mA MAX.
200
TOP3 Insulated 0.9 TOP3 Insulated 50
mA
mA
°C/W
PRODUCT SELECTOR
PartNumber
600 V 800 V 1200 V
BTW67-xxx X X X 80 mA RD91 BTW69-xxx X X X 80 mA TOP3 Ins.
Voltage (xxx)
Sensitivity
Package
ORDERING INFORMATION
OTHER INFORMATION
Part Number Marking Weight Base Quantity Packing mode
BTW67-xxx BTW67xxx 20.0 g 25 Bulk BTW69-xxx BTW69xxx 4.5 g 120 Bulk
Note:xxx=voltage
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Page 3
BTW67 and BTW69 Series
Fig. 1: Maximum average power dissipation
versus average on-state curr ent.
Fig. 3: Relative variation of thermal impedance versus pulse duration.
Fig. 2: Average and D.C. on-state current versus case temperature.
Fig. 4: Relative variation of gate trigger current, holding current and latching current versus junction temperature.
Fig. 5: Surge peak on-state current versus number of cycles.
Fig. 6: Non-repetitive surge peak on-st ate current for a sinusoidal pulse with width tp < 10ms, and corresponding value of I²t.
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Page 4
BTW67 and BTW69 Series
Fig. 7: On-state characteristics (maximum
values).
PACKAGE MECHANICAL DATA
RD91 (Plastic)
DIMENSIONS
REF.
A 40.00 1.575 A1 29.90 30.30 1.177 1.193 A2 22.00 0.867
B 27.00 1.063 B1 13.50 16.50 0.531 0.650 B2 24.00 0.945
C 14.00 0.551 C1 3.50 0.138 C2 1.95 3.00 0.077 0.118 E3 0.70 0.90 0.027 0.035
F 4.00 4.50 0.157 0.177
I 11.20 13.60 0.441 0.535 L1 3.10 3.50 0.122 0.138 L2 1.70 1.90 0.067 0.075 N1 33° 43° 33° 43° N2 28° 38° 28° 38°
Millimeters Inches
Min. Max. Min. Max.
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PACKAGE MECHANICAL DATA
TOP3 Ins.(Plastic)
BTW67 and BTW69 Series
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.STMicroelect ronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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© 2001 STMicroelectronics - Printed in Italy - All rights reser ved
.
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