Page 1
BF3506TV
FULL 50-60Hz RECTIFICA T ION BRIDGE
MAIN PRODUCT CHARACTERISTICS
I
F(AV)
V
RRM
VF (max) 1.3V
FEATURES AND BENEFITS
35A
600V
.COMPACT ISOTOP DESIGN COMPATIB LE
WITH FAST DIODES, TRANSISTORS AND
PASSIVE COMPONENTS.
.EXCELLENT THERMAL TRANSFER JUNC-
TION TI HEATSINK
.UL PENDING
DESCRIPTION
The Bridges series from SGS-THOMSON has
been designed to allow a better standardization
of packages on boards principally designed with
ISOTOP packages. The insulated package of the
bridge will be able to sit on heatsink with other
components. Single phase and 3-phase high
power SMPS, UPS, MOTOR DRIVES and
WELDING equipment will primarily find advantage in these industry package products.
PRELIMINARY DATASHEET
+
-
+
-
Screw version
ISOTOP
(Plastic)
MAXIMUM RATINGS AND ELECTRICAL CHARA CTERISTICS ( per diode unless specified)
Symbol Parameter Value Unit
V
RRM
V
RSM
I
F(AV) total
I
FSM
I2.t Fusing 660 A2.s
Tstg Storage temperature range - 65 to + 150 °C
Tj Max. operating junction temperature 150 °C
Pmax total Total power dissipation 50 W
TM : ISOTOP is a trademark of SGS-THOMSON Microelectronics.
November 1995 Ed : 1
Repetitive peak reverse voltage 600 V
Non repetitive peak reverse voltage 600 V
Average forward current Tc=80°C
Sinus
Surge non repetitive forward current
50Hz JEDEC method
35 A
300 A
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Page 2
BF3506TV
THERMAL RESISTANCE
Symbol Parameter Value Unit
Rth (j-c)
total
Junction to case 0.5 °C/W
ELECTRICAL CHARACTERISTICS (Per diode)
STATIC CHARACTERISTICS
Symbol Parameter Test Conditions Min. Typ. Max. Unit
IR * Reverse leakage current VR = 0.8 V
δ < 2%
tp = 5ms
V
F **
Pulse test : * tp = 5 ms, duty cycle < 2 %
** tp = 380 µs, duty cycle < 2 %
For one diode: Pcond = 1.02 x I
Forward voltage drop IF = 35 A
δ < 2%
tp = 380µs
+ 0.008 x I
F(AV)
RRM
2
F(RMS)
Tj = 25°C10µA
T
= 125°C 0.2 mA
j
Tj = 25°C 1.4 V
Tj = 125°C 1.3 V
and Tj = Pcond x 4 x R
th(j-c)
+ Tc
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Page 3
PACKAGE DATA (millimeter)
ISOTOP (Plastic)
M
G
/
OI
OJ
/
O
K
L
OI
BF3506TV
REF. DIMENSIONS
Millimeters Inches
A
B
/
H
C
D
EF
P
screw H M4
Min. Max. Min. Max.
A 11.80 12.20 0.465 0.480
B 8.90 9.10 0.350 0.358
C 1.95 2.05 0.077 0.081
D 0.75 0.85 0.029 0.034
E 12.60 12.80 0.496 0.504
F 25.10 25.50 0.988 1.004
G 31.50 31.70 1.240 1.248
H 4.00 0.157
I 4.10 4.30 0.161 0.169
J 4.10 4.30 0.161 0.169
K 14.90 15.10 0.586 0.595
L 30.10 30.30 1.185 1.193
M 37.80 38.20 1.488 1.504
O 7.80 8.20 0.307 0.323
P 5.50 0.216
Cooling method : C
Marking : Type number
Weight : 28 g. (without screws)
Electrical isolation : 2500V
Capacitance : < 45 pF
Inductance : < 5 nH
(RMS)
- Recommended torque value : 1.3 N.m (MAX 1.5 N.m) for the 6 x M4 screws. (2 x M4 screws
recommended for mounting the package on the heatsink and the 4 screws given with the screw
version).
- The screws supplied with the package are adapted for mounting on a board (or other types of
terminals) with a thickness of 0.6 mm min and 2.2 mm max.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may
result from its use. No license is grante d by implication or othe rwise under any patent or p atent rights of SGS-THOMSON Microe lectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems
without express written approval of SGS-THOMSON Microelectronics.
© 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore -
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Spain - Sweden - Switzerland - Taiwan - Thailand - U nited Kingdom - U.S.A.
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