Octal inverting buffer with 30Ω series
termination resistors (3-State)
Product specification
Supersedes data of 1996 Oct 08
IC23 Data Handbook
1998 Jan 16
Page 2
Philips Semiconductors Product specification
Octal inverting buffer with 30Ω series termination
resistors (3-State)
FEA TURES
•Octal bus interface
•3-State buffers
•Live insertion/extraction permitted
•Outputs include series resistance of 30Ω, making external
termination resistors unnecessary
•Output capability: +12mA/–32mA
•Latch-up protection exceeds 500mA per Jedec Std 17
•ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
•Power-up 3-State
•Same part as 74ABT240-1
QUICK REFERENCE DATA
SYMBOLPARAMETER
C
t
PLH
t
PHL
C
OUT
I
CCZ
IN
Propagation delay
An to Yn
CL = 50pF; VCC = 5V
Input capacitanceVI = 0V or V
Output capacitanceOutputs disabled; VO = 0V or V
Total supply currentOutputs disabled; VCC = 5.5V50µA
DESCRIPTION
The 74ABT2240 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed.
The 74ABT2240 device is an octal inverting buffer that is ideal for
driving bus lines. The device features two Output Enables (1OE
), each controlling four of the 3-State outputs.
2OE
The 74ABT2240 is designed with 30Ω series resistance in both the
High and Low states of the output. This design reduces line noise in
applications such as memory address drivers, clock drivers and bus
receivers/transmitters.
The 74ABT2240 is the same as the 74ABT240-1. The part number
has been changed to reflect industry standards.
CONDITIONS
T
= 25°C; GND = 0V
amb
CC
CC
74ABT2240
TYPICALUNIT
2.8
4.3
3pF
7pF
ns
,
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
20-Pin Plastic DIP–40°C to +85°C74ABT2240 N74ABT2240 NSOT146-1
20-Pin plastic SO–40°C to +85°C74ABT2240 D74ABT2240 DSOT163-1
20-Pin Plastic SSOP Type II–40°C to +85°C74ABT2240 DB74ABT2240 DBSOT339-1
20-Pin Plastic TSSOP Type I–40°C to +85°C74ABT2240 PW7ABT2240PW DHSOT360-1
Octal inverting buffer with 30Ω series termination
resistors (3-State)
LOGIC SYMBOL
1A0
2
1A1
4
1A2
6
1A3
8
1OE
1
2A0
17
2A1
15
2A2
13
2A3
11
2OE
19
LOGIC SYMBOL (IEE/IEC)
1Y
0
1
1Y
1Y
2
1Y
3
2Y0
1
2Y
2
2Y
2Y
3
SA00035
18
16
14
12
3
5
7
9
FUNCTION TABLE
1OE1An2OE2An1Yn2Yn
LLLLHH
LHLHLL
HXHXZZ
H =High voltage level
L =Low voltage level
X = Don’t care
Z =High impedance ”off” state
SCHEMATIC OF EACH OUTPUT
74ABT2240
INPUTSOUTPUTS
V
CC
1
EN
2
4
6
8
19
17
15
13
11
EN
ABSOLUTE MAXIMUM RA TINGS
18
16
14
12
GND
3
5
7
9
SA00036
1, 2
OUTPUT
SA00030
SYMBOLPARAMETERCONDITIONSRATINGUNIT
V
I
V
I
V
I
OK
OUT
OUT
T
CC
IK
stg
DC supply voltage–0.5 to +7.0V
DC input diode currentVI < 0–18mA
I
DC input voltage
3
–1.2 to +7.0V
DC output diode currentVO < 0–50mA
DC output voltage
3
output in Off or High state–0.5 to +5.5V
DC output currentoutput in Low state128mA
Storage temperature range–65 to 150°C
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Jan 16
3
Page 4
Philips Semiconductors Product specification
SYMBOL
PARAMETER
UNIT
Octal inverting buffer with 30Ω series termination
resistors (3-State)
RECOMMENDED OPERATING CONDITIONS
LIMITS
MinMax
V
CC
V
V
V
I
OH
I
OL
∆t/∆vInput transition rise or fall rate010ns/V
T
amb
DC ELECTRICAL CHARACTERISTICS
SYMBOLPARAMETERTEST CONDITIONST
V
IK
V
OH
V
OL
I
I
OFF
I
PU/PD
I
OZH
I
OZL
I
CEX
I
O
I
CCH
I
CCL
I
CCZ
∆I
CC
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any VCC between 0V and 2.1V , with a transition time of up to 10msec. From VCC = 2.1V to VCC = 5V ± 10% a
transition time of up to 100µsec is permitted.
High-level output voltageVCC = 5.0V; IOH = –3mA; VI = VIL or V
VCC = 4.5V; IOH = –32mA; VI = VIL or V
IH
IH
IH
2.52.92.5V
3.03.43.0V
2.02.42.0V
Low-level output voltageVCC = 4.5V; IOL = 5mA; VI = VIL or VIH;0.320.550.55V
VCC = 4.5V; IOL = 12mA; VI = VIL or V
Input leakage currentVCC = 5.5V; VI = GND or 5.5V±0.01±1.0±1.0µA
I
IH
Power-off leakage currentVCC = 0.0V; VO or VI ≤ 4.5V±5.0±100±100µA
Power–up/down 3-State
output current
3
3-State output High currentVCC = 5.5V; VO = 2.7V; VI = VIL or V
3-State output Low currentVCC = 5.5V; VO = 0.5V; VI = VIL or V
Output high leakage currentVCC = 5.5V; VO = 5.5V; VI = GND or V
Output current
1
Quiescent supply currentVCC = 5.5V; Outputs Low, VI = GND or V
Additional supply current per
input pin
2
VCC = 2.1V; VO = 0.5V; VI = GND or VCC;
VOE = Don’t care
IH
IH
CC
±5.0±50±50µA
0.015050µA
–0.01–50–50µA
5.05050µA
VCC = 5.5V; VO = 2.5V–50–100–180–50–180mA
VCC = 5.5V; Outputs High, VI = GND or V
VCC = 5.5V; Outputs 3-State;
VI = GND or V
CC
Outputs enabled, one data input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V
Outputs 3-State, one data input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V
Outputs 3-State, one enable input at 3.4V ,
other inputs at VCC or GND; VCC = 5.5V
CC
CC
50250250µA
243030mA
50250250µA
0.51.51.5mA
50250250µA
0.51.51.5mA
74ABT2240
CC
T
= –40°C
amb
to +85°C
0.80.8V
V
UNIT
1998 Jan 16
4
Page 5
Philips Semiconductors Product specification
Octal inverting buffer with 30Ω series termination
resistors (3-State)
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500Ω
SYMBOLPARAMETERWAVEFORM
MinTypMaxMinMax
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
INPUT
OUTPUT
TEST CIRCUIT AND WAVEFORMS
Propagation delay
An to Yn
Output enable time
to High and Low level
Output disable time
from High and Low level
1.5V
t
PLH
1.5V1.5V
1.5V
t
PHL
Waveform 1. W aveforms Showing the Input (An)
to Output (Y
n) Propagation Delays
1
2
2
3 V
0 V
V
V
SA00028
1.0
3.0
1.5
4.2
1.9
2.5
OE INPUT
Yn OUTPUT
OH
OL
Yn OUTPUT
74ABT2240
LIMITS
T
= +25°C
amb
V
= +5.0V
CC
2.8
4.3
3.4
5.5
4.1
3.4
4.0
5.8
4.7
7.6
5.0
5.8
V
M
t
PZL
t
PZH
Waveform 2. Waveforms Showing the 3-State Output
Enable and Disable Times
From Output
Under Test
C
= 50 pF
L
T
= –40°C to +85°C
amb
V
= +5.0V ±0.5V
CC
1.0
3.0
1.5
4.2
1.9
2.5
V
M
V
M
500 Ω
500 Ω
4.9
6.0
5.8
8.4
5.6
6.4
V
M
t
PLZ
t
PHZ
7 V
S1
GND
Open
3.5V
V
OL
V
OL
V
OH
V
OH
UNIT
SA00029
ns
ns
ns
+ 0.3V
– 0.3V
0V
1998 Jan 16
Load Circuit
TESTS1
t
pd
t
PLZ/tPZL
t
PHZ/tPZH
DEFINITIONS
=Load capacitance includes jig and probe capacitance;
C
L
see AC CHARACTERISTICS for value.
open
7 V
open
SA00012
5
Page 6
Philips Semiconductors Product specification
Octal inverting buffer with 30Ω series termination
resistors (3-State)
Octal inverting buffer with 30Ω series termination
resistors (3-State)
SO20: plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
74ABT2240
1998 Jan 16
7
Page 8
Philips Semiconductors Product specification
Octal inverting buffer with 30Ω series termination
resistors (3-State)
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
74ABT2240
1998 Jan 16
8
Page 9
Philips Semiconductors Product specification
Octal inverting buffer with 30Ω series termination
resistors (3-State)
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1
74ABT2240
1998 Jan 16
9
Page 10
Philips SemiconductorsProduct specification
Octal inverting buffer with 30Ω series termination
resistors (3-State)
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
74ABT2240
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03463
yyyy mmm dd
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