Datasheet 74ABT16646CSSCX, 74ABT16646CSSC, 74ABT16646CMTDX, 74ABT16646CMTD Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS011644 www.fairchildsemi.com
October 1993 Revised November 1999
74ABT16646 16-Bit Transceivers and Registers with 3-STATE Outputs
74ABT16646 16-Bit Transceivers and Registers with 3-STATE Outputs
General Description
The ABT16646 consists o f bus transceiver circ uits with 3­STATE, D-type flip-flo ps, and c ontrol circui try arranged for multiplexed transmission of da ta directly from the input bus or from the internal registers. Data on the A or B bus will be clocked into the registers as the appropriate clock pin goes to a high logic level. Control OE
and direction pins are pr o­vided to control the tr ansceiver function. In the tran sceiver mode, data present at the high impedance port may be stored in either the A or the B register or in both. The select controls can multiplex stored and real-time (transparent mode) data. The direction control determines which bus will receive data when the enable control OE
is Active
LOW. In the isolation mode (control OE
HIGH), A data may be stored in the B register a nd/or B data may be stored in the A regis ter.
Features
Independent registers for A and B buses
Multiplexed real-time and stored data
A and B output sink capability of 64 mA, source
capability of 32 mA
Guarante ed latchup protection
High impedance glitch free bus loading during entire
power up and power down cycle
Nondestructive hot insertion capability
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Pin Descriptions
Connection Diagram
Order Number Package Number Package Description
74ABT16646CSSC MS56A 56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide 74ABT16646CMTD MTD56 56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Pin Names Description
A
0–A15
Data Register A Inputs/ 3-STATE Outputs
B
0–B15
Data Register B Inputs/ 3-STATE Outputs
CPAB
n
, CPBAn Clock Pulse Inputs
SAB
n
, SBA
n
Select Inputs
OE
n
Output Enable Input
DIR Direction Control Input
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74ABT16646
Function Table
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial
= LOW-to-HIGH Transition
Note 1: The data output functions may be enabled or disabled by various s ignals at the OE
and DIR inputs. Data input functions are always enabled; i.e., data at the bus pins will be stored on every LOW-to-HIGH transition of the appropriate clock inputs. Also applies to data I/O (A and B: 8-15) and #2 control pins.
Real Time Transfer
A-Bus to B-Bus
FIGURE 1.
Real Time Transfer
B-Bus to A-Bus
FIGURE 2.
Storage from
Bus to Register
FIGURE 3.
Transfer from
Register to Bus
FIGURE 4.
Inputs Data I/O (Note 1) Output Operation Mode
OE
1
DIR1CPAB1CPBA1SAB1SBA1A
0–7
B
0–7
H X H or L H or L X X Isolatio n H X
X X X Input Input Clock An Data into A Register
H X X
X X Clock Bn Data Into B Register L H X X L X An to BnReal Time (Transparent Mode) L H
X L X Input Output Clock An Data to A Register L H H or L X H X A Register to Bn (Stored Mode) L H
X H X Clock An Data into A Register and Output to Bn L L X X X L Bn to AnReal Time (Transparent Mode) L L X
X L Output Input Clock Bn Data into B Register L L X H or L X H B Register to An (Stored Mode) L L X
X H Clock Bn into B Register and Output to An
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74ABT16646
Logic Diagram
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74ABT16646
Absolute Maximum Ratings(Note 2) Recommended Operating
Conditions
Note 2: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation under these conditi ons is not implied.
Note 3: Either voltage lim it or c urrent limit is sufficient to prot ect inputs.
DC Electrical Characteristics
Note 4: For 8-bit toggling, I
CCD
< 1.4 mA/MHz.
Note 5: Guaranteed but not tested.
Storage Temperature −65°C to +150°C Ambient Temperature under Bias 55°C to +125°C Junction Temperature under Bias −55°C to +150°C V
CC
Pin Potential to Ground Pin 0.5V to +7.0V Input Voltage (Note 3) 0.5V to +7.0V Input Current (Note 3) 30 mA to +5.0 mA Voltage Applied to Any Output
in the Disable or Power-Off State 0.5V to +5.5V in the HIGH State 0.5V to V
CC
Current Applied to Output
in LOW State (Max) twice the r ated I
OL
(mA) DC Latchup Source Current 500 mA Over Voltage Latchup (I/O) 10V
Free Air Ambient Temperature −40°C to +85°C Supply Voltage +4.5V to +5.5V Minimum Input Edge Rate (∆V/∆t)
Data Input 50 mV/ns Enable Inpu t 20 mV/ns Clock Input 100 mV/ns
Symbol Parameter Min Typ Max Units
V
CC
Conditions
V
IH
Input HIGH Voltage 2.0 V Recognized HIGH Signal
V
IL
Input LOW Voltage 0.8 V Recognized LOW Signal
V
CD
Input Clamp Diode Voltage 1.2 V Min IIN = 18 mA (Non I/O Pins)
V
OH
Output HIGH Voltage 2.5 IOH = 3 mA, (An, Bn)
2.0 IOH = 32 mA, (An, Bn)
V
OL
Output LOW Voltage 0.55 V Min IOL = 64 mA, (An, Bn)
V
ID
Input Leakage Test 4.75 V 0.0 IID = 1.9 µA, (Non-I/O Pins)
All Other Pins Grounded
I
IH
Input HIGH Current 1
µA Max
VIN = 2.7V (Non-I/O Pins) (Note 5)
1 V
IN
= VCC (Non-I/O Pins)
I
BVI
Input HIGH Current Breakdown Test 7 µA Max VIN = 7.0V (Non-I/O Pins)
I
BVIT
Input HIGH Current Breakdown T est (I/O) 100 µA Max VIN = 5.5V (An, Bn)
I
IL
Input LOW Current −1
µA Max
VIN = 0.5V (Non-I/O Pins) (Note 5)
1 V
IN
= 0.0V (Non-I/O Pins)
IIH + I
OZH
Output Leakage Current 10 µA 0V–5.5V
V
OUT
= 2.7V (An, Bn); OE = 2.0V
IIL + I
OZL
Output Leakage Current −10 µA 0V–5.5V
V
OUT
= 0.5V (An, Bn); OE = 2.0V
I
OS
Output Short-Circuit Current −100 275 mA Max V
OUT
= 0V (An, Bn)
I
CEX
Output HIGH Leakage Current 50 µA Max V
OUT
= VCC (An, Bn)
I
ZZ
Bus Drainage Test 100 µA 0.0V V
OUT
= 5.5V (An, Bn);
All Others GND
I
CCH
Power Supply Current 1.0 mA Max All Outputs HIGH
I
CCL
Power Supply Current 60 mA Max All Outputs LOW
I
CCZ
Power Supply Current 1.0 mA Max Outputs 3-STATE; All Others GND
I
CCT
Additional ICC/Input 2.5 mA Max VI = VCC 2.1V
All Other Outputs at VCC or GND
I
CCD
Dynamic I
CC
No Load mA/ Max Outputs OPEN
(Note 5)
0.23 MHz
OE, DIR, and SEL = GND, Non-I/O = GND or VCC(Note 4) One Bit toggling, 50% duty cycle
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74ABT16646
DC Electrical Characteristics
(SSOP Package)
Note 6: Max number of outputs defined as (n). n 1 data input s are driven 0V to 3V. One output at LOW. Guaran te ed, but not tested. Note 7: Max number of outputs defined as (n). n 1 data input s are driven 0V to 3V. One output HIGH. Guaranteed, but not te s t ed. Note 8: Max number of data inputs (n) s witc hing. n 1 inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (V
ILD
), 0V to threshold (V
IHD
).
Guaranteed, but not tested.
AC Electrical Characteristics
(SSOP Package)
AC Operating Requirements
Symbol Par ameter Min Typ Max Units
V
CC
Conditions
CL = 50 pF, RL = 500
V
OLP
Quiet Output Maximum Dynamic V
OL
0.7 1.2 V 5.0 TA = 25°C (Note 6)
V
OLV
Quiet Output Minimum Dynamic V
OL
1.4 1.0 V 5.0 TA = 25°C (Note 6)
V
OHV
Minimum HIGH Level Dynamic Output Voltage 2.5 3.0 V 5.0 TA = 25° (Note 7)
V
IHD
Minimum HIGH Level Dynamic Input Voltage 2.2 1.6 V 5.0 TA = 25°C (Note 8)
V
ILD
Maximum LOW Level Dynamic Input Voltage 1.2 0.8 V 5.0 TA = 25°C (Note 8)
Symbol Parameter
TA = +25°CT
A
= 40°C to +85°C
Units
V
CC
= +5.0V VCC = 4.5V5.5V
CL = 50 pF CL = 50 pF
Min Typ Max Min Max
f
MAX
Maximum Clock Frequency 200 MHz
t
PLH
Propagation Delay 1.5 3.0 4.9 1.5 4.9
ns
t
PHL
Clock to Bus 1.5 3.4 4.9 1.5 4.9
t
PLH
Propagation Delay 1.5 2.6 4.5 1.5 4.5
ns
t
PHL
Bus to Bus 1.5 3.0 4.5 1.5 4.5
t
PLH
Propagation Delay 1.5 2.9 5.0 1.5 5.0
ns
t
PHL
SBAn or SABn to An to B
n
1.5 3.2 5.0 1.5 5.0
t
PZH
Enable Time 1.5 2.8 5.5 1.5 5.5
ns
t
PZL
OEn to An or B
n
1.5 3.0 5.5 1.5 5.5
t
PHZ
Disable Time 1.5 3.9 6.0 1.5 6.0
ns
t
PLZ
OEn to An or B
n
1.5 3.2 6.0 1.5 6.0
t
PZH
Enable Time 1.5 3.5 5.5 1.5 5.5
ns
t
PZL
DIRn to An or B
n
1.5 3.2 5.5 1.5 5.5
t
PHZ
Disable Time 1.5 3.8 6.5 1.5 6.5
ns
t
PLZ
DIRn to An or B
n
1.5 3.2 6.5 1.5 6.5
Symbol Parameter
TA = +25°CT
A
= 40°C to +85°C
Units
V
CC
= +5.0V VCC = 4.5V–5.5V
CL = 50 pF CL = 50 pF
Min Max Min Max
tS(H) Setup Time, HIGH
2.0 2.0 ns
tS(L) or LOW Bus to Clock tH(H) Hold Time, HIGH
1.0 1.0 ns
tH(L) or LOW Bus to Clock tW(H) Pulse Width,
3.0 3.0 ns
tW(L) HIGH or LOW
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74ABT16646
Extended AC Electrical Characteristics
(SSOP Package)
Note 9: This specification is gu aranteed but not tested. The limits apply to propagation delays for all paths described s w it ch ing in phase (i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 10: This specification is guaranteed but no t tested. The limits represent propagation delay with 250 pF lo ad capacitors in place of the 50 pF load capac­itors in the standard AC load. This specification pertains to single output switching only.
Note 11: This specification is guaranteed but not tested. The limits represent propagation delays for all paths described switching in phase (i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.) with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 12: The 3-STATE delays are dominated by the RC n et work (500, 250 pF) on the output and has been excluded from the datasheet.
Symbol Parameter
TA = 40°C to +85°CTA = 40°C to +85°CTA = 40°C to +85°C
Units
VCC = 4.5V–5.5V VCC = 4.5V–5.5V VCC = 4.5V–5.5V
CL = 50 pF CL = 250 pF CL = 250 pF
8 Outputs Switching 1 Output Switching 8 Outputs Switching
(Note 9) (Note 10) (Note 11)
Min Max Min Max Min Max
t
PLH
Propagation Delay 1.5 5.8 2.0 7.5 2.5 10.0
ns
t
PHL
Clock to Bus 1.5 5.8 2.0 7.5 2.5 10.0
t
PLH
Propagation Delay 1.5 6.5 2.0 7.0 2.5 9.5
ns
t
PHL
Bus to Bus 1.5 6.5 2.0 7.0 2.5 9.5
t
PLH
Progagation Delay
1.5 6.0 2.0 7.5 2.5 10.0 ns
t
PHL
SBAn or SABn to An or B
n
1.5 6.0 2.0 7.5 2.5 10.0
t
PZH
Output Enable Time 1.5 6.0 2.0 8.0 2.5 10.5
ns
t
PZL
OEn to An or B
n
1.5 6.0 2.0 8.0 2.5 10.5
t
PHZ
Output Disable Time 1.5 6.0
(Note 12) (Note 12) ns
t
PLZ
OEn to An or B
n
1.5 6.0
t
PZH
Output Enable Time 1.5 6.5 2.0 8.0 2.5 10.5
ns
t
PZL
DIR to An or B
n
1.5 6.5 2.0 8.0 2.5 10.5
t
PHZ
Output Disable Time 1.5 6.5
(Note 12) (Note 12) ns
t
PLZ
DIR to An or B
n
1.5 6.5
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74ABT16646
Skew
(SOIC Package)
Note 13: This specification is guaranteed but not tested. The limits apply to propagation delays for all paths described switching in phase (i.e., all LOW-to-HIGH, HIGH-to-LOW, etc.).
Note 14: This spec ification is guara nteed but no t tested. The lim its represen t propagation de lays with 250 pF load capacitors in place of the 50 pF load capacitors in the standard AC load.
Note 15: Skew is def ined as the absolu te valu e of the differ ence be tween the actu al propag ation de lays f or any tw o separ ate outpu ts of the sam e devi ce. The specification a pplies to any outputs s w it c hing HIGH to LOW (t
OSHL
), LOW to HIGH (t
OSLH
), or any combination switching LOW to HIGH and/or HIGH to
LOW (t
OST
). This specification is guaranteed but not tested.
Note 16: This describ es th e d ifferenc e b etw een t he del ay o f t he LO W-to -HIGH an d the HIGH -to -LOW tra nsitio n on t he s ame p in. It is mea sure d across all the outputs (drivers) on t he same chip, the worst (largest delta) numb er is the guaranteed specification. This specification is guaranteed but not tested.
Note 17: Propagation delay variation for a given set of conditions (i.e., temperature and V
CC
) from device to device. This specification is guaranteed but not
tested.
Capacitance
Note 18: C
I/O
is measured at frequency, f = 1 MHz, per MIL-STD-883, M et hod 3012.
Symbol Parameter
TA = 40°C to +85°CT
A
= 40°C to +85°C
Units
VCC = 4.5V–5.5V VCC = 4.5V–5.5V
CL = 50 pF CL = 250 pF
16 Outputs Switching 16 Outputs Switching
(Note 13) (Note 14)
Max Max
t
OSHL
Pin to Pin Skew
2.0 2.5 ns
(Note 15) HL Transitions t
OSLH
Pin to Pin Skew
2.0 2.5 ns
(Note 15) LH Transitions t
PS
Duty Cycle
2.0 2.5
(Note 16) LH–HL Skew t
OST
Pin to Pin Skew
2.8 3.0 ns
(Note 15) LH/HL Transitions t
PV
Device to Device Skew
3.5 4.0 ns
(Note 17) LH/HL Transitions
Symbol Parameter Typ Units
Conditions
TA = 25°C
C
IN
Input Capacitance 5 pF VCC = 0V (non I/O pins)
C
I/O
(Note 18) Output Capacitance 11 pF VCC = 5.0V (An, Bn)
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74ABT16646
Physical Dimensions inches (millimeters) unless otherwise noted
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300 Wide
Package Number MS56A
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74ABT16646 16-Bit Transceivers and Registers with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
56-Lead Thin Shrink Sm all Ou tline Pa ck age (TS SO P), JE DE C MO-153, 6.1mm Wide
Package Number MTD56
Fairchild does not assume any responsibility for use of any circuitry described , no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are dev ic es or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provide d in the labe l ing, can be re a­sonably expected to result in a significant injury to the user.
2. A critical compo nent in any com ponen t of a life s upp ort device or system whose failure to perform can be rea­sonably expected to cause the failure of the l ife s upport device or system, or to affect its safety or effectiveness.
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