Datasheet 2SK3155 Datasheet (HIT)

Page 1
2SK3155
Silicon N Channel MOS FET High Speed Power Switching
Features
Low on-resistance
RDS = 100 m typ.
High speed switching
4 V gate drive device can be driven from 5 V source
Outline
ADE-208-768C (Z)
4th. Edition
Februaty 1999
TO–220FM
G
D
1. Gate
2. Drain
1
2
3
S
3. Source
Page 2
2SK3155
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body-drain diode reverse drain current I Avalanche current I Avalanche energy E Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note3
Note3
AR
Note1
Note2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10 µs, duty cycle 1%
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg 50
Electrical Characteristics (Ta = 25°C)
150 V ±20 V 15 A 60 A 15 A 15 A 16 mJ 30 W
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V Gate to source breakdown voltage V Gate to source leak current I Zero gate voltege drain current I Gate to source cutoff voltage V Static drain to source on state R resistance R
(BR)DSS
(BR)GSS
GSS
DSS
GS(off)
DS(on)
DS(on)
150 V ID = 10 mA, VGS = 0 ±20——V I
= ±100 µA, VDS = 0
G
——±10 µAVGS = ±16 V, VDS = 0 ——10µAVDS = 150 V, VGS = 0
1.0 2.5 V ID = 1 mA, VDS = 10 V — 0.10 0.13 ID = 8 A, VGS = 10 V
0.12 0.15 ID = 8 A, VGS = 4 V Forward transfer admittance |yfs| 8.5 14 S ID = 8 A, VDS = 10 V Input capacitance Ciss 850 pF VDS = 10 V Output capacitance Coss 300 pF VGS = 0 Reverse transfer capacitance Crss 160 pF f = 1 MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body–drain diode forward voltage V Body–drain diode reverse
recovery time
t
d(on)
r
d(off)
f
DF
rr
13 ns ID = 8 A, VGS = 10 V
100 ns RL = 3.75
195 ns
110 ns
0.9 V IF = 15 A, VGS = 0
140 ns IF = 15 A, VGS = 0
diF/ dt = 50 A/ µs
Note: 4. Pulse test
Note4
Note4
Note4
2
Page 3
Main Characteristics
2SK3155
Power vs. Temperature Derating
40
30
20
10
Channel Dissipation Pch (W)
0
50 100 150 200
Case Temperature Tc (°C)
Typical Output Characteristics
20
10 V
5 V
4 V
16
Pulse Test
3.5 V
500 200
100
50
D
20 10
5 2
1
0.5
0.2
0.1
0.05
0.1
Operation in this area is limited by R
Ta = 25°C
0.3
Drain Current I (A)
PW = 10 ms(1shot)
DC Operation
(Tc = 25°C)
DS(on)
1
3
Drain to Source Voltage V (V)
Typical Transfer Characteristics
20
Maximum Safe Operation Area
V = 10 V
DS
Pulse Test
16
10
100 µs
1 ms
30
10 µs
DS
1000
300100
D
12
8
Drain Current I (A)
4
0
246810
Drain to Source Voltage V (V)
3 V
V = 2.5 V
GS
DS
D
12
8
Drain Current I (A)
4
0
75°C
12345
Gate to Source Voltage V (V)
25°C
Tc = –25°C
GS
3
Page 4
2SK3155
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
5
Pulse Test
4
DS(on)
V (V)
3
2
1
I = 15 A
D
10 A
Drain to Source Saturation Voltage
0
48
12
16 20 30 1001103
Gate to Source Voltage V (V)
Static Drain to Source on State Resistance
vs. Temperature
0.5 Pulse Test
0.4
DS(on)
R ( )
0.3
I = 10 A
D
0.2
V = 4 V
GS
10 A 5 A
0.1
10 V
0
Static Drain to Source on State Resistance
–40 0 40 80 120 160
Case Temperature Tc (°C)
5 A
GS
5 A
Static Drain to Source on State Resistance
vs. Drain Current
1.0 Pulse Test
0.5
DS(on)
0.2
R ( )
V = 4 V
GS
0.1
10 V
0.05
0.02
Drain to Source On State Resistance
0.01
0.1 0.3 Drain Current I (A)
D
Forward Transfer Admittance vs.
Drain Current
1000
fs
300
Tc = –25 °C
100
30
75 °C
1
0.3
Forward Transfer Admittance |y | (S)
0.1
0.1
0.2
0.5
2
1
Drain Current I (A)
V = 10 V
DS
Pulse Test
10
520
D
25 °C
50 100
4
Page 5
2SK3155
Body–Drain Diode Reverse
Recovery Time
500
di / dt = 50 A / µs V = 0, Ta = 25 °C
200
GS
100
50
20
10
Reverse Recovery Time trr (ns)
5
0.1 0.5 1 2 100.2 5 Reverse Drain Current I (A)
DR
20
Typical Capacitance vs. Drain to Source Voltage
10000
3000
1000
Ciss
300
100
Capacitance C (pF)
30
V = 0
GS
Coss
Crss
f = 1 MHz
10
01020304050
Drain to Source Voltage V (V)
DS
200
I = 15A
D
V
160
DS
V = 100 V
DD
50 V
GS
25 V
120
Dynamic Input Characteristics
V
DS
80
40
Drain to Source Voltage V (V)
0
V = 100 V
DD
50 V 25 V
20 40 60 80 100
Gate Charge Qg (nc)
20
1000
Switching Characteristics
500
16
GS
t
d(off)
200
12
8
4
0
100
50
20
Switching Time t (ns)
Gate to Source Voltage V (V)
10
5
0.1 0.2
0.5 Drain Current I (A)
V = 10 V, V = 30 V
GS
DD
PW = 5 µs, duty < 1 %
t
f
t
r
t
d(on)
2
1
5
10
D
20
5
Page 6
2SK3155
Reverse Drain Current vs.
Source to Drain Voltage
20
16
DR
12
10 V
8
5 V
V = 0, –5 V
GS
4
Reverse Drain Current I (A)
0
0.4 0.8 1.2 1.6 2.0
Pulse Test
Source to Drain Voltage V (V)
SD
Maximun Avalanche Energy vs.
Channel Temperature Derating
20
I = 15 A
AP
AR
16
V = 50 V
DD
duty < 0.1 % Rg > 50
12
8
4
0
Repetitive Avalanche Energy E (mJ)
25 50 75 100 125 150
Channel Temperature Tch (°C)
Vin 15 V
Avalanche Test Circuit Avalanche Waveform
V
DSS
V – V
DSS DD
AR
1 2
V
DS
L
E = • L • I •
AP
2
Monitor
I
AP
Monitor
I
Rg
D. U. T
V
DD
AP
V
I
D
50
V
DD
0
V
DS
(BR)DSS
6
Page 7
2SK3155
Normalized Transient Thermal Impedance vs. Pulse Width
3
s (t)
1
γ
D = 1
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.01 10 µ
0.02
0.01
1shot pulse
100 µ 1 m 10 m
Pulse Width PW (S)
Switching Time Test Circuit Waveform
Tc = 25°C
θ γ θ
ch – c(t) = s (t) • ch – c
θ
ch – c = 4.17°C/W, Tc = 25°C
P
DM
PW T
D =
100 m 1 10
PW
T
Vin Monitor
Vin 10 V
50
D.U.T.
R
L
V
DD
= 30 V
Vout Monitor
Vin Vout
td(on)
10%
10%
90%
tr
90%
td(off)
90%
10%
t
f
7
Page 8
2SK3155
Package Dimensions
Unit: mm
1.2 ± 0.2
1.4 ± 0.2
0.7 ± 0.1
2.54 ± 0.5
10.0 ± 0.3
7.0 ± 0.3
φ
3.2 ± 0.2
12.0 ± 0.3
2.0 ± 0.3
5.0 ± 0.3
2.54 ± 0.5
4.45 ± 0.3
2.7
0.6
2.8 ± 0.2
2.5 ± 0.2
17.0 ± 0.3
14.0 ± 1.0
0.5 ± 0.1 Hitachi Code
EIAJ
JEDEC
TO–220FM
SC–67
8
Page 9
Cautions
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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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