Silicon N Channel MOS FET
High Speed Power Switching
Features
• Low on-resistance
RDS = 100 mΩ typ.
• High speed switching
• 4 V gate drive device can be driven from 5 V source
Outline
ADE-208-768C (Z)
4th. Edition
Februaty 1999
TO–220FM
G
D
1. Gate
2. Drain
1
2
3
S
3. Source
Page 2
2SK3155
Absolute Maximum Ratings (Ta = 25°C)
ItemSymbolRatingsUnit
Drain to source voltageV
Gate to source voltageV
Drain currentI
Drain peak currentI
Body-drain diode reverse drain current I
Avalanche currentI
Avalanche energyE
Channel dissipationPch
DSS
GSS
D
D(pulse)
DR
Note3
AP
Note3
AR
Note1
Note2
Channel temperatureTch150°C
Storage temperatureTstg–55 to +150°C
Note:1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50 Ω
Electrical Characteristics (Ta = 25°C)
150V
±20V
15A
60A
15A
15A
16mJ
30W
ItemSymbol MinTypMaxUnitTest Conditions
Drain to source breakdown voltage V
Gate to source breakdown voltage V
Gate to source leak currentI
Zero gate voltege drain currentI
Gate to source cutoff voltageV
Static drain to source on stateR
resistanceR
1.0—2.5VID = 1 mA, VDS = 10 V
—0.100.13ΩID = 8 A, VGS = 10 V
—0.120.15ΩID = 8 A, VGS = 4 V
Forward transfer admittance|yfs|8.514—SID = 8 A, VDS = 10 V
Input capacitanceCiss—850—pFVDS = 10 V
Output capacitanceCoss—300—pFVGS = 0
Reverse transfer capacitanceCrss—160—pFf = 1 MHz
Turn-on delay timet
Rise timet
Turn-off delay timet
Fall timet
Body–drain diode forward voltageV
Body–drain diode reverse
recovery time
t
d(on)
r
d(off)
f
DF
rr
—13—nsID = 8 A, VGS = 10 V
—100—nsRL = 3.75 Ω
—195—ns
—110—ns
—0.9—VIF = 15 A, VGS = 0
—140—nsIF = 15 A, VGS = 0
diF/ dt = 50 A/ µs
Note:4. Pulse test
Note4
Note4
Note4
2
Page 3
Main Characteristics
2SK3155
Power vs. Temperature Derating
40
30
20
10
Channel Dissipation Pch (W)
0
50100150200
Case Temperature Tc (°C)
Typical Output Characteristics
20
10 V
5 V
4 V
16
Pulse Test
3.5 V
500
200
100
50
D
20
10
5
2
1
0.5
0.2
0.1
0.05
0.1
Operation in
this area is
limited by R
Ta = 25°C
0.3
Drain Current I (A)
PW = 10 ms(1shot)
DC Operation
(Tc = 25°C)
DS(on)
1
3
Drain to Source Voltage V (V)
Typical Transfer Characteristics
20
Maximum Safe Operation Area
V = 10 V
DS
Pulse Test
16
10
100 µs
1 ms
30
10 µs
DS
1000
300100
D
12
8
Drain Current I (A)
4
0
246810
Drain to Source Voltage V (V)
3 V
V = 2.5 V
GS
DS
D
12
8
Drain Current I (A)
4
0
75°C
12345
Gate to Source Voltage V (V)
25°C
Tc = –25°C
GS
3
Page 4
2SK3155
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
5
Pulse Test
4
DS(on)
V (V)
3
2
1
I = 15 A
D
10 A
Drain to Source Saturation Voltage
0
48
12
1620301001103
Gate to Source Voltage V (V)
Static Drain to Source on State Resistance
vs. Temperature
0.5
Pulse Test
Ω
0.4
DS(on)
R ( )
0.3
I = 10 A
D
0.2
V = 4 V
GS
10 A5 A
0.1
10 V
0
Static Drain to Source on State Resistance
–4004080120160
Case Temperature Tc (°C)
5 A
GS
5 A
Static Drain to Source on State Resistance
vs. Drain Current
1.0
Pulse Test
0.5
DS(on)
0.2
R ( )Ω
V = 4 V
GS
0.1
10 V
0.05
0.02
Drain to Source On State Resistance
0.01
0.10.3
Drain Current I (A)
D
Forward Transfer Admittance vs.
Drain Current
1000
fs
300
Tc = –25 °C
100
30
75 °C
1
0.3
Forward Transfer Admittance |y | (S)
0.1
0.1
0.2
0.5
2
1
Drain Current I (A)
V = 10 V
DS
Pulse Test
10
520
D
25 °C
50 100
4
Page 5
2SK3155
Body–Drain Diode Reverse
Recovery Time
500
di / dt = 50 A / µs
V = 0, Ta = 25 °C
200
GS
100
50
20
10
Reverse Recovery Time trr (ns)
5
0.10.512100.25
Reverse Drain Current I (A)
DR
20
Typical Capacitance vs.
Drain to Source Voltage
10000
3000
1000
Ciss
300
100
Capacitance C (pF)
30
V = 0
GS
Coss
Crss
f = 1 MHz
10
01020304050
Drain to Source Voltage V (V)
DS
200
I = 15A
D
V
160
DS
V = 100 V
DD
50 V
GS
25 V
120
Dynamic Input Characteristics
V
DS
80
40
Drain to Source Voltage V (V)
0
V = 100 V
DD
50 V
25 V
20406080100
Gate Charge Qg (nc)
20
1000
Switching Characteristics
500
16
GS
t
d(off)
200
12
8
4
0
100
50
20
Switching Time t (ns)
Gate to Source Voltage V (V)
10
5
0.1 0.2
0.5
Drain Current I (A)
V = 10 V, V = 30 V
GS
DD
PW = 5 µs, duty < 1 %
t
f
t
r
t
d(on)
2
1
5
10
D
20
5
Page 6
2SK3155
Reverse Drain Current vs.
Source to Drain Voltage
20
16
DR
12
10 V
8
5 V
V = 0, –5 V
GS
4
Reverse Drain Current I (A)
0
0.40.81.21.62.0
Pulse Test
Source to Drain Voltage V (V)
SD
Maximun Avalanche Energy vs.
Channel Temperature Derating
20
I = 15 A
AP
AR
16
V = 50 V
DD
duty < 0.1 %
Rg > 50
Ω
12
8
4
0
Repetitive Avalanche Energy E (mJ)
255075100125150
Channel Temperature Tch (°C)
Vin
15 V
Avalanche Test CircuitAvalanche Waveform
V
DSS
V – V
DSSDD
AR
1
2
V
DS
L
E = • L • I •
AP
2
Monitor
I
AP
Monitor
I
Rg
D. U. T
V
DD
AP
V
I
D
50Ω
V
DD
0
V
DS
(BR)DSS
6
Page 7
2SK3155
Normalized Transient Thermal Impedance vs. Pulse Width
3
s (t)
1
γ
D = 1
0.5
0.3
0.2
0.1
0.1
0.05
0.03
Normalized Transient Thermal Impedance
0.01
10 µ
0.02
0.01
1shot pulse
100 µ1 m10 m
Pulse Width PW (S)
Switching Time Test Circuit Waveform
Tc = 25°C
θ γ θ
ch – c(t) = s (t) • ch – c
θ
ch – c = 4.17°C/W, Tc = 25°C
P
DM
PW
T
D =
100 m110
PW
T
Vin Monitor
Vin
10 V
50Ω
D.U.T.
R
L
V
DD
= 30 V
Vout
Monitor
Vin
Vout
td(on)
10%
10%
90%
tr
90%
td(off)
90%
10%
t
f
7
Page 8
2SK3155
Package Dimensions
Unit: mm
1.2 ± 0.2
1.4 ± 0.2
0.7 ± 0.1
2.54 ± 0.5
10.0 ± 0.3
7.0 ± 0.3
φ
3.2 ± 0.2
12.0 ± 0.3
2.0 ± 0.3
5.0 ± 0.3
2.54 ± 0.5
4.45 ± 0.3
2.7
0.6
2.8 ± 0.2
2.5 ± 0.2
17.0 ± 0.3
14.0 ± 1.0
0.5 ± 0.1
Hitachi Code
EIAJ
JEDEC
TO–220FM
SC–67
—
8
Page 9
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore): http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.