Datasheet 2N5401HR Datasheet (ST)

Hi-Rel PNP bipolar transistor 150 V - 0.5 A
Features
BV
CEO
IC (max) 0.5 A
H
at 10 V - 150 mA > 60
FE
Operating temperature range -65°C to +200°C
150 V
2N5401HR
3
1
2
3
TO-18 LCC-3
3
1
2
Hi-Rel PNP bipolar transistor
Linear gain characteristics
European preferred part list - EPPL
100 krad low dose rate
Radiation level: lot specific total dose contact

Figure 1. Internal schematic diagram

4
1
2
LCC-3UB
marketing for specified level
Description
The 2N5401HR is a silicon planar epitaxial PNP transistor in TO-18 and LCC-3 packages. It is specifically designed for aerospace Hi-Rel applications and ESCC qualified according to the 5202-014 specification. In case of conflict between this datasheet and ESCC detailed specification, the latter prevails.

Table 1. Device summary

Order codes ESCC Part num. Quality Level Rad level Packages Lead Finish Mass (g) EPPL
2N5401UB1 - Eng. Model LCC-3UB Gold 0.06 -
SOC5401SW 5202/014/07 ESCC Flight 100 krad LCC-3 Solder Dip 0.06 Y
2N5401UB06 5202/014/06 ESCC Flight LCC-3UB Gold 0.06 -
2N5401UB07 5202/014/07 ESCC Flight LCC-3UB Solder Dip 0.06 -
SOC5401 - Eng. Model LCC-3 Gold 0.06 -
SOC5401HRB 5202/014/04 or 05 ESCC Flight LCC-3 Gold/Solder Dip
(1)
0.06 Y
2N5401/T1 - Eng. Model TO-18 Gold 0.40 -
2N5401HR 5202/014/01 or 02 ESCC Flight TO-18 Gold/Solder Dip
1. Depending ESCC part number mentioned on the purchase order.
(1)
0.40 -
July 2010 Doc ID 16934 Rev 2 1/10
www.st.com
10
Electrical ratings 2N5401HR

1 Electrical ratings

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit
V
V
V
Collector-base voltage (IE = 0) -160 V
CBO
Collector-emitter voltage (IB = 0) -150 V
CEO
Emitter-base voltage (IC = 0) -5 V
EBO
Collector current
I
for 2N5401HR
C
for SOC5401HRB
Total dissipation at T
amb
25 °C
for 2N5401HR
P
for SOC5401HRB
TOT
for SOC5401HRB
(1)
-0.6
-0.5
0.36
0.36
0.58 Total dissipation at Tc 25 °C for 2N5401HR
T
1. When mounted on a 8x10x0.6 mm ceramic substrate.
Storage temperature -65 to 200 °C
STG
T
Max. operating junction temperature 200 °C
J
1.2

Table 3. Thermal data for through-hole package

Symbol Parameter Value Unit
R R
Thermal resistance junction-case __ max
thJC
Thermal resistance junction-ambient __ max
thJA
146 486
°C/W °C/W
A A
W W W
W

Table 4. Thermal data for SMD package

Symbol Parameter Value Unit
R
1. When mounted on a 8x10x0.6 mm ceramic substrate.
2/10 Doc ID 16934 Rev 2
Thermal resistance junction-ambient __ max
thJA
Thermal resistance junction-ambient
(1)
__ max
486 302
°C/W °C/W
2N5401HR Electrical characteristics

2 Electrical characteristics

T
= 25 °C unless otherwise specified.
case

Table 5. Electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit
I
CBO
I
EBO
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
V
CE(sat)
V
BE(sat)
h
FE
Collector-base cut-off current (I
= 0)
E
Emitter-base cut-off current (I
= 0)
C
= -120 V
V
CB
V
= -120 V TC = 150 °C
CB
= -3 V -50 nA
V
EB
-50
-50nAµA
Collector-base breakdown voltage
= 0)
(I
E
= -100 µA -160 V
I
C
Collector-emitter
(1)
breakdown voltage (I
= 0)
B
= -1 mA -150 V
I
C
Emitter-base breakdown voltage
= 0)
(I
C
Collector-emitter
(1)
saturation voltage
Base-emitter
(1)
saturation voltage
(1)
DC current gain
h
fe
Small signal current gain
= -10 µA -5 V
I
E
= -10 mA IB = -1 mA
I
C
IC = -50 mA IB = -5 mA
= -10 mA IB = -1 mA
I
C
IC = -50 mA IB = -5 mA
= -1 mA V
I
C
IC = -10 mA V I
= -50 mA V
C
IC = -10 mA V T
= -55 °C
amb
= -10 V IC = -10 mA
V
CE
CE
CE
CE
CE
= -5 V = -5 V = -5 V = -5 V
f = 10 kHz
50 60 60 20
5
-0.2
-0.5
-1
-1
240
V V
V V
C
obo
1. Pulsed duration = 300 µs, duty cycle 2 %
Output capacitance (I
= 0)
E
V
Doc ID 16934 Rev 2 3/10
= -10 V f = 1 MHz 6 pF
CB
Package mechanical data 2N5401HR

3 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
www.st.com
.
4/10 Doc ID 16934 Rev 2
2N5401HR Package mechanical data
LCC-3 mechanical data
Dim.
Min. Typ. Max.
A 1.16 1.42
C 0.45 0.50 0.56
D0.600.760.91
E0.911.011.12
F1.952.03 2.11
G2.92 3.05 3.17
I 2.41 2.54 2.66
J 0.42 0.57 0.72
K1.371.521.67
L 0.40 0.50 0.60
M 2.46 2.54 2.62
N1.801.902.00
R0.30
N
mm.
0041211
Doc ID 16934 Rev 2 5/10
Package mechanical data 2N5401HR
LCC-3UB mechanical data
Dim.
A1.16 1.42
C 0.46 0.51 0.56
D 0.56 0.76 0.96
E0.92 1.02 1.12
F1.952.03 2.11
G2.92 3.05 3.18
I 2.41 2.54 2.67
J 0.42 0.57 0.72
K1.37 1.52 1.67
L 0.41 0.51 0.61
M 2.46 2.54 2.62
N1.811.91 2.01
r0.20
r1 0.30
r2 0.56
Min. Typ. Max.
mm.
6/10 Doc ID 16934 Rev 2
8206487
2N5401HR Package mechanical data
D
Doc ID 16934 Rev 2 7/10
Order codes 2N5401HR

4 Order codes

Table 6. Order codes

Order codes
2N5401UB1 - LCC-3UB Gold 2N5401UB1 - Waffle pack
SOC5401SW 5202/014/07 100 krad LCC-3 Solder Dip 520201407 Y Waffle pack
2N5401UB06 5202/014/06 LCC-3UB Gold 520201406 - Waffle pack
2N5401UB07 5202/014/07 LCC-3UB Solder Dip 520201407 - Waffle pack
SOC5401 - LCC-3 Gold SOC5401 - Waffle pack
SOC5401HRB
2N5401/T1 - TO-18 Gold 2N5401/T1 - Strip pack
2N5401HR
1. Depending ESCC part number mentioned on the purchase order.
ESCC Part
number
5202/014/04
or 05
5202/014/01
or 02
Radiation
level
Packages Lead Finish Marking EPPL Packing
(1)
LCC-3 Gold/Solder Dip
TO-18 Gold/Solder Dip
520201404 or 05 Y Waffle pack
(1)
520201401 or 02 - Strip pack
Contact ST sales office for information about the specific conditions for:
Products in die form
Tape and reel packing
8/10 Doc ID 16934 Rev 2
2N5401HR Revision history

5 Revision history

Table 7. Document revision history

Date Revision Changes
04-Jan-2010 1 Initial release
26-Jul-2010 2 Modified
Table 1 on page 1
, added
Table 6 on page 8
Doc ID 16934 Rev 2 9/10
2N5401HR
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