Danfoss Mold Module Fact sheet

Fact sheet

Mold Module

The solid, flexible basis for power electronics systems

Advanced technology			Key characteristics
• Fully automotive compliant	•	Weightand volume reduction	and applications
(AEC-Q100)	• Very high mechanical robustness		The Mold Module provides a universal
• Less production steps, faster	•	Increased cycling capability	platform which can integrate various
assembling		(temperature shocks and load	electrical circuits and any kind of
• Minimised material usage: copper		cycling)	semiconductor technology.
base plate, soft molding and	•	Pressfit connections instead
bondable frame eliminated		of solder pins	Pressfit pins assure reliable electrical
			connections, no soldering of the
			electrical contacts.

Circuit examples

Inverter leg

Fullbridge

Complete inverter

Due to its robust and lightweight conception, the Mold Module is particularly suited for applications with harsh environmental conditions:

•Automotive and heavy duty vehicles

•Inverters for traction and auxiliaries

•Solar inverters

•Uninterruptible power supplies

siliconpower.danfoss.com

Speci cations

Module information
Isolation test voltage terminals to bottom area (AC 50 Hz 1 minute)	3000	V
Material for internal insulation	AL203
Thickness of insulation material	0.32	mm
Creepage distance terminal to bottom side of module	9.5	mm
Creepage distance terminal to terminal	2.7	mm
Clearance terminal to bottom side of module	8.2	mm
Clearance terminal to terminal	1.1	mm
Comparative tracking index of the mold compound (CTI)	> 400
RoHs compliant	yes
Lead free	yes
UL flammability standard	94 - V0
Maximum ratings
Ambient temperature	-40 to + 125	°C
Allowable continuous current on one connection pin	50	Arms
Reliability
Vibration and shock	Automotive profile
Thermal cycles -40°C / +125° C 30 min	1000	---
Pressfit qualification	IEC-60352-5

Package dimensions

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Danfoss Silicon Power GmbH, Husumer Strasse 251, 24941 Flensburg, Germany, Tel. [phone], Fax [phone] www.siliconpower.danfoss.com, E-mail: [e-mail]

DKSP.PFP.400.A3.02

Produced for DSP 2016.04