Conexant P9573, LSD20463 Datasheet

Doc. No. 100475A October 28, 1999
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SmartHCF Mobile Modem Designer’s Guide
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Information provided by Conexant Sys t ems, Inc. is believed to be accurate and reliable. However, no responsibility is assumed by Conexant for its use, nor any infri ngem ent of patents, copyright s, or other rights of third parti es which may result from its use. No license is granted by implication or otherwise under any patent rights or copyright of Conexant other than for circuitry embodied in Conexant products. Conexant reserves the right to change circuitry at any time wi thout notice. This document is subject to change wit h out notice.
Conexant products are not designed or i nt ended for use in life support appliances, devices, or systems where malfunction of a Conexant product can reasonably be expected t o result in personal injury or death. Conexant cus t omers using or selling Conexant products for use in such applications do so at their own risk and agree to fully i ndem ni fy Conexant for any damages resul ting from such improper use or s al e.
K56flex is a trademark of Conexant Systems, Inc. and Lucent Technologies. Conexant, the Conexant C sym bol , “What's Next in Communic at ions Technologies”, SmartDAA, SmartHCF, and SmartHSF are t radem arks
of Conexant Systems, Inc.
Product names or servic es listed in this public ation are for identification purpos es only, and may be trademarks or regi stered trademarks of third parties [their respec tive companies]. Al l other marks mentioned herein are the property of their respective [holders] owners.
©1999, Conexant Systems , Inc. All Rights Reserved
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Table of Contents
1. INTRODUCTION................................................................................................................................................. 1-1
1.1 OVERVIEW.............................................................................................................................................. 1-1
1.2 FEATURES.............................................................................................................................................. 1-4
1.2.1 General Modem Features.......................................................................................................... 1-4
1.2.2 PCI Bus Host Interface Features ............................................................................................... 1-4
1.2.3 SmartDAA Features................................................................................................................... 1-5
1.2.4 Applications................................................................................................................................ 1-5
1.3 TECHNICAL OVERVIEW......................................................................................................................... 1-5
1.3.1 General Description................................................................................................................... 1-5
1.3.2 Host Modem Software................................................................................................................ 1-5
1.3.3 Operating Modes........................................................................................................................ 1-5
Data/Fax Modes................................................................................................................ 1-5
Synchronous Access Mode (SAM) - Video Conferencing................................................. 1-6
TAM Mode......................................................................................................................... 1-6
Voice/Speakerphone Mode (S Models) ............................................................................ 1-6
1.3.4 Reference Design...................................................................................................................... 1-6
1.4 HARDWARE DESCRIPTION................................................................................................................... 1-6
1.4.1 Host Side Device (HSD)............................................................................................................. 1-6
1.4.2 Digital Isolation Barrier (DIB) (OEM Supplied)........................................................................... 1-7
1.4.3 SmartDAA Line Side Device (LSD)............................................................................................1-7
1.4.4 Voice Codec (VC) (S Models).................................................................................................... 1-7
2. TECHNICAL SPECIFICATIONS ........................................................................................................................ 2-1
2.1 ESTABLISHING DATA MODEM CONNECTIONS................................................................................... 2-1
Dialing............................................................................................................................... 2-1
Modem Handshaking Protocol.......................................................................................... 2-1
Call Progress Tone Detection........................................................................................... 2-1
Answer Tone Detection..................................................................................................... 2-1
Ring Detection................................................................................................................... 2-1
Billing Protection ............................................................................................................... 2-1
Connection Speeds........................................................................................................... 2-1
Automode.......................................................................................................................... 2-1
2.2 DATA MODE............................................................................................................................................ 2-1
Speed Buffering (Normal Mode) .......................................................................................2-1
DTE-to-Modem Flow Control............................................................................................. 2-1
Escape Sequence Detection............................................................................................. 2-1
GSTN Cleardown (V.90/K56flex, V.34, V.32 bis, V.32)..................................................... 2-2
Fall Forward/Fallback (V.90/K56flex, V.34/V.32 bis/V.32)................................................ 2-2
Retrain............................................................................................................................... 2-2
2.3 ERROR CORRECTION AND DATA COMPRESSION............................................................................. 2-2
V.42 Error Correction........................................................................................................ 2-2
MNP 2-4 Error Correction ................................................................................................. 2-2
V.42 bis Data Compression .............................................................................................. 2-2
MNP 5 Data Compression ................................................................................................2-2
2.4 FAX CLASS 1 OPERATION..................................................................................................................... 2-2
2.5 VOICE/TAM MODE.................................................................................................................................. 2-2
2.5.1 Online Voice Command Mode................................................................................................... 2-2
2.5.2 Voice Receive Mode.................................................................................................................. 2-3
2.5.3 Voice Transmit Mode....................................................................................................... .......... 2-3
2.5.4 Speakerphone Modes................................................................................................................ 2-3
2.6 FULL-DUPLEX SPEAKERPHONE (FDSP) MODE.................................................................................. 2-3
2.7 CALLER ID............................................................................................................................................... 2-3
2.8 MULTIPLE COUNTRY SUPPORT (W MODELS).................................................................................... 2-3
2.8.1 OEM Programmable Parameters............................................................................................... 2-3
2.8.2 Blacklist Parameters.................................................................................................................. 2-4
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2.9 DIAGNOSTICS......................................................................................................................................... 2-4
2.9.1 Commanded Tests..................................................................................................................... 2-4
2.10 LOW POWER SLEEP MODE...................................................................................................................2-4
3. HARDWARE INTERFACE ................................................................................................................................. 3-1
3.1 HSD (P9573) HARDWARE PINS AND SIGNALS.................................................................................... 3-1
3.1.1 HSD Signal Interfaces................................................................................................................ 3-1
PCI Bus/MiniPCI/CardBus Host Interface......................................................................... 3-1
Power Detection and Switching ........................................................................................ 3-1
Serial EEPROM Interface ................................................................................................. 3-1
LSD Interface (Through DIB) ............................................................................................3-2
VC Interface (S Models).................................................................................................... 3-2
Telephone Handset Interface (S Models) ......................................................................... 3-2
Call Progress Speaker Interface....................................................................................... 3-2
3.1.2 HSD Interface Signals, Pin Assignments, and Signal Definitions.............................................. 3-2
3.2 LSD (20463) HARDWARE PINS AND SIGNALS................................................................................... 3-11
3.2.1 LSD Signal Interfaces .............................................................................................................. 3-11
HSD Interface (Through DIB).......................................................................................... 3-11
Telephone Line Interface ................................................................................................ 3-11
3.2.2 LSD Interface Signals, Pin Assignments, and Signal Definitions............................................. 3-11
3.3 VC (20437) HARDWARE
PINS AND SIGNALS (S MODELS)............................................................... 3-16
3.3.1 VC Signal Interfaces ................................................................................................................ 3-16
Speakerphone Interface.................................................................................................. 3-16
Telephone Handset/Headset Interface ........................................................................... 3-16
HSD Interface.................................................................................................................. 3-16
3.3.2 VC Interface Signals, Pin Assignments, and Signal Definitions............................................... 3-16
3.4 ELECTRICAL, ENVIRONMENTAL, AND TIMING SPECIFICATIONS................................................... 3-22
3.4.1 Operating Conditions and Absolute Maximum Ratings............................................................ 3-22
Caution: Handling CMOS Devices.................................................................................. 3-22
3.4.2 PCI BUS ELECTRICAL, SWITCHING, AND TIMING CHARACTERISTICS............................ 3-22
3.4.3 SERIAL EEPROM INTERFACE TIMING................................................................................. 3-23
4. CRYSTAL SPECIFICATIONS.......................................................................................................................... 4-25
5. LAYOUT GUIDELINES....................................................................................................................................... 5-1
5.1 EMI CONSIDERATIONS.......................................................................................................................... 5-1
5.1.1 General...................................................................................................................................... 5-1
5.1.2 Filtering...................................................................................................................................... 5-1
5.1.3 Decoupling................................................................................................................................. 5-2
5.1.4 Optional Configurations ............................................................................................................. 5-2
5.2 GENERAL LAYOUT GUIDELINES FOR A 2-LAYER PCI BOARD.......................................................... 5-3
5.2.1 Placing Components.................................................................................................................. 5-3
5.2.2 Power......................................................................................................................................... 5-4
5.2.3 Grounds..................................................................................................................................... 5-4
5.2.4 Trace Widths.............................................................................................................................. 5-4
5.2.5 Trace Spacing............................................................................................................................ 5-4
5.2.6 Trace Routing ............................................................................................................................ 5-5
5.3 SPECIFIC LAYOUT GUIDELINES FOR A 6-LAYER MINI PCI BOARD.................................................. 5-6
5.3.1 Digital Section............................................................................................................................ 5-6
Crystal Circuit.................................................................................................................... 5-6
DIB Interface..................................................................................................................... 5-6
MiniPCI Signal Routing..................................................................................................... 5-6
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5.3.2 DAA Section............................................................................................................................... 5-6
DAA Isolation Gap............................................................................................................. 5-6
DAA Section Grounding.................................................................................................... 5-7
DIB Interface..................................................................................................................... 5-7
DC Hold and Impedance Match Interface......................................................................... 5-7
Diode Bridge ..................................................................................................................... 5-7
VC and VREF Circuit ........................................................................................................5-7
Telephone Line Interface .................................................................................................. 5-7
Handset Interface (Optional)............................................................................................. 5-8
5.4 PACKAGE DIMENSIONS....................................................................................................................... 5-11
6. HOST SOFTWARE INTERFACE ....................................................................................................................... 6-1
6.1 PCI CONFIGURATION REGISTERS....................................................................................................... 6-1
6.1.1 0x00 - Vendor ID Field............................................................................................................... 6-2
6.1.2 0x02 - Device ID Field................................................................................................................ 6-2
6.1.3 0x04 - Command Register......................................................................................................... 6-2
6.1.4 0x06 - Status Register ............................................................................................................... 6-3
6.1.5 0x08 - Revision ID Field............................................................................................................. 6-3
6.1.6 0x09 - Class Code Field............................................................................................................. 6-3
6.1.7 0x0D - Latency Timer Register .................................................................................................. 6-3
6.1.8 0x0E - Header Type Field.......................................................................................................... 6-3
6.1.9 0x28 - CIS Pointer Register ....................................................................................................... 6-3
6.1.10 0x2C - Subsystem Vendor ID Register...................................................................................... 6-4
6.1.11 0x2E- Subsystem ID Register.................................................................................................... 6-4
6.1.12 0x34 - Cap Ptr............................................................................................................................ 6-4
6.1.13 0x3C - Interrupt Line Register.................................................................................................... 6-4
6.1.14 0x3D - Interrupt Pin Register...................................................................................................... 6-4
6.1.15 0x3E - Min Grant Register.......................................................................................................... 6-4
6.1.16 0x3F - Max Latency Register..................................................................................................... 6-4
6.1.17 0x40 - Capability Identifier ......................................................................................................... 6-4
6.1.18 0x41 - Next Item Pointer ............................................................................................................ 6-4
6.1.19 0x42 - PMC - Power Management Capabilities ......................................................................... 6-5
6.1.20 0x44 - PMCSR - Power Management Control/Status Register (Offset = 4)............................... 6-5
6.1.21 0x46 - PMCSR_BSE - PMCSR PCI to PCI Bridge Support Extensions..................................... 6-6
6.1.22 0x47 - Data ................................................................................................................................ 6-6
6.2 BASE ADDRESS REGISTER .................................................................................................................. 6-6
6.3 SERIAL EEPROM INTERFACE............................................................................................................... 6-7
6.3.1 Supported EEPROM Sizes........................................................................................................ 6-7
6.3.2 Definitions.................................................................................................................................. 6-8
Device ID Register............................................................................................................ 6-8
Vendor ID Register............................................................................................................ 6-8
Subsystem Vendor ID and Subsystem Device Register................................................... 6-8
Min_Gnt Register.............................................................................................................. 6-8
Max_Lat Register.............................................................................................................. 6-9
PMC [8:6] and PME DRV Type......................................................................................... 6-9
Class Code Register (Class Code, Sub-class Code, Prog. I/F)........................................ 6-9
CardBus CIS Pointer (CardBus CIS pointer High, CardBus CIS pointer Low).................. 6-9
Data Register (D3, D2, D1, D0 power consumed and D3, D2, D1, D0 power
dissipated)......................................................................................................................... 6-9
Load CISRAM Count (CIS _SIZE) .................................................................................... 6-9
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List of Figures
Figure 1-1. SmartHCF Modem Simplified Interface Diagram................................................................................................... 1-2
Figure 1-2. SmartHCF Modem Major Interfaces....................................................................................................................... 1-3
Figure 3-1. HSD (P9573) 100-Pin TQFP Hardware Interface Signals...................................................................................... 3-3
Figure 3-2. HSD (P9573) 100-Pin TQFP Pin Signals............................................................................................................... 3-4
Figure 3-3. LSD (20463) 32-Pin TQFP Hardware Interface Signals....................................................................................... 3-12
Figure 3-4. LSD (20463) 32-Pin TQFP Pin Signals................................................................................................................ 3-12
Figure 3-5. VC (20437) 32-Pin TQFP Hardware Interface Signals......................................................................................... 3-17
Figure 3-6. VC (20437) 32-Pin TQFP Pin Signals.................................................................................................................. 3-17
Figure 3-7. Waveforms - Serial EEPROM Interface............................................................................................................... 3-23
Figure 5-1. PCICLK Guard Band Technique............................................................................................................................ 5-9
Figure 5-2. Crystal Solution...................................................................................................................................................... 5-9
Figure 5-3. Power and Ground Distribution............................................................................................................................ 5-10
Figure 5-4. Bridge Connections.............................................................................................................................................. 5-10
Figure 5-5. Package Dimensions - 100-Pin TQFP................................................................................................................. 5-11
Figure 5-6. Package Dimensions - 32-pin TQFP.................................................................................................................... 5-12
List of Tables
Table 1-1. SmartHCF Modem Models and Functions.............................................................................................................. 1-2
Table 3-1. HSD (P9573) 100-Pin TQFP Pin Signals................................................................................................................ 3-5
Table 3-2. HSD (P9573) 100-pin TQFP Pin Signal Definitions ................................................................................................ 3-7
Table 3-3. LSD (20463) 32-Pin TQFP Pin Signals................................................................................................................. 3-13
Table 3-4. LSD (20463) 32-Pin TQFP Pin Signal Definitions................................................................................................. 3-14
Table 3-5. LSD (20463) Digital Electrical Characteristics....................................................................................................... 3-15
Table 3-6. VC (20437) 32-Pin TQFP Pin Signals................................................................................................................... 3-18
Table 3-7. VC (20437) 32-Pin TQFP Pin Signal Definitions................................................................................................... 3-19
Table 3-8. VC Digital Electrical Characteristics...................................................................................................................... 3-21
Table 3-9. VC Analog Electrical Characteristics..................................................................................................................... 3-21
Table 3-10. Operating Conditions........................................................................................................................................... 3-22
Table 3-11. Absolute Maximum Ratings................................................................................................................................. 3-22
Table 3-12. Timing - Serial EEPROM Interface...................................................................................................................... 3-23
Table 4-1. Crystal Specifications - Surface Mount ................................................................................................................. 4-25
Table 4-2. Crystal Specifications - Through Hole................................................................................................................... 4-26
Table 6-1. PCI Configuration Registers.................................................................................................................................... 6-1
Table 6-2. Command Register ................................................................................................................................................. 6-2
Table 6-3. Status Register........................................................................................................................................................ 6-3
Table 6-4. Power Management Capabilities (PMC) Register................................................................................................... 6-5
Table 6-5. Power Management Control/Status Register (PMCSR).......................................................................................... 6-5
Table 6-6. HSD Address Map................................................................................................................................................... 6-6
Table 6-7. EEPROM Content for 256 Words by 16 Bits per Word........................................................................................... 6-7
Table 6-8. EEPROM Content for 128 Words by 16 Bits per Word........................................................................................... 6-7
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1.
INTRODUCTION
1.1
OVERVIEW
The Conexant SmartHCF Host-Controlled, V.90/K56flex Modem Device Family with SmartDAA technology supports analog data up to 56 kbps, analog fax to 14.4 kbps, telephone answering machine (TAM), voice/speakerphone (optional), and PCI Bus/MiniPCI/CardBus host interface operation. These modem devices meet the size and power requirements of the mobile environment. The modem operates with PSTN telephone lines in the U.S./Japan/Canada and optionally world-wide. Modem software is provided. Table 1-1 lists the available models.
Conexant's SmartDAA technology (patent pending) eliminates the need for a costly line transformer, relays, and opto­isolators typically used in discrete DAA (Data Access Arrangement) implementations. The SmartDAA architecture also simplifies product implementation by eliminating the need for country-specific board configurations enabling world-wide homologation of a single modem board design.
The SmartDAA system-powered DAA operates reliably without drawing power from the line, unlike line-powered DAAs which operate poorly when line current is insufficient due to long lines or poor line conditions. Enhanced features, such as monitoring of local extension status without going off-hook, are also supported.
Incorporating Conexant’s proprietary Digital Isolation Barrier (DIB) design (patent pending) and other innovative DAA features, such as Digital PBX line protection and reporting, the SmartDAA architecture simplifies application design, minimizes layout area, and reduces component cost.
For over a decade, Conexant has assisted customers with DAA technology and homologation. This expertise and system level approach has been leveraged in this product.
The SmartHCF device set, consisting of a Host Side Device (HSD) in a 100-pin TQFP and a Line Side Device (LSD) (SmartDAA device) in a 32-pin TQFP, supports data/fax/TAM operation with hardware-based digital signal processing and DAA/telephone line interface functions (Figure 1-1 ). The optional Voice Codec (VC), in a 32-pin TQFP, supports voice/full­duplex speakerphone (FDSP) operation with interfaces to a microphone, speaker, and telephone handset/headset. Figure 1-2 identifies the major hardware signal interfaces.
In V.90/K56flex data mode, the modem can receive data at speeds up to 56 kbps from a digitally connected V.90 or K56flex­compatible central site modem. In this mode, the modem can transmit data at speeds up to V.34 rates.
In V.34 data mode, the modem operates at line speeds up to 33.6 kbps. When applicable, error correction (V.42/MNP 2-4) and data compression (V.42 bis/MNP 5) maximize data transfer integrity and boost average data throughput. Non-error­correcting mode is also supported.
Fax Group 3 send and receive rates are supported up to 14.4 kbps with T.30 protocol. V.80 synchronous access mode supports host-controlled communication protocols, e. g., H.324 video conferencing. Audio recording and playback over the telephone line interface using A-Law, µ-Law, or linear coding at 8 kHz sample rate
supports applications such as remote digital telephone answering machine (TAM). This designer's guide describes the modem hardware capabilities and identifies the supporting commands. Commands and
parameters are defined in the Commands Reference Manual (Doc. No. 100498, formerly identified as Doc. No. 1118).
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Host Side
Device
(HSD) P9573
100-Pin TQFP
Line Side
Device (LSD)
(SmartDAA)
20463
32-Pin TQFP
Voice Codec
(VC)
20437
32-Pin TQFP
(Optional)
MIC SPEAKER
TIP RING
Telephone
Line
Interface
Discrete
Components
MD260F1_SID
Digital
Isolation
Barrier
(DIB)
PCI Bus/ Mini PCI/ CardBus
TIP RING
HANDSET (OPTIONAL)
TELEPHONE LINE
(OPTIONAL)
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1.2
FEATURES
1.2.1 General Modem Features
V.90 data modem with receive rates up to 56k bps and send rates up to V.34 rates
ITU-T V.90, K56flex, V.34 (33.6 kbps), V.32 bis, V.32, V.22 bis, V.22, V.23, and V.21; Bell 212A and 103
V.42 LAPM and MNP 2-4 error correction
V.42 bis and MNP 5 data compression
V.250 (ex V.25 ter) and V.251 (ex V.25 ter Annex A) commands
V.17 fax modem with send and receive rates up to 14.4 kbps
V.17, V.29, V.27 ter, and V.21 ch 2
EIA/TIA 578 Class 1 and T.31 Class 1.0 commands
Telephony/TAM
V.253 commands
8-bit µ-Law/A-Law coding (G.711)
8-bit/16-bit linear coding
8 kHz sample rate
Concurrent DTMF, ring, and Caller ID detection
V.80 synchronous access mode supports host-controlled communication protocols with H.324 interface support
V.8/V.8bis and V.251 (ex V.25 ter Annex A) commands
Data/Fax/Voice call discrimination
Full-duplex Speakerphone (FDSP) Mode (S models)
Microphone and speaker interface
Telephone handset/headset interface
Hardware-based digital signal processing
Single configuration profile stored in host
Operates in US/Japan/Canada
World-wide operation (W models)
Complies to TBR21 and other country requirements
Caller ID detection
System compatibilities
Windows 95, Windows 95 OSR2, Windows 98, Windows NT 4.0, Windows 2000 operating systems
Microsoft's PC 98 and PC 99 Design Initiative compliant
Advanced Configuration and Power Interface (ACPI)
Unimodem/V compliant
Pentium 133 MHz compatible PC or greater
16 Mbyte RAM or more
Thin packages support low profile designs
HSD (P9573): 100-pin TQFP (1.2 mm max. height)
LSD (20463): 32-pin TQFP (1.6 mm max. height)
VC (20437): 32-pin TQFP (1.6 mm max. height)
+3.3V operation with +5V tolerant digital inputs
1.2.2 PCI Bus Host Interface Features
32-bit PCI Bus host interface
Meets PCI Local Bus Specification Rev. 2.2
PCI Bus Mastering interface
33 MHz PCI clock support
Supports Power Management
Meets PCI Bus Power Management Spec. Rev. 1.1
ACPI Power Management Registers
APM support
PME# support
Vaux/Vpci power switching support
VauxDET support
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1.2.3 SmartDAA Features
Digital PBX line protection
System side powered DAA operates under poor line current supply conditions
Wake-on-ring
Ring detection
Line polarity reversal detection
Line current loss detection
Caller ID (CID) detection
Pulse dialing
Line-in-use detection – detects even while on-hook
Remote hang-up detect – for efficient call termination
Extension pickup detect
Call waiting detection
Meets world-wide DC VI Masks requirements (W models)
1.2.4 Applications
Laptop, notebook, and handheld computers
PCI Bus/Mini-PCI embedded system boards
PCI Bus/Mini-PCI/CardBus plug-in cards
1.3
TECHNICAL OVERVIEW
1.3.1 General Description
Modem operation, including dialing, call progress, telephone line interface, telephone handset interface, voice/speakerphone interface, and host interface functions are supported and controlled through the V.250, V.251, and V.253-compatible command set.
The modem hardware connects to the host processor via a PCI/MiniPCI/CardBus bus interface. The OEM adds a crystal circuit, EEPROM, DIB and LSD power rectifier and filter components, telephone line interface, optional telephone handset interface, optional voice/speakerphone interface, and other supporting discrete components as required by the modem model and the application to complete the system.
1.3.2 Host Modem Software
The host modem software performs the following tasks:
1. General modem control, which includes command sets, fax Class 1, TAM, voice/speakerphone, error correction, data compression, and operating system interface functions.
2. Modem data pump (MDP) control. Binary DSP executable code controlling MDP operation is downloaded as required during operation. Signal processing, including data and facsimile modulation and demodulation, as well as voice sample formatting, is performed in the hardware DSP.
3. SmartDAA control, which includes HSD SmartDAA Interface control, LSD configuration and control, telephone line interface parameter control, and telephone line impedance control.
Configurations of the modem software are provided to support modem models listed in Table 1-1.
1.3.3 Operating Modes
Data/Fax Modes
In V.90/K56flex data modem mode, the modem can receive data from a digital source using a V.90- or K56flex-compatible central site modem at line speeds up to 56 kbps. Asymmetrical data transmission supports sending data at line speeds up to V.34 rates. This mode can fallback to full-duplex V.34 mode, and to lower rates, as dictated by line conditions.
In V.34 data modem mode, the modem can operate in 2-wire, full-duplex, asynchronous modes at line rates up to 33.6 kbps. Data modem modes perform complete handshake and data rate negotiations. Using V.34 modulation to optimize modem configuration for line conditions, the modem can connect at the highest data rate that the channel can support from 33600 bps down to 2400 bps with automatic fallback. Automode operation in V.34 is provided in accordance with PN3320 and in V.32 bis in accordance with PN2330. All tone and pattern detection functions required by the applicable ITU or Bell standard are supported.
In V.32 bis data modem mode, the modem can operate at line speeds up to 14.4 kbps.
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In fax modem mode, the modem can operate in 2-wire, half-duplex, synchronous modes and can support Group 3 facsimile send and receive speeds of 14400, 12000, 9600, 7200, 4800, and 2400 bps. Fax data transmission and reception performed by the modem are controlled and monitored through the EIA/TIA-578 Class 1 or T.31 Class 1.0 command interface. Full HDLC formatting, zero insertion/deletion, and CRC generation/checking are provided.
Synchronous Access Mode (SAM) - Video Conferencing
V.80 Synchronous Access Mode between the modem and the host/DTE is provided for host-controlled communication protocols, e.g., H.324 video conferencing applications.
Voice-call-first (VCF) before switching to a videophone call is also supported.
TAM Mode
TAM Mode features include 8-bit µ-Law, A-Law, and linear coding at 8 kHz sample rate. Full-duplex voice supports concurrent voice receive and transmit. Tone detection/generation, call discrimination, and concurrent DTMF detection are also supported. This mode supports applications such as digital TAM, voice annotation, and recording from and playback to the telephone line. ADPCM (4-bit IMA) coding is also supported to meet Microsoft WHQL logo requirements.
TAM Mode is supported by three submodes:
1. Online Voice Command Mode supports connection to the telephone line or, for S models, a microphone/speaker/handset/headset.
2. Voice Receive Mode supports recording voice or audio data input from the telephone line or, for S models, a microphone/handset/headset.
3. Voice Transmit Mode supports playback of voice or audio data to the telephone line or, for S models, a speaker/handset/headset.
Voice/Speakerphone Mode (S Models)
The S models include additional telephone handset, external microphone, and external speaker interfaces which support voice and full-duplex speakerphone (FDSP) operation.
Hands-free full-duplex telephone operation is supported in Speakerphone Mode under host control. Speakerphone Mode features an advanced proprietary speakerphone algorithm which supports full-duplex voice conversation with acoustic, line, and handset echo cancellation. Parameters are constantly adjusted to maintain stability with automatic fallback from full­duplex to pseudo-duplex operation. The speakerphone algorithm allows position independent placement of microphone and speaker. The host can separately control volume, muting, and AGC in microphone and speaker channels.
1.3.4 Reference Design
A MiniPCI Type IIIB data/fax/TAM reference design board is available to minimize application design time and costs. The board is pretested to pass FCC Part 15, Part 68, and CTR 21 for immediate manufacturing. A design package for the board is available in electronic form. The design package includes schematics, bill of materials
(BOM), vendor parts list (VPL), board layout files in Gerber format, and complete documentation. The design can also be used for the basis of a custom design by the OEM to accelerate design completion for rapid market
entry.
1.4
HARDWARE DESCRIPTION
SmartDAA technology (patent pending) eliminates the need for a costly analog transformer, relays, and opto-isolators that are typically used in discrete DAA implementations. The programmable SmartDAA architecture simplifies product implementation in world-wide markets by eliminating the need for country-specific components.
1.4.1 Host Side Device (HSD)
The HSD, packaged in a 100-pin TQFP, includes a PCI/MiniPCI/CardBus Interface, a Modem Data Pump (MDP), and a SmartDAA Interface.
The PCI/MiniPCI/CardBus interface connects directly to an embedded or external PCI/MiniPCI/CardBus interface eliminating the need for additional external logic components.
The MDP performs telephone line signal modulation/demodulation in a hardware digital signal processor (DSP) which reduces computational load on the host processor. Downloadable architecture allows updating of MDP executable code.
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The SmartDAA Interface communicates with, and supplies power and clock to, the LSD through the DIB.
1.4.2 Digital Isolation Barrier (DIB) (OEM Supplied)
The DIB electrically DC isolates the HSD from the LSD and telephone line. The HSD is connected to a fixed digital ground and operates with standard CMOS logic levels. The LSD is connected to a floating ground and can tolerate high voltage input (compatible with telephone line and typical surge requirements).
The DIB power and clock transformer (PCXFMR) couples power and clock from the HSD to the LSD. (See Mobile Product Updates for qualified transformers.)
The DIB data channel supports bidirectional half-duplex serial transfer of data, control, and status information between the HSD and the LSD.
1.4.3 SmartDAA Line Side Device (LSD)
The LSD includes a Line Side DIB Interface (LSDI), a coder/decoder (codec), and a Telephone Line Interface (TLI). The LSDI communicates with, and receives power and clock from, the SmartDAA interface in the HSD through the DIB. LSD power is received from the DIB PCXFMR secondary winding through a half-wave rectifying diode and capacitive power
filter circuit. The CLK input is also accepted from the PCXFMR secondary winding through a capacitor and a resistor in series.
Information is transferred between the LSD and the HSD through the DIB_P and DIB_N pins. These pins connect to the HSD DIB_DATAP and DIB_DATAN pins, respectively, through the DIB.
The TLI integrates DAA and direct telephone line interface functions and connects directly to the line TIP and RING pins, as well as to external line protection components.
Direct LSD connection to TIP and RING allows real-time measurement of telephone line parameters, such as the telephone central office (CO) battery voltage, individual telephone line (copper wire) resistance, and allows dynamic regulation of the off­hook TIP and RING voltage and total current drawn from the central office (CO). This allows the modem to maintain compliance with U.S. and world-wide regulations and to actively control the DAA power dissipation.
1.4.4 Voice Codec (VC) (S Models)
The optional VC, packaged in a 32-pin TQFP, supports voice/full-duplex speakerphone (FDSP) operation with interfaces to a microphone and speaker and to a telephone handset/headset.
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2.
TECHNICAL SPECIFICATIONS
2.1
ESTABLISHING DATA MODEM CONNECTIONS
Dialing DTMF Dialing.
DTMF dialing using DTMF tone pairs is supported in accordance with ITU-T Q.23. The transmit tone level
complies with Bell Publication 47001.
Pulse Dialing.
Pulse dialing is supported in accordance with EIA/TIA-496-A.
Blind Dialing.
The modem can blind dial in the absence of a dial tone if enabled by the X0, X1, or X3 command.
Modem Handshaking Protocol
If a tone is not detected within the time specified in the S7 register after the last digit is dialed, the modem aborts the call attempt.
Call Progress Tone Detection
Ringback, equipment busy, and progress tones can be detected in accordance with the applicable standard represented by the country profile currently in affect.
Answer Tone Detection
Answer tone can be detected over the frequency range of 2100 ± 40 Hz in ITU-T modes and 2225 ± 40 Hz in Bell modes.
Ring Detection
A ring signal can be detected from a TTL-compatible square wave input (frequency is country-dependent).
Billing Protection
When the modem goes off-hook to answer an incoming call, both transmission and reception of data are prevented for a period of time determined by country requirement to allow transmission of the billing signal.
Connection Speeds
Data modem line speed can be selected using the +MS command in accordance with V.25 ter. The +MS command selects modulation, enables/disables automode, and selects transmit and receive minimum and maximum line speeds.
Automode
Automode detection can be enabled by the +MS command to allow the modem to connect to a remote modem in accordance with V.25 ter.
2.2
DATA MODE
Data mode exists when a telephone line connection has been established between modems and all handshaking has been completed.
Speed Buffering (Normal Mode)
Speed buffering allows a DTE to send data to, and receive data from, a modem at a speed different than the line speed. The modem supports speed buffering at all line speeds.
DTE-to-Modem Flow Control
If the modem-to-line speed is less than the DTE-to-modem speed, the modem supports XOFF/XON or RTS/CTS flow control with the DTE to ensure data integrity.
Escape Sequence Detection
The “+++” escape sequence can be used to return control to the command mode from the data mode. Escape sequence detection is disabled by an S2 Register value greater than 127.
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GSTN Cleardown (V.90/K56flex, V.34, V.32 bis, V.32)
Upon receiving GSTN Cleardown from the remote modem in a non-error correcting mode, the modem cleanly terminates the call.
Fall Forward/Fallback (V.90/K56flex, V.34/V.32 bis/V.32)
During initial handshake, the modem will fallback to the optimal line connection within K56flex/V.34/V.32 bis/V.32 mode depending upon signal quality if automode is enabled by the +MS command.
When connected in V.90/K56flex/V.34/V.32 bis/V.32 mode, the modem will fall forward or fallback to the optimal line speed within the current modulation depending upon signal quality if fall forward/fallback is enabled by the %E1 command.
Retrain
The modem may lose synchronization with the received line signal under poor line conditions. If this occurs, retraining may be initiated to attempt recovery depending on the type of connection.
The modem initiates a retrain if line quality becomes unacceptable if enabled by the %E command. The modem continues to retrain until an acceptable connection is achieved, or until 30 seconds elapse resulting in line disconnect.
2.3
ERROR CORRECTION AND DATA COMPRESSION
V.42 Error Correction
V.42 supports two methods of error correction: LAPM and, as a fallback, MNP 4. The modem provides a detection and negotiation technique for determining and establishing the best method of error correction between two modems.
MNP 2-4 Error Correction
MNP 2-4 is a data link protocol that uses error correction algorithms to ensure data integrity. Supporting stream mode, the modem sends data frames in varying lengths depending on the amount of time between characters coming from the DTE.
V.42 bis Data Compression
V.42 bis data compression mode operates when a LAPM or MNP connection is established. The V.42 bis data compression employs a “string learning” algorithm in which a string of characters from the DTE is encoded
as a fixed length codeword. Two dictionaries, dynamically updated during normal operation, are used to store the strings.
MNP 5 Data Compression
MNP 5 data compression mode operates during an MNP connection. In MNP 5, the modem increases its throughput by compressing data into tokens before transmitting it to the remote modem,
and by decompressing encoded received data before sending it to the DTE.
2.4
FAX CLASS 1 OPERATION
Facsimile functions operate in response to Fax Class 1 commands when +FCLASS=1 or +FCLASS=1.0. In the fax mode, the on-line behavior of the modem is different from the data (non-fax) mode. After dialing, modem operation
is controlled by fax commands. Some AT commands are still valid but may operate differently than in data modem mode. Calling tone is generated in accordance with T.30.
2.5
VOICE/TAM MODE
Voice and audio functions are supported by the Voice Mode. Voice Mode includes three submodes: Online Voice Command Mode, Voice Receive Mode, and Voice Transmit Mode.
2.5.1 Online Voice Command Mode
This mode results from the connection to the telephone line or a voice/audio I/O device (e.g., microphone or speaker) through the use of the +FCLASS=8 and +VLS commands. After mode entry, AT commands can be entered without aborting the connection.
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2.5.2 Voice Receive Mode
This mode is entered when the +VRX command is active in order to record voice or audio data input, typically from a microphone or the telephone line.
Received analog voice samples are converted to digital form and compressed for reading by the host. AT commands control the codec sample rate.
Received analog mono audio samples are converted to digital form and formatted into 8-bit µ-Law, A Law, linear, or 4-bit IMA ADPCM format for reading by the host. AT commands control the bit length and sampling rate. Concurrent DTMF/tone detection is available.
2.5.3 Voice Transmit Mode
This mode is entered when the +VTX command is active in order to playback voice or audio data, typically to a speaker or to the telephone line. Concurrent DTMF/tone detection is available. Digitized audio data is converted to analog form.
2.5.4 Speakerphone Modes
Speakerphone modes are selected in voice mode with the following commands:
Speakerphone ON/OFF (+VSP).
This command turns the Speakerphone function ON (+VSP = 1) or OFF (+VSP = 0).
Microphone Gain (+VGM=<gain>).
This command sets the microphone gain of the Speakerphone function.
Speaker Gain (+VGS=<gain>).
This command sets the speaker gain of the Speakerphone function.
2.6
FULL-DUPLEX SPEAKERPHONE (FDSP) MODE
The modem operates in FDSP mode when +FCLASS=8 and +VSP=1 (see 2.5.4). In FDSP Mode, speech from a microphone or handset is converted to digital form, shaped, and output to the telephone line
through the line interface circuit. Speech received from the telephone line is shaped, converted to analog form, and output to the speaker or handset. Shaping includes both acoustic and line echo cancellation.
2.7
CALLER ID
Caller ID can be enabled/disabled using the +VCID command. When enabled, caller ID information (date, time, caller code, and name) can be passed to the DTE in formatted or unformatted form. Inquiry support allows the current caller ID mode and mode capabilities of the modem to be retrieved from the modem. The retrieval of the Caller ID via an explicit AT query at a later time is essential for implementing a compliant “Instantly available PC” concept.
2.8
MULTIPLE COUNTRY SUPPORT (W MODELS)
W models support modem operation in various countries. The country choice is made via the AT+GCI command or country select applet from within those installed in Windows registry. The following capabilities are provided in addition to the data modem functions previously described. Country dependent parameters are included in the .INF file for customization by the OEM Programmable Parameters
2.8.1 OEM Programmable Parameters
The following parameters are programmable:
Dial tone detection levels and frequency ranges
DTMF dialing transmit output level, DTMF signal duration, and DTMF interdigit interval parameters
Pulse dialing parameters such as make/break times, set/clear times, and dial codes
Ring detection frequency range
Blind dialing disable/enable
The maximum, minimum, and default carrier transmit level values
Calling tone, generated in accordance with V.25, may also be disabled
Call progress frequency and tone cadence for busy, ringback, congested, dial tone 1, and dial tone 2
Answer tone detection period
On-hook/off-hook, make/break, and set/clear relay control parameters
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2.8.2 Blacklist Parameters
The modem can operate in accordance with requirements of individual countries to prevent misuse of the network by limiting repeated calls to the same number when previous call attempts have failed. Call failure can be detected for reasons such as no dial tone, number busy, no answer, no ringback detected, voice (rather than modem) detected, and key abort (dial attempt aborted by user). Actions resulting from such failures can include specification of minimum inter-call delay, extended delay between calls, and maximum numbers of retries before the number is permanently forbidden ("blacklisted"). Up to 20 such numbers may be tabulated. The blacklist parameters are programmable. The current blacklisted and delayed numbers can be queried via AT*B and AT*D commands, respectively.
2.9
DIAGNOSTICS
2.9.1 Commanded Tests
Diagnostics are performed in response to the &T1 command per V.54.
Analog Loopback (&T1 Command).
Data from the local DTE is sent to the modem, which loops the data back to the local
DTE.
Last Call Status Report (#UD).
This command reports the status of the last call.
2.10 LOW POWER SLEEP MODE
When not connected in data, fax, or speakerphone mode, the HSD is placed in a low power state.
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3.
HARDWARE INTERFACE
3.1
HSD (P9573) HARDWARE PINS AND SIGNALS
3.1.1 HSD Signal Interfaces
PCI Bus/MiniPCI/CardBus Host Interface
The Host Side Device conforms to the PCI Local Bus Specification Version 2.2, MiniPCI Specification Draft 1.0, and PC Card Standard for CardBus. It is a memory slave and a bus master for PC host memory accesses (burst transactions). Configuration is by PCI configuration protocol.
The PCI Bus/MiniPCI/CardBus interface signals are:
Address and data
32 bidirectional Address/Data (AD[31-0]); bidirectional
4 Bus Command and Byte Enable (CBE [3:0]); bidirectional
Bidirectional Parity (PAR); bidirectional
Interface control
Cycle Frame (FRAME#); bidirectional
Initiator Ready (IRDY#); bidirectional
Target Ready (TRDY#); bidirectional
Stop (STOP#); bidirectional
Initialization Device Select (IDSEL); input
Device Select (DEVSEL#); bidirectional
Arbitration
Request (REQ#); output
Grant (GRANT#); input
Error reporting
Parity Error (PERR#); bidirectional
System Error (SERR#); bidirectional
Interrupt
Interrupt A (INTA#); output
System
Clock (PCICLK); input
Reset (PCIRST#); input
Clock Running (CLKRUN#); input
Power Management Event (PME#), output (-PCI model)
Status Change (STSCHG#), output (-CB model)
Power Detection and Switching
Vaux Enable (VauxEN#); output (-PCI model)
Vpci Enable (VpciEN#); output (-PCI model)
Vpci Detect (VpciDET); input
Vaux Detect (VauxDET); input
Serial EEPROM Interface
A serial EEPROM is required to store the Device ID, Vendor ID, Subsystem ID, Subsystem Vendor ID, and Power Management parameters for the PCI Configuration Space Header. The EEPROM is also required to store the CIS table for CardBus designs.
The EEPROM must be 2048 (128 x 16) bits or larger for PCI Bus/MiniPCI applications or 4096 (256 x 16) bits or larger for CardBus applications, and be rated at 1MHz (SROMCLK is 537.6 kHz). For example, the following EEPROMs or equivalent may be used: Microchip 93LC66B (256 x 16), 93LC56B (128 x 16), Atmel AT93C66 (256 x 16), AT93C56 (128 x 16). The EEPROM is programmable by the PC via the modem.
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The EEPROM interface signals are:
Serial Data Input (SROMIN); input
Serial Data Output (SROMOUT); output
Clock (SROMCLK); output
Chip Select (SROMCS); output
LSD Interface (Through DIB)
The DIB interface signals are:
Clock and Power Positive (PWRCLKP); output
Clock and Power Negative (PWRCLKN); output
Data Positive (DIB_DATAP); input/output
Data Negative (DIB_DATAN); input/output
VC Interface (S Models)
The VC interface signals are:
Modem Sleep (IASLEEP); output
Master Clock (M_CLK); output
Voice Serial Clock (V_SCLK); input
Voice Serial Control (V_CTRL); output
Voice Serial Frame Sync (V_STROBE); input
Voice Serial Transmit Data (V_TXSIN); output
Voice Serial Receive Data (V_RXOUT); input
Telephone Handset Interface (S Models)
The telephone handset interface signals are:
Voice Relay Control (VOICE#); output
Handset Pickup Detect (H_PICKUP); input
Call Progress Speaker Interface
The call progress speaker interface signal is:
Digital speaker output (DSPKOUT); output
DSPKOUT is a square wave output in Data/Fax mode used for call progress or carrier monitoring. This output can be optionally connected to a low-cost on-board speaker, e.g., a sounducer, or to an analog speaker circuit.
3.1.2 HSD Interface Signals, Pin Assignments, and Signal Definitions
The HSD (P9573) 100-pin TQFP hardware interface signals are shown by major interface in Figure 3-1, are shown by pin number in Figure 3-2 and are listed by pin number in Table 3-1.
The HSD hardware interface signals are defined in Table 3-2.
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SDXTAL1
SDXTAL2
CLKRUN# AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 AD21 AD22 AD23 AD24 AD25 AD26 AD27 AD28 AD29 AD30 AD31 CBE0# CBE1# CBE2# CBE3# PCICLK FRAME# IDSEL DEVSEL# IRDY# TRDY# PAR REQ# GNT# INTA# STOP# PERR# SERR# PME#/STSCHG# PCIRST# VIO VIO
VauxDET VauxEN# VpciEN# VpciDET
74
75
86 67 66 65 64 62 61 60 59 56 55 54 53 52 51 50 49 37 35 34 33 32 30 29 28 24 23 21 20 19 17 16 15 57 48 38 25 10 39 27 42 40 41 46 13 12
8 43 44 45 14
9 22 26
80 70 69 71
27pF
5%
28.224 MHz
1M
PCI BUS/ MINI PCI/
CARDBUS
SROMCS
SROMCLK
SROMIN
SROMOUT
GPIO3 GPIO4 GPIO5 GPIO6
SPKMUTE (GPIO8) DSPKOUT (GPIO11) H_PICKUP (GPIO10)
VOICE# (GPIO2)
PWRCLKP
PWRCLKN
DIB_DATAP
DIB_DATAN
IASLEEP
DRESET# (GPOL0)
M_CLK
V_SCLK
V_STROBE
V_TXSIN
V_RXOUT
V_CTRL
PLLVDD
PLLVSS
VDD
VDD VDD VDD VDD VDD VDD VDD
GND GND GND GND
SCANEN
SCANMODE
76 79 78 77
85 83 82 81
99 87 88 100
92
93
91
90
96 95 5 3 1 4 2 6
97
98
84
7 18 31 47 58 68 94
11 36 63 89
72 73
EEPROM
MD260F3 HIS P95 100T
POWER DETECTION AND
SWITCHING CIRCUIT
HOST SIDE DEVICE
(HSD) P9573
100-PIN TQFP
27pF
5%
VOICE CODEC
(VC)
20437
32-PIN TQFP
SLEEP POR M_CLKIN M_SCK M_STROBE M_TXSIN M_RXOUT M_CNTRLSIN
+3.3V
SPEAKER CIRCUIT SPEAKER CIRCUIT HANDSET PICKUP DETECTION CIRCUIT VOICE RELAY
DIGITAL ISOLATION BARRIER (DIB)
NC NC NC NC
0.1uF
33
+3.3V
+3.3V
0
)LJXUH  +6' 3 3LQ 74)3 +DUGZDUH ,QWHUIDFH 6LJQDOV
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