Datasheet LBB110S, LBB110PTR, LBB110P, LBB110, LBB110STR Datasheet (CLARE)

1
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LBB110
DS-LBB110-R6
The LBB110 is a Dual 1 Form B solid state relay that has two independently controlled optically coupled MOSFETs. The efficient MOSFET switches and photovoltaic die use Clare’s patented OptoMOS®architecture to provide 3750 V
RMS
of input to output isolation. The optically coupled inputs are controlled by highly efficient GaAIAs infrared LEDs. Dual pole OptoMOS relays provide a more compact design solution than discrete single pole relay in a variety of applications. The dual pole relays save board space by incorporating both relays in a single 8-pin package.
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Hookswitch
Dial Pulsing
Ground Start
Ringer Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment—Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
UL Recognized: File Number E76270
CSA Certified: File Number LR 43639-10
BSI Certified to:
BS EN 60950:1992 (BS7002:1992)
Certificate #: 7344
BS EN 41003:1993
Certificate #: 7344
Small 8 Pin DIP Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
3750V
RMS
Input/Output Isolation
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Surface Mount and Tape & Reel Versions Available
Applications
Features
Description
Approvals
DUAL POLE OptoMOS®Relay
Ordering Information
Part # Description
LBB110 8 Pin DIP (50/Tube) LBB110P 8 Pin Flatpack (50/Tube) LBB110PTR 8 Pin Flatpack (1000/Reel) LBB110S 8 Pin Surface Mount (50/Tube) LBB110STR 8 Pin Surface Mount (1000/Reel)
LBB110 Units
Load Voltage 350 V Load Current 120 mA Max R
ON
35
Pin Configuration
Switching Characteristics of
Normally Closed (Form B) Devices
CONTROL
10ms
10%
90%
90%
+
+
T
ON
T
OFF
+
1
2 3
4
8
7 6
5
+ Control - Switch #1
– Control - Switch #1 + Control - Switch #2
– Control - Switch #2
Load - Switch #1
Load - Switch #1 Load - Switch #2
Load - Switch #2
LBB110 Pinout
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LBB110
Rev. 6
Electrical Characteristics
Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this data sheet is not implied. Exposure of the device to the absolute maximum ratings for an extended period may degrade the device and effect its reliability.
Absolute Maximum Ratings (@ 25˚ C)
2
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics @ 25°C
Load Voltage (Peak) - V
L
- - 350 V
Load Current* (Continuous) - I
L
- - 120 mA
Peak Load Current 10ms I
LPK
- - 350 mA
On-Resistance I
L
=120mA R
ON
-25 35
Off-State Leakage Current V
L
=350V - - - 1 µA
Switching Speeds
Turn-On I
F
=5mA,VL=10V T
ON
-- 3ms
Turn-Off I
F
=5mA,VL=10V T
OFF
-- 3ms
Output Capacitance 50V; f=1MHz C
OUT
-25 - pF
Input Characteristics @ 25°C
Input Control Current I
L
=120mA I
F
5- 50mA
Input Dropout Current - I
F
0.4 0.7 - mA
Input Voltage Drop I
F
=5mA V
F
0.9 1.2 1.4 V
Reverse Input Voltage - V
R
-- 5 V
Reverse Input Current V
R
=5V I
L
- - 10 µA
Input to Output Capacitance - V
C/O
-3 - pF
Input to Output Isolation - V
I/O
3750 - - V
RMS
*Note: If both poles operate simulataneously load current must be derated so as not to exceed the package power dissipation value.
Parameter Min Typ Max Units
Input Power Dissipation - - 1501mW Input Control Current - - 50 mA
Peak (10ms) - - 1 A Reverse Input Voltage - - 5 V Total Power Dissipation - - 8002mW Isolation Voltage
Input to Output 3750 - - V
RMS
Operational Temperature -40 - +85 °C Storage Temperature -40 - +125 °C Soldering Temperature
(10 Seconds Max.)
DIP Package - - +260 °C
Flatpack/Surface Mount
Package - - +220 °C
1
Derate Linearly 1.33 mw/˚C
2
Derate Linearly 6.67 mw/˚C
LBB110
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Rev. 6
PERFORMANCE DATA*
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
3
LBB110
Typical LED Forward Voltage Drop
(N=50 Ambient Temperature = 25°C)
IF = 5mADC
35 30 25 20 15 10
5 0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
LBB110
Typical On-Resistance Distribution
(N=50 Ambient Temperature = 25°C)
(Load Current = 120mADC)
25
20
15
10
5
0
25.5 27.5 28.5 30.529.5 31.5
On-Resistance (Ω)
Device Count (N)
26.5
LBB110
Typical Blocking Voltage Distribution
(N=50 Ambient Temperature = 25°C)
IF = 5mADC
25
20
15
10
5
0
357.5 372.5 387.5 402.5 417.5 432.5
Blocking Voltage (V)
Device Count (N)
LBB110
Typical IF for Switch Operation
(N=50 Ambient Temperature = 25°C)
(Load Current = 120mADC)
0.33 0.77 1.21 1.650.55 0.99 1.43
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
LBB110
Typical IF for Switch Dropout
(N=50 Ambient Temperature = 25°C)
(Load Current = 120mADC
25
20
15
10
5
0
0.11 0.55 0.99 1.430.33 0.77 1.21
LED Current (mA)
Device Count (N)
)
LBB110
Typical Turn-On Time
(N=50 Ambient Temperature = 25°C)
(Load Current = 120mADC; IF = 5mADC)
0.27 0.63 0.990.45 0.81
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
0.09
LBB110
Typical Turn-Off Time
(N=50 Ambient Temperature = 25°C)
(Load Current = 120mADC; IF = 5mADC)
0.45 0.81 1.350.27 0.63 0.99
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
1.17
LBB110
Typical Leakage vs. Temperature
(Measured across Pins 5 & 6 or 7 & 8)
Temperature (°C)
Leakage (µA)
-40
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005 0
-20 0 20 40 60 80 100
LBB110
Typical Blocking Voltage vs. Temperature
IF = 5mADC
Temperature (°C)
Blocking Voltage (V
RMS
)
-40
410
405
400
395
390
385
380
-20 0 20 40 60 80 100
LBB110
Typical Turn-On vs. Temperature
(Load Current = 120mADC)
Temperature (°C)
5mA
Turn-On (ms)
-40
0.6
0.5
0.4
0.3
0.2
0.1 0
-20 0 20 40 60 80 100
LBB110
Typical Turn-Off vs. Temperature
(Load Current = 120mADC)
Temperature (°C)
Turn-Off (ms)
-40
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4 0
-20 0 20 40 60 80 100
10mA
5mA
LBB110
Typical Load Current vs. Temperature
Temperature (°C)
Load Current (mA)
180 160 140 120 100
80 60 40 20
0
-40 -20 0 20 40 60 80 120100
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4
LBB110
Rev. 6
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.
LBB110
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (°C)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
50mA
10mA 5mA
LBB110
Typical Turn-On vs. LED Forward Current
(Load Current = 120mADC)
LED Forward Current (mA)
Turn-On (ms)
0
5 1015202530354045
0.3000
0.2500
0.2000
0.1500
0.1000
0.0500 0
50
LBB110
Typical Turn-Off vs. LED Forward Current
(Load Current = 120mADC)
LED Forward Current (mA)
Turn-Off (ms)
0
5 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1 0
50
LBB110
Typical IF for Switch Operation
vs. Temperature
(Load Current = 120mADC)
Temperature (°C)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5 0
-20 0 20 40 60 80 100
LBB110
Typical IF for Switch Dropout
vs. Temperature
(Load Current = 120mADC)
Temperature (°C)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5 0
-20 0 20 40 60 80 100
LBB110
Typical Load Current vs. Load Voltage
(Ambient Temperature = 25°C)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-4 -3 -2 -1 1 2 304
LBB110
Energy Rating Curve
Time
Load Current (A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1 0
10µs 1ms 100ms 10s100µs 10ms 1s 100s
LBB110
Typical On-Resistance vs. Temperature
(Load Current =Max Rated Over Temp.)
Temperature (°C)
On-Resistance(Ω)
-40
50 45 40 35 30 25 20 15 10
5 0
-20 0 20 40 60 80 100
Dual Pole
Single Pole
Instantaneous
LBB110
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Rev. 6
Dimensions
mm
(inches)
Mechanical Dimensions
PC Board Pattern (Top View)
6.350 ± .127
(.250 ± .005)
2.540 ± .127
(.100 ± .005)
7.620 ± .127
(.300 ± .005)
7.620 ± .127
(.300 ± .005)
8-.800 DIA.
(8-.031 DIA.)
7.239 TYP. (.285)
3.302 (.130)
7.620 ± .254
(.300 ± .010)
9.144 TYP. (.360)
6.350 ± .127
(.250 ± .005)
9.652 ± .381
(.380 ± .015)
2.540 ± .127
(.100 ± .005)
9.144 ± .508
(.360 ± .020)
.457 ± .076
(.018 ± .003)
8.077 ± .127
(.318 ± .005 )
8 Pin DIP Through Hole (Standard)
PC Board Pattern (Top View)
2.540 ± .127
(.100 ± .005)
8.763 ± .127
(.345 ± .005)
1.193
(.047)
.787
(.031)
8 Pin Flatpack (P Suffix)
7.620 ± .254 (.300 ± .010)
2.159 TYP. (.085)
2.286 MAX. (.090)
9.398 ± .127 (.370 ± .005)
6.350 ± .127 (.250 ± .005)
9.652 ± .381
(.380 ± .015)
2.540 ± .127 (.100 ± .005)
8.077 ± .127 (.318 ± .005)
.457 ± .076
(.018 ± .003)
.203
(.008)
.635 ± .127
(.025)
4.445 ± .127
(.175 ± .005)
3.302
(.130)
7.620 ± .254
(.300 ± .010)
6.350 ± .127
(.250 ± .005)
8.077 ± .127
(.318 ± .005)
2.540 ± .127
(.100 ± .005)
9.525 ± .254
(.375 ± .010)
.457 ± .076
(.018 ± .003)
.254 TYP.
(.010)
.635 TYP.
(.025)
8 Pin DIP Surface Mount (S Suffix)
9.652 ± .381
(.380 ± .015)
PC Board Pattern (Top View)
2.540 ± .127
(.100 ± .005)
8.305 ± .127
(.327 ± .005)
1.905 ± .127
(.075 ± .005)
1.498 ± .127
(.059 ± .005)
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6
LBB110
Rev. 6
Tape and Reel Packaging for 8 Pin Surface Mount Package
7.493 ± .102 (.295 ± .004)
12.090 (.476)
1.753 ± .102
(.069 ± .004)
3.987 ± .102 (.157 ± .004)
1.498 ± .102 (.059 ± .004)
6.731 MAX. (.265)
.406 MAX.
(.016)
4.877
(.192)
Top Cover
Tape
2.007 ± .102 (.079 ± .004)
11.989 ± .102 (.472 ± .004)
User Direction of Feed
.050R TYP.
16.002 ± .305 (.630 ± .012)
10.300 (.405)
Embossment
Embossed Carrier
Top Cover Tape Thickness .102 MAX. (.004)
10.300 ± .102 (.405 ± .004)
1.549 ± .102 (.061 ± .004)
330.2 DIA. (13.00)
18
Tape and Reel Packaging for 8 Pin Flatpack Package
7.493 ± .102 (.295 ± .004)
12.090 (.476)
1.753 ± 0.102 (.069 ± .004)
3.987 ± .102
(.157 ± .004)
1.498 ± .102 (.059 ± .004)
6.731 MAX. (.265)
.406 MAX.
(.016)
4.877 (.192)
Top Cover
Tape
2.007 ± .102 (.079 ± .004)
11.988 ± .102 (.472 ± .004)
User Direction of Feed
.050R TYP.
16.002 ± .305 (.630 ± .012)
10.287 (.405)
Embossment
Embossed Carrier
Top Cover Tape Thickness .102 MAX. (.004)
10.287 ± .102 (.405 ± .004)
1.549 ± .102 (.061 ± .004)
330.2 DIA. (13.00)
18
Dimensions
mm
(inches)
Mechanical Dimensions
CLARE LOCATIONS
Clare Headquarters 78 Cherry Hill Drive Beverly, MA 01915 Tel: 1-978-524-6700 Fax: 1-978-524-4900 Toll Free: 1-800-27-CLARE
Clare Micronix Division 145 Columbia Aliso Viejo, CA 92656-1490 Tel: 1-949-831-4622 Fax: 1-949-831-4628
SALES OFFICES AMERICAS
Americas Headquarters
Clare 78 Cherry Hill Drive Beverly, MA 01915 Tel: 1-978-524-6700 Fax: 1-978-524-4900 Toll Free: 1-800-27-CLARE
Eastern Region
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Central Region
Clare Canada Ltd. 3425 Harvester Road, Suite 202 Burlington, Ontario L7N 3N1 Tel: 1-905-333-9066 Fax: 1-905-333-1824
Western Region
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Canada
Clare Canada Ltd. 3425 Harvester Road, Suite 202 Burlington, Ontario L7N 3N1 Tel: 1-905-333-9066 Fax: 1-905-333-1824
EUROPE
European Headquarters
CP Clare nv Bampslaan 17 B-3500 Hasselt (Belgium) Tel: 32-11-300868 Fax: 32-11-300890
France
Clare France Sales Lead Rep 99 route de Versailles 91160 Champlan France Tel: 33 1 69 79 93 50 Fax: 33 1 69 79 93 59
Germany
Clare Germany Sales ActiveComp Electronic GmbH Mitterstrasse 12 85077 Manching Germany Tel: 49 8459 3214 10 Fax: 49 8459 3214 29
Italy
C.L.A.R.E.s.a.s. Via C. Colombo 10/A I-20066 Melzo (Milano) Tel: 39-02-95737160 Fax: 39-02-95738829
Sweden
Clare Sales Comptronic AB Box 167 S-16329 Spånga Tel: 46-862-10370 Fax: 46-862-10371
United Kingdom
Clare UK Sales Marco Polo House Cook Way Bindon Road Taunton UK-Somerset TA2 6BG Tel: 44-1-823 352541 Fax: 44-1-823 352797
ASIA PACIFIC
Asian Headquarters
Clare Room N1016, Chia-Hsin, Bldg II, 10F, No. 96, Sec. 2 Chung Shan North Road Taipei, Taiwan R.O.C. Tel: 886-2-2523-6368 Fax: 886-2-2523-6369
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Worldwide Sales Offices
Specification: DS-LBB110-R6 ©Copyright 2001, Clare, Inc. OptoMOS®is a registered trademark of Clare, Inc. All rights reserved. Printed in USA. 1/25/01
Clare cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in this Clare product. No circuit patent licenses nor indemnity are expressed or implied. Clare reserves the right to change the specification and circuitry, with­out notice at any time. The products described in this document are not intended for use in medical implantation or other direct life support applications where malfunction may result in direct phys­ical harm, injury or death to a person.
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