• Programmable Quasi-resonant Second Stage with
Constant-current Output
- Flyback, Buck, and Tapped Buck
• Register Lockout
• Fast Startup
• Tight LED Current Regulation: Better than ±5%
• Primary-side Regulation (PSR)
• >0.9 Power Factor
• IEC-61000-3-2 Compliant
• Soft Start
• Protections:
- Output Open/Short
- Current-sense Resistor Open/Short
- External Overtemperature Using NTC
Overview
The CS1630 and CS1631 are high-performance offline AC /DC
LED drivers for dimmable and high color rendering index (CRI)
LED replacement lamps and luminaires. They feature Cirrus
Logic’s proprietary digital dimmer compatibility control technology
and digital correlated color temperature (CCT) control system that
enables two-channel LED color mixing. The CS1630 is designed
for 120VAC line voltage applications, and the CS1631 is
optimized for 230VAC line voltage applications.
The CS1630/31 integrates a critical conduction mode boost
converter, providing power factor correction and superior dimmer
compatibility with a primary-side regulated quasi-resonant second
stage, which is configurable for isolated and non-isolated
topologies. The digital CCT control system provides the ability to
program dimming profiles, such as constant CCT dimming and
black body line dimming. The CS1630/31 optimizes LED color
mixing by temperature compensating LED current with an
external NTC. The IC controller is also equipped with power line
calibration for remote system calibration and end-of-line
programming. The CS1630/31 provides a register lockout feature
for security against potential access to proprietary registers.
A typical schematic using the CS1630/31 IC is shown on the
front page.
Startup current is provided from a patent-pending, external
high-voltage source-follower network. In addition to providing
startup current, this unique topology is integral in providing
compatibility with digital dimmers by ensuring V
always available to the IC. During steady-state operation, an
auxiliary winding on the boost inductor back-biases the
DD
power is
source-follower circuit and provides steady-state operating
current to the IC to improve system efficiency.
The rectified input voltage is sensed as a current into pin IAC
and is used to control the adaptive dimmer compatibility
algorithm and extract the phase of the input voltage for output
dimming control. During steady-state operation, the external
high-voltage, source-follower circuit is source-switched in
critical conduction mode (CRM) to boost the input voltage.
This allows the boost stage to maintain good power factor,
provide dimmer compatibility, reduce bulk capacitor ripple
current, and provide a regulated input voltage to the second
stage.
The current into the boost output voltage sense pin BSTOUT
senses the output voltage of the CRM boost front-end.
4DS954F3
The quasi-resonant second stage is implemented with peakcurrent mode primary-side control, which eliminates the need
for additional components to provide feedback from the
secondary and reduces system cost and complexity.
Voltage across an external user-selected resistor is sensed
through pin FBSENSE to control the peak current through the
second stage inductor. Leading-edge and trailing-edge
blanking on pin FBSENSE prevents false triggering.
Pin FBAUX is used to sense the second stage inductor
demagnetization to ensure quasi-resonant switching of the
output stage.
An internal current source is adjusted by a feedback loop to
regulate a constant reference voltage on pin eOTP for external
negative temperature coefficient (NTC) thermistor
measurements. An external NTC is connected to pin eOTP to
provide thermal protection of the system and LED temperature
compensation. The output current of the system is steadily
reduced when the system temperature exceeds a
programmable temperature set point. If the temperature
reaches a designated high set point, the IC is shutdown and
stops switching.
2. PIN DESCRIPTION
I2C Clock
Source Switch
Source Ground
Boost Zero-current Detect
Rectifier Voltage Sense
No Connection
SCL
SDAI
2
C Data
SOURCE
SGND
BSTAUX
eOTP
FBSENSE
GND
GDGate Driver
VDD
IC Supply Voltage
FBAUX
Second Stage Zero-current Detect
BSTOUT
Boost Output Voltage Sense
IAC
CLAMP
V
oltage Clamp Current Source
16-lead SOIC
NC
SYNC
7
6
5
4
3
2
1
10
11
12
13
14
15
16
8
9
External Overtemperature Protection
Second Stage Current Sense
Ground
Second Stage Synchronization
Figure 2. CS1630/31
CS1630/31
Pin Name
BSTAUX
IAC
CLAMP
SGND
SOURCE
SDA
SCL
NC
SYNC
eOTP
FBSENSE
GND
GD
VDD
FBAUX
BSTOUT
DS954F35
Pin #I/O
1IN
2IN
3OUT
4PWR
5IN
6I/O
7IN
8-
9OUT
10IN
11IN
12PWR
13OUT
14PWR
15IN
16IN
Description
Boost Zero-current Detect — Boost Inductor demagnetization sensing input for
zero-current detection (ZCD) information. The pin is connected to the PFC boost
inductor auxiliary winding through an external resistor divider.
Rectifier Voltage Sense — A current proportional to the rectified line voltage is fed
into this pin. The current is measured with an A/D converter.
Voltage Clamp Current Source — Connect to a voltage clamp circuit on the output
of the boost stage.
Source Ground — Common reference current return for the SOURCE pin.
Source Switch — Connected to the source of the boost stage external high-voltage
FET.
I2C™ Data — I2C data.
I2C™ Clock — I2C clock.
No Connection — Leave pin unconnected.
Second Stage Synchronization — A digital synchronization signal that indicates
which channel the controller is signaling for each gate switching period.
External Overtemperature Protection — Connect an external NTC thermistor to
this pin, allowing the internal A/D converter to sample the change to NTC resistance.
Second Stage Current Sense — The current flowing in the second stage FET is
sensed across a resistor. The resulting voltage is applied to this pin and digitized for
use by the second stage computational logic to determine the FET's duty cycle.
Ground — Common reference. Current return for both the input signal portion of the
IC and the gate driver.
Gate Driver — Gate drive for the second stage power FET.
IC Supply Voltage
— Connect a storage capacitor to this pin to serve as a reservoir for
operating current for the device, including the gate drive current to the power transistor.
Second Stage Zero-current Detect — Second stage inductor sensing input. The
pin is connected to the second stage inductor’s auxiliary winding through an external
resistor divider.
Boost Output Voltage Sense — A current proportional to the boost output is fed
into this pin. The current is measured with an A/D converter.
CS1630/31
3. CHARACTERISTICS AND SPECIFICATIONS
3.1Electrical Characteristics
Typical characteristics conditions:
=25ºC, VDD= 12V, GND = 0V
•T
A
• All voltages are measured with respect to GND.
• Unless otherwise specified, all currents are positive
when flowing into the IC.
ParameterConditionSymbolMinTypMaxUnit
VDD Supply Voltage
Operating RangeAfter Turn-onV
Turn-on Threshold VoltageV
Turn-off Threshold Voltage (UVLO)V
Zener Voltage(Note 1)I
IncreasingV
DD
DecreasingV
DD
=20mAV
DD
VDD Supply Current
Startup Supply CurrentV
Operating Supply Current(Note 5)
DD<VST(th)
CL= 0.25nF, Fsw60 kHz
Reference
Reference Current
V
CS1630
CS1631
= 200 V
BST
V
= 400 V
BST
Boost
Maximum Switching Frequencyf
Clamp CurrentI
Dimmer Attach Peak Current
CS1630
CS1631
108 V
207 V
line
line
Boost Zero-current Detect
BSTZCD ThresholdV
ZCD Sink Current(Note 2)I
BSTAUX Upper VoltageI
BSTZCD
Boost Protection
Clamp Turn-on
CS1630
CS1631
108 V
207 V
line
line
Second Stage Zero-current Detect
FBZCD ThresholdV
ZCD Sink Current(Note 2)I
FBAUX Upper VoltageI
=1mA-VDD+0.6-V
FBZCD
Second Stage Current Sense
Peak Control ThresholdV
Delay to Output--100ns
Minimum/Maximum characteristics conditions:
= -40°C to +125°C, VDD= 11V to 17V, GND = 0 V
•T
J
DD
ST(th)
STP(th)
Z
I
ST
11-17V
-8.5-V
-7.5-V
18.5-19.8V
--200A
-5.8-mA
132
253
I
ref
BST(Max)
CLAMP
BSTZCD(th)
BSTZCD
-
-
--200kHz
--3.8-mA
-
-
-200-mV
-2--mA
133
133
590
508
-
-
-
-
A
A
mA
mA
=1mA-VDD+0.6-V
132
253
FBZCD(th)
FBZCD
Pk_Max(th)
-
-
-200-mV
-2--mA
-1.4-V
146.7
141.7
-
-
A
A
6DS954F3
CS1630/31
GD OU T
GD
GND
VDD
Buffer
S
1
R
1
R
2
R
3
TP
+15V
-15V
S
2
V
DD
C
L
0.25 nF
ParameterConditionSymbolMinTypMaxUnit
Second Stage Pulse Width Modulator
Minimum Switching Frequencyt
Maximum Switching Frequencyt
FB(Min)
FB(Max)
Second Stage Gate Driver
Output Source Resistance
Output Sink Resistance
Rise Time(Note 5)
Fall Time(Note 5)
VDD=12V
VDD=12V
CL=0.25nF
CL=0.25nF
Second Stage Protection
Overcurrent Protection (OCP)V
Overvoltage Protection (OVP)V
Open Loop Protection (OLP)V
OCP(th)
OVP(th)
OLP(th)
External Overtemperature Protection (eOTP)
Pull-up Current Source – MaximumI
CONNECT
Conductance Accuracy (Note 3)--±5
Conductance Offset(Note 3)-± 250-nS
Current Source Voltage ThresholdV
CONNECT(th)
Internal Overtemperature Protection (iOTP)
Thermal Shutdown Threshold (Note 4)T
Thermal Shutdown Hysteresis (Note 4)T
Notes:1. The CS1630/31 has an internal shunt regulator that limits the voltage on the VDD pin. VZ, the shunt regulation voltage, is defined
in the VDD Supply Voltage section on page 6.
2. External circuitry should be designed to ensure that the ZCD current drawn from the internal clamp diode when it is forward biased
does not exceed specification.
3. Conductance is the inverse of resistance (1/) and is expressed in siemens (S). A decrease in conductance is equivalent to an
increase in resistance.
4. Specifications are guaranteed by design and are characterized and correlated using statistical process methods.
5. For test purposes, load capacitance (C
) is 0.25nF and is connected as shown in the following diagram.
L
SD
SD(Hy)
-625-Hz
-200-kHz
-24-
-11-
--30ns
--20ns
-1.69-V
-1.25-V
-200-mV
-80-A
-1.25-V
-135-ºC
-14-ºC
DS954F37
3.2I2C™ Port Switching Characteristics
Stop
SDA
SCL
t
f
t
susp
Stop
t
r
t
hdst
t
sust
t
hddo
t
sud
t
high
t
hddi
t
low
t
hdst
t
buf
Start
Repeated
Start
Test conditions (unless otherwise specified):
• Inputs: Logic 0 = GND = 0 V, Logic 1 = 3.3 V.
• The CS1630 / 31 control port only supports I
• It is recommended that a 2.2 k pull-up resistor be placed from the SDA pin to V
ParameterSymbolMinTypMaxUnit
SCL Clock Frequencyf
Bus Free Time Between Transmissionst
Start Condition Hold Time (prior to first clock pulse)t
Clock Low timet
Clock High Timet
Setup Time for Repeated Start Conditiont
SDA Input Hold Time from SCL Falling
SDA Setup time to SCL Risingt
Setup Time for Stop Conditiont
SDA Input Voltage LowV
SDA Input Voltage HighV
SDA Output Voltage LowV
2
C slave functionality.
scl
buf
hdst
low
high
sust
t
hddi
sud
susp
il
ih
ol
CS1630/31
.
DD
--400kHz
1.3--µs
0.6--µs
1.3--µs
0.6--µs
0.6--µs
0-0.9µs
100--ns
0.6--µs
-1.5-V
-1.85-V
-0.25-V
8DS954F3
CS1630/31
3.3Power Line Calibration Characteristics
Typical characteristics conditions:
•TA=25ºC, VDD= 12V, GND = 0V
• All voltages are measured with respect to GND.
• Unless otherwise specified, all current is positive when
flowing into the IC.
Parameter (Note 6)MinTypMaxUnits
Input Line Frequency (Note 7)4750/6063Hz
Input Voltage (Note 7)
CS1630
CS1631
Dual-bit 00 (“00”)243444Degrees
Dual-bit 01 (“01”)526272Degrees
Dual-bit 10 (“10”)108118128Degrees
Dual-bit 11 (“11”)136146156Degrees
Special Character (SC)8090100Degrees
Notes:6. The CS1630/31 supports leading-edge phase-cut waveforms only for power line calibration.
7. Range is recommended for power line calibration operation only.
Minimum/Maximum characteristics conditions:
TJ=25ºC, VDD= 11V to 17V, GND = 0 V
114
218
120
230
126
242
V
V
DS954F39
CS1630/31
3.4 Thermal Resistance
SymbolParameterValueUnit
Junction-to-ambient Thermal Impedance2 Layer PCB
JA
Junction-to-case Thermal Impedance2 Layer PCB
JC
4 Layer PCB
4 Layer PCB
3.5 Absolute Maximum Ratings
Characteristics conditions:
All voltages are measured with respect to GND.
Pin SymbolParameterValueUnit
14V
1, 2, 5, 6, 7, 9,
10, 11, 15, 16
1, 2, 6, 7, 9, 10,
11,15,16
13V
13I
5I
SOURCE
3I
-P
-T
-T
All PinsESD
DD
GD
GD
CLAMP
Stg
IC Supply Voltage18.5V
Analog Input Maximum Voltage-0.5 to (V
Analog Input Maximum Current5mA
Gate Drive Output Voltage-0.3 to (VDD+0.3)V
Gate Drive Output Current-1.0 / +0.5A
Current into Pin1.1A
Clamp Output Current5mA
Total Power Dissipation400mW
D
Junction Temperature Operating Range(Note 8)-40 to +125ºC
J
Storage Temperature Range-65 to +150ºC
Electrostatic Discharge CapabilityHuman Body Model
Charged Device Model
84
47
39
31
DD
2000
500
°C/W
°C/W
°C/W
°C/W
+0.5)V
V
V
Note:8. Long-term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation at
the rate of 50mW/ ºC for variation over temperature.
WARNING:
Operation at or beyond these limits may result in permanent damage to the device.
Normal operation is not guaranteed at these extremes.
10DS954F3
4. TYPICAL PERFORMANCE PLOTS
0
1
2
3
-50050100150
UVLO Hysteresis
Temperature (°C)
-2
0
2
4
6
8
10
12
02468101214161820
I
DD
(mA)
VDD(V)
7
8
9
10
-5005010 0150
VDD (V)
Temperature (
°C)
Turn On
Turn Off
18
18.5
19
19.5
20
-50050100150
V
Z
(V)
Temperature (C°)
0
10
20
30
40
-50050100150
Z
OUT
(:)
Temperature (ºC)
Source
Sink
-2
-1.5
-1
-0.5
0
0.5
-50050100150
Drift (%)
Temperature (°C)
CS1630/31
Figure 3. UVLO Characteristics
Figure 5. Turn-on/off Threshold Voltage vs. Temperature
Figure 4. Supply Current vs. Voltage
Figure 6. Zener Voltage vs. Temperature
Figure 7. Gate Drive Resistance vs. Temperature
DS954F311
Figure 8. Reference Current (I
) Drift vs. Temperature
ref
5. GENERAL DESCRIPTION
5.1Overview
The CS1630 and CS1631 are high-performance offline AC /DC
LED drivers for dimmable and high color rendering index (CRI)
LED replacement lamps and luminaires. They feature Cirrus
Logic’s proprietary digital dimmer compatibility control
technology and digital correlated color temperature (CCT) control
system that enables two-channel LED color mixing. The CS1630
is designed for 120VAC line voltage applications, and the
CS1631 is optimized for 230VAC line voltage applications.
The CS1630/31 integrates a critical conduction mode (CRM)
boost converter, providing power factor correction and superior
dimmer compatibility with a primary-side regulated quasiresonant second stage, which is configurable for isolated and
non-isolated topologies. The digital CCT control system provides
the ability to program dimming profiles, such as constant CCT
dimming and black body line dimming. The CS1630/31
optimizes LED color mixing by temperature compensating LED
current with an external negative temperature coefficient
(NTC) thermistor. The IC controller is also equipped with power
line calibration for remote system calibration and end-of-line
programming. The CS1630/31 provides a register lockout
feature for security against potential access to proprietary
registers.
5.2Startup Circuit
An external, high-voltage source-follower circuit is used to
deliver startup current to the IC. During steady-state operation,
an auxiliary winding on the boost inductor biases this circuit to
an off state to improve system efficiency, and all IC supply
current is generated from the auxiliary winding. The patent
pending technology of the external, high-voltage sourcefollower circuit enables system compatibility with digital
dimmers (dimmers containing an internal power supply) by
providing a continuous path for a dimmer’s power supply to
recharge during its off state. During steady-state operation,
high-voltage FET Q1 is source-switched by a variable internal
current source on the SOURCE pin to create the boost circuit.
A Schottky diode with a forward voltage less than 0.6V is
recommended for diode D5. Schottky diode D5 will limit inrush
current through the internal diode, preventing damage to the IC.
5.3Dimmer Switch Detection
The CS1630/ 31 dimmer switch detection algorithm determines
if the solid-state lighting system is controlled by a regular switch,
a leading-edge dimmer, or a trailing-edge dimmer. Dimmer
switch detection is implemented using two modes: Dimmer
Learn Mode and Dimmer Validate Mode. These assist in
limiting the system power losses. Once the IC reaches UVLO
start threshold V
in Dimmer Learn Mode, allowing the dimmer switch detection
and begins operating, the CS1630/31 is
ST(th)
CS1630/31
circuit to set the operating state of the IC to one of three modes:
No-dimmer Mode, Leading-edge Mode, or Trailing-edge Mode.
5.3.1Dimmer Learn Mode
In Dimmer Learn Mode, the dimmer detection circuit spends
approximately two line-cycles learning whether there is a
dimmer switch and, if present, whether it is a trailing-edge or
leading-edge dimmer. A modified version of the leading-edge
algorithm is used. The trailing-side slope of the input line
voltage is sensed to decide whether the dimmer switch is a
trailing-edge dimmer. The dimmer detection circuit transitions to
Dimmer Validate Mode once the circuit detects that a dimmer is
present.
5.3.2Dimmer Validate Mode
During normal operation, CS1630/31 is in Dimmer Validate
Mode. This instructs the dimmer detection circuit to periodically
validate that the IC is executing the correct algorithm for the
attached dimmer. The dimmer detection algorithm periodically
verifies the IC operating state as a protection against incorrect
detection. As additional protection, the output of the dimmer
detection algorithm is low-pass filtered to prevent noise or
transient events from changing the IC’s operating mode. The IC
will return to Dimmer Learn Mode when it has determined that
the wrong algorithm is being executed.
5.3.3No-dimmer Mode
Upon detection that the line is not phase cut with a dimmer, the
CS1630/ 31 operates in No-dimmer Mode, where it provides a
power factor that is in excess of 0.9. The CS1630/31
accomplishes this by boosting in CRM and DCM mode. The
peak current is modulated to provide link regulation. The
CS1630/ 31 alternates between two settings of peak current. To
regulate the boost output voltage, the CS1630/31 uses a peak
current set by register PEAK_CUR (see "Peak Current
(PEAK_CUR) – Address 51" on page 39). The time that this
current is used is determined by an internal compensation loop
to regulate the boost output voltage. The internal algorithm will
reduce the peak current of the boost stage to maintain output
voltage regulation and obtain the desired power factor.
5.3.4Leading-edge Mode
In Leading-edge Mode, the CS1630/31 regulates boost output
voltage V
Figure 9. on page 13). The device executes a CCM boost
algorithm using dimmer attach current as the initial peak current
for the initial firing event of the dimmer. Upon gaining control of
the incoming current, the CS1630/ 31 transitions to a CRM
boost algorithm to regulate boost output voltage V
device periodically executes a probe event on the incoming
while maintaining the dimmer phase angle (see
BST
BST
. The
12DS954F3
CS1630/31
Figure 9. Leading-edge Mode Phase-cut Waveform
Figure 10. Trailing-edge Mode Phase-cut Waveform
Gain
White
dim
I
White
I
ref
White
I
ref
Color
X
X
ADC
NTC
I
Color
Gain
Color
X
X
Figure 11. Block Diagram of Color Control System
waveform. The information from the probe event is used to
maintain proper operation with the dimmer circuitry.
5.3.5Trailing-edge Mode
In Trailing-edge Mode, the CS1630/31 determines its operation
based on the falling edge of the input voltage waveform (see
Figure 10). To provide proper dimmer operation, the
CS1630/ 31 executes the boost algorithm on the falling edge of
the input line voltage that maintains a charge in the dimmer
capacitor. To ensure maximum compatibility with dimmer
components, the device boosts during this falling edge event
using a peak current that must meet a minimum value.
Trailing-edge Mode, only the CRM boost algorithm is used.
Red and amber LEDs are necessary components in
color-mixing applications when providing warm white or other
CCTs. When mixing colors, red and amber LEDs are the most
temperature sensitive, so they cause a large variation in
temperature. The CS1630/31 is capable of providing LED
CCT and luminosity with temperature compensation using the
NTC thermistor to resolve the significant change in the
luminous output due to temperature variations.
Since LED lumens are mainly a function of temperature and
forward current, color temperature and luminosity can be
maintained by independently adjusting each string's output
current as the ambient temperature changes. This can be
done by mapping the NTC reading to a required value of the
current in each string using a digital mapping block.
In the CS1630/31, only one of the LED string currents is
compensated for due to temperature variations. The current in
the other string is kept constant over temperature, which may
result in the luminosity decreasing slightly as temperature
increases. In order for the ADC to resolve the entire range of
possible temperature variation in the LEDs, it is recommended
to select series resistor R
and NTC resistor R
S
appropriate Beta value, which retains the total resistance
(RS+R
) at all possible operating temperatures within the
NTC
tracking range of the ADC. The final temperature-to-digital
code mapping depends on these variables.
The CS1630/31 color control system also has the ability to
maintain a constant CCT or change CCT as the light dims.
In
OTP configurations allow the selection of the dimming profile.
A specific CCT profile can be programmed to the digital
mapping device. In this case, the mapping is two-dimensional:
one current versus temperature profile is generated for each
dim level. The CS1630/31 provides two-dimensional mapping
for the color LED’s current only, and one-dimensional
mapping (current versus dim level) for the other string. A
simplified block diagram of the color control system is shown
in Figure 11.
NTC
with the
5.4Correlated Color Temperature Control
The CS1630/31 color control system can adjust and maintain
the correlated color temperature (CCT) for the LED colormixing application by connecting an external negative
temperature coefficient (NTC) thermistor to the eOTP pin. The
LED temperature variation can be accurately detected by the
internal eOTP feedback loops
Protection" on page 19).
DS954F313
(see "External Overtemperature
CS1630/31
where,
T = the measured normalized temperature and is 0 T 1.0
D = the normalized dim value and is 0
D1.0
GAIN
DTR
= gain of the channel based on the temperature measurement and the dim value:
where,
D = the normalized dim value and is 0
D1.0
GAIN
DR
= gain of the channel based on the dim value
GAIN
DTR
P30 T3P20 T2P10++TP03 D3P02++D2P01 DP21 T2D++=P12 T D2P11 T DP00+++
[Eq.1]
GAIN
DR
Q3=D3Q2 D2Q1 DQ0+++
[Eq.2]
P
IN max
I
PKVRMS typ
2
------------------------------------------------
=
[Eq.3]
The reference currents are the required values at ambient
temperature TA= 25ºC and dim = 100%. They are multiplied
by the appropriate gains, and these values are passed to the
final power stage. The CS1630 / 31 uses polynomial
approximations in one and two dimensions to generate the
color gains. These polynomials can be up to third-order.
GAIN
compensation profile and dimming profile of the temperaturesensitive LEDs (see Equation 1). Profiles are programmed
through the Color Polynomial Coefficient registers (see "Color
Polynomial Coefficient (P30, P20, P10, P03, P02, P01, P21,
P12, P11, P00) – Address 5 - 24" on page 29).
GAIN
white LEDs (see Equation 2). The profile is programmed
through the Color Polynomial Coefficient registers (see "Color
Polynomial Coefficient (Q3, Q2, Q1, Q0) – Address 25 - 32" on
page 30).
Cirrus Logic, Inc. and its affiliates and subsidiaries generally
make no representations or warranties that the combination of
Cirrus Logic’s products with light-emitting diodes (“LEDs”),
converter materials, and/or other components will not infringe
any third-party patents, including any patents related to color
mixing in LED lighting applications, such as, for example, U.S.
Patent No. 7,213,940 and related patents of Cree, Inc. For
more information, please see Cirrus Logic’s Terms and
Conditions of Sale, or contact a Cirrus Logic sales
representative.
approximations create a custom temperature
DTR
approximation allows custom dimming profile of the
DR
5.5Dimming Signal Extraction and the
5.6Boost Stage
The high-voltage FET in the source-follower startup circuit is
source-switched by a variable current source on the SOURCE
pin to operate a boost circuit. Peak FET switching current is
set by the PEAK_CUR register (see "Peak Current
(PEAK_CUR) – Address 51" on page 39).
In No-dimmer Mode, the boost stage begins operating when
the start threshold is reached during each rectified half line-cycle and is disabled at the nominal boost output voltage. The
peak FET switching current determines the percentage of the
rectified input voltage conduction angle over which the boost
stage will operate. The control algorithm adjusts the peak FET
switching current to maximize the operating time of the boost
stage, thus improving the input power factor.
When operating in Leading-edge Mode, the boost stage
ensures the hold current requirement of the dimmer is met
from the initiation of each half-line dimmer conduction cycle
until the peak of the rectified input voltage. Trailing-edge Mode
boost stage ensures that the trailing-edge is exposed at the
correct time with the correct current.
5.6.1Maximum Peak Current
The maximum boost inductor peak current is configured by
adjusting the peak switching current with peak current
code I
(PEAK_CUR) – Address 51" on page 39) is used to store peak
current code I
to peak current code I
. The PEAK_CUR register (see "Peak Current
PK(code)
. Maximum power output is proportional
PK(code)
, as shown in Equation 3:
PK(code)
Dim Mapping Algorithm
When operating with a dimmer, the dimming signal is
extracted in the time domain and is proportional to the
conduction angle of the dimmer. A control variable is passed
to the quasi-resonant second stage to achieve output currents
from 0% to 100%.
where,
= the correction term at 0.55
V
RMS(typ)
I
PK
= nominal operating input RMS voltage
= peak current code I
PK(code)
4.1mA
14DS954F3
CS1630/31
V
BST
CS1630 /31
15 k
ADC
R
BST
I
BSTOUT
I
ref
16
BSTOU T
R8
R9
Figure 12. BSTOUT Input Pin Model
R
BST
V
BST
I
ref
--------------
400V
133A
------------------
3M==
[Eq.4]
R3
R
IA C
I
AC
IAC
V
rect
CS1630 /31
15 k
ADC
R4
2
I
ref
12
Figure 13. IAC Input Pin Model
R
IAC
R
BST
=
[Eq.5]
5.6.2Output BSTOUT Sense & Input IAC
Sense
A current proportional to boost output voltage V
to the IC on pin BSTOUT and is used as a feedback control
signal (see Figure 12). The ADC is used to measure the
magnitude of current I
magnitude of current I
reference current I
Resistor R
BST
of 133A.
ref
sets the feedback current at the nominal boost
BSTOUT
through resistor R
BSTOUT
is then compared to an internal
output voltage. For 230VAC line voltage applications,
resistor R
is calculated as shown in Equation 4:
BST
where,
V
= nominal boost output voltage
BST
I
= internal reference current
ref
For 120VAC line voltage applications (CS1630), nominal
boost output voltage V
is 200V, and resistor R
BST
1.5M. By using digital loop compensation, the voltage
feedback signal does not require an external compensation
network.
A current proportional to the AC input voltage is supplied to the
IC on pin IAC and is used by the boost control algorithm (see
Figure 13).
is supplied
BST
BST
. The
BST
is
Resistor R
For optimal performance, resistors R
1% tolerance or better resistors for best V
sets current IAC and is derived from Equation 5:
IAC
IAC
and R
should use
BST
BST
voltage
accuracy.
5.6.3Boost Auxiliary Winding
The boost auxiliary winding is used for zero-current detection
(ZCD). The voltage on the auxiliary winding is sensed through
the BSTAUX pin of the IC. It is also used to deliver startup
current during startup time (see "Startup Circuit" on page 12).
5.6.4Boost Overvoltage Protection
The CS1630/31 supports boost overvoltage protection (BOP)
to protect the bulk capacitor C8 (see Figure 14. on page 16).
If the boost output voltage exceeds the overvoltage protection
thresholds programmed in the OTP registers a BOP fault
signal is generated. The voltage level, V
within 227V to 257V for a CS1630 and 432V to 462V for a
CS1631 (see "Configuration 53 (Config53) – Address 85" on
page 45). The control logic continuously averages the BOP
fault signal using a leaky integrator. When the output of the
leaky integrator exceeds a certain threshold, which can be set
using bits BOP_INTEG[3:0] in register Config53 (see
"Configuration 53 (Config53) – Address 85" on page 45), a
boost overvoltage fault is declared and the system stops
boosting. More information on the leaky integrator size and
sample rate is provided in section 6.23 "Configuration 18
(Config18) – Address 50" on page 38.
During a boost overvoltage protection event, the second stage
is kept enabled only if the MAX_CUR bit in register Config45
(see "Configuration 45 (Config45) – Address 77" on page 40)
is set to ‘1’ (enabled), and its dim input is railed to full scale.
This allows the second stage to quickly dissipate the stored
energy on the bulk capacitor C8, bringing down the boost
output voltage to a safe value. A visible flash on the LED might
appear, indicating that an overvoltage event has occurred.
When the boost output voltage drops to 195V (for a 120V
application), or 392V (for a 230V application), the boost stage
is enabled if bit BOP_RSTART in register Config54 (see
"Configuration 54 (Config54) – Address 86" on page 46) is set
to ‘1’, and the system returns to normal operation. If bit
BOP_RSTART is set to ‘0’, a boost overvoltage fault is latched
and the system stays in the fault mode until the input power is
recycled.
BOP(th)
, can be set
DS954F315
5.7Voltage Clamp Circuit
To keep dimmers conducting and prevent them from misfiring,
a minimum power needs to be delivered from the dimmer to
the load. This power is nominally around 2W for 230 V and
120V TRIAC dimmers. At low dim angles (
power cannot be converted into light by the second stage due
to the dim mapping at light loads. The boost output
voltage V
can rise above the safe operating voltage of the
BST
primary-side bulk capacitor C8.
90°), this excess
CS1630/31
CLAMP
Q3
R10
I
CLAMP
V
BST
S1
CS1630 /31
V
BE
VDD
3
C8
Figure 14. CLAMP Pin Model
D7
R13
Z2
R11
R14
Q4
CS1630/31
FBAUX
GND
13
GD
FBSENSE
15
12
11
T1
V
BST
R12
D9
C9
C11
C12
D11
D8
R15 D10
Q5
R16
C10
Z3
IGND
LED2 +
LED 1+
LED 1-
LED2 -
D
GND
_QVCC
Figure 15. Flyback Parallel Output Model
R13
R11
R14
Q4
L3
D8
CS1630 /31
FBAUX
GND
13
GD
FBSENSE
15
12
11
V
BST
R12
D9
C9
C11
C12
D11
R15 D10
Q5
R16
C10
Z3
IGND
LED 2+
LED1 +
LED 1-
LED 2-
D
GND
_QVCC
Figure 16. Buck Parallel Output Model
The CS1630/31 provides active clamp circuitry on the CLAMP
pin, as shown in Figure 14.
A PWM control loop ensures that the boost output
voltage V
does not exceed 227V for 120VAC applications
BST
or 424V for 230VAC applications. This control turns on the
BJT of the voltage clamp circuit, allowing the clamp circuit to
sink current through the load resistor, preventing boost output
voltage V
from exceeding the maximum safe voltage.
BST
5.7.1Clamp Overpower Protection
The CS1630/31 clamp overpower protection (COP) control
logic continuously monitors the turn-on time of the clamp
circuit. If the cumulative turn-on time exceeds 84.48ms during
the internally generated 1 second window time, a COP event
is actuated, disabling the boost and second stages. The clamp
circuitry is turned off during the fault event.
Figure 15 illustrates a quasi-resonant flyback stage
configured for two-channel parallel output.
The flyback stage is controlled by measuring current in the
transformer primary and voltage on the auxiliary winding.
Quasi-resonant operation is achieved by detecting
transformer flyback using an auxiliary winding.
A quasi-resonant buck stage configured for two-channel
parallel output is illustrated in Figure 16.
5.8Quasi-resonant Second Stage
The second stage is a quasi-resonant current-regulated DCDC converter capable of flyback, buck, or tapped buck
operation. The second stage output configuration is set by bit
S2CONFIG in register Config12 (see "Configuration 12
(Config12) – Address 44" on page 36) and bits BUCK[3:0] in
register Config10 (see "Configuration 10 (Config10) – Address
42" on page 35). To deliver the highest possible efficiency, the
second stage can operate in quasi-resonant mode and
provides constant output current with minimum line-frequency
ripple. Primary-side control is used to simplify system design
and reduce system cost and complexity.
The digital algorithm ensures monotonic dimming from 0 % to
100% of the dimming range with a linear relationship between
the dimming signal and the LED current.
16DS954F3
The buck stage is controlled by measuring current in the buck
R13
R11R14
Q4
L3
CS1630 /31
FBAUX
GND
13
GD
FBSEN SE
15
12
11
D8
V
BST
R12
D9
C9
C11
C12
D11
R15 D10
Q5
R16
C10
Z3
IGND
LED2 +
LED1 +
LED1 -
LED 2-
D
GND
_QVCC
Figure 17. Tapped Buck Parallel Output Model
D7
R13
Z2
R11
R14
Q4
CS1630 /31
FBAUX
GND
13
GD
FBSENSE
15
12
11
T1
V
BST
R12
D9
C9
D8
R15 D10
R16
C10
Z3
D
GND
_QVCC
Q5
IGND
C12
LED 2+
LED2 -
C11
LED 1+
LED 1-
D11
Figure 18. Flyback Series Output Model
R13
R11R14
Q4
L3
CS1630 /31
FBAUX
GND
13
GD
FBSENSE
15
12
11
V
BST
R12
D9
C9
R15 D10
R16
C10
Z3
D
GND
_QVCC
Q5
IGND
D11
D8
C12
LED1 +
LED1 -
C11
LED2 +
LED 2-
Figure 19. Buck Series Output Model
inductor and voltage on the auxiliary winding. Quasi-resonant
operation is achieved by detecting buck inductor
demagnetization using an auxiliary winding. The digital control
algorithm rejects line-frequency ripple created on the second
stage input by the front-end boost stage, resulting in the
highest possible LED efficiency and long LED life.
The tapped buck stage operates similar to a buck stage. The
tapped buck topology provides minimum turn-on time and
improves conversion efficiency when large input-to-output
voltage ratio is present. The tapped buck inductor behaves as
a transformer for voltage conversion and is controlled by
measuring current in the tapped inductor and voltage on the
auxiliary winding. Quasi-resonant operation is achieved by
detecting tapped inductor demagnetization using an auxiliary
winding.
CS1630/31
Similarly, a series connection in a flyback stage and buck
stage use an NMOS switch and a PMOS switch, respectively,
as shown in Figures 18 and 19.
5.8.1Series & Parallel Two-Channel Output
The CS1630/31 is designed to be programmed to support
series or parallel two-channel output configurations using one
set of power magnetics. Series or parallel configuration is set
by bit STRING and bit LED_ARG in the Config3 register (see
"Configuration 3 (Config3) – Address 35" on page 32). A
parallel connection for a flyback stage and buck stage are
connected differently: an NMOS switch is used in flyback
configuration, and a PMOS switch is used in buck / tapped
buck configuration (see Figures 15, 16, and 17).
DS954F317
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