Note: Nominal specs represent the design specs. All units should be able to approximate these – some will
exceed and some may drop slightly below these specs. Limit specs repres ent the absolute worst con dition that
still might be considered acceptable; In no case should a unit fail to meet limit specs.
1-1-1HM4N0SP
Page 4
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristic s which are often not evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special s afety characteristics are
identifi ed b y a ! on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review continuously and new instructions are issued whenever
appropriate. Prior to shipment from the factory, our
products are carefully inspected to confirm with the
recognized product safety and electr ical codes of the
countries in which they are to be sold. However, in
order to maintai n suc h c omp li anc e, it is e qual ly imp or tant to implement the following precautions when a set
is being serviced.
Precautions during Servicing
A. Parts identified by the ! symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spur ious radi ation. Thes e must also be
replaced only with specified replacements.
Examples: RF conver ters, RF cables, noise blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1)Wires covered with PVC tubing
2)Double insulated wires
3)High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1)Insulation tape
2)PVC tubing
3)Spacers
4)Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before soldering.
F. Observe that the wires do no t co ntac t he at prod uc -
ing parts (heatsink s, oxide metal film resist ors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has b een replac ed, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type connectors
which connect the power cord and the primary side
of the transformer. When replacing the transformer,
follow these steps carefully and precisely to prevent shock hazards.
Replacement procedure
1)Remove the old connector by cutting the wires at a
point close to the connector.
Important: Do not re-use a connector. (Discard it.)
2)Strip about 15 mm of the insu lation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
3)Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4)Use a crimping tool to crimp the metal sleeve at its
center. Be sure to crimp fully to the comp lete closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconne ct the AC plug from the
AC outlet.
1-2-1U31P_ISP
Page 5
Safety Check after Servicing
Examine the area surrounding the repaired location
for damage or deterioration. Observe that screws,
parts, and wires have been returned to their original
positions. Afterwards, do the following tests and confirm the specified values to verify compliance with
safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance dista nce (d) and (d’) between soldered terminals, and between terminals and surrounding metallic parts. (See Fig. 1)
Table 1 : Ratings for selected area
AC Line VoltageClearance Distance (d), (d’)
220 to 240 V
Note: This table is unofficial and for reference only.
Be sure to confirm the precise values.
≥3mm(d)
≥6 mm(d’)
2. Leakage Curre nt Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs)
and externally exposed accessible parts (RF terminals, antenna terminals, video and audio input and
output terminals, microphone jacks, earphone jacks,
etc.) is lower than or equal to the specified value in the
table below.
Measuring Method (Power ON) :
Insert load Z between B (earth ground, power cord
plug prongs) and exposed accessible parts. Use an
AC voltmeter to measure across t he ter minals of l oad
Z. See Fig. 2 and the following table.
Chassis or Secondary Conductor
Primary Circuit
d'd
Exposed Accessible Part
Z
One side of
B
Power Cord Plug Prongs
AC Voltmeter
(High Impedance)
Fig. 1
Fig. 2
Table 2: Leakage current ratings for selected areas
AC Line VoltageLoad ZLeakage Current (i)
2kΩ RES.
Connected in
parallel
220 to 240 V
50kΩ RES.
Connected in
parallel
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
i≤0.7mA AC Peak
i≤2mA DC
i≤0.7mA AC Peak
i≤2mA DC
1-2-2U31P_ISP
One side of power cord plug
prongs (B) to:
RF or
Antenna terminals
A/V Input, Output
Page 6
STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
Top View
Out
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
Pin 1
3. The 1st pin of every male connector is indicated as
shown.
Pin 1
Input
In
Bottom View
5
10
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
Fig. S-1-1
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pa ck-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the c hip par ts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protec t other pa r ts from
damage. (Fig. S-1-2)
1-3-1VCRP_SN
Page 7
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or dam age the foil of ea ch
pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applie d to all pi ns of the fl at pack-IC,
you can remove it easily. (Fig. S-1-3)
CBA
Masking
Tape
Tweezers
Hot-air
Flat Pack-IC
Desoldering
Machine
Flat Pack-IC
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
2. Lift each lead of the flat pack-IC upward one by
one, using a shar p pin or wi re to which s older will
not adhere (iron wire). W hen hea tin g the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
Sharp
Pin
Fine Tip
Soldering Iron
3. Bottom of the flat pa ck-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Fig. S-1-4
1-3-2VCRP_SN
Page 8
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is ap plied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the f lat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
Hot Air Blower
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a r ep la cem ent fl at p ack-IC mo re
easily.
2. The “●” mar k on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be su re thi s mar k m atche s the 1
on the PCB when positioni ng for installa tion. Then
presolder the four corners of th e fl at pa ck-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
To Solid
Mounting Point
CBA
Tweezers
Iron Wire
Soldering Iron
Fig. S-1-5
Fine Tip
Soldering Iron
Flat Pack-IC
or
Presolder
Flat Pack-IC
CBA
Fig. S-1-8
Fig. S-1-6
1-3-3VCRP_SN
Page 9
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static el ectric ity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a c onductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductor s
with your clothing.
<Incorrect>
<Correct>
1MΩ
CBA
Grounding Band
1MΩ
CBA
Conductive Sheet or
Copper Plate
1-3-4VCRP_SN
Page 10
PREPARATION FOR SERVICING
How to Enter the Service Mode
About Optical Sensors
Caution:
An optical sensor system is used for the Tape Start
and End Sensors on this equipment. Carefully read
and follow the instructions below. Otherwise the unit
may operate erratically.
What to do for preparation
Insert a tape into the Deck Mechanism Asse mbly and
press the PLAY button. The tape will be loaded into
the Deck Mechanism Assembly. Make sure the power
is on, connect TP507 (S-INH) to GND. T his will stop
the function of Tape Start Sensor, Tape End Sensor
and Reel Sensors. (If these TPs ar e c on nected before
plugging in the unit, the function of the sensors will
stay valid.) See Fig. 1.
Note: Because the Tape End Sensors are inactive, do
not run a tape al l t he way to the start or the end of the
tape to avoid tape damage.
Q505
Q504
TP507
S-INH
Fig. 1
1-4-1HM4N0PFS
Page 11
CABINET DISASSEMBLY INSTRUCTIONS
1. Disassembl y Flowchart
This flowchar t indi cates the di sass embly ste ps to ga in
access to item(s) to be serviced. When reassembling,
follow the steps in reverse order. Bend, route, and
dress the cables as they were originally.
[1] T op Case
[2] Front Assembly
[3] VCR Chassis Unit
[4] Jack CBA
[5] Deck Assembly
[6] Main CBA
[7] Cylinder Shield
[8] Jack Board
2. Disassembl y Method
REMOVAL
ID/
LOC
.No.
PART
REMOVE/*UNHOOK/
Fig.
UNLOCK/RELEASE/
No.
UNPLUG/DESOLDER
Note
(1):Identification (location) No. of parts in the figures
(2):Name of the part
(3):Figure Number for reference
(4): Identification of parts to be removed, unhooked,
unlocked, released, unplugged, unclamped, or
desoldered.
P=Spring, L=Locking Tab, S=Screw,
CN=Connector
*=Unhook, Unlock, Release, Unplug, or Desolder
e.g. 2(S-2) = two Screws (S-2),
2(L-2) = two Locking Tabs (L-2)
(5):Refer to “Reference Notes.”
Reference Notes
CAUTION: Locking Tabs (L-1) and (L-2) are fragile.
Be careful not to break them.
1. Remove five Screws (S-2), three Screws (S-3) and
Screw (S-4). Then, slowly lift the VCR Chassis Unit
(Deck Assembly, Jack CBA and Main CBA) up.
2. When reassembling, solder wire jumpers as shown
in Fig. D5.
3. Before installing the Deck Assembly, be sure to
place the pin of LD-SW on Main CBA as shown in
Fig. D6. Then, install the Deck Assembly while
aligning the hole of Cam Gear with the pin of LDSW, the shaft of Cam Gear with the hol e of L D-SW
as shown in Fig. D6.
[1]Top CaseD17(S-1)-
Front
[2]
Assembly
VCR Chassis
[3]
Unit
[4]Jack CBAD4Desolder, (S-5)-
Deck
[5]
Assembly
[6]Main CBAD5-----------
Cylinder
[7]
Shield
[8]Jack BoardD5*(L-3)-
↓
(1)
↓
(2)
D2*3(L-1),*4(L-2)-
D35(S-2), 3(S-3), (S-4)1
D5
2(S-6), Desolder2,3
D6
D5(S-7)-
↓
(3)
↓
(4)
(S-1)
(S-1)
[1] T op Case
(S-1)
↓
(5)
Fig. D1
1-5-1HM4N0DC
Page 12
(L-2)
[2] Front
Assembly
(S-2)
(S-3)
[3]VCR
Chassis
Unit
(L-1)
(S-3)
(S-2)
(L-2)
(S-2)
[4] Jack CBA
(S-5)
Desolder
Fig. D4
Fig. D2
(S-4)
(S-3)
(S-2)
Fig. D3
1-5-2HM4N0DC
Page 13
[7] Cylinder Shield
FE Head
Cylinder Assembly
(S-7)
ACE Head
Assembly
Pin
SW507
LD-SW
[6] Main CBA
[8] Jack Board
(L-3)
From
From
FE Head
Cylinder
Assembly
(S-6)
TOP VIEW
From
ACE Head
Assembly
[5] Deck
Assembly
[6] Main CBA
(S-6)
From
Capstan Motor
Assembly
Lead with
blue stripe
[5] Deck Assembly
Shaft
Hole
LD-SW
Cam Gear
Hole
Pin
[6] Main CBA
Fig. D6
Printing
Lead with
white stripe
Lead connections of Deck Assembly and Main CBA
Lead with
blue stripe
Desolder
from bottom
side
Fig. D5
1-5-3HM4N0DC
Page 14
ELECTRICAL ADJUSTMENT INSTRUCTIONS
General Note: "CBA" is an abbreviation for
"Circuit Board Assembly."
NOTE:
1.Electri cal adjustm ents are re quired after re placing
circuit components and certain mechanical par ts.
It is impor tant to do these adjustments only after
all repairs and replacements have been completed. Also, do not attempt these adjustments
unless the proper equipment is available.
2.To perfor m these alignment / confirmation procedures, make sure that the tracking control is set in
the center po sition: Press either "CHANNEL L5??" or
"CHANNEL K" button on the remote control unit
first, then the "PLAY" button (Front Panel only).
Te st Equipment Required
1.Oscilloscope: Dual-trace with 10:1 probe,
V-Range: 0.001~50V/Div.,
F-Range: DC~AC-20MHz
2.Alignment Tape (FL6A)
Head Switching Position Adjustment
Purpose:
To determ ine the Head Switching position during
playback.
Symptom of Misadjustment:
May cause Head Switch ing noise or vertical jit ter
in the picture.
Test pointAdj.PointModeInput
J23(V-OUT)
TP502(RF-SW)
GND
Tape
FL6AOscilloscope
Connections of Measurement Equipment
Main CBA
VR501
(Switching Point)
(MAIN CBA)
Measurement
Equipment
J23
GND
TP502
PLAY
(SP)
6.5H±1H
(416µs±64µs)
Oscilloscope
-----
Spec.
CH1 CH2
Trig. (+)
Figure 1
EXT. Syncronize Trigger Point
CH1
CH2
Reference Notes:
Playback the Alignment tape and adjust VR501 so that
the V-sync front edg e of the CH1 video out put waveform is at the 6.5H±1H (416µs±64µs) delayed position
from the rising edge o f the CH2 head switching pulse
waveform.
1.0H
6.5H+/-1H (416µs+/-64µs)
Switching Pulse
0.5H
V-Sync
1-6-1FEGVCREA
Page 15
HOW TO INITIALIZE THE VCR
To put the program back at the factory-default,
initialize the VCR as the following procedure.
1. Make sure that no timer programming is set. If not,
reset all timer programming.
2. Turn the power off.
3. Press the [STOP/EJECT] button and
[CHANNEL K] button on the unit simultaneously
for at least 2 seconds.
Upon completion of the initialization of the
EEPROM, “” mark on the display turns on a
light.
4. Release the [STOP/EJECT] button and
[CHANNEL K] button to complete this mode.
1-7-1HM410INT
Page 16
FUNCTION INDICATOR SYMBOLS
Note:
The following symbols will appear on the indicator panel to indicate the current mode or operation of the VCR.
On-screen modes will also be momentarily displayed on the tv screen when you press the operation buttons.
RF OUTRF out channel number is displayed on the indicator panel.
S-INH conditionAll modesBlinks at 0.8Hz interval
All lighting modeAll charactersON
" "
" "
" "
ON
OFF
ON
(T-REC OFF,T-REC incomplete
Blinks at 0.8Hz interval)
1-8-1HM4N0FIS
Page 17
TV screen
Note:
OSD for mechanical error will be displayed for 5 sec. after the mechanical error occurs.
CauseIndicator Active
When reel or capstan mechanism is not
functioning correctly
When tape loading mechanism is not
functioning correctly
When cassette loading mechanism is not
functioning correctly
When the drum is not working properly
P-ON Power safety detection
When reel or capstan mechanism is not functioning
correctly
A
R
When tape loading mechanism i s not function ing correctly
“A R” is displayed on a TV screen. (Refer to Fig. 1.)
“A T” is displayed on a TV screen. (Refer to Fig. 2.)
“A C” is displayed on a TV screen. (Refer to Fig. 3.)
“A D” is displayed on a TV screen. (Refer to Fig. 4.)
“A P” is displayed on a TV screen. (Refer to Fig. 5.)
Fig. 1
When the drum is not working properly
A
D
P-ON Power safety detection
Fig. 4
A
T
Fig. 2
When cassette loadi ng mechanism is not functi oning
correctly
A
C
Fig. 3
A
P
Fig. 5
1-8-2HM4N0FIS
Page 18
BLOCK DIAGRAMS
Servo / System Control Block Diagram
TO
AUDIO BLOCK
FROM/TO
Hi-Fi AUDIO
BLOCK
FROM/TO
VIDEO BLOCK
KEY
SWITCH
TP507
SENS-INH
KEY
SWITCH
8
7
KEY- 2
KEY- 1REMOCON-IN
CTL(+)
CTL(-)
REMOTE
RS501
14
SENSOR
S-LED
D502
LD-SW9
94
957610480
AL+5V
IC501
(SERVO/SYSTEM CONTROL)
AL+5V
LED DISPLAY
FP562
232221
D1D2D3
DRV-DATA
DRV-STB
DRV-CLK
(LED DISPLAY)
2
1
28
686970
DRV-STB
DRV-CLK
DRV-DATA
T-REEL
RESET
S-REEL79
34
Q501
RESET
TIMER+5V
S-REEL
PS503
ST-S
IC561
END-S
20
D4
161413e12
17
a
bcd
SDA
SCL
SDA
SCL
TU701(TUNER UNIT)
3
7
f
IC503 (MEMORY)
5
12
11
11
j
SDA
5
SCL
6
IIC-BUS SDA
AL+5V
VR501
A-MUTE-H
IIC-BUS SCL
83
A-MUTE-H
REC-SAF-SW
PG-DELAY
2
31
SW506
AL+5V
SW-POINT
A-MODE
Hi-Fi-H-SW
IIC-BUS SCL
IIC-BUS SDA
19
Hi-Fi-H-SW
REC-SAFETY
P-ON+15V
AL+12V
CN502
AL+12V(2)
12 P-ON+15V
11
LINE-MUTE
IIC-BUS SCL
IIC-BUS SDA
72
32
28
A-MODE
LINE-MUTE
IIC-BUS SDA
LM-FWD/REV
D-CONT77
D-PFG
81
90
D-PFG8D-CONT7LM-FWD/REV
GND5C-CONT4C-F/R3C-FG2P-ON+5V1AL+12V/+20.5V
6
9
10 GND
RF-SW
C-ROTA
D-REC-H
15
183316
71
RF-SW
C-ROTA
D-REC-H
IIC-BUS SCL
C-CONT
C-F/R
C-FG
78
87
H-A-SW
D-V-SYNC
H-A-COMP
17
13
H-A-SW
D-V-SYNC
H-A-COMP
AL+12V/+20.5V
P-ON+5V
V-ENV
C-SYNC
6
58
V-ENV
C-SYNC
C-POW-SW
66
C-POW-SW
FROM/TO
P-ON-H
P-DOWN-L
67
86
P-ON-H
P-DOWN-L
POWER
SUPPLY
BLOCK
SW507
LD-SW
MAIN CBA
ST-S
Q504
Q505
SENSOR CBA
END-S
T-REEL
Q503
TP506
END-S
SENSOR CBA
(DECK ASSEMBLY)
CN504
CL504
2 CTL(+)
1 CTL(-)
CONTROL
ACE HEAD ASSEMBLY
HEAD
1-9-1
MOTOR
CAPSTAN MOTOR
M
PG
SENSOR
CYLINDER ASSEMBLY
DRUM
MOTOR
DRIVE
CIRCUIT
CAPSTAN
MOTOR
M
M
LOADING
MOTOR
HM462BLS
Page 19
Video Block Diagram
VIDEO (L)-1
HEAD
VIDEO (R)-1
HEAD
CYLINDER ASSEMBLY
(DECK ASSEMBLY)
123
456
CN253
VIDEO(L)-1
VIDEO(L)-2
VIDEO(R)-1
VIDEO-COM
969593
94
SP
HEAD
AMP
SP
EP
VIDEO (R)-2
HEAD
VIDEO (L)-2
HEAD
VIDEO(R)-2
VIDEO-COM
908988
EP
HEAD
WF1
AMP
TP502
87
RF-SW
FROM/TO SERVO/SYSTEM
CONTROL BLOCK
RF-SW
H-A-SW
C-ROTA
D-REC-H
D-V-SYNC
71
62
70
80
D-REC-H
H-A-SW
D-V-SYNC
C-ROTA/RF-SW
V-ENV
C-SYNC
H-A-COMP
67
84
83
V-ENV
C-SYNC
H-A-COMP
SERIAL
DECORDER
P
R
LUMINANCE
SIGNAL
PROCESS
7978
REC-VIDEO SIGNAL PB-VIDEO SIGNAL MODE: SP/REC
69684643
IIC-BUS SDA
IIC-BUS SCL
Y. DELAY
65
FROM
SERVO/SYSTEM
CONTROL BLOCK
50
OSD
CHARACTER
IC501 (OSD)
MIX
52
IC301
(Y/C SIGNAL PROCESS)
BUFFER
AGC
BYPASS
FRT
IN1
IN2
TUNER
4850525456
REC FM
AGC
+
Y
CCD 1H DELAY
CHARA.
INS.
IN2
FRT
PB/EE
C
CHROMINANCE
1/2
MUTE
IN1
TUNER
RPRP
SIGNAL
PROCESS
MUTE
PB/EE
Y/C
FBC
MIX
WF3
J23
PR
V-OUT
21
2928
C-PB
TP301
X301
4.433619MHz
WF2
AGCVXO
5859
61
63
MAIN CBA
Q351
TU-VIDEO
VIDEO-IN1TO
SERVO/SYSTEM
CONTROL BLOCK
6
24
VIDEO IN
VIDEO OUT
TU701(TUNER UNIT)
JK756
1-9-2
VIDEO
FRONT
CN151
JACK CBA
CN101
JK101
-IN
CN152
1
VIDEO-OUT1
1
1
VIDEO-OUT2
VIDEO-IN1
33
VIDEO-IN2 3
3
1
CN102
Q101
BUFFER
19
VIDEO
-OUT1
20
VIDEO
-IN1
Q102
JK102
VIDEO
BUFFER
19
20
-OUT2
VIDEO
-IN2
HM462BLV
Page 20
Audio Block Diagram
Mode : SP/REC
PB-AUDIO SIGNALREC-AUDIO SIGNAL
TO SERVO/SYSTEM
11
12
SERIAL
DECODER
AUDIO HD-SW
CONTROL
71
68 69
16
MUTE
LINE
AMP
ALC
ALC
DET
IN1
151317
TUNERIN2
INV
P
R
ATT
98
REC-ON
REC
AMP
100
7
3
CONTROL BLOCK
A-MUTE-H
IIC-BUS SCL
IIC-BUS SDA
MAIN CBA
IC301
(AUDIO SIGNAL PROCESS)
N-A-PB
N-A-REC
TO Hi-Fi
AUDIO BLOCK
EQ
PB-ON
5
AMP
6
SP/LP-ON
+5V
Q401
CN504
AUDIO-PB/REC
3
Q402
4 A-COM
BIAS
6 AE-H
OSC
AUTO
BIAS
2
1
Q406
5 AE-H/FE-H
+5V
Q403 (SWITCHING)
Q405
CN501
2 FE-H
1 FE-H-GND
FE HEAD
(PB=ON)
1-9-3
ACE HEAD ASSEMBLY
AUDI O
HEAD
(DECK ASSEMBLY)
AUDI O
ERASE
HEAD
FULL
ERASE
HEAD
HM462BLA
Page 21
Hi-Fi Audio Block Diagram
AUDIO(L)
-OUT
AUDIO(R)
-OUT
TU701
JK751
SIF OUT
(TUNER UNIT)
22
AUDIO IN
2
FROM/TO
SERVO/SYSTEM
CONTROL BLOCK
Hi-Fi
CYLINDER
ASSEMBLY
AUDIO
(R) HEAD
Hi-Fi
AUDIO
(L) HEAD
CN509
AUDIO(L)-OUT1
AUDIO(R)-OUT1
2
REC-AUDIO SIGNALPB-AUDIO SIGNALMode : SP/REC
1
SUB JACK CBA
AFV CBA
2
CN701
SIF
2
CN1
4
IF SIGNAL
PROCESS
5
7374727677
MUTE-ON
VCOMUTE
OUTPUT
SELECT
75
MUTE-ON
A-MODE
IIC-BUS SCL
IIC-BUS SDA
Q451
37
38
LOGIC
ENV
R-CH
BPF
NOISE
COMP
SW
NOISE
PPR
LINE-MUTE
21
53
MUTE
DET
DET
VCO
LIMDEV
Hi-Fi-H-SW
39
HOLD
PULSE
LPF
(DECK ASSEMBLY)
MIXV/I
LPF
VCO
LIMDEV
9
-COM 8
CN253
Hi-Fi-AUDIO(R)7Hi-Fi
Hi-Fi-AUDIO(L)
242627
R
L
34 33
LIM
L-CH
BPF
DO
DET
COMP
SW
NOISE
R
MAIN CBA
7
9
CN151
AUDIO(R)-IN1
AUDIO(L)-IN1
7
9
CN101
5
11
AUDIO(R)-OUT1
AUDIO(L)-OUT1
5
11
9
CN152
AUDIO(R)-IN2
9
CN102
8
6
11
AUDIO(R)-OUT2
AUDIO(L)-IN2
AUDIO(L)-OUT2
8
6
11
CN701C N1
TU-AUDIO(R)
TU-AUDIO(L)
5
4
(Hi-Fi AUDIO SIGNAL PROCESS)
IC451
L-CH
R-CH
PNR
6171
47
48
R-CH
INSEL
5256545060
2
L-CH
6108
14
INSEL
ALC
ALC
ALC
70
62
SW
SW
67
65
PNR
15
4
ALC
+
78
N-A-REC
TO AUDIO BLOCK
80
N-A-PB
JACK CBA
JK101
2
AUDIO(R)-IN1
6
1
3
AUDIO(L)-IN1
AUDIO(R)-OUT1
AUDIO(L)-OUT1
JK102
2
6
AUDIO(R)-IN2
AUDIO(L)-IN2
1
3
AUDIO(R)-OUT2
AUDIO(L)-OUT2
1-9-4
JK758
AUDIO(R)
-IN
FRONT
JK757
AUDIO(L)
-IN
HM462BLH
Page 22
Power Supply Block Diagram
P-ON+44V
P-ON+15V12P-ON-H
AL+12V/+20.5V
AL+9V
AL+12V
C-POW-SW
AL+5V
TIMER+5V
P-ON+5V
P-DOWN-L
Q053
MAIN CBA
Q051
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
T001
2
Q057
Q052
13
Q055
Q058
14
4
15
Q001
Q054
Q059
16
Q056
SHUNT
REGULATOR
Q004
11
17
18
1
4
IC001
ERROR
6
7
VOLTAGE DET
COLD
23
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
BRIDGE
D001 - D004
LINE
F001L003
T1.6A L 250V
HOT CIRCUIT. BE CAREFUL.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
AC001
RECTIFIER
FILTER
1-9-5
Q002
Q003
HOT
HM462BLP
Page 23
SCHEMATIC DIAG RAMS / CBA’S AND TEST POINTS
Standard Notes
WARNING
Many electrical and mechanical parts in this chassis
have special characteristics. These characteristics
often pass unnoticed and the protection afforded by
them cannot necessarily be obtained by using
replacement components rated for higher voltage,
wattage, etc. Replacement parts that have these special safety character istics are id entified in th is manual
and its supplements; electrical components having
such features are identified by the m ark " ! " in the
schematic diagram and the par ts list. Before replacing
any of these components, read the parts list in this
manual carefully. The use of substitute replacement
parts that do not have the same safety characterist ics
as specified in the pa r ts list may create sh ock, fire, or
other hazards.
Notes:
1. Do not use the part number sh own on these draw-
ings fo r orde ring. The cor rect part number is sho wn
in the parts list, and may be slightly different or
amended since these drawings were prepared.
2. All resistance values are indicated in ohms
3
(K=10
3. Resistor wattages are 1/4W or 1/6W unless other-
wise specified.
4. All capacitance values are indicated in µF
(P=10
5. All voltages are DC voltages unless otherwise
specified.
6. Electrical parts such as capacitors, connectors,
diodes, IC’s, transistors, resistors, switches, and
fuses are identified by four digits. The first two digits are not shown for each component. In each
block of the diagram, there is a note such as shown
below to indicate these abbreviated two digits.
, M=106).
-6
µF).
1-10-1SCPA1
Page 24
LIST OF CAUTION, NOTES, AND SYMBOLS USED IN THE SCHEMATIC DIAGRAMS ON THE FOLLOW ING
PAGES:
1. CAUTION:
FOR CONTINUED PROTECTION AGAINST FIRE HAZARD, REPLACE ONLY WITH THE SAME TYPE FUSE.
2. CAUTION:
Fixed Voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown, first check to see that all components in the power supply circuit are not defective
before you connect the AC plug to the AC power supply. Otherwise it may cause some components in the
power supply circuit to fail.
3. Note:
(1) Do not use the part number shown on the drawings for ordering. The correct part number is shown in the
parts list, and may be slightly different or amended since the drawings were prepared.
(2) To maintai n original function and reliabi lity of repaired units, use only orig inal replacement par ts which are
listed with their part numbers in the parts list section of the service manual.
4. Mode: SP/REC
5. Voltage indications for PLAY and REC modes on the schematics are as shown below:
Unit: Volts
The same voltage for
both PLAY & REC modes
6. How to read converged lines
1-D3
Distinction Area
Line Number
(1 to 3 digits)
Examples:
1. "1-D3" means that line number "1" goes to the line number
"1" of the area "D3".
2. "1-B1" means that line number "1" goes to the line number
"1" of the area "B1".
7. Test Point Information
: Indicates a test point with a jumper wire across a hole in the PCB.
: Used to indicate a test point with a component lead on foil side.
5.0
231
5.0
PLAY mode
REC mode
(2.5)
Indicates that the voltage
is not consistent here.
3
AREA D3
2
1
AREA B1
1-D3
ABCD
1-B1
: Used to indicate a test point with no test pin.
: Used to indicate a test point with a test pin.
1-10-2SCRK05
Page 25
Main 1/6 Schematic Diagram
1-10-3
HM462SCM1
Page 26
D1D2D3D4
a
b
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
c
d
e
f
g
h
j
i
a
b
c
d
e
f
g
a
b
a
b
a
b
FP562 MATRIX CHART
Main 2/6 & Sensor Schematic Diagram
D1D2D3D4
a
f
g
e
d
b
c
1-10-4
HM462SCM2
Page 27
Main 3/6 Schematic Diagram
1-10-5
HM462SCM3
Page 28
Main 4/6, Jack & Sub Jack Schematic Diagram
1-10-6
HM462SCM4
Page 29
Main 5/6 Schematic Diagram
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
1-10-7
HM462SCM5
Page 30
Main 6/6 Schematic Diagram
1-10-8
HM462SCM6
Page 31
AFV Schematic Diagram
1-10-9
HM462SCAFV
Page 32
Main CBA Top View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
Sensor CBA Top View
BHF300F01012A
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
BHF300F01012B
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
WF3
J23
V-OUT
WF1
TP502
RF-SW
VR501
SW-POINT
1-10-10
TP507
S-INH
TP501
CTL
WF2
TP301
C-PB
BHM450F01011A
Page 33
Main CBA Bottom View
CAUTION !
For continued protection against fire hazard,
replace only with the same type fuse.
NOTE:
The voltage for parts in hot circuit is measured using
hot GND as a common terminal.
CAUTION !
Fixed voltage (or Auto voltage selectable) power supply circuit is used in this unit.
If Main Fuse (F001) is blown , check to see that all components in the power supply
circuit are not defective before you connect the AC plug to the AC power supply.
Otherwise it may cause some components in the power supply circuit to fail.
Because a hot chassis ground is present in the power
supply circut, an isolation transformer must be used.
Also, in order to have the ability to increase the input
slowly, when troubleshooting this type power supply
circuit, a variable isolation transformer is required.
1-10-11
BHM450F01011A
Page 34
Jack CBA Top View
Jack CBA Bottom View
1-10-12
BHM450F01011C
Page 35
AFV CBA Top View
AFV CBA Bottom View
Sub Jack CBA Top View
BE6800F01091
Sub Jack CBA Bottom View
1-10-13
BHM450F01011B
Page 36
WAVEFORMS
NOTE:
Input
VCR: COLOR BAR SIGNAL (WITH 1KHz AUDIO SIGNAL)
(WF1~WF3)
See Electrical Parts List
for parts with this mark.
Some Ref. Numbers are
not in sequence.
2L021
2L021
2B5
2L051
SUB JACK CBA
AFV CBA
MAIN CBA
2L041
2L041
SENSOR CBA
2B46
2B8
2L031
2B7
2L041
2L099
2L021
1B1
A10
A3
A7
1-15-2HM462CEX
Page 43
Packing
Some Ref. Numbers
are not in sequence.
S2
X3X20AX20BX1
X2
X4
S2
S3
Unit
S1
A14
1-15-3HM462PEX
Page 44
MECHANICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTE: Parts that are not assigned part numbers
(---------) are not available.
! have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
C.....±0.25%D.....±0.5%F.....±1%
G.....±2%J......±5%K.....±10%
M.....±20%N.....±30%Z.....+80/-20%
MCV CBA
Ref. No.DescriptionPart No.
MCV CBA
Consists of the following:
MAIN CBA (MCV-A)
SUB JACK CBA (MCV -B)
JACK CBA (MCV -C)
SENSOR CBA
MAIN CBA
Ref. No.DescriptionPart No.
MAIN CBA (MCV-A)
Consists of the following:
CAPACITORS
C002!MET A LIZED FILM CAP. 0.068 µF/250V K orCT2E683DC011
!METALIZED FILM CAP. 0.068µF/250V K orCT2E683DC014
!METALIZED FILM CAP. 0.068µF/25 0V MCT2E683MS0 37C003!SAFTY CAP . 2200pF/ 250V orCCN2EMA0E222
!SAFETY CAP. 2200pF/ 250VCA2E222MR049
C004ELECTROLYTIC CAP . 33µF/400V MCE2HMZXJH330
C005CERAMIC CAP. B K 0.01µF/500VCCD2JKP0B103
C006CERAMIC CAP. SL K 56pF/ 1KV orCCD3AKPSL560
CERAMIC CAP. SL J 56pF/ 1KVCCD3AJPSL560
C007CERAMIC CAP.(AX) B K 1000pF/ 50VCCA1JKT0B102
C008CERAMIC CAP.(AX) X K 5600pF/ 16VCCA1CKT0X562
C010FILM CAP.(P) 0.022µF/100V J orCMA2AJP00223
FILM CAP (P) 0.022µF/50V J orCMA1JJP00223
FILM CAP.(P) 0. 022 µF/50V J orCA1J223MS02 9
POL YEST ER FILM CAP. (PB FREE) 0.022µF/
100V J
C011ELECTROLYTIC CAP . 10µF/ 16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C012ELECTROLYTIC CAP . 10µF/ 50V M H7 orCE1JMA VS L100
ALUMINUM ELECTROL YT IC CAP 10µF/50V H7 CE1JMAVS M100
C014ELECTROLYTIC CAP . 470µF/ 35V M orCE1GMASDL471
ELECTROLYTIC CAP . 47 0µF/35V MCE1GMASTM471
C015ELECTROLYTIC CAP . 47µF/25V M H7 orCE1EMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/25V H7 CE1EMAVSM470
C017ELECTROLYTIC CAP . 470µF/ 16V M orCE1CMASDL471
ELECTROLYTIC CAP . 47 0µF/16V MCE1CMASTM471
C018ELECTROLYTIC CAP . 100µF/ 16V M orCE1CMASDL101
ELECTROLYTIC CAP . 10 0µF/16V MCE1CMASTM101
C020ELECTROLYTIC CAP . 1000µF/16V M orCE1CMASDL102
ALUMINUM ELECTROL YT IC CAP 1000µF/16V MCE1CMZPTM102
C021ELECTROLYTIC CAP . 470µF/ 10V M orCE1AMASDL471
ELECTROLYTIC CAP . 47 0µF/10V MCE1AMASTM471
1VSA14150
----------
----------
---------0VSA14893
----------
CA2A223DT018
Ref. No.DescriptionPart No.
C025CHIP CERAMIC CAP. B K 8200pF/ 50VCHD1JK30B822
C026ELECTROLYTI C CAP. 47µF/16V M H7 orCE1CMA VS L470
ALUMINUM ELECTROLYTIC CAP 47µF/16V H7 CE1CMAVSM470
C053ELECTROLYTI C CAP. 220µF/6.3V M H7 orCE0KMASSL221
ELECTROLYTIC CAP. 220µF/6.3V M H7CE0KMASSM221
C056CHIP CERAMIC CAP.(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C057CHIP CERAMIC CAP.(1608) CH J 470pF/ 50VCHD1JJ3CH471
C060ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C061CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C157ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C158CHIP CERAMIC CAP.(1608) B K 1000pF/ 50VCHD1JK30B102
C251ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C252CHIP CERAMIC CAP.(1608) B K 1000pF/ 50VCHD1JK30B102
C253ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C254CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C302CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C303ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C304ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C305CHIP CERAMIC CAP. F Z 0.22µF/16VCHD1CZ30F224
C307CHIP CERAMIC CAP.(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C308CHIP CERAMIC CAP.(1608) B K 0.022µF/50V or CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022µF/25VCHD1EK30B223
C309CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C310CHIP CERAMIC CAP.(1608) B K 0.047µF/50V or CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047µF/25VCHD1EK30B473
C312CHIP CERAMIC CAP. B K 8200pF/ 50VCHD1JK30B822
C313CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C314CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C315CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C316CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C317ELECTROLYTI C CAP. 47µF/6.3V M H7 orCE0KMA VSL470
ALUMINUM ELECTROLYTIC CAP 47µF/6.3V H7CE0KMAVSM470
C318ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C319ELECTROLYTI C CAP. 1µF/50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROLYTIC CAP 1µF/50V H7 CE1JMAVSM1R0
C320CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C321CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C322ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C323CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C324CHIP CERAMIC CAP.(1608) CH J 68pF/ 50VCHD1JJ3CH680
C325CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C326CHIP CERAMIC CAP.(1608) CH J 68pF/ 50VCHD1JJ3CH680
C327ELECTROLYTI C CAP. 0.47µF/50V M H7 orCE1JMAVSLR47
200607031-17-1HM462EL
Page 46
Ref. No.DescriptionPart No.
ALUMINUM ELECTROL YT IC CAP 0.47µF/50V H7CE1JMA VS MR47
C328CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C329CHIP CERAMIC CAP .(1608) CH J 68pF/ 50VCHD1JJ3CH680
C331CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C332CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C333ELECTROLYTIC CAP . 0.47µF/50V M H7 orCE1JMAVSLR47
ALUMINUM ELECTROL YT IC CAP 0.47µF/50V H7CE1JMA VS MR47
C334ELECTROLYTIC CAP . 4.7 µF/25V M NP H7CP1EMAVSB4R7
C335ELECTROLYTIC CAP . 10µF/ 16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C336CHIP CERAMIC CAP .(1608) CH J 1000pF/ 50V orCHD1JJ3CH102
CHIP CERAMIC CAP . CH J 1000pF/ 25VCHD1EJ3CH102
C337CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C338ELECTROLYTIC CAP . 100µF/ 6.3V H7 orCE0KMA V SL101
ALUMINUM ELECTROL YT IC CAP 100µF/6.3V H7CE0KMAVSM101
C339ELECTROLYTIC CAP . 1µF/ 50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C340CHIP CERAMIC CAP . CH J 120pF/ 50VCHD1JJ3CH121
C341CHIP CERAMIC CAP . CH J 220pF/ 50VCHD1JJ3CH221
C342ELECTROLYTIC CAP . 1µF/ 50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C343CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C345CHIP CERAMIC CAP .(1608) CH J 68pF/ 50VCHD1JJ3CH680
C346CHIP CERAMIC CAP .(1608) CH J 68pF/ 50VCHD1JJ3CH680
C347CHIP CERAMIC CAP .(1608) CH D 10pF/ 50VCHD1JD3CH100
C351ELECTROLYTIC CAP . 220µF/ 6.3V M H 7 orCE0KMAVSL221
ALUMINUM ELECTROL YT IC CAP 220µF/6.3V H7CE0KMAVSM221
C352ELECTROLYTIC CAP . 100µF/ 16V M H7 orCE1CMAVS L101
ALUMINUM ELECTROL YT IC CAP 100µF/16V H7CE1CMA VSM1 01
C401ELECTROLYTIC CAP . 47µF/6.3V M H7 orCE0KMAVSL470
ALUMINUM ELECTROL YT IC CAP 47µF/6.3V H7CE0KMAVSM470
C402ELECTROLYTIC CAP . 220µF/ 6.3V M H7 orCE0KMASSL221
ELECTROLYTIC CAP . 22 0µF/6.3V M H7CE0KMASSM221
C403CERAMIC CAP. B K 470pF/ 100VCCD2AKS0B471
C404FILM CAP.(P) 0.018µF/100V J orCMA2AJP00183
FILM CAP.(P) 0. 018 µF/50V J orCMA1JJP00183
FILM CAP.(P) 0. 018 µF/50V J orCA1J183MS02 9
POL YEST ER FILM CAP. (PB FREE) 0.018µF/
100V J
C411CHIP CERAMIC CAP .(1608) B K 1000pF/ 50VCHD1JK30B102
C412CHIP CERAMIC CAP . B K 1800pF/ 50VCHD1JK30B182
C414CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C415ELECTROLYTIC CAP . 10µF/ 16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C416CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C417CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B22 3
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C418CHIP CERAMIC CAP .(1608) CH J 33pF/ 50VCHD1JJ3CH330
C419CHIP CERAMIC CAP .(1608) B K 4700pF/ 50VCHD1JK30B472
C421ELECTROLYTIC CAP . 33µF/6.3V M H7 orCE0KMAVSL330
ALUMINUM ELECTROL YT IC CAP 33µF/6.3V H7CE0KMAVSM330
C422ELECTROLYTIC CAP . 4.7 µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROL YT IC CAP 4.7µF/25V H7CE1EMAVSM4R7
C424ELECTROLYTIC CAP . 22µF/6.3V M H7 orCE0KMAVSL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMAVSM220
CA2A183DT018
Ref. No.DescriptionPart No.
C425CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C428CHIP CERAMIC CAP. CH J 220pF/ 50VCHD1JJ3CH221
C430ELECTROLYTI C CAP. 47µF/6.3V M H7 orCE0KMA VSL470
ALUMINUM ELECTROLYTIC CAP 47µF/6.3V H7CE0KMAVSM470
C451ELECTROLYTI C CAP. 47µF/16V M H7 orCE1CMA VS L470
ALUMINUM ELECTROLYTIC CAP 47µF/16V H7 CE1CMAVSM470
C452CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C453ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C454ELECTROLYTI C CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/10V H7 CE1AMAVSM220
C455CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C456CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C457ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C458ELECTROLYTI C CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C459CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C460CHIP CERAMIC CAP.(1608) B K 4700pF/ 50VCHD1JK30B472
C461ELECTROLYTI C CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/10V H7 CE1AMAVSM220
C462CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C463CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C464ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C465CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C466ELECTROLYTI C CAP. 220µF/6.3V M H7 orCE0KMAVSL221
ALUMINUM ELECTROLYTIC CAP 220µF/6.3V H7CE0KMAVSM221
C467ELECTROLYTI C CAP. 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROLYTIC CAP 22µF/10V H7 CE1AMAVSM220
C468CHIP CERAMIC CAP.(1608) B K 4700pF/ 50VCHD1JK30B472
C469CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C470ELECTROLYTI C CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C471ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C472CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C473CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C474ELECTROLYTI C CAP. 22µF/6.3V M H7 orCE0KMA VSL220
ALUMINUM ELECTROLYTIC CAP 22µF/6.3V H7CE0KMAVSM220
C475CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C476CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C477ELECTROLYTI C CAP. 10µF/16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROLYTIC CAP 10µF/16V H7 CE1CMAVSM100
C478ELECTROLYTI C CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C479ELECTROLYTI C CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C480CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C481ELECTROLYTI C CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROLYTIC CAP 4.7µF/25V H7CE1EMAVSM4R7
C482ELECTROLYTI C CAP. 4.7µF/25V M H7 orCE1EMAVSL4R7
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Page 47
Ref. No.DescriptionPart No.
ALUMINUM ELECTROL YT IC CAP 4.7µF/25V H7CE1EMAVSM4R7
C483ELECTROLYTIC CAP . 4.7 µF/25V M H7 orCE1EMAVSL4R7
ALUMINUM ELECTROL YT IC CAP 4.7µF/25V H7CE1EMAVSM4R7
C484ELECTROLYTIC CAP . 10µF/ 16V M H7 orCE1CMA VS L100
ALUMINUM ELECTROL YT IC CAP 10µF/16V H7 CE1CMAV SM100
C485CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C486CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C489CHIP CERAMIC CAP . B K 2200pF/ 50VCHD1JK30B222
C501ELECTROLYTIC CAP . 220µF/ 6.3V M H 7 orCE0KMAVSL221
ALUMINUM ELECTROL YT IC CAP 220µF/6.3V H7CE0KMAVSM221
C502CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C506CERAMIC CAP.(AX) B K 100pF/ 50VCCA1JKT0B101
C508ELECTROLYTIC CAP . 1µF/ 50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C510ELECTROLYTIC CAP . 22µF/10V M H7 orCE1AMAVSL220
ALUMINUM ELECTROL YT IC CAP 22µF/10V H7 CE1AMAVSM220
C511ELECTROLYTIC CAP . 100µF/ 6.3V H7 orCE0KMA V SL101
ALUMINUM ELECTROL YT IC CAP 100µF/6.3V H7CE0KMAVSM101
C512CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C513CHIP CERAMIC CAP .(1608) CH J 22pF/ 50VCHD1JJ3CH220
C514CHIP CERAMIC CAP .(1608) CH J 22pF/ 50VCHD1JJ3CH220
C515CHIP CERAMIC CAP . CH J 18pF/ 50VCHD1JJ3CH180
C516CHIP CERAMIC CAP . CH J 18pF/ 50VCHD1JJ3CH180
C517CHIP CERAMIC CAP .(1608) B K 4700pF/ 50VCHD1JK30B472
C518CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK 30B47 3
CHIP CERAMIC CAP .(1608) B K 0.047µF/25VCHD1EK30B473
C519CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C520CHIP CERAMIC CAP .(1608) CH J 100pF/ 50VCHD1JJ3CH101
C521CHIP CERAMIC CAP . CH J 560pF/ 50VCHD1JJ3CH561
C522ELECTROLYTIC CAP . 22µF/6 .3V M H7 orCE0KMASSL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMASSM220
C523CHIP CERAMIC CAP .(1608) B K 1000pF/ 50VCHD1JK30B102
C524CHIP CERAMIC CAP . CH J 330pF/ 50VCHD1JJ3CH331
C526CHIP CERAMIC CAP .(1608) B K 4700pF/ 50VCHD1JK30B472
C527ELECTROLYTIC CAP . 22µF/6 .3V M H7 orCE0KMASSL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMASSM220
C528CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C530CERAMIC CAP.(AX) F Z 0.022µF/25VCCA1EZTFZ223
C531CERAMIC CAP.(AX) Y M 0.01µF/16VCCA1CMT0Y103
C532ELECTROLYTIC CAP . 22µF/6 .3V M H7 orCE0KMASSL220
ALUMINUM ELECTROL YT IC CAP 22µF/6.3V H7CE0KMASSM220
C533CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C535CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C538CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B22 3
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C540ELECTROLYTIC CAP . 470µF/ 6.3V M o rCE0KMASDL471
ELECTROLYTIC CAP . 47 0µF/6.3V MCE0KMASTM471
C561CHIP CERAMIC CAP .(1608) B K 0.022µF/50V or CHD1JK30B22 3
CHIP CERAMIC CAP .(1608) B K 0.022µF/25VCHD1EK30B223
C562ELECTROLYTIC CAP . 330µF/ 6.3V M H7 orCE0KMASSL331
ELECTROLYTIC CAP . 33 0µF/6.3V M H7CE0KMASSM331
C563CHIP CERAMIC CAP . F Z 1µF/10V orCHD1AZB0F105
CHIP CERAMIC CAP . F Z 1µF/10VCHD1AZ30F105
C564CHIP CERAMIC CAP .(1608) CH J 100pF/ 50VCHD1JJ3CH101
C567CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C701CHIP CERAMIC CAP .(1608) B K 0.047µF/50V or CHD1JK30B47 3
CHIP CERAMIC CAP .(1608) B K 0.047µF/25VCHD1EK30B473
Ref. No.DescriptionPart No.
C702CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C704CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C705CHIP CERAMIC CAP. CH J 56pF/ 50VCHD1JJ3CH560
C706CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C708CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C716CHIP CERAMIC CAP. F Z 0.22µF/16VCHD1CZ30F224
C717CHIP CERAMIC CAP. F Z 0.22µF/16VCHD1CZ30F224
C756CHIP CERAMIC CAP.(1608) CH J 470pF/ 50VCHD1JJ3CH471
C757CHIP CERAMIC CAP.(1608) CH J 470pF/ 50VCHD1JJ3CH471
C851CHIP CERAMIC CAP.(1608) CH J 22pF/ 50VCHD1JJ3CH220
C852CHIP CERAMIC CAP.(1608) CH J 22pF/ 50VCHD1JJ3CH220
C853CHIP CERAMIC CAP.(1608) B K 4700pF/ 50VCHD1JK30B472
C854CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
C855CHIP CERAMIC CAP.(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1µF/25VCHD1EZ30F104
C856CHIP CERAMIC CAP. CH J 180pF/ 50VCHD1JJ3CH181
C859ELECTROLYTI C CAP. 47µF/6.3V M H7 orCE0KMA VSL470
ALUMINUM ELECTROLYTIC CAP 47µF/6.3V H7CE0KMAVSM470
C862CHIP CERAMIC CAP.(1608) B K 0.01µF/50VCHD1JK30B103
T A CT SWITCH SKQSAF001A orSST0101AL041
T A CT SWITCH TC-1104(H=9.5)SST0101DNG01
SW502TACT S WITCH KSM0614B orSST0101HH013
T A CT SWITCH SKQSAF001A orSST0101AL041
T A CT SWITCH TC-1104(H=9.5)SST0101DNG01
SW503TACT S WITCH KSM0614B orSST0101HH013
T A CT SWITCH SKQSAF001A orSST0101AL041
T A CT SWITCH TC-1104(H=9.5)SST0101DNG01
SW504TACT S WITCH KSM0614B orSST0101HH013
T A CT SWITCH SKQSAF001A orSST0101AL041
T A CT SWITCH TC-1104(H=9.5)SST0101DNG01
SW505TACT S WITCH KSM0614B orSST0101HH013
T A CT SWITCH SKQSAF001A orSST0101AL041
T A CT SWITCH TC-1104(H=9.5)SST0101DNG01
SW506LEAF SWITCH MXS01830MVP0SSC0101MCE03
SW507ROT AR Y MODE SWITCH SSS-53MDSSR0106KB003
SW509TACT S WITCH KSM0614B orSST0101HH013
T A CT SWITCH SKQSAF001A orSST0101AL041
T A CT SWITCH TC-1104(H=9.5)SST0101DNG01
SW510TACT S WITCH KSM0614B orSST0101HH013
T A CT SWITCH SKQSAF001A orSST0101AL041
T A CT SWITCH TC-1104(H=9.5)SST0101DNG01
SW511TACT S WITCH KSM0614B orSST0101HH013
T A CT SWITCH SKQSAF001A orSST0101AL041
T A CT SWITCH TC-1104(H=9.5)SST0101DNG01
SW512TACT S WITCH KSM0614B orSST0101HH013
JK751RCA JACK 2P MSP-2 82V-12 NILF(B11JXRL020LY121
JW003FLAT CABLE 3P AWG26#2651/P2.0/200WX1HE480-001
JACK CBA
Ref. No.DescriptionPart No.
JACK CBA (MCV -C)
Consists of the following:
CAPACITORS
C101CHIP CERAMIC CAP . B K 2200pF/ 50VCHD1JK30B222
C102CHIP CERAMIC CAP . B K 2200pF/ 50VCHD1JK30B222
C103CHIP CERAMIC CAP .(1608) CH J 470pF/ 50VCHD1JJ3CH471
C104CHIP CERAMIC CAP .(1608) CH J 470pF/ 50VCHD1JJ3CH471
C105CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C107ELECTROLYTIC CAP . 1µF/ 50V M H7 orCE1JMAVSL1R0
ALUMINUM ELECTROL YT IC CAP 1µF/50V H7 CE1JMAVSM1R 0
C108CHIP CERAMIC CAP .(1608) B K 1000pF/ 50VCHD1JK30B102
C109CHIP CERAMIC CAP . B K 2200pF/ 50VCHD1JK30B222
C110CHIP CERAMIC CAP . B K 2200pF/ 50VCHD1JK30B222
C111CHIP CERAMIC CAP .(1608) CH J 470pF/ 50VCHD1JJ3CH471
C112CHIP CERAMIC CAP .(1608) CH J 470pF/ 50VCHD1JJ3CH471
C113CHIP CERAMIC CAP . B K 2200pF/ 50VCHD1JK30B222
C115ELECTROLYTIC CAP . 100µF/ 16V M H7 orCE1CMAVS L101
ALUMINUM ELECTROL YT IC CAP 100µF/16V H7CE1CMA VSM1 01
C116ELECTROLYTIC CAP . 470µF/ 6.3V M o rCE0KMASDL471
ELECTROLYTIC CAP . 47 0µF/6.3V MCE0KMASTM471
C117ELECTROLYTIC CAP . 470µF/ 6.3V M o rCE0KMASDL471
ELECTROLYTIC CAP . 47 0µF/6.3V MCE0KMASTM471
DIODES
D101ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
----------
Ref. No.DescriptionPart No.
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D102ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D103ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D104ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
D105ZENER DIODE DZ-11BSAT265 orNDTA00DZ11BS
ZENER DIODE MTZJT-7711AQDTA00MTZJ11
COILS
L101BEAD CORE ASSEMBL Y HK47 PED1VSA12574
L102BEAD CORE ASSEMBL Y HK47 PED1VSA12574
Q504PHOT O TRA NSIST OR PT 204-6B -12 orNPWZT2046B 12
PHOTO T RANSIST OR M ID-32A22FNPWZ1D32A22F
Q505PHOT O TRA NSIST OR PT 204-6B -12 orNPWZT2046B 12
PHOTO T RANSIST OR M ID-32A22FNPWZ1D32A22F
0VSA14893
200607031-17-8HM462EL
Page 53
AFV CBA
Ref. No.DescriptionPart No.
AFV CBA
Consists of the following:
CAPACITORS
C1CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C4CHIP CERAMIC CAP . CH J 56pF/ 50VCHD1JJ3CH560
C5CHIP CERAMIC CAP .(1608) CH J 22pF/ 50VCHD1JJ3CH220
C6CHIP CERAMIC CAP . CH J 56pF/ 50VCHD1JJ3CH560
C7CHIP CERAMIC CAP . CH C 3pF/ 50V orCHD1JC3CH3R0
CHIP CERAMIC CAP . CJ C 3pF/ 50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP . CH D 3pF/ 50VCHD1JD3CH3R0
C8CHIP CERAMIC CAP . CH C 3pF/ 50V orCHD1JC3CH3R0
CHIP CERAMIC CAP . CJ C 3pF/ 50V orCHD1JC3CJ3R0
CHIP CERAMIC CAP . CH D 3pF/ 50VCHD1JD3CH3R0
C11CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C12ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL1 00
ELECTROLYTIC CAP . 10 µF/16V M H7CE1CMASSM100
C13CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C14CHIP CERAMIC CAP .(1608) B K 0.01µF/50VCHD1JK30B103
C15ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL1 00
ELECTROLYTIC CAP . 10 µF/16V M H7CE1CMASSM100
C16ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL1 00
ELECTROLYTIC CAP . 10 µF/16V M H7CE1CMASSM100
C17CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C19CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C20ELECTROLYTIC CAP. 3.3µF/50V M H7 orCE1JMASSL3R3
ALUMINUM ELECTROL YT IC CAP 3.3µF/50V H7CE1JMASSM3R3
1VSA14128
C21CHIP CERAMIC CAP .(1608) F Z 0.1µF/50V orCHD1JZ30F104
CHIP CERAMIC CAP .(1608) F Z 0.1µF/25VCHD1EZ30F104
C22ELECTROLYTIC CAP. 10µF/16V M H7 orCE1CMASSL1 00
ELECTROLYTIC CAP . 10 µF/16V M H7CE1CMASSM100
C24ELECTROLYTIC CAP. 0.22µF/50V M H7 orCE1JMASSLR22
ALUMINUM ELECTROL YT IC CAP 0.22µF/50V H7CE1JMASSMR22
C26CHIP CERAMIC CAP .(1608) CH J 22pF/ 50VCHD1JJ3CH220
C27CERAMIC CAP.(AX) F Z 0.1µF/50VCCA1JZTFZ104