BenQ D72 Service Manual

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Page 1

BenQ Rev 1.0

BenQ March (D72)/Amethyst

LT Mobile Phone

Service Manual

BenQ Inc.

Wireless Business Unit

Customer Service Dep. Tel : +886-(0)2-2799-8800 ext 6687 E-Mail : Roychen@acercm.com.tw

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BenQ Rev 1.0

Contents

l Preface…………………………………………………..……………1 l Theory of Operation

1.GSM system Description…………………………………………7

2.Baseband function description…………………………………12

3.Radio Frequency function description ………………………..44

l Download

1.System requirements and setup ………………………………59

2.Function descriptions……………………………………………61

3.FAQ… ……………….……………….……………………………67

l Disassembly (Level1~Level2)………….………………………….69 l Troubleshooting

Level 1~level 2 repair………………………………………………73 Level 3~level 4 repair………………………………………………74 l Replacement parts

Exploded View (fig1~fig3)………………………………………….95 Spare parts list………………………………………………….…..98

l Service Manual Feedback Form……..…………………………….99

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BenQ Rev 1.0

Preface

This service manual is for the customers who purchase of Acer

March handset . It has several main parts of our handset that include hardware/software and simple disassembly/assembly procedure introduction. If you don’t understand some of these sections or any query about it please kindly use our service manual feedback form and send it back to our Customer Service Department and we’ll response your query as soon as possible.

Specifications

Table 1: Radio Frequency

Radio Frequency (900 MHz)

Frequency Range TX 880-915 MHz; RX 925-

960

MHz Channel Spacing 200 KHz Number of Channels 174 Carriers x 8 (TDMA) Modulation GMSK Duplex Spacing 45 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 33 dBM Class 4 (2 W peak) Receiver Level < -102 dBm (Wireless)

Radio Frequency (1800 MHz)

Frequency Range TX 1710-1785 MHz; RX

1805-1880 MHz Channel Spacing 200 KHz Number of Channels 374 Carriers x 8 (TDMA) Modulation GMSK Duplex Spacing 95 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 30 dBM – 0 dBM Receiver Level < -102 dBm (Wireless)

Operating Temperature Range -10 to +55 °C

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Table 2: Voltage Operation

Voltage Operation

Li-ion Battery DC 3.3-4.2 V Ni-MH Battery DC 3.3-4.2 V

Table 3: Power Consumption

Power Consumption

Working Current Average < 270 mAH Standby Current 6 +/-0.2 mAH Talking Time* 120 ~300 min (With Ni-

MH 550

mAH)

Standby Time* 50~120 hours (With Ni-

MH 550

mAH)

DTX / DTR Yes

Table 4: Appearance

Handset Appearance

Dimensions 106 x 40 x 16 mm Volume 68 c.c. Handset Weight 99 g

Table 5: Basic Services

Telephony (Speech)

Tele Service

Emergency Call

Delivery Report

Short Message Service MT/MO

Short Message Service

Cell Broadcast

Bearer Service

Data circuit duplex

asynchronous up to 14400

bit/sec

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Scope of Manual

This manual is intended for use by experienced technicians familiar with similar types of equipment. It is intended primarily to support electrical and mechanical repairs. Repairs not covered in the scope of this manual should be forwarded to Motorola’s regional Cellular Subscriber Support Centers.

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Theory of Operation

△ GSM System Description

General Cellular Concept

The cellular systems are used to provide radiotelephone service in the frequency range 890-960 MHz. A cellular system provides higher call handling capacity and system availability than would be possible with conventional radiotelephone systems (those which require total system area coverage on every operating channel) by dividing the system coverage area into several adjoining sub-areas or cells.

Each cell contains a base station (cell site) which provides transmitting and receiving facilities, for an allocated set of duplex frequency pairs (channels). Since each cell is a relatively small area, both the cell site and the radiotelephone that it supports can operate at lower power levels than would be used in conventional systems.

Using this technique, radiation on a given channel is virtually contained in the cell operating on that channel and, to some extent, those cells directly adjacent to that cell.

Since the coverage area of a cell on a given channel is limited to a small area (relative to the total system coverage area), a channel may be reused in another cell outside the coverage area of the first. By this means, several subscribers may operate within the same geographic area, without interference with each other, on a single channel.

GSM Description

Unlike previous cellular systems, GSM uses digital radio techniques. The GSM system has the following advantages over previous analogue systems: ♦International Roaming - Due to international harmonization and

standardization, it will be possible to make and receive calls in any

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country which supports a GSM system.

♦Digital Air Interface - The GSM phone will provide an entirely digital link between the telephone and the base station, which is, in turn, digitally linked into the switching subsystems and on into the PSTN.

♦ISDN Compatibility - ISDN is a digital communications standard that many countries are committed to implementing. It is designed to carry digital voice and data over existing copper telephone cables. The GSM phone will be able to offer similar features to the ISDN telephone.

♦Security and Confidentiality – Telephone calls on analogue systems can very easily be overheard by the use of a suitable radio receiver.

GSM offers vastly improved confidentiality because of the way in which data is digitally encrypted and transmitted.

♦Better Call Quality - Co-channel interference, handover breaks, and fading will be dealt with more effectively in the digital system. The call quality is also enhanced by error correction, which reconstructs lost information.

♦Efficiency - The GSM system will be able to use spectral resources in a much more efficient way than previous analogue

Systems

In the figure below, the area bounded by bold lines represents the total coverage area of a hypothetical system. This area is divided into several cells, each containing a cell site (base station) operating on a given set of channels which interfaces radiotele- phone subscribers to the telephone switching system.

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The radiotelephones themselves are capable of operation on any channel in the system, allowing them to operate in any cell. Due to the low power requirements for communications between radiotelephones in a particular cell and the cell site, operating channels may be repeated in cells which are outside the coverage area of each other.

For example, presume that cell A operates on channels arbitrarily numbered 1 through 8, cell B operates on channels 9 through 16, cell C operates on channels 17 through 24 and cell D operates on channels 1 through 8 (repeating the usage of those channels used by cell A). In this system, subscribers in cell A and subscribers in cell D could simultaneously operate on channels 1 through 8.

The implementation of frequency re-use increases the call handling capability of the system, without increasing the number of available channels. When re-using identical frequencies in a small area, co-channel interference can be a problem. The GSM system can tolerate higher levels of co-channel interference than analogue systems, by incorporating digital modulation, forward error correction and equalization. This means that cells using identical frequencies can be

CELL A

CHANNELS

1-8

CELL B

CHANNELS

9-16

CELL C

CHANNELS

17-24

CELL D

CHANNELS

1-8

CELL F

CHANNELS

17-24

CELL E

CHANNELS

9-16

Figure 2: Hypothetical

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physically closer, than similar cells in analogue systems. Therefore the advantage of frequency re-use can be further enhanced in a GSM system, allowing greater traffic handling in high use areas.

By incorporating Time Division Multiple Access (TDMA) several calls can share the same carrier. The carrier is divided into a continuous stream of TDMA frames, each frame is split into eight time slots. When a connection is required the system allocates the subscriber a dedicated time slot within each TDMA frame. User data (speech/data) for transmission is digitized and sectioned into blocks. The user data blocks are sent as information bursts in the allocated time slot of each TDMA frame.

The data blocks are modulated onto the carrier using Gaussian Minimum Shift Keying (GMSK), a very efficient method of phase modulation.

Each time an information burst is transmitted, it may be transmitted on a different frequency. This process is known as frequency hopping. Frequency hopping reduces the effects of fading, and enhances the security and confidentiality of the link. A GSM radiotelephone is only required to transmit for one burst in each frame, and not continually, thus enabling the unit to be more power efficient.

Each radiotelephone must be able to move from one cell to another, with minimal inconvenience to the user. The mobile itself carries out signal strength measurements on adjacent cells, and the quality of the traffic channel is measured by both the mobile and the base station. The handover criteria can thus be much more accurately determined, and the handover made before the channel quality deteriorates to the point that the subscriber notices.

When a radiotelephone is well within a cell, the signal strength measured will be high. As the radiotelephone moves towards the edge of the cell, the signal strength and quality measurement decreases.

Signal information provides an indication of the subscriber’s

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distance from the base station. As the radiotelephone moves from cell to cell, its control is handed from one base station to another in the new cell.

This change is handled by the radiotele-phone and base stations, and is completely transparent to the user.

Service Area

The area within which calls can be placed and received is defined by the system operators. (Because this is a radio system, there is no exact boundary that can be drawn on a map.) If the telephone is outside a coverage area, the (no service) indicator will illuminate and calls will be unable to be placed or received. If this happens during a conversation, the call will be lost. There may also besmall areas within a particular service area where communications may be lost.

The radiotelephone’s identity information is held by its local GSM system in its Home Location Register (HLR) and Visitor Location Register (VLR). The VLR contains identity information on all local active radiotelephones. Should you roam to another area, system or country the radiotelephones identity information is sent to the VLR in the new system. The new system will then check the radiotelephones details with your home system for authenticity. If everything is in order it will be possible to initiate and receive calls whilst in the new area.

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△ Baseband function Descriptions

1. Introduction:

March(T191) utilizes TI’s chipsets (Ulysse and Nausica) as base-band solution. Base-band is composed with two potions: Logic and Analog/Codec. Ulysse is a GSM digital base-band logic solution included microprocessor, DSP, and peripherals. Nausica is a combination of analog/codec solution and power management which contain base-band codec, voice-band codec, several voltage regulators and SIM level shifter etc. In addition, 56D66 integrates with other features such as LED backlight, LCD display, vibration, buzzer and charging etc. The following sections will present the operation theory with circuitry and descriptions respectively.

2. Block Diagram

2.1 Ulysse (Hercules)

JAMES WANG, WEN-SHIH LIU PAGE 1 OF 2

DUAL BAND AMETHYST

BASEBAND BLOCK DIAGRAM REV 1.0

DUAL BAND AMETHYST

SRAM 1Mbit

G5 A2 B5 A1 B2

Flash

Memory

32Mbit

D7 B4 B3 D8

ARM7

RTC

PWT PWL

UART

I2C

SPI

MEM. INTF.

GPIO

ACT

TSP

SIM

JTAG

RIF

Voice-

band INTF

DAI

DSP

SRAM

E10 A11

B6 C2

B1 D2

D3 F4

K11

J1 J3 M6 A7

C7 C8 A8

P6 M9 N8 L8

P7 K8 K7

C6 E6 E9 B11 D11 B12 B13 H10

D14 E14 D13

J14 J13 K14

G1 H1 H3 H2

F12 F13 F14 G13

G11 H12 H13 H11

D8 D9 B9 A9

NROMCS1 FDP RNW NFOE

NRAMCS NBLE NBHE

MCUEN MCUDO MCUDI

IO3DATA_HP_SEL IO13ACCIN

IO0VIBRATOR IO1BATID_DET

SCL SDA NRSTOUT

TXD0 RXD0

BU BL

RTCINT

H3 D7 G3 G14 H14

VR1 VR2 VR2B VR3

RX_ON TX_ON

DCS_T/R

GSM_T/R

BS2

BS1

DATA

CLK

TSPEN0

S_CLK

S_IO

S_RST

TCK TMS TDO

TDI

BFSR

BDR

BFSX

BDX

VCLKRX

VDX VDR

VFSRX

DAI_RST

DAI_CLK

DAI_DI

DAI_DO

TO / FROM

OMEGA

{

TO / FROM

OMEGA

{

JTAG

TO / FROM

OMEGA

{

DAI INTF

{

DATA BUS

ADDRESS BUS

VR2

DATA BUS

ADDRESS BUS

VR2

}

TO / FROM ULYSSE

LCM

CONT.

4 5 6

7 , 8

2 , 3

VR2 VLCD

C34

}

TO EARPHONE JACK

BQ3

BUZZER

U7 BQ2

LCM BACKLIGHT

KEYPAD BACKLIGHT

BQ4 M

U15 BATID

EXTIRQ EXTFIQ NRESET

13MHZ

13MOUT

FROM

OMEGA

FROM U61

KEYPAD

POWER

FROM OMEGA

ULYSSE

VIBRATOR

X1 32.768KHZ

E11 D6

TCXOEN

ON_OFF

{

{ {

TO RF BLOCK

{

TO / FROM

OMEGA

ROW0~ROW3

COL0~COL4

ADDRESS BUS

VBAT

VBATBB

VBAT

TO OMEGA

TO U84,U90

FROM OMEGA

TO OMEGA

3 4 2

R72

EARPHONE JACK

TXDO

AUXI

IO3DATA_HP_SEL

IO13ACCIN

RXDO

AUXOP

U10

VR2BSW

MIC

SPK

VR2BSWVR2B

{

U13

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BenQ Rev 1.0

2.2 Nausica (Omega)

IBIC BUS

CONT.

C4 B3 B2 B4 B5 D4 A2 A1 B1

BSP

K5 J 5 H5 G5

SPI

BCI

ADC

VRPC

F5 K6 J 6

E3 E4 E5

B5 A5 E6 D6 C6

F7 F6 D7 D10

B10

BACKUP

VR1B

2.0V@50mA

VR2B

2.9V@50mA

VR2

2.9V@120mA VR1

1.8V@120mA VR3

2.9V@80mA

VREG

B/B U/L

C10

D8 D9

B/B D/L

E7 E8 E9

E10

AFC APC

TSP

VOICE

D/L

VOICE

U/L

USP

SIM REG.

3/5V

SHIFTER

F8 F9 J 4

K4 H8

H9 J 9 K9 J 8 K8 H7

H6 G6 G7 K7

K3 D2

J3 C3

H10

F1 A4

TXIP TXIN TXQP TXQN RXIP RXIN RXQP RXQN

AFC

RAMP

SMADA TPENQ

AUXOP MICBIAS

MICIN MICIP AUXI

VCLKRX VDR VDSRX VDX

S_CLK S_RST S_IO CLK RST I/O VSIM

BDX

BFSX

BDR

BFSR

MCUEN0

MCUDO

MCUDI

ICTL

VCHG

VBAT

BATID

TBAT

HWID

EXTFIQ

NRESET

RTCINT

ON_OFF

PWON

VCC1 VCC2 VCC3

VBACKUP

UPR

VR1B

VR2B

VR2

VR1

VR3

OSCAS EXTIRQ

EARPHONE_IN

SIM

SOCKET

1 3 2 4

}

TO / FROM ULYSSE

}

TO U61

}

FROM U61

TR1

ROW4

S19

EARN EARP

SPEAKER

MICROPHONE

TO U85 TO U74

}

TO/FROM ULYSSE

{

TO / FROM

ULYSSE

{

TO / FROM

ULYSSE

{

FROM BATBB

OMEGA

POWER JACK

BATTERY

CONNECTOR

COIN LI-ION

BATTERY

TO / FROM ULYSSE

1 2 3 4

4 3 2 1

ICTL

VCHG

MANTEST

FUSE

U14

FROM ULYSSE

C22

TO / FROM

ULYSSE

{

U17

JAMES WANG, WEN-SHIH LIU PAGE 2 OF 2

DUAL BAND AMETHYST

BASEBAND BLOCK DIAGRAM REV 1.0

DUAL BAND AMETHYST

U18

U16

J 1

R21

R24

VR3

VBBATBB

3. Theory:

3.1 Ulysse

ULYSSE (HERCROM200) is a chip implementing the digital base-band processor of a GSM mobile phone. This chip combines a DSP M16L80 mega-module (LEAD2 CPU) with its program and data memories, a Micro-Controller core with emulation facilities (ARM7TDMIE) and an internal 2M-bit RAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and 120K equivalent CMOS gates.

Major functions of this chip are as follows:

3.1.1 Real Time Clock (RTC)

3.1.2 Pulse Width Tones (PWT)

The function of the PWT is to generate a modulated frequency signal for the external buzzer.

3.1.3 Pulse Width Light (PWL)

This module allows the control of the backlight of LCD and keypad by employing a 4096 bit random sequence.

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3.1.4 MODEM-UART

3.1.5 I2C master serial interface (I2C)

In 56D66, we employ I2C bus to control LCD module.

I2C_SCL: programmed to the fast transmission mode (400KHz) I2C_SDA: the serial bi-directional data of the LCM controller

3.1.6 General Purposes I/O (GPIO)

Ulysse provides 16 GPIOs configurable in read or write mode by internal registers. In 56D66, we utilize 5 of them as follows:

IO0 : to control vibrator; ‘L’: idle, ‘H’: activate vibrator IO1 : to identify legal NiMH battery IO3 : to control phone jack configuration; ‘L’: data cable, ‘H’:

hands-free

IO8 : to support one-wire protocol for Li-Ion battery

IO13 : to detect accessory plug-in at phone jack; ‘H’: idle, ‘L’: plug-in

3.1.7 Serial Port Interface (SPI)

3.1.8 Memory Interface and internal Static RAM

A 2Mbit SRAM is embedded on the die and memory mapped on the chip-select CS6 of the memory interface.

3.1.9 SIM Interface

3.1.10 JTAG

3.1.11 Time Serial Port (TSP)

3.1.12 TSP Parallel interface (ACT)

In 56D66, we employ 8 of them to control RF activity.

TSPACT1: Band selection 1 (BS1) TSPACT2: Power control enable (PC) TSPACT3: Band selection 2 (BS2) TSPACT4: GSM TR switch on/off (GSM_TR) TSPACT5: DCS TR switch on/off (DCS_TR) TSPACT8: RX VCO on/off (RX_ON) TSPACT9: TX VCO on/off (TX_ON) TSPACT10: Latch enable (LE)

3.1.13 Radio Interface (RIF)

3.2 Nausica (Omega)

Together with a digital base-band device (Ulysse), OMEGA is part of a TI DSP solution intended for digital cellular telephone applications including GSM 900, DCS 1800 and PCS 1900 standards (dual band

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capability).

It includes a complete set of base-band functions to perform the interface and processing of voice signals, base-band in-phase (I) and quadrature (Q) signals which support single-slot and multi-slot mode, associated auxiliary RF control features, supply voltage regulation, battery charging control and switch ON/OFF system analysis.

OMEGA interfaces with the digital base-band device through a set of digital interfaces dedicated to the main functions of Ulysse, a base-band serial port (BSP) and a voice-band serial port (VSP) to communicate with the DSP core (LEAD), a micro-controller serial port to communicate with the micro-controller core and a time serial port (TSP) to communicate with the time processing unit (TPU) for real time control.

OMEGA includes also on chip voltage reference, under voltage detection and power-on reset circuits.

Major functions of this chip are as follows:

3.2.1 Baseband Codec (BBC)

3.2.2 Automatic Frequency control (AFC)

3.2.3 Automatic Power Control (APC)

3.2.4 Time serial port (TSP)

3.2.5 Voice band Codec (VBC)

3.2.6 Micro-controller serial port (USP)

3.2.7 SIM card shifters (SIMS)

3.2.8 Voltage Regulation (VREG)

Linear-regulation performed by several low dropout (LDO) regulators to supply analog and digital baseband circuits. (1) LDO R1 generates the supply voltage (2.5V, 1.8V, 1.4V and 1.2V)

for the digital core of Ulysse. In 56D66, it is programmed to 1.8V. This regulator takes power from the battery voltage and it has a backup through BBS system.

(2) LDO R1B generates the supply voltage 2.0V for the digital core of

OMEGA. It is supplied by the battery.

(3) LDO R2B generates the supply voltage 2.9V for the digital I/O’s of

Ulysse and Omega. It is supplied from battery voltage and has a backup through BBS system.

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(4) LDO R2 generates the supply voltages 2.9V for Ulysse memory

interfaces I/O’s. It has a backup through BBS system.

(5) LDO R3 generates the supply voltage 2.9V for the analog

functions of OMEGA.

The backup battery switch (BBS) generates at its output an uninterrupted power rail (UPR) of which purpose is to supply continuously the minimum necessary circuitry of the power-control functions either from the main battery of from the backup battery

3.2.9 Baseband Serial Port (BSP)

3.2.10 Battery charger Interface (BCI)

3.2.11 Monitoring ADC (MADC)

3.2.12 Reference Voltage / Power on Control (VRPC)

3.2.13 Internal bus and interrupt controller (IBIC)

3.3 Power Supply circuit

BGND

VR3

BGND

VR2B

BGND

VR2

VBATBB

VR1VR1B

TPL16

ULYSSE_uBGA179

B2 C2 C3 B1 C1 D3 D2 D1 F5 E4 E2 E3 E1 F4 F3 F2 F1 G5 G4 G2 G3 G1 H1 H3 H2 H4 H5 J1 J2 J3 J4 K1 K3 K2 K4 J5 L1 L2 L3 M1 N1 M3 M2

P2N3P3L4M4N4P4K5L5N5P5M5K6M6P6N6L6K7L7P7N7M7M8N8P8L8K8L9N9P9M9K9M10

P10

N10

L10

K10

P11

N11

M11

L11

P12

N12

P13

N13

M13

M12

N14

M14

L12

L13

L14

K11

K13

K12

K14

J11

J12

J13

J14

H10

H11

H13

H12

H14

G14

J10

G12

G13

G11

G10

F14

F13

F12

F11

E14

E12

E13

E11

F10

D14

D13

D12

C14

B14

C12

C13

B13

A13

B12

A12

D11

C11

B11

A11

E10

D10

B10

A10

C10E9C9A9B9D9E8D8A8B8C8C7B7A7D7E7D6B6A6C6E6C5A5B5D5E5A4B4C4D4A3B3A2

A14

P14

GND BU/PWT VDDS2 LT/PWL SDO/INT10n RX_MODEM TX_MODEM SD_IRDA/CLKOUT_DSP DSR_MODEM/LPG RTS_MODEM/TOUT CTS_MODEM/XF SCLK/INT1n RX_IRDA nSCS0/SCL RXIR_IRDA/X_A1 TX_IRDA TXIR_IRDA/X_A4 nSCS1/X_A2 nEMU1 nEMU0 nRESPWRON TCK TMS TDO TDI nBSCAN EN_LMM_PWR/X_IOSTRB IO0/TPU_WAIT GND IO1/TPU_IDLE ADD0 ADD1 VDDS1 ADD2 ADD3 VDD ADD4 ADD5 ADD6 ADD7 ADD8 ADD9 ADD10

ADD11

ADD12

ADD13

GNDLMM

ADD14

IO2/IRQ4

ADD15

ADD16

ADD17

ADD18

ADD19

ADD20

VDDLMM

ADD21/CK16X_IRDA

IO3/SIM_RnW

nCS0

GND

VDDS1

nBHE/IO14

nCS1

nCS2

GNDLMM

nCS3

CS4/ADD22

RnW

VDD

nFOE/X_A3

nBLE/IO15

nFWE/X_A0

VDDS1

DATA0

FDP/nIACK

DATA1

GND

DATA2

DATA3

GND

DATA4

DATA5

GNDARM

DATA6

DATA7

VDDARM

DATA8

DATA9

DATA10

DATA11

DATA12

DATA13

DATA14

GND

DATA15

CLK13M_OUT/START_BIT

nRESET_OUT/IO7

TSPACT11/MCLK

VDDS2

SIM_RST

SIM_CD/MAS0

SIM_PWCTRL/IO5

SIM_IO

SIM_CLK

TSPACT10/nWAIT

VFSRX

VDR

VDX

GNDA1

CLKTCXO

VDDS1

VDDA1

BDX

VCLKRX

BCLKX/IO6

BFSX

BDR

BFSR

BCLKR/ARMCLK

TSPCLKX

GND

EXT_IRQ

TCXOEN

VDD

TSPDO

TSPEN0

TSPEN1

TSPDI/IO4

TSPEN2

TSPEN3/nSCS2

TSPACT0

TSPACT1

VDD

TSPACT2

GND

TSPACT3

CLK32K_OUT

GNDA2

OSC32K_OUT

OSC32K_IN

VDDS2

TSPACT4

RFEN/NOPC

GND

TSPACT5

IDDQ

MCSI_TXD/IO9

MCSI_RXD/IO10

MCSI_CLK/IO11

TSPACT6/nCS6

MCSI_FSYNCH/IO12

MCUDI

VDDLMM

MCUDO

MCUEN0

MCUEN1/IO8

MCUEN2/IO13

EXT_FIQ

TSPACT7/CLKX_SPI

ON_OFF

IT_WAKEUP/INT4n

KBC0/NFIQ

TSPACT8/nMREQ

TSPACT9/MAS1

GNDLMM

KBC1/NIRQ

KBC2/XDI_00

KBC3/XDI_01

KBC4/XDI_02

KBR0/XDI_03

KBR1/XDI_04

SDI/SDA

KBR2/XDI_05

VDDLMM

KBR3/XDI_06

KBR4/XDI_07

GND

VDDS2

VDDS1

C21 10UF

C26

0.1UF

C250.1UF

C19 2.2UF

C1710UF

C20 10UF

R22

R15

OMEGA

B2B1C2C3C1D2D1D3E1E2E3E4E5F1F2F3F4G4G1G2G3H1H2J1K1

K10

A10

B10C9D8D9D10D7E7E8E9

E10F6F7F8F9

F10G8G10G9H10H8H9

J10

C10

SIO3

VS1

GRND2

UPR

VR1BOUT

VCC2

VR2BOUT

VR2SEL

VR2OUT

VR2IN

ICTL

VCHG

VBAT

OSCAS

TESTRESETZ

REFGND

VREF

BGTR1

IBIAS

BGTR3

BGTR2

VR1OUT

BGTR4

FDBK

GRND1

BGTR5

SWITCH

VBACKUP

COMP

VCC1

TDR

TEN

INT2

BDX

BFSX

BDR

BFSR

UEN

UDR

UDX

VCK

VDX

VFS

VDR

AGNDA1

AUXI

MICIP

MICIN

MICBIAS

BUZZOP

RPWON

PWON

BULIP

BULQP

BULQM

ONNOFF

RTC_ALARM

BDLIP

BDLIM

BDLQP

BDLQM

RESPWRONZ

INT1

AFC

APC

DAC

AUXGND

GRND3

VCC3

VR3OUT

EARN

EARP

AUXON

AUXOP

VS2

SVDD

SRST3

VAUX

SCLK3

SCLK5

CK13M

SIO5

SRST5

LCDSYNC

ADIN1

ADIN2

ADIN3

ADIN4/TSCXP

ADIN5/TSCYP

TSCXM

TSCYM

TDO

TDI

TCK

TMS

TEST1

TEST2

TEST3

TEST4

BULIM

R54

+-V

U4A

Back-up Battery

2 1

R160R17

C15 2.2UF

2.9V@80mA Omega/Ulysse Analog part

1.8V@120mA

Ulysse Core

2.9V@120mA

Memory

2.9V@50mA

Peripherals

(From Main Battery)

2.0V@50mA

Omega Core

The phone is mainly supplied from the main battery (VBAT) which is divided into two routes: VBAT is for RF block, vibrator and buzzer; VBATBB is for baseband block.

The input power (VBATBB) to Nausica is divided into 4 blocks:

Page 16

BenQ Rev 1.0

VCC1: to provide power for DC/DC and regulator R1 (VR1) VCC2: to provide power for regulator R1B (VR1B), R2B (VR2B) and

charger pump VCC3: to provide power for regulator R3 (VR3) VR2IN: to provide power for regulator R2 (VR2)

NAUSICA provides five low drop-out voltage regulators. R1 (VR1): 1.8V@50mA; to supply ULYSSE digital core, RTC,

32KHz and the internal SRAM

R2 (VR2): 2.9V@120mA; to supply 13MHz clock, external memory

devices and LCD display

R2B (VR2B): 2.9V@50mA; to supply peripheral devices, I/O to

NAUSICA R1B (VR1B): 2.0V@50mA; to supply the digital part of NAUSICA R3 (VR3): 2.9V@80mA; to supply analog part of NAUSICA. Among these 5 LDOs, only R1, R2 and R2B are support with

back-up mode.

The power of Ulysse is supplied by these LDOs: VDD: supplied by VR1 and used for core logic VDDS1: supplied by VR2 and used for I/Os to memory devices VDDS2: supplied by VR2B and used for I/Os to Omega and peripherals

VDDLMM: supplied by VR1 and used for Lead MegaModule (DSP) VDDARM: supplied by VR1 and used for ARM

Page 17

BenQ Rev 1.0

3.4 System power on/off Sequence

3.4.1 Power on

There are three conditions that system can power on.

-On button pushed: A falling edge is detected on PWON pin and the

debouncing time is greater than 30ms.

-Set Alarm: A rising edge is detected on RTC_ALARM (RTCINT)

-Charger plugged: VCHG > VBAT + 0.4V is detected

When these conditions occur in the power on state, the

hardware power on sequence starts:

1. Enable local oscillator OSCAS (~ 100KHz)

2. Enable band-gap (VREF and IREF)

3. Check if Main Battery voltage is greater than 3.2V

4. Enable charge pump (VAUX ~ 5.8V)

5. Enable LDO regulators (R1, R1B, R2, R2B and R3)

6. Set ON_OFF pin to ‘H’.

7. NRESET pin is set from ‘L’ to ‘H’

8. 13MHz clock oscillator is enabled (Ulysse’s task)

3.4.2 Power off in normal mode

When system is powered off in normal mode by long pressing

power-on key, the power off sequence will be executed:

1. Start watchdog timer during 150us and disable DC/DC

2. Set ON_OFF pin to ‘L’

3. Disable all the regulators

4. Disable the band-gap

5. Disable the local oscillator OSCAS

3.4.3 Power off in emergency mode

When the main battery voltage is detected lower than 2.7V, the

following sequence is executed:

1. Set INT1 (FIQ) to ‘L’

2. Start watchdog timer during 150us and disable DC/DC

3. Set ON_OFF pin to ‘L’

4. Disable all the regulators

5. Disable the band-gap

6. Disable the local oscillator OSCAS

Page 18

BenQ Rev 1.0

3.5 Memory circuit

DATA BUS

FLASH

SRAM

ULYSSE

CE#

CE1

NROMCS1

NRAMCS

OE#

NFOE

ADDRESS BUS

RP#

WE#

FDP

RNW

OE HB LB

NBHE NBLE

VCCQ

VCC

VCC VCC CE2

VR2

Description

Flash (U5) is a 32Mbit device, supported by VR2 and booted from top. The total 32Mbits are divided into two sections: 24Mbits is used for software program code and 8Mbits is used for EEPROM data. The access time of Flash is 100ns. SRAM (U6) is a 1Mbit device, supported by VR2. The access time of SRAM is 70ns.

Page 19

BenQ Rev 1.0

3.6 Display circuit

VR2

BGND

NRSTOUT

I2C_SDA

I2C_SCL

R27

C33

1UF(0603)

C32

C(0603)

LCD

VLCD

VSS

SCL

SDA

/RES

VDD2,3

VDD1

C50

39PF

C51

39PF

C34

1UF(0805 Z5U 16V)

2.9V

400KHz

7.6V

From U1/Ulysse

Description

Display circuit is composed of a 98*64 resolution LCD module and a display supply voltage bypass capacitor C34. The power of LCDM is supplied from VR2. It is controlled by U1 via I2C bus: SCL and SDA. The data rate of I2C is programmed to 400KHz. NRESTOUT is low active to reset all LCD registers. The LCD Module is adopted with COG (chip on glass) type, and default display supply voltage VLCD at normal temperature is 7.6V. R27 is used for ESD protection and C50, C51 are used for radiation suppression.

Page 20

BenQ Rev 1.0

3.7 Vibrator circuit

BGND

VBAT

IO0VIBRATOR

R49

R46

M1 LA4-432

BQ4

UMT4401

D14

DAN222

3.6V

94mA

1.2V

From U1/Ulysse

Description

To enable vibration, Ulysse sets IO0VIBRATOR to ‘H’ to activate the motor. R46 and R49 are used to make BQ4 working in saturation area. D14 is used to feedback EMF. Under the condition of VBAT =

3.6V, the average voltage across the motor is about 1.2V and drain current is around 94mA.

Page 21

BenQ Rev 1.0

3.8 Buzzer circuit

VBAT

BGND

BGNDBGND

BUZZOP

C59 8PF

D14 DAN222

U13

BUZZER

R48 0

R45

BQ3

UMT4401

T10

TVS

1 2

. .

D16

DAN222(N.M.)

R71

3.6V

78mA

1.3V

From U1/Ulysse

(PWT)

(Not In Use)

Description

To alert the buzzer, Ulysse applies PWT (Pulse Width Tone) signal at BU to drive the buzzer. R45 and R48 are used to make BQ3 working in saturation mode. D14 is used to feedback EMF. Under the condition of VBAT = 3.6V, the average current is 78mA and terminal voltage of buzzer is about 1.3V.

Page 22

BenQ Rev 1.0

3.9 LED circuit

BGND

VBATBB

BGND

BQ2

UMT4403

1 3

D8 19-21

D7 19-21

D9 19-21

D5 19-21D619-21

R34

D10 19-21

R35

24 (0805)

UMH10N(SOT363)

1 6

3 4

D11 19-21

D12 19-21

D3 22-21

D13 22-21

D4 22-21

R40

39 (0805)

3.6V

From U1/Ulysse

3.35V

60mA37mA

1.9V

(PWL)

Description

56D66 employs three LEDs for LCD module backlight and eight LEDs for keypad backlight. To light up the LEDs, Ulysse applies PWL (Pulse Width Light) at BL to drive LEDs. U7 is used as an inverter to enable BQ2. Under the default condition (VBAT=3.6V), the average current of one LCD backlight LED is about 12mA and of one keypad backlight LED is about 7.5mA. In 56D66, all the LEDs are yellow-green color and forward voltage is 1.9V

Page 23

BenQ Rev 1.0

3.10 Audio circuit Uplink:

MICIP

MICIN

BGND

MICBIAS

BGND

C43

4.7UF(0805)

R43

C44 1UF(0603)

Microphone

1 2 3

C54 47PF

R44

4.3K

C42

0.1UF

C45 1UF(0603)

R47

4.3K

U14

EMIF01-10005W5

1 2

GND

I2O2

R50 0

C53 47PF

R51 0

2.5V

From U3/Omega

To U3/Omega To U3/Omega

Downlink:

EARN

EARP

BGND BGND

BGND

C39

100PF

BL2 0

BL3 0

R74

LS1

SPEAKER_0

C41 150PF

U12

EMIF01-10005W5 (N.M.)

1 2

3 4

I1 GND

I2 O2

C40 150PF

R73

TVS

1 2

. .

TVS

1 2

. .

From U3/Omega From U3/Omega

Description The audio circuit is divided into two parts, uplink and downlink.

For uplink path, the analog voice signals are fed into NAUSICA from the microphone differential input and then transmitted to Ulysse DSP via the voice-band series port (VSP). After being modulated, the signals go through the uplink I/Q path to the RF transceiver and transmitted from the antenna.

The microphone circuit is biased from Nausica MICBIAS (2.5V). The bias circuit R43, R44, R47 mainly provides the optimal operation point for the microphone signals, MICP and MICN. For downlink path, the signals received from the antenna are down-converted to I/Q signals and then transmitted to Ulysse DSP. After being demodulated, the signals are fed to NAUSICA via voice-band interface and then amplified to drive the receiver.

Page 24

BenQ Rev 1.0

3.11 Charging circuit

BGND

VBATBB

VBAT

VR3

BGND

CHARGERIN

TBAT

VCHG

BATID_NIMH

IO8ONEWIRE

ICTL

S2 G2

D2S1D1

U17 FDC6506P

1 6

3 4

C28

C31

0.1UF

U18 FDG6303N

1 6

3 4

R70 0

R66

3.9M

R67 200K

C48

4.7UF(0805)

R68 0

D15

RB520S-30

1 2

U16FDG6303N

1 6

3 4

R65 43K (1%)

R63

470K

R62

470K (1%)

R60

6.2K

FUSE(1A 0603)

C49 1K

TVS

Power Jack

1 2 3 4

V+ SW SW

GND

1 2 3

C56

10UF(0805)

R24

0.2(1%) 0805

CRS03

1 2

C30 100PF

R25 47K

JP1

BATTERY CONN

4 3 2 1

C29

10UF(0805)

C47

0.1UF

C57

1000PF

C55

0.1UF

R64 100K

C58

1000PF

Trigger Charging Circuit

Charger Over-voltage Protection Circuit

Main Charging Route

To U3/Omega To U3/Omega

Description

The charging circuit of 56D66 is composed of charger over-voltage protection circuit, 3-sec trigger charging circuit and main charging circuit that are controlled by Omega (U3). 56D66’s charging devices are standard linear 3.6V/600mA charger and switching VPA (cigarette charger) with 6V/400mA output.

The group of R62, R65, R63 R64, R70, C47 and U16 compose the charger over-voltage protection circuit. The cut-off voltage is 8V. While the charger voltage is over 8V, the circuit will turn off U17 by latching U17.G1 to stop charging.

The group of D15, R66, C48, R67 and U18 compose the 3-sec trigger charging circuit. At the very beginning of charging, the circuit will force to turn on U17 to full charger the battery which can prevent from long charging wake-up for deep discharge battery. After around 3 seconds, software will take over the charging task by controlling ICTL.

Page 25

BenQ Rev 1.0

F1 is a 1A fuse to assure charging current under limit.

The normal charging operation theory is that Omega monitors charger voltage via VCHG pin to decide whether charger plug in or out, and control power P-MOSFET (U17) via ICTL pin. If phone enters into charging mode, Ulysse will follow the charging algorithm to control charging circuit and monitor charging current by detecting the terminal voltage of R24 (0.2 ohm). Omega control procedure is classified into two parts according to whether battery voltage is higher than 3.2V. Omega will execute trickle charge with 20mA to charge battery via VCHG pin if battery voltage is lower than 3.2V. On the other hand, the phone will proceed normal charging task following by the charging algorithm.

Page 26

BenQ Rev 1.0

3.12 Earphone jack circuit

IO3DATA_HP_SEL

VR3

IO13ACCIN

AUXI

EARPHONE_INRXD0

MICBIAS

TXD0

AUXOP

BGND

VR3

VR2B_SW

BGND

VR2B_SW

BGND

TVS

1 2

. .

1 2

. .

R76

NC7SB3157

GndAVcc

BL1

BEAD(0603)

R36 10K

TVS

1 2

. .

C37

4.7UF(0805)

R72 1K

Audio Jack

12 3 4 5

GNDSW SPK MIC MIC

R37 2K

R38

R41

EMIF01-10005W5

1 2

3 4

I1 GND

I2 O2

U10

NC7SB3157

GndAVcc

C38

1UF(0603)

BL4

1 2 3

TP33

R32 100K

L: Download H: Earpiece active

Plug-In

2.9V

V= 1.0 ~ 2.4 => Hands-free V= 2.6 ~ 2.8 => Data Cable

(To U3/Omega)

2.9V

(Not In Use)

For Data Cable

For Hands-Free

(From U1/Ulysse)

Description

The earphone Jack circuit is used either for the headset or the data service. The IO13ACCIN will be pulled to low level when headset or data cable is plugged in. Here, U8 and U10 are used as the switch between headset using or data service using which is controlled by the IO3DATA_HP_SEL. When IO13ACCIN is detected as low level, IO3DATA_HP_SEL is switched from low to high level to identify whether the headset or the data cable is plug-in by reading the voltage at EARPHONE_IN. If the voltage at EARPHONE_IN is in the range of

1.0V to 2.4V, the phone recognizes headset is plugged in and IO3DATA_HP_SEL stays at high to keep U8 and U10 as auxiliary audio path. If the voltage at EARPHONE_IN is in the range of 2.6V to 2.8V, the phone identifies data cable plugged in and IO IO3DATA_HP_SEL switches back to low to keep U8 and U10 as data service path.

Page 27

BenQ Rev 1.0

3.13 Rader circuit

OMEGA

SCLK5

SIO5

SRST5

SVDD

RST

CLK

VCC/VPP

GND

I/OSIO3

SCLK3

SRST3

SIM_IO

SIM_CLK

SIM_RST

ULYSSE

SIM

SOCKET

Description

The SIM follows the GSM and ISO specifications and works in 3 volts or in 5 volts with a minimum external logic.

SIM_IO(I/O): Data SIM_RST(O): Reset signal SIM_CLK(O): Clock (1.6MHz/3.2MHz)

The SIM card digital interface insures the translation of logic levels between ULYSSE and SIM card. There is a level shifter embedded in Omega to support 5V SIM card.

Page 28

BenQ Rev 1.0

3.14 Keyboard circuit

BGND

ROW2

COL2

COL3

COL1

ROW4

ROW3ROW0

COL4

ROW1

COL0

PWON

S1 KSW

[3]

S7 KSW

[4]

S2 KSW

[2]

S16 KSW

[#]

S10 KSW

[7]

S3 KSW

[1]

KSW

[8]

S6 KSW

[5]

S5 KSW

[6]

S4 KSW

[Down]

RB520S-30

1 2

S13 KSW

[0]

S15 KSW

[menu]

S19

KSW

[NO] [PWR]

S14 KSW

[*]

S8 KSW

[SEL]

S17 KSW

[Send]

S12 KSW

[9]

S18 KSW

[QUIT]

S11 KSW

[Up]

To U3/Omega

Description

1. The keypad is made of a 5 Column x 4 Row matrixes.

2. The keypad matrix is as follows:

Function Key

COL0 COL1 COL2 COL3 COL4 RO

W0 ROW1 ROW2

ROW3

3 S1 0 0 2 S2 0 0 1 S3 0 0

DOWN S4 0 0

6 S5 0 0 5 S6 0 0 4 S7 0 0

SEL S8 0 0

8 S9 0 0 7 S10 0 0

UP S11 0 0

9 S12 0 0 0 S13 0 0

* S14 0 0

MENU S15 0 0

# S16 0 0

SEND S17 0 0

QUIT S18 0 0

NO/PWR S19

Reference Drawing:

Page 29

BenQ Rev 1.0

56D72 Side 1 Layout

RN4

RN2

RN1

RN3

R26

R56

R52

R59

R58

R57

RN5 RN6

C13

R14

BQ2 U14

C35

R34

C54

C53

C44

C45

C55

R51

R50

R44

C43

C48 U18

D15

R24

C29 C56

R66

R67

R25

C36

C42

TR1

R43

R47

R19

R5 R8

R28 R29 R13

R15

R17

R18

R16

R21

C24 R20

C25

C18

R77

C22

R23

C46

C23

C19 C20

C21

C17

C15

R41

R22

C12

C11

C26

R54

C37

R37

R38

U10

C38

R33

R36

R32

JP1

R11

BLOCK

D14

T10

T9 T2

R72

R76

C27

C16

U15

Page 30

BenQ Rev 1.0

56D72 Side 2 Layout

LCD Module

D11

D10

D12

D13

C57

C34

BL2

BL3 R74

C41

R73

C39

C40

R40

R35

C50

C51

C33R27

BQ3

BQ4

R48

R45

R71

R49

R46

C31

C30

R60

R75

R68

U17

R64

R70

R65

R63

R62

C49

C47

U16

R61C10

R80

C58

Page 31

BenQ Rev 1.0

56D72 ULYSSE

RN4

RN2

RN5

RN3

R56

C52

DATA

TCXOEN

CLK

TSPDO

TCXOEN

TSPCLKX

CLKTCXO

13MHZ

OSC32KOUT

GANDA2

OSC32KIN

KBR4

KBR3

KBR1

KBR2

KBR0

RXMODEM

RX_IRDA

VR2B

SDI SCL

ULYSSE

X1 CRYSTAL 32.768KHz

Page 32

BenQ Rev 1.0

56D72 OMEGA

R N

R6R9

TR1

C46

R11

R18

U15

R58 R57

R14

C12

C11

R59

ADIN2

CK13M

ADIN4

ACCID

ADIN5

PWON

RPWON

ONNOFF

ADIN1

EARPHONIN

VR3

13MOUT

IO1BATID_DET

VR2

TBAT

VR3

OMEGA

RESPWRONZ

Page 33

BenQ Rev 1.0

VAUX

VR2

VR1B

VR2B

SVDD

VR3

VBAT

VBATBB

UPR

U3 Omega

C21

C20C19

C23

C15

C17

R24

C18

1.8V

2.9V

2.0V

2.9V

VBACKUP

C25

LCD

Flash & SRAM

Ulysse

SIM

SOCKET

VR1

Lower side

R15

R16

R17

R20

R22

R54

U5,U6

1.8V

U4A

2.9V

5.8V

3.0V/5.0V

56D72 Power Supply Circuit

3.2V

On Side 2

Page 34

BenQ Rev 1.0

A B C D E F

1 2 3 4 5 6

7 8

ADD

DATA

ADD

A B C D E F

1 2 3 4 5 6

G H

DATA

ADD

DATA

ADD

R28 R29

R30

C35

C36

VR2

2.9V

U1.J12

IO5FLASH_WP#

U1.P6

NROMCS1

U1.M9

FDP

U1.N8

RNW

U1.L8

NFOE

U1.P7

NRAMCS

U1.K7

NBHE NBLE

U1.K8

FLASH

SRAM

2.9V

56D72 Memory Circuit

Page 35

BenQ Rev 1.0

Receiver

EARN

EARP

U3.H8

U3.H9

BL2

BL3

R74

C40 C41

R73

C39

U12

U3.K9

U3.K8

U3.J8

R43

R44

C42

C43

R50

R51

C44

C45

C53

C54

U14

R47

2.5V

56D72 Audio Driver

MICBIAS

Microphone

MICP MICN

Page 36

BenQ Rev 1.0

56D72 Earphone Jack

VR2B

BL1

R36

R37

R38

C37

C38

R41

BL4

U8 U10

R72

R32

T9 R76

EARPHONE_IN

VR3

IO13ACCIN

AUXI

AUXOP

TXD0

RXD0

IO3DATA_HP_SEL

R33

VR3

Upper side

2.9V

earphone_in

= 1~2.4V for earphone

earphone_in

= 2.6~2.8V for data cable

2.9V

L: plug-in H: idle

U1.A7

U3.H10

U3.D1 U1.M6

U3.J9

U3.H7

U3.H10

U1.D3

U1.D2

2.9V

L: Data Cable H: Earphone

Page 37

BenQ Rev 1.0

56D72 Charging Circuit

U16

U18

R62

R65

R64 R70

R68

R24

R25

R66

D15

C29

C49

C31

R63

U17

C47

C48

C30

C10

C55

R60

Charger In

R69

C28

JP1

C56

R67

VBAT

VBATBB

VCHG

VR3

U3 Omega

ICTL

On Side 1

Page 38

BenQ Rev 1.0

56D72 Vibrator & Buzzer

D14

T10

BQ4

R49

R46

On Side 2

IOVIBRATOR

R71

R45

BQ3

On Side 2

D14

T10

U1.C2

U1.J3

VBAT

Page 39

BenQ Rev 1.0

GND

VPP

I / O

VCC

RST

CLK

U3.D5

U3.A2

U3.D4

R3U3.B4

C4R7

3V/5V

SIO5

SCLK5

SVDD

SRST5

1.6/3.2MHz

56D72 SIM Circuit

1.6/3.2MHz

Page 40

BenQ Rev 1.0

56D72 Keypad and LEDs

D9 D10

D11

D12

ROW0

U1.A4

ROW1

U1.B4

ROW2

U1.D4

U1.B3

ROW3

U1.A6

COL0

U1.A5

COL1

COL2

U1.B5

COL3

U1.D5

COL4

U1.E5

ROW4

U1.A2

PWON

U3.B10

D13

R40

R35

BQ2

U7.6

R34

VBATBB

1.9V

LCD

Backlight

1.9V

On Side 1

Page 41

BenQ Rev 1.0

56D72 LCD Circuit

VR2

I2C_SCL

C32

R27

C34

C50

C33

C51

NRSTOUT

I2C_SDA

U1.K11

10 9 8 7

5 4

2 1

RN3.1 / U1.C4

RN3.2 / U1.F4

2.9V

7.6V

2.9V

400KHz

Page 42

BenQ Rev 1.0

△ Radio Frequency function Descriptions (Top Side)

Page 43

BenQ Rev 1.0

Bottom Side

Page 44

BenQ Rev 1.0

Tx Flow Chart

T/R Switch For TX

EGSM:880.2∼914.8MHz

DCS:1712.2∼1786.8MHz

(LMC33-07A0533A)

DCS:3604.4~3753.6 MHz

GSM:3700.8~3839.2 MHz

RFVCO

(UCVE4X307)

Dual Band PA

EGSM：880.2∼914.8MHz

DCS：1712.2∼1786.8MHz

(CX77301)

RF Synthesizer

(HD 155141TF)

Mixer with RF

(HD155141TF)

Loop

Filter

Phase

Dectector

I/Q

Modulator

DCS: 360/368MHz

GSM: 360/368MHz

IFVCO

(HD155141TF)

IF Synthesizer

(HD 155141TF)

DCS/4=90/92MHz

EGSM/8=45/46MHz

TX VCO

EGSM: 880.2∼914.8 MHz

DCS:1712.2~1786.8 MHz

(ENFVF382S12)

HD155141TF

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Rx Flow Chart

T/R Switch For RX

EGSM：925.2∼959.8MHz

DCS：1805.2∼1879.8MHz

(LMC33-07A0533A)

DCS:3610.4~3759.6 MHz

EGSM:3700.8~3839.2 MHz

RFVCO

(UCVE4X307)

DUAL SAW FILTER

EGSM：925.2∼959.8MHz

(B7710)

DCS：1805.2∼1879.8MHz

(SAFSD1G84CB0T00)

Mixer with RF

(HD155141TF)

DC Offset

Cancellation

(HD155141TF)

LNA

(HD155141TF)

RF Synthesizer

(HD 155141TF)

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Tx Block Diagram

Dual Band PA

T/R

Switch

Charge

Pump

PFD

QTxP

QTxN

ITxP

ITxN

EGSM : 45 MHz

DCS : 90 MHz

TX EGSM : 880.2~ 914.8 MHz

DCS : 1712.2~1786.8 MHz

Loop Filter

DCS:3604.4~3753.6 MHz

EGSM:3700.8~3839.2 MHz

RFVCO

Synth

IFVCO

I&Q Mod

Shift(1/2)

Synth

DCS

EGSM

DCS

EGSM

DCS:1802.2~1876.8 MHz

EGSM: 925.2~959.8 MHz

DCS:360/368 MHz

EGSM: 360/368 MHz

DCS : 90/92 MHz

EGSM : 45/46 MHz

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Rx Block Diagram

T/R

Switch

QRxP

QRxN

IRxP

IRxN

EGSM LNA

DCS LNA

EGSM: 925.2~959.8 MHz

DCS:1805.2~1879.8 MHz

DCS:3610.4~3759.6 MHz

EGSM:3700.8~3839.2 MHz

RFVCO

Shift(1/2)

ADC/DAC & Control Logic for DC Offset Cancellation

Synth

DCS:

1805.2~1879.8 MHz

EGSM:

1850.4~1919.6 MHz

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U75

U73

U67

U66

U71

C704

U61

U65

U85

U63

U64

U74

RF circuit element placement

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U75

U73

U67

U66

U71

C704

D 3

U61

U65

U85

U63

U64

U74

EGSM 900 Receive Signal Path Diagram

U72

CW Wave

CH 62 947.46MHz

-50dBm

-53dBm

-54dBm

-63dBm

Phone setting +:continuous RX mode ARFCN:62 BB PGC Gain value:3 IF PGC Gain value:60 LNA turned off:n

Legend：

chip inductor

chip capacitor

chip resistor

Vpp = 0.9V for RFin=-60dBm

-3dBm

1.66V

2.84V

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U75

U73

U67

U66

U71

C704

D 3

U61

U65

U85

U63

U64

U74

CW Wave

CH 700

1842.86MHz

-50dBm

-53dBm

-56dBm

-63dBm

Phone setting +:continuous RX modeARFCN：700 BB PGC Gain value：3 IF PGC Gain value： 60 LNA turned off ：n

Legend：

chip inductor

chip capacitor

chip resistor

Vpp = 0.7V for

RFin = -60dBm

-3dBm

1.18V

2.84V

DCS 1800 Receive Signal Path Diagram

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U75

U73

U67

U66

U71

C704

U61

U65

U85

U63

U64

U74

DCS 1800 Transmit Signal Path Diagram

U72

CH 700

1747.8MHz 27dBm

C806

L606

C622

DC 1.18V

AC 0.46Vpp

1747.8 MHz

1747.8MHz 6dBm

C714

3675.6MHz

-1dBm

1.1V

2.8V

C621

26MHz

C709

1748.8MHz 24dBm

1747.8MHz 28dBm

1.6V

1.4V

360MHz

-4dBm

DC 1.18V

AC 0.46Vpp

DC 1.18V

AC 0.46Vpp

1.8V

1.4V

Phone setting RF toolkit mode CH 700 : ARFCN Power Supply Setting : 3.8V Spectrum Analyzer Trace : Max Hold Mode

800 : scaling factor 6 : Data pattern =>random data=>TSC=5

Legend：

chip inductor

chip capacitor

chip resistor

3.8V

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U75

U73

U67

U66

U71

C704

U61

U65

U85

U63

U64

U74

EGSM 900 Transmit Signal Path Diagram

U72

CH 62

902.4MHz 31dBm

C806

L606

C622

DC 1.18V

AC 0.46Vpp

902.4MHz 5dBm

C715

3693.6MHz

-2dBm

1.6V

2.8V

C621

26MHz

C709

902.4MHz 27dBm

1.6V

1.3V

368MHz

-5dBm

DC 1.18V

AC 0.46Vpp

DC 1.4V

AC 0.7Vpp

1.9V

902.4MHz 28dBm

6.5dBm

Phone setting RF toolkit mode CH 62 : ARFCN Power Supply Setting : 3.8V Spectrum Analyzer Trace : Max Hold Mode

Legend：

chip inductor

chip capacitor

chip resistor

800 : scaling factor 6 : Data pattern =>random data=>TSC=5

3.8V

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1.T/R switch:

U75 is a front-end switch device for GSM/DCS. These devices include 1 diplexer + 2 switches + 2 LPFs. The below table shows the three operating mode.

Mode Vc1 (pin 2) Vc2 (pin 11)

GSM TX L H

DCS TX H L

GSM Rx and DCS

L L

These four control signals are generated from U73 Dual Buffer, which controlled by GSM_T/R(U1 Pin B10) DCS_T/R(U1 pin E9).

2.PA and power control circuit:

PA (U71) is control by signal BS and APC (U74 Pin7). APC is generated from U74 (Operational Amplifier), which controlled by RAMP signal (U3 pin 47). The power control loop is a current sensor. U74 works as the error amplifier. It can compare the RAMP signal and feedback signal from R702 then amplify the error part to drive PA. U86 is a switch for power saving. Please refer to TX signal path chart for detailed signal waveform. Please refer to TX signal path chart for detailed signal waveform.

3.Transceiver:

U61 is the transceiver.

A>.Receiver Operation

The receiver employs a direct-conversion architecture. The incoming RF signals pass via a suitable front-end filter into the balanced LNA and a pair of Gilbert Cell mixers. The mixers convert the RF signal directly down to baseband frequencies. The I/Q local oscillator signals for the mixers are derived from a 3.6~3.84GHz RFLO, divided down by high-speed BiCMOS flip-flops. The receiver has 2 separate front-end blocks, optimized for 900MHz and 1.8GHz operation respectively. Each front-end block has 3 discrete gain settings. These settings allow the signal levels in the receiver to be optimized, particularly under high signal conditions. The I/Q baseband lowpass filters and programmable gain amplifiers follow the mixer. The

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baseband filtering is distributed in the PGA and comprises a single R/C

low-pass section and 2 second order Butterworth filters. The majority of the baseband filtering is implemented on-chip. Each 3 stage PGA is DC coupled and has a gain range. The base-band PGA has 2dB gain steps and 90dB control range. The baseband PGA includes a DC offset cancellation system.

The signal is then down converted by a demodulator to I and Q.

B>.Transmitter Operation The transmitter chain converts differential IQ baseband signals to a suitable format for transmission by a power amplifier. The common mode voltage range of the modulator inputs is 0.9V to

1.4V and they have 1.25V differential swing. The modulator circuit uses double-balanced mixer for the I and Q paths. The Local signals are generated by dividing the IFLO signals by 8 for GSM, and dividing IFLO signals by 4 for DCS, and then passed to the modulator through a phase splitter / shifter. The IF signals generated are then summed to produce a single modulated IF signal which is amplified and fed into the offset PLL block. Within the offset PLL block there are a down converter, a phase comparator and a VCO driver. The down converter mixes the first local signal and the TXVCO (U65) signal to create a reference local signal for use in the offset PLL circuit. The phase comparator and the VCO driver generate an error current, which is proportional to the phase differential between the reference IF and the modulated IF signals. This current is used in a second order loop filter to generate a voltage, which in turn modulates the TXVCO.

4. Synthesizer:

A>.TCVCXO U85 is a TCVCXO module which providing RF system clock (26 MHz). The 13MHz generated by dividing the 26 MHz by 2 provide Baseband system clock. U3 (Pin F8) can fine tune the clock frequency by AFC signal (U85 Pin1). B>.RF VCO

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U63 is a RF VCO module. The frequency band is 3610∼3840 MHz for GSM / DCS TX / RX. The output frequency can be controlled by

U61 pin 43,44. C>.IF VCO

IF VCO consists of U61 pin 32、33, D601、D602(varactor) and other RLCs. The operating frequency is 360 MHz, and 368MHz. The output

frequency is controlled by U61 pin 34.

5.Regulator

U90 is the Dual regulator for RF circuit. The first regulator (pin 1) provides transceiver 2.85V and TXVCO (U65) 2.85V through Q700 pin6 which is a switch for power saving. The second regulator (pin 6) provides synthesizer of transmitter and RFVCO (2.85V) through Q700 pin3. All the Dual regulators can be shut down simultaneously by set TCXOEN signal (U1 pin E11).

Table A Receiver Troubleshooting and Repair Chart

Rx Symptom Probable Cause

Verification and Remedy

1. Portable

telephone exhibits poor reception and/or erratic operation (such as calls

a) Antenna assembly is defective.

1. Check to make sure that the antenna is properly touched to the telephone Main Board pad. If not, substitute a known good antenna assembly.

2. If the fault is still present, proceed to b.

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frequently dropping, weak and/or distorted audio, etc.).

b) Defective or misplaced telephone Main Board.

1. Check for appropriate frequencies and power

level gains/losses in the Rx

path.

2. Replace malfunctioning components if listed in parts list. Likely fail components are：U75,

C608, C609, L601, L602, L603, and L604.

3. If parts replacement doesn’t correct the fault,

replace the SAW filter U66,

U67, or transceiver U61.

Table B Transmitter Troubleshooting and Repair Chart

Tx Symptom Probable Cause Verification and Remedy

a) Microphone

connections to Main Board defective.

1. Check connections and

if OK, proceed to b.

1.Transmit audio is weak, (usually indicated by called parties complaining of difficulty in hearing voice from portable phone).

b) Microphone

defective.

1. Substitute a known good microphone.

2. Place a call and Verify improvement in portable transmit signal as heard by called party. If good, re-assemble portable with new microphone

3. If microphone is not at fault, re-install original microphone and proceed to c.

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c) Main Board

assembly defective.

1. Replace Main Board Assembly.

2. If Main Board Assembly is at fault, examine for improper solder and connections.

Download

Introduction:

This document describes all the functions in service DMtool.

△ System requirements and setup:

A. Minimum requirement:

Operation system: Win95/ Win98 / WinNT / Win2000. CPU: Pentium 233 Mhz or higher. Hard Disk: Free 10MB space. Memory: 64MB RAM. Input Device: Keyboard and mouse

B. Calibration requirement:

1.Instrument for calibration Hp8922M GSM/DCS/PCS MS Test Set Hp8960 GSM/DCS/PCS RF Interface

2.GPIB interface card and cable For RF calibration

3.Power Supplies:

HpE3631,Hp66332A,Hp66311,Hp66111,Hp66309

4.Communication cables Rs232 and Acer Downloader

5.RF Cable 50 ohm cable for RF calibration.

6.Dummy battery For RF and battery calibration.

C. Setup in Windows:

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In Windows 95/98/NT/2000, extract the Dmtool compress files to any temporary directory. It will create DISK1 this subdirectory. Please go into the DISK1 and double click the setup.exe. The Install shield will auto setup the Dmtool in your operating system.

Some necessary files are listed below :

Fixed Items: ===============================

(1) DMtool.exe (main application )

(2) DL.dll (the dll for download) (3) CALDL.dll (the dll for calibration) (4) E2pMmi.dll (the dll for read/write e2p and mmitest) (5) AtStCom.dll (the dll for animation and melody download) (6) r_flash_xx.mot (Rs232 boot code file) (7) dmtool.hlp, dmtool.cnt (dmtool help file) (8) AutocalMarch.cfg (auto-calibration parameter reference file)

Volatile Items: ===============================

The files you gotten may differ from the files listed below as the result of software upgraded for handsets. When the software of handsets release, you will get a handset program file and an eeprom database file.

(9) mh1060.bin (eeprom database file, its file extension name must

be “bin” (10) mh106010.mot (handset program file, its file extension name

must be “mot”

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△ Function descriptions:

There are several windows (views) in the DMtool application.

Each view performs a special function.

A. Download:

Before you start a RS232 download, you must select a flash-load program file by pressing down the “Flash File” button or “Set Flash File” submenu button in “File” menu. Then you must select the correct com port in “Option” menu. When the Dmtool application setup completed, the default boot code will be assigned. You don’t need to change the boot code yourself. You can change boot code by “Boot File” button or “Set Boot Code File” submenu button in “File” menu. If you assigned incorrect flash or boot code file, you may still encounter errors. Before press “Download” button to start a RS232 download process, you must power off the handset. When the string “Wait for target ready” appears, power on the handset. Then the download process starts. It will take about 5 minutes for completing the download. After undergoing a completed download process, the Dmtool will auto trigger a Set E2P Default dialog to execute set e2p default. There are two option, “Set E2P Default” or “Set E2P Default and Phone Book Initialize” in this dialog. You must select “Set E2p Default and Phone Book Initialize” and click the “OK” button. After the “Wait for target ready” message appears, power on the handset. If the handset receive the set e2p command form dmtool, it will start to execute set e2p command and send the ack message to dmtool. When the dmtool received the ack from handset it will display the message “Waiting for target Acknowledgment …”. If the handset complete the set e2p command, it send the ack to dmtool. When the dmtool receive the ack message, it will display “Set e2p command success” message.

Remark:

1. It must be emphasized that never stop or remove the power supply (battery) when your handset is downloading the block 0

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and block 1 program codes . It is writing critical boot codes at this time. If you terminate the download process at this moment, this handset not only can’t power on but also can’t re-download again. In this case , the only solution is using a special “Jtag interface and cable” to do a low-level download.

2. When the new vendor flash used in handset, the boot code

r_flash_xxx.mot need upgrade to new version which support new vendor flash.

B. Set E2P:

There are several sub-options for this function. You can select these option from “Set E2p Mode” submenu in “Option” menu. You can see which set e2p mode you select current in the status bar (in the right-bottom) of the window. To execute those options, first power off the handset and click this “Set E2p” button. After the “Wait for target ready” message appears, power on the handset. Details for each sub-options are listed below.

(1).Set EEPROM default will set a part of contents in EERPOM to

factory default value. Phone books and calibration data won’t be reset in this operation.

(2).Set EEPROM Default Phone books initialize is similar to Set

EEPROM default, but this option will erase all phone book data in EEPROM.

C. Read/Write FlexOption:

”Flex option” is used for modifying the handset’s flex option settings. Changing those options are straightforward, just click the individual enable/disable check button of every tree-item. The procedure to Read/Write FlexOption is:

(1).Set baud rate 115200 and select com port then connect RS232

communication. (2).Turn on the handset. (3).Check the database file are the same as software version. You

can assign database file from menu “File” à “Set Database

File”. You can verify software version by keypress “*#300#” in

handset. (4).Click “Read Flex Option” to read flex option from handset.

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(5).Select the feature you want enable/disable by click check button

in option tree-item.

(6).Click “Write Flex Option” to write flex option to handset.

D. Calibration:

(1).calibration connect cable:

PS:

1. In some calibration instrument, the RF output of GSM and DCS are different, so you must calibrate GSM and DCS each other.

2. If you have no connector with power supply and Acer downloader, you can get a travel charger and cut it, then divide the positive and negative electrode to connect into power supply.

(2). Calibration Item:

2-1.Configuration file:

The auto-calibration configure file contents some optimal value for some object in handset and some parameters dependent on calibration device and handset.

Calibration Instrument

RF output

Power Supply

Acer downloader

GPIB

Com

GPIB

Rs232

RF Cable

Power lines

Downloader cable

Dummy battery

u w x

GSM I/O

Power

Handset

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2-2.Auto-Power-Control:

If the flag is TRUE and the power supply is a supported

type (please refer to System Requirement

) , the calibration

will start automatically, or you must operate it manually.

2-3.Set Ramping Default:

Some measurement instruments do not support ramping

calibration, you can set the ramping table by default values.

2-4.HW Version:

The hardware version of the target handset. It combined with major and minor hardware version. The major hardware version is indicates the type of PA, and the minor hardware version indicates the type of baseband or others.

Major version 1.x – Conexant PA

Major version 2.x -- Hitachi PA

2-5.PA Type Selection:

There are two kinds of PA, Conexant PA and Hitachi PA. Before you start to calibrate, you must select the correct

PA type.

2-6.Auto-calibration selection:

Choose the items that you want to calibrate when

running auto-calibration function.

AFC: Frequency. (Before calibrate AFC, you must select

AGC Item)

AGC: RxGain APC: TxPower ADC: Battery is for battery A/D converter calibration ARC: Ramping table calibration.

2-7.Band selection: Choose the frequency band for calibration.

GSM900 DCS1800

E. Start calibration:

Before start calibration you must check the following things:

(1) Change your battery to dummy battery. (2) Check connect cable is OK? (3) Check GPIB interface is OK? (4) Power on power supply and set it to 3.8 V

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Before Click the “Auto-Calibration” button, make sure all listed

items are done:

(1) Set the correct com port and baudrat in option menu (2) Choose Auto-calibration configure file. When you set up the

program success, we had assigned the default configure file.

What you want to do is to check or set the value of the field

Board_Address to your GPIB0 primary address.

For example: Auto-calibration configure file [GPIB_DEVICE] Board_Address=0 ç GPIB0 primary address.

(3) Check your target handset software version(you can input

*#300# int the keypad)And assign the correct database file which dependent with the software version of target handset.

(4) Check your target handset hardware version(you can input

*#300# in the keypad). Then select your PA Type by your hardware version. 1.0 for Conexant PA and 2.0 for Hitachi

PA. And input the hardware version of target handset in HW Version field of window.

(5) Choose calibration items and frequency band in check box.

When all settings are done, just click the “Auto-Cal” button in

main window to start the calibration process.

(1) If the power supply is a supported type, the calibration will

start automatically, or you must operate it manually: Turn off the power supply before the calibration start, and turn it on immediately when the message Wait for target ready show up. For details: If your power supply isn’t supported by dmtool, then you must turn off the power supply (please refer the figure of “Calibration Connect Cable” ), then the power of target handset and Acer downloader will turn off. when the message “Wait for target ready” show up, you must turn on the power supply immediately. If your power supply is supported by dmtool and you check up the Auto Power Control check box, then the dmtool will auto do the all things in the above.

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(2) If the DmTool receive the signal from target handset , then it

will start to identify calibration device, and show up Identify Calibration device… message. If the calibration device identified ok, then it will start the calibration.

(3) And then the dmtool will start auto calibrate the target handset

with calibration instrument, and receive the result messages of calibration . You can see the result message of calibration in the Calibration Window.

(4) Calibration Notes:

There are 5 options for auto-calibration: AGC (RX) AFC (Frequency error) APC (TX)

ARC (Ramping)

ADC (Battery)

There is no correlation between AGC, APC, and ADC options ,therefore you can make any combinations when calibrate these options. However, AFC need some parameters gotten from AGC, you must select AGC when you want to calibrate AFC. Besides, GSM and DCS share the same parameters of AFC and AFC will be calibrated only in GSM band, you should select GSM band to calibrate AFC.

ARC requires some parameters gotten from APC, but these parameters can be retrieved from the E2P memory in target handset. Thus if you can guarantee these parameters are well-setup, you can calibrate ARC only without APC. If you know nothing about it, then calibrate both of them is a recommendation.

If your calibration instrument can only calibrate one band (GSM or DCS) at a time, you have to pay more attention about the combination of calibration options, recommended combinations are list below:

(1). GSM band : AGC, ADC ,and APC can be calibrated separately. AGC+AFC

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APC+ARC AGC+AFC+APC AGC+AFC+APC+ARC AGC+AFC+APC+ARC+ADC (2). DCS band : AGC, ADC, and APC can be calibrated separately. APC+ARC AGC+APC AGC+APC+ARC AGC+APC+ARC+ADC

If your calibration instrument can’t support ramping calibration, we

support Set Ramping default to set the ramping table to optimal default value.

F. E2p Clone:

”E2p Clone” is used for duplicating the data in the handset’s EEPROM. It backup the Network-Lock, handset-feature settings, and phone book records to PC and enable users to restore them to handsets latter. The procedure to Read/Write FlexOption is:

(1)Set baud rate 115200 and select com port then connect RS232

communication. (2)Turn on the handset. (3)Check the database file are the same as software version. You

can assign database file from menu “File” à “Set Database File”.

You can verify software version by keypress “*#300#” in handset. (4)Select the e2p backup file and phonebook backup file. (5)Click “Backup” to backup e2p and phonebook from handset to

file.

(6)Click “Restore” to restore e2p and phonebook from file to

handset.

△ FAQ:

1.How do I select a correct boot code file?

The boot code file plays an important role during a download procedure. It takes care of programming flash ROM and is responsible for data receiving/transmission. The boot code files for download vary

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as different MS models. For March model, it uses r_flash_xxx.mot. When the new vendor flash used in handset, the boot code r_flash_xxx.mot need upgrade to new version which support new vendor flash. Users just need to click the “Boot File” button in Download window or click the “Set Boot Code File” menu button in “File” menu to select this file.

2. Why can’t I download/upgrade programs into the handset?

For RS232 download, verify the following procedures step by step:

1. Do you set the switch to left side in your downloader?

2. Do you assign a correct boot code file?

3. Do you select a correct COM port?

4. Dose the connection between the MS and PC setup properly?

5. Do you power off the MS before the download starts?

6. Do you power on the MS after the sentence “Wait for Target ready…” appear?

7. Have you ever terminated a download process when it was downloading the block 0 and 1 codes? If yes, then the boot-code area of this handset has been corrupted and can’t use RS232 download.

3. Why can’t set e2p?

1. Do you select a correct COM port?

2. Dose the connection between the MS and PC setup properly?

3. Do you power off the MS before the Set E2p starts?

4. If the sentence “Wait for Target read…” dosen’t appear, it may be some application occupied the com port now. Please terminate that application and execute set e2p again.

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Disassembly

Introduction

Responsible care should be taken during the disassembly and reassembly of the units in order to avoid damaging or stressing the housing and internal components. Ensure that a properly grounded high impedance conductive wrist strap is used while performing these procedures on electronic units.

NOTE Many of the integrated circuit devices used in this equipment are

vulnerable to damage from static charges. Ensure that adequate static protection is in place when handling, shipping, and servicing the internal components of this equipment.

Recommended Tools

The following tools (or similar tools with the same functions) are recommended for use during the disassembly and reassembly of the phone.

• Anti-Static Mat (Ground Cord included)

• Anti-Static Wrist Strap

• Torque Screw Driver (T5 type, torque is set to 1.2kg-cm)

• Tweezers

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Disassembly Procedure

The following information describes the procedure for removing and accessing various parts of the phone.

Front Case Removal

1. Turn off the telephone.

2. Slide down the bottom cover,

and remove the battery pack from the Rear housing.

3. Remove the bottom cover and

nameplate from the rear housing.

4. Release the six screws and

remove them.

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5. Unclip the 2 snap fits from the left

and right hand sides of the unit and separate the rear from the front housing

Main Board Removal

1. Carefully separate the main

board from the front housing by lifting it upwards.

2. Carefully use a tweezers to remove

the four corner of RF Shielding case.

3. Carefully use a tweezers to remove

the four corner of BB Shielding case.

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4. Place the main board facing

upwards on an anti-static mat.

5. Place a protection tape over

the LCD module.

NOTE Do not touch the LCD

module with your hands!

6. Remove the Keypad from the front

housing by lifting it upwards.

Assembly Procedure

Once the unit is disassembled and the repair is carried out, it then becomes obvious that to assemble the unit, the procedure is the

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reverse of that previously completed for disassembly.

Troubleshooting

△ Level 1 ~level 2 repair

Symptom Probable Cause Verification and Remedy

a).Battery either discharged or defective.

1. Measure battery voltage. If the battery voltage is <3.2V, recharge the battery using the appropriate battery charger.

2.If the battery can’t be recharge, replace

the battery.

1.Unit doesn’t turn on

b).Shield case short with components

1.Visually inspect the RF/BB shielding

case. If they become deformed , replace

the shielding case.

2.Keypad no function.

Keypad bottom short 1.Disassembly to

replace the keypad metal

dome.

3.Buzzer no function

Components shift 1.Disassembly to visually inspect the U13.

If the spring of the U13 becomes deformed, replace the U13.

4.Vibrator no

function

Components shift 1.Disassembly to visually inspect the M1.

the spring of the M1 becomes deformed and doesn’t contact well with PCB pads, replace the M1.

5.Speaker no function

Components shift 1.Disassembly to visually inspect the LS1.

If the spring of the M1 becomes deformed and doesn’t contact well with PCB pads, replace the LS1.

6.Micphone no function

Components shift

1.Disassembly to visually inspect the X2. If

the cover of the X2 is not matched with the micphone hole or micphone doesn’t contact well with PCB pads, replace the cover of the X2 or micphone.

7.Datacable no function

Components are at fault.

1.Measure voltage level if VR3 and

VR2B_SW voltage level are equal 2.9V.

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8.Can’t charge

Battery or charger is at fault

1. Use the correct battery and charger to check the charge function.

2.If charging function is ok, the battery or

charger is illegal.

△ Level 3~ level 4 repair

Symptom Probable Cause Verification and Remedy

a) Battery either discharged or defective.

2. Measure battery voltage. If the battery voltage is <3.2V, recharge the battery using the appropriate battery charger.

3. If the battery can’t be recharge, replace the battery.

4. If the battery is not at fault, proceed to b.

b) Battery connector open or misaligned.

1. Visually inspect the battery connectors on both the battery pack and the unit.

2. Disassembly to check the battery connectors if it misaligned or short with the RF or Base-band shielding cases. If necessary, replace either the battery or battery connector.

If the battery connectors are not at fault,

proceed to c.

1.Unit doesn’t turn on

c) Shield case short with components

1. Visually inspect the RF/BB shielding

case. If they become deformed, replace

the shielding case.

2. If the shielding case are not at fault, proceed to d.

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d) X1, R56, C1 or C2

1. Use the power supply to supply the VBAT voltage. Then, press the power-on key. Visually inspect the current of the handset used.

2. Measure the waveform of the R56.

3. If the waveform isn’t the 32KHz clock, replace the C3 and R2.

4. If they are not at fault, proceed to e.

e) C3 or R2 is at fault.

1. Measure the waveform of the R2.

2. If the waveform isn’t the 13MHz clock, replace the X1, R56, C1 or C2.

3. If they are not at fault, proceed to f.

f) U3 is at fault.

1. If the current is under 100mA when power on, check the VR1 (2.5V), VR2 (2.9V), VR2B (2.9V), and VR3 (2.9V) voltage.

2. If they are not correct, maybe the U3 is at fault. Replace the U3.

a) LCD module is at fault

Disassembly to visually inspect the LCD

module. If the glass is break on the LCD, replace the LCD module.

2. If the LCD module is not brea

k, proceed

to b

2.LCD no display.

b) LCD module has no power.

1. Visually inspect the C34 or R27 is still on the board. If no, replace the C34 or R27.

2. Measure the voltage of C34. If it is not about 8V, the LCD driver IC is failed on the LCD module. Replace the LCD module.

3. If

the LCD module is not break, proceed

to c

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c) U1 is at fault

1. Power on the handset. Then measure the waveforms of the J2.6, J2.4 and J2.5 pins.

2. If the J2.6 pin is always low or the other two pins (J2.4 and J2.5) are no data, the U1 is at fault. Replace the U1.

3.Keypad no function.

Keypad bottom short Disassembly to replace the keypad metal

dome.

a) Components shift

1. Disassembly to visually inspect the U7, R34, BQ2, R40, R35. If any component is shifted, replace the components.

2. If they are not shifted, proceed to b

b) U1 is at fault

1. Measure the waveform of the U7.2. If

the U7.2 doesn’t output any signal when

LED function is executed, U1 is at fault.

2. If it is not at fault, proceed to c.

4.LED no display

c) Other components are at fault.

1. Measure the waveform of the U7.6, BQ2.2, and BQ2.3 when LED function is executed.

2. If any pin is no signal, replace the component relative to that pin.

a) Components shift

1. Disassembly to visually inspect the U13. If the spring of the U13 becomes deformed, replace the U13.

2. Visually inspect the R48, BQ3, R45, and R71. If any component is shifted, replace the components.

3. If they are not shifted, proceed to b

5.Buzzer no function

b) U1 is at fault

1. Measure the waveform of the D16.1. If the D16.1 doesn’t output any signal w

hen Buzzer function is executed, U1 is

at fault.

2. If it is not at fault, proceed to c.

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c) Other

components are at fault.

1. Measure the waveform of the BQ3.3, BQ3.2, and BQ3.1 when Buzzer function is executed.

2. If any pin is no signal, replace the component relative to that pin.

a) Components shift

1. Disassembly to visually inspect the M1. If the spring of the M1 becomes deformed and doesn’t contact well with PCB pads, replace the M1.

2. Visually inspect the R46, BQ4, and R49. If any component is shifted, replace the components.

3. If they are not shifted, proceed to b

b) U1 is at fault

1. Measure the waveform of the R46. If the R46 pin doesn’t output any signal when Vibrator function is executed, U1 is at fault.

2. If it is not at fault, proceed to c.

6.Vibrator no

function

c) Other components are at fault.

1. Measure the waveform of the BQ4.3, BQ4.2, and BQ4.1 when Vibrator function is executed.

2. If any pin is no signal, replace the component relative to that pin.

a) Components shift

1. Disassembly to

visually inspect the LS1.

If the spring of the M1 becomes deformed and doesn’t contact well with PCB pads, replace the LS1.

2. Visually inspect the R73, BL2, BL3 and R74. If any component isn’t contacted well, replace the components.

3. If they are not shifted, proceed to b

7.Speaker no function

b) U3 is at fault

1. Measure the waveforms of the R73 and

R74. If the R73 or R74 pins don’t output

any signal when speaker function is executed, U3 is at fault.

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a) Components shift

1. Disassembly to visually inspect the X2. If the cover of the X2 is not matched with the micphone hole or micphone doesn’t contact well with PCB pads, replace the cover of the X2 or micphone.

2. Visually inspect the R50, R51, C44, C45, R43, R44, R47, C42, C43, C53, C54 and U14. If any component isn’t

contacted well, replace the components.

3. If they are not shifted, proceed to b

b) U3 is at fault

1. Measure the waveforms of the R50, R51, and R43. If the R50 or R51 pins don’t output any signal or Micbias voltage level is not equal 2~2.5V when micphone function is executed, U3 is at fault.

2. If it is not at fault, proceed to c.

8.Micphone no function

c) Other components are at fault.

1. Measure the waveforms of U14.5, U14.1, U14.4 and U14.3 when micphone function is executed.

2. If any pin is no signal, replace the U14.

9.Handfree no function

a) Components shift

1. Disassembly to visually inspect the J3. If audio jack (J3) pins don’t contact well with PCB pads, solder the pins and pads together.

2. Visually inspect the R72, R32, U9, U8, U10, R36, BL1, R41, C38, R38, R37, C37 and J4. If any component isn’t

contacted well, replace the components.

3. If they are not shifted, proceed to b

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b) U3 is at fault

1. Measure voltage level if VR3 and VR2B_SW voltage level are equal 2.9V.

2. Measure the waveforms of the BL1, R41, and J4. If the BL1 or R41 pins don’t output any signal when handfree function is executed, U3 is at fault.

3. If it is not at fault, proceed to c.

c) Other components are at fault.

1. When handfree is plugged in, IO13ACCIN detect 0V. Then, IO3DATA_HP_SEL outputs high level, U8.1 pin connects to U8.4 pin and U10.1 pin connects to U10.4 pin. If not, maybe the U8 and U10 are at fault. Replace the U8 or U10.

2. After IO3DATA_HP_SEL outputs high level, measure the waveform of the U10.4 pin. If its voltage level doesn’t drop to 1 ~ 2.6V and the voltage of the U3.C6 pin isn’t equal to 0.5 ~ 1.3V, test

it again by another handfree. If handfree

is still no function, U9, R37, R38, R6 or R9 is at fault. Visually inspect the components. If any component isn’t contacted well or wrong, replace the components.

3. Measure the waveforms of U9.5, U9.1, U9.4 and U9.3 when handfree function is executed.

4. If any pin is no signal, replace the U9.

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a) Components shift

1. Disassembly to visually inspect the J3. If audio jack (J3) pins don’t contact well with PCB pads, solder the pins and pads together.

2. Visually inspect the R72, R32, U9, U8, U10, R36, BL1, R41, C38, R38, R37, C37 and J4. If any component isn’t

contacted well, replace the components.

3. If they are not shifted, proceed to b

10.Datacable

no function

b) Components are at fault.

1. Measure voltage level if VR3 and VR2B_SW voltage level are equal 2.9V.

2. When datacable is plugged in, IO13ACCIN detect 0V. Then, IO3DATA_HP_SEL outputs high level about 1 ~ 2 sec, and switches to low

level. U8.3 pin connects to U8.4 pin and

U10.

3 pin connects to U10.4 pin. Check

if the U8.3 and U8.4 pins are short. If not, maybe the U8 is at fault. Replace the U8.

3. Check if the U10.3 and U10.4 pins are short. If not, maybe the U10 is at fault. Replace the U10.

4. After IO3DATA_HP_SEL outputs low level, measure the waveform of the U10.4 pin. If its voltage level isn’t equal

to 2.7 ~ 2.9V, maybe U9 is at fault. If U9

isn’t contacted well or wrong, replace the component.

5. Measure the voltage of the U3.C6. If it isn’t equal to 1.35 ~ 1.45V, maybe the R6 or R9 is at fault. Check their voltage value and replace the components.

6. If it is not at fault, proceed to c.

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c) U1 is at fault

1. Measure the waveforms of U8.3 and U10.3 when datacable function is executed.

2. If any pin is no signal, maybe U1 is at fault then replace the U1.

a) Components shift

Visually inspect the U2. If the pins of the

SIM socket is at fault, Disassembly to replace the U2.

2. Disassembly to visually inspect the R8, R7, C5, C8, R4, C4 and R13. If any component isn’t contacted well, replace the components.

3. If they are not shifted, proceed to b

12. Can’t find SIM

b) Components are at fault.

1. Plug in the SIM card to power on the

handset and measure the voltage of the

TPSIM1. If it isn’t equal to 3V or 5V, check the R8 and replace it.

2. If R8 is ok but TPSIM1 is still no voltage, proceed to c.

3. Measure the voltage of the TPSIM4 if it goes to high about 3V or 5V. If not, check the R7 and replace it.

4. If R7 is ok but TPSIM4 is still no voltage, proceed to c.

5. Measure the voltage of the TPSIM2 if it output a clock about 3V or 5V. If not, check the R4 and replace it.

6. If R4 is ok but TPSIM4 is still no voltage, proceed to c.

7. Measure the voltage of the TPSIM3 if it goes to high about 3V or 5V. If not, proceed to c.

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c) U3 or U1 is at

fault

1. If check the b steps and the TPSIM1, TPSIM2, TPSIM3 or TPSIM4 is still no signal, maybe the U3 or U1 is at fault.

2. Replace the U3 then re-check the step b.

3. If it is still no signal, replace the U1.

a) Battery or charger

is at fault

2. Use the correct battery and charger to check the charge function.

3. If charging function is ok, the battery or charger is illegal.

4. If it still can’t charge, proceed to b

13. Can’t charge

b) Components shift

5. Disassembly to visually inspect the J1. If the pins of the power jack (J1) aren’t contacted well with the pads of the PCB, re-solder the pins.

6. Visually inspect the R60, C55, F1, R68, R62, R63, R65, C47, R70, R64, U16,

U17, D1, R24, D15, C48, R66, R67 and

U18. If any component isn’t contacted well, replace the components.

7. Visually inspect the polarity of the U17, D1 and D15. If any component is wrong, replace the component.

8. Check the F1. If it is open, replace the F1.

9. If they are not wrong, proceed to c

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c) Peripheral

components for charging are at fault.

1. Use dummy battery to check the charging function. JP1.4 connected to V+ (3.6V) of the power supply. JP1.1 connected to V- (GND) of the power supply. JP1.3 connected to a resistor (10K ohm) to ground. JP1.2 connected to a resistor (47 ohm) to 1.2V of the power supply.

2. Plugged in the charger then check the voltage of the CHARGERIN pin and

U17.5 pin. If their voltage isn’t the same

about 4~6V, R68 is at fault. Replace the

R68.

3. Check the voltage of the U16.2 if it is under 0.6V. If not, check the resistor value of the R62 and R65. If anything is wrong, replace the components.

4. Check the voltage of the U16.5 if it is above 3V and the voltage of the U17.1 if it is under 0.6V. If not, maybe U16 is at fault. Replace the U16.

5. Check the voltages of the U17.2 and U17.4 if their voltages are above 4V. If not, ma ybe U17 is at fault. Replace the U17.

6. Check the voltage of the D1.2 if it is above 4V. If not, maybe D1 is at fault. Replace the D1.

7. Measure the current flowing across the R24. If not, maybe R24 is at fault. Replace the R24.

8. If they are not wrong, proceed to d

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d) U3 is at fault

1. When the charger is plugged in, the voltage of the VCHG pin is 4~6V. And when charging, the ICTL pin will high/low to control charging pulse.

2. If not, maybe U3 is at fault. Replace the U3.

Symptom Probable Cause Verification and Remedy

a) Battery either discharged or defective.

5. Measure battery voltage. If the battery voltage is <3.2V, recharge the battery using the appropriate battery charger.

6. If the battery can’t be recharge, replace the battery.

7. If the battery is not at fault, proceed to b.

b) Battery connector open or misaligned.

4. Visually inspect the battery connectors on both the battery pack and the unit.

5. Disassembly to check the battery connectors if it misaligned or short with the RF or Base-band shielding cases. If necessary, replace either the battery or battery connector.

If the battery connectors are not at fault,

proceed to c.

c) Shield case short with components

3. Visually inspect the RF/BB shielding

case. If they become deformed, replace

the shielding case.

4. If the shielding case are not at fault, proceed to d.

1.Unit doesn’t turn on

d) X1, R56, C1 or C2

5. Use the power supply to supply the VBAT voltage. Then, press the power-on key. Visually inspect the current of the handset used.

6. Measure the waveform of the R56.

7. If the waveform isn’t the 32KHz clock, replace the C3 and R2.

8. If they are not at fault, proceed to e.

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e) C3 or R2 is at fault.

4. Measure the waveform of the R2.

5. If the waveform isn’t the 13MHz clock, replace the X1, R56, C1 or C2.

6. If they are not at fault, proceed to f.

f) U3 is at fault.

3. If the current is under 100mA when power on, check the VR1 (2.5V), VR2 (2.9V), VR2B (2.9V), and VR3 (2.9V) voltage.

4. If they are not correct, maybe the U3 is at fault. Replace the U3.

a) LCD module is at fault

Disassembly to visually inspect the LCD

module. If the glass is break on the LCD, replace the LCD module.

If the LCD module is not break, proceed

to b

b) LCD module has no power.

4. Visually inspect the C34 or R27 is still on the board. If no, replace the C34 or R27.

5. Measure the voltage of C34. If it is not about 8V, the LCD driver IC is failed on the LCD module. Replace the LCD module.

If the LCD module is not break, proceed

to c

2.LCD no display.

c) U1 is at fault

3. Power on the handset. Then measure the waveforms of the J2.6, J2.4 and J2.5 pins.

4. If the J2.6 pin is always low or the other two pins (J2.4 and J2.5) are no data, the U1 is at fault. Replace the U1.

3.Keypad no function.

Keypad bottom short Disassembly to replace the keypad metal

dome.

4.LED no display

a) Components shift

3. Disassembly to visually inspect the U7, R34, BQ2, R40, R35. If any component is shifted, replace the components.

4. If they are not shifted, proceed to b

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b) U1 is at fault

3. Measure the waveform of the U7.2. If the U7.2 doesn’t output an

y signal when

LED function is executed, U1 is at fault.

4. If it is not at fault, proceed to c.

c) Other components are at fault.

3. Measure the waveform of the U7.6, BQ2.2, and BQ2.3 when LED function is executed.

4. If any pin is no signal, replace the component relative to that pin.

a) Components shift

4. Disassembly to visually inspect the U13. If the spring of the U13 becomes deformed, replace the U13.

5. Visually inspect the R48, BQ3, R45, and R71. If any component is shifted, replace the components.

6. If they are not shifted, proceed to b

b) U1 is at fault

3. Measure the waveform of the D16.1. If the D16.1 doesn’t output any signal

when Buzzer function is executed, U1 is

at fault.

4. If it is not at fault, proceed to c.

5.Buzzer no function

c) Other components are at fault.

3. Measure the waveform of the BQ3.3, BQ3.2, and BQ3.1 when Buzzer function is executed.

4. If any pin is no signal, replace the component relative to that pin.

6.Vibrator no

function

a) Components shift

4. Disassembly to visually inspect the M1. If the spring of the M1 becomes deformed and doesn’t contact well with PCB pads, replace the M1.

5. Visually inspect the R46, BQ4, and R49. If any component is shifted, replace the components.

6. If they are not shifted, proceed to b

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b) U1 is at fault

3. Measure the waveform of the R46. If the R46 pin doesn’t output any signal when Vibrator function is executed, U1 is at fault.

4. If it is not at fault, proceed to c.

c) Other components are at fault.

3. Measure the waveform of the BQ4.3, BQ4.2, and BQ4.1 when Vibrator function is executed.

4. If any pin is no signal, replace the component relative to that pin.

a) Components shift

Disassembly to visually inspect the LS1.

If the spring of the M1 becomes deformed and doesn’t contact well with PCB pads, replace the LS1.

5. Visually inspect the R73, BL2, BL3 and R74. If any component isn’t contacted well, replace the components.

6. If they are not shifted, proceed to b

7.Speaker no function

b) U3 is at fault

2. Measure the waveforms of the R73 and

R74. If the R73 or R74 pins don’t output

any signal when speaker function is executed, U3 is at fault.

8.Micphone no function

a) Components shift

4. Disassembly to visually inspect the X2. If the cover of the X2 is not matched with the micphone hole or micphone doesn’t contact well with PCB pads, replace the cover of the X2 or micphone.

5. Visually inspect the R50, R51, C44, C45, R43, R44, R47, C42, C43, C53, C54 and U14. If any component isn’t

contacted well, replace the components.

6. If they are not shifted, proceed to b

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b) U3 is at fault

3. Measure the waveforms of the R50, R51, and R43. If the R50 or R51 pins don’t output any signal or Micbias voltage level is not equal 2~2.5V when micphone function is executed, U3 is at fault.

4. If it is not at fault, proceed to c.

c) Other components are at fault.

3. Measure the waveforms of U14.5, U14.1, U14.4 and U14.3 when micphone function is executed.

4. If any pin is no signal, replace the U14.

a) Components shift

4. Disassembly to visually inspect the J3. If audio jack (J3) pins don’t contact well with PCB pads, solder the pins and pads together.

5. Visually inspect the R72, R32, U9, U8, U10, R36, BL1, R41, C38, R38, R37, C37 and J4. If any component isn’t

contacted well, replace the components.

6. If they are not shifted, proceed to b

9.Handfree no function

b) U3 is at fault

4. Measure voltage level if VR3 and VR2B_SW voltage level are equal 2.9V.

5. Measure the waveforms of the BL1, R41, and J4. If the BL1 or R41 pins don’t output any signal when handfree function is executed, U3 is at fault.

6. If it is not at fault, proceed to c.

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c) Other

components are at fault.

5. When handfree is plugged in, IO13ACCIN detect 0V. Then, IO3DATA_HP_SEL outputs high level, U8.1 pin connects to U8.4 pin and U10.1 pin connects to U10.4 pin. If not, maybe the U8 and U10 are at fault. Replace the U8 or U10.

6. After IO3DATA_HP_SEL outputs high level, measure the waveform of the U10.4 pin. If its voltage level doesn’t drop to 1 ~ 2.6V and the voltage of the U3.C6 pin isn’t equal to 0.5 ~ 1.3V, test

it again by another handfree. If handfree

is still no function, U9, R37, R38, R6 or R9 is at fault. Visually inspect the components. If any component isn’t contacted well or wrong, replace the components.

7. Measure the waveforms of U9.5, U9.1, U9.4 and U9.3 when handfree function is executed.

8. If any pin is no signal, replace the U9.

10.Datacable

no function

a) Components shift

4. Disassembly to visually inspect the J3. If audio jack (J3) pins don’t contact well with PCB pads, solder the pins and pads together.

5. Visually inspect the R72, R32, U9, U8, U10, R36, BL1, R41, C38, R38, R37, C37 and J4. If any component isn’t

contacted well, replace the components.

6. If they are not shifted, proceed to b

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b) Components are at fault.

7. Measure voltage level if VR3 and VR2B_SW voltage level are equal 2.9V.

8. When datacable is plugged in, IO13ACCIN detect 0V. Then, IO3DATA_HP_SEL outputs high level about 1 ~ 2 sec, and switches to low

level. U8.3 pin connects to U8.4 pin and

U10.3 pin connects to U10.4 pin. Check

if the U8.3 and U8.4 pins are short. If not, maybe the U8 is at fault. Replace the U8.

9. Check if the U10.3 and U10.4 pins are short. If not, maybe the U10 is at fault. Replace the U10.

10. After IO3DATA_HP_SEL outputs low level, measure the waveform of the U10.4 pin. If its voltage level isn’t equal to 2.7 ~ 2.9V, maybe U9 is at fault.

If U9

isn’t contacted well or wrong, replace the component.

11. Measure the voltage of the U3.C6. If it isn’t equal to 1.35 ~ 1.45V, maybe the R6 or R9 is at fault. Check their voltage value and replace the components.

12. If it is not at fault, proceed to c.

c) U1 is at fault

3. Measure the waveforms of U8.3 and U10.3 when datacable function is executed.

4. If any pin is no signal, maybe U1 is at fault then replace the U1.

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a) Components shift

Visually inspect the U2. If the pins of the

SIM socket is at fault, Disassembly to replace the U2.

5. Disassembly to visually inspect the R8, R7, C5, C8, R4, C4 and R13. If any component isn’t contacted well, replace the components.

6. If they are not shifted, proceed to b

b) Components are at fault.

8. Plug in the SIM card to power on the

handset and measure the voltage of the

TPSIM1. If it isn’t equal to 3V or 5V, check the R8 and replace it.

9. If R8 is ok but TPSIM1 is still no voltage, proceed to c.

10.

Measure the voltage of the TPSIM4 if it

goes to high about 3V or 5V. If not, check the R7 and replace it.

11. If R7 is ok but TPSIM4 is still no voltage, proceed to c.

12.

Measure the voltage of the TPSIM2 if it

output a clock about 3V or 5V. If not, check the R4 and replace it.

13. If R4 is ok but TPSIM4 is still no voltage, proceed to c.

14.

Measure the voltage of the TPSIM3 if it

goes to high about 3V or 5V. If not, proceed to c.

12. Can’t find SIM

c) U3 or U1 is at fault

4. If check the b steps and the TPSIM1, TPSIM2, TPSIM3 or TPSIM4 is still no signal, maybe the U3 or U1 is at fault.

5. Replace the U3 then re-check the step b.

6. If it is still no signal, replace the U1.

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13. Can’t charge

a) Battery or charger

is at fault

10. Use the correct battery and charger to check the charge function.

11.

If charging function is ok, the battery or

charger is illegal.

12. If it still can’t charge, proceed to b

b) Components shift

13. Disassembly to visually inspect the J1. If the pins of the power jack (J1) aren’t contacted well with the pads of the PCB, re-solder the pins.

14. Visually inspect the R60, C55, F1, R68, R62, R63, R65, C47, R70, R64, U16, U17, D1, R24, D15, C48, R66, R67 and U18. If any component isn’t contacted well, replace the components.

15.

Visually inspect the polarity of the U17,

D1 and D15. If any component is wrong, replace the component.

16. Check the F1. If it is open, replace the F1.

17. If they are not wrong, proceed to c

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c) Peripheral

components for charging are at fault.

9. Use dummy battery to check the charging function. JP1.4 connected to V+ (3.6V) of the power supply. JP1.1 connected to V- (GND) of the power supply. JP1.3 connected to a resistor (10K ohm) to ground. JP1.2 connected to a resistor (47 ohm) to 1.2V of the power supply.

10. Plugged in the charger then check the voltage of the CHARGERIN pin and U17.5 pin. If their voltage isn’t the same about 4~6V, R68 is at fault.

Replace the

R68.

11. Check the voltage of the U16.2 if it is under 0.6V. If not, check the resistor value of the R62 and R65. If anything is wrong, replace the components.

12. Check the voltage of the U16.5 if it is above 3V and the voltage of the U17.1 if it is under 0.6V. If not, maybe U16 is at fault. Replace the U16.

13. Check the voltages of the U17.2 and U17.4 if their voltages are above 4V. If not, maybe U17 is at fault. Replace the U17.

14. Check the voltage of the D1.2 if it is above 4V. If not, maybe D1 is at fault. Replace the D1.

15.

Measure the current flowing across the

R24. If not, maybe R24 is at fault. Replace the R24.

16. If they are not wrong, proceed to d

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d) U3 is at fault

3. When the charger is plugged in, the voltage of the VCHG pin is 4~6V. And when charging, the ICTL pin will high/low to control charging pulse.

4. If not, maybe U3 is at fault. Replace the U3.

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Replacement Parts

△ Exploded View

Fig 1. Mechanical Exploded View (I)

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Fig 2. Mechanical Exploded View (II)

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Fig 3. Mechanical Exploded View (III)

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△ Spare Parts List

No Part Number Description Q’ty

42.G2201.001

Cover LCD 1

60.G2206.001

Assy Case Upper 1

3 23.40051.022 Speaker 1 4 42.G2202.002 Keypad 1 5 55.G2201.001 Assy PCB 1 6 23.60019.021 Buzzer 1 7 23.46003.011 Vibrator 1 8 25.90020.002 Antenna 1

9 60.G2202.001 Assy Case Lower 1 10 86.00T03.2P1 Screw March 3.5L 6 11 60.G2203.011 Assy Battery Pack 1 12 56.07G17.031 LCD Module 1 13 42.G1703.001 Assy Holder LCD 1 14 34.G1701.002 Membrane Dial Pad 1 15 21.N0015.001 Lithium backup ba ttery 1 16 47.G1703.001 Cap MIC 1 17 23.42021.001 Microphone 1 18 62.10036.001 Headset Jack 1 19 62.10039.004 DC Power Jack 1 20 22.10128.006 SIM connector 1 21 21.N0009.022 Battery contact 1 22 69.50017.001 RF connector 1 23 21.N0020.001 Mic Holder 1

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Service Manual Feedback Form

To feedback any problem or omission to this manual

1. Highlight/Photocopy the page.

2. Fill in the information below.

3. Fax/Email this form to Customer Service Dep. of BenQ Inc. (FAX: +886-(0)2-26566396; E-Mail: PT_CS@api.com.tw)

Service Manual Type: Version: Requestor’s Name: Requestor’s address: Requestor’s Phone Number: Detail the problems or omission :( Specify the content, section,

page, diagram …etc)