Atmel SAM9G15-EK, SAM9G25-EK, SAM9G35-EK, SAM9X25-EK, SAM9X35-EK User guide

SAM9G15-EK SAM9G25-EK SAM9G35-EK SAM9X25-EK SAM9X35-EK

...................................................................................................................

User Guide

11115A–ATARM–27-Jul-11

1-2 Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

Section 1

Introduction.................................................................................................................1-1

1.1 Scope................................................................................................................................. 1-1

1.2 Applicable Documents ....................................................................................................... 1-2

Section 2

Kit Contents ................................................................................................................2-1

2.1 Deliverables ....................................................................................................................... 2-1

2.2 Evaluation Board Specifications......................................................................................... 2-2

2.3 Electrostatic Warning .........................................................................................................2-3

Section 3

Power Up....................................................................................................................3-1

3.1 Power Up the Board........................................................................................................... 3-1

3.2 DevStart ............................................................................................................................. 3-1

3.3 Recovery Procedure .......................................................................................................... 3-2

3.4 Sample Code and Technical Support ................................................................................ 3-2

Section 4

Evaluation Kit Hardware .............................................................................................4-1

4.1 Introduction ........................................................................................................................ 4-1

4.2 Computer Module (CM)...................................................................................................... 4-3

4.2.1 CM Board Overview ............................................................................................. 4-3

4.2.2 Equipment List ..................................................................................................... 4-3

4.2.3 Function Blocks ................................................................................................... 4-5

4.2.4 Configuration ..................................................................................................... 4-14

4.2.5 Connectors ........................................................................................................ 4-15

4.2.6 Schematics ........................................................................................................ 4-16

4.3 EK Board Description....................................................................................................... 4-21

4.3.1 EK Board Overview ........................................................................................... 4-21

4.3.2 Equipment List ................................................................................................... 4-22

4.3.3 Function Blocks ................................................................................................. 4-23

4.3.4 Configuration ..................................................................................................... 4-39

4.3.5 Connectors ........................................................................................................ 4-45

4.3.6 Schematics ........................................................................................................ 4-63

4.4 Optional Display Module (DM) Board Hardware .............................................................. 4-78

4.4.1 DM Board Overview ........................................................................................... 4-78

4.4.2 Equipment List ................................................................................................... 4-78

4.4.3 Function Blocks ................................................................................................. 4-78

Evaluation Kit (EK) User Guide i

11115A–ATARM–27-Jul-11

4.4.4 Schematics ........................................................................................................ 4-82

Section 5

Revision History..........................................................................................................5-1

5.1 Revision History ................................................................................................................. 5-1

ii Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

1.1 Scope

Section 1

Introduction

This User Guide introduces the Evaluation Kit and describes the development and debugging capabilities running on an AT91SAM9 ARM®-based Embedded MPUs as listed below:

 SAM9G15

 SAM9G25

 SAM9X25

 SAM9G35

 SAM9X35

The User Guide pertains to the following Evaluation Kit references:

 SAM9G15-EK

 SAM9G25-EK

 SAM9X25-EK

 SAM9G35-EK

 SAM9X35-EK

This User Guide gives design details on the Evaluation Kit and is made up of 5 sections:

 Section 1 includes a photo of the board, device and kit references and applicable documents.

 Section 2 describes the kit contents, its main features.

 Section 3 provides instructions to power up the Evaluation Kit and describes how to use it.

 Section 4 describes the CPU Module (CM), the Main Board (MB) and optional Display Module (DM).

Evaluation Kit (EK) User Guide 1-1

11115A–ATARM–27-Jul-11

Introduction

Figure 1-1. Board Photo (Display module is optional)

1.2 Applicable Documents

Table 1-1. Applicable Documents

Reference Title Comment

Atmel lit° 11052 Atmel lit° 11032 Atmel lit° 11054 Atmel lit° 11053 Atmel lit° 11055

http://www.atmel.com/products/at91/default.asp?category_id=163&family_id=605&source=global_nav

SAM9G15 datasheet SAM9G25 datasheet SAM9X25 datasheet SAM9G35 datasheet SAM9X35 datasheet

These documents provide technical support for each one of the

Atmel ARM-based Embedded MPU products supported by these

Evaluation Kits.

The datasheets can be found on www.atmel.com in the

SAM9G/SAM9X product families by means of the link below:

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11115A–ATARM–27-Jul-11

2.1 Deliverables

The Evaluation Kits include:

 Board

– One EK board

– One of the five available CPU modules (CM)

– One optional DM board featured in SAM9G15, SAM9G35, SAM9X35 kits only.

 Power supply

– Universal input AC/DC power supply with US, Europe and UK plug adapters

– One 3V Lithium Battery type CR1225

 Cables

– One serial RS232 cable

– One micro A/B-type USB cable

– One RJ45 crossed cable

 A Welcome Letter

Section 2

Kit Contents

SAM9G15-CM SAM9G35-CM SAM9X35-CM SAM9G25-CM SAM9X25-CM

Evaluation Kit (EK) User Guide 2-1

11115A–ATARM–27-Jul-11

Kit Contents

Figure 2-1. Unpacked Evaluation Kit

Unpack and inspect the kit carefully. Contact your local Atmel distributor, should there be issues concerning the contents of the kit.

2.2 Evaluation Board Specifications

Table 2-1. Evaluation Kit Specifications

Characteristics Specifications

Clock speed 400 MHz PCK, 133 MHz MCK

Ports Ethernet, USB, RS232, DBGU, JTAG, CAN, Audio, SD Card

Board supply voltage 5 VDC from connector

Temperature

- operating

- storage

Relative humidity 0 to 90% (non condensing)

Dimensions

EK (Evaluation Kit) CM (Computer Module) DM (Display Module)

-10° to +50° C

-40° to +85° C

165 mm x 135 mm

67.6 mm x 35 mm 135 mm x 80 mm

RoHS status Compliant

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2.3 Electrostatic Warning

The Evaluation Kit is shipped in a protective anti-static package. The board system must not be subjected to high electrostatic potentials. A grounding strap or similar ESD protective device should be worn when handling the board in hostile ESD environments (offices with synthetic carpet, for example). Avoid touching the component pins or any other metallic element on the board.

Kit Contents

Evaluation Kit (EK) User Guide 2-3

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3.1 Power Up the Board

Unpack the board taking care to avoid electrostatic discharge. Unpack the power supply, select the right power plug adapter corresponding to that of your country, and insert it in the power supply.

Connect the power supply DC connector to the board and plug the power supply to an AC power plug.

The board LCD should light up and display a welcome page. Then, click or touch icons displayed on the screen and enjoy the demo.

3.2 DevStart

The on-board NAND Flash contains an installation guide named: “SAM9x5-EK DevStart”.

It is stored in the “SAM9x5-EK DevStart” folder on the USB Flash disk available when the Evaluation Kit is connected to a host computer.

Click the file “welcome.html” in this folder to launch the SAM9x5-EK DevStart.

Section 3

Power Up

DevStart guides the user through the installation processes of IAR™ EWARM, Keil™ MDK and GNU toolkits. Then, it gives step-by-step instructions on how to rebuild a single example project and how to program it into the Evaluation Kit. Optionally, if the user has a SAM-ICE™ interface, instructions are also given about how to debug the code.

It is strongly recommended that users backup the “SAM9x5-EK DevStart” folder on their computer before launching it.

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Power Up

3.3 Recovery Procedure

The DevStart ends by giving step-by-step instructions on how to recover the Evaluation Kit to the state as it was when shipped by Atmel.

Follow the instructions if contents of the NAND Flash or the SPI DataFlash®have been deleted, in order to recover from this situation.

3.4 Sample Code and Technical Support

After boot up, designers can run sample code or their own application, on the development kit. Users can download sample code and get technical support from the Atmel web site:

http://www.atmel.com/products/at91/default.asp?category_id=163&family_id=605&source=global_nav

Figure 3-1. Atmel Web Site

Note: Different interfaces on the EK boards share the same connections to the CPU module. Therefore the actual

usage depends on the CPU module featured in the evaluation kit.

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4.1 Introduction

The Evaluation Kit is a fully-featured evaluation platform for the Atmel MPU. The Evaluation Kit enables users to extensively evaluate, prototype and create application-specific designs.

The Evaluation Kit is a new platform architecture based on a Main Board (MB), a CPU Module (CM) equipped with one of the five processors and an optional Display Module (DM).

The Evaluation Kit consists of three boards:

1. The CPU Module (CM) board, is a single-board computer that integrates all the core components and is mounted onto an application-specific carrier board (EK board). The CPU Module has specified pinouts based on the SODIMM200 connector. It provides the functional requirements for an embedded application. These functions include, but are not limited to, graphics, audio, mass storage, network and multiple serial and USB ports. A single SODIMM200 connector provides an interface for the carrier board to carry all the I/O signals to and from the CPU Module.

2. The Evaluation Kit board (EK Main Board) provides all the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a densely packed solution, which results in a more reliable product while simplifying system integration.

3. The optional Display Module (DM) board integrates LCD, TouchScreen and Qtouch®technology.

Section 4

Evaluation Kit Hardware

Table 4-1, on the page that follows, lists the features provided on the Evaluation Kit:

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11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

Table 4-1. Evaluation Kit Features

Supported modules SAM9 products

Expansion Slot SO-DIMM200

Processor options

LAN

USART/UART

CAN CAN interface Shared interface

USB

SMD Software Modem Device X X X X X

Memory Card Support

MII/RMII Ethernet 10/100 w/PHY and three Led status

RMII Ethernet 10/100 w/PHY and three Led status

RS232 four wires/RS485 Shared interface

SAM9

G15

ETH0 X X X X

ETH1 X

COM0 X X X X X

SAM9

G25

SAM9

G35

SAM9

X25

SAM9

X35

RS232 four wires COM3 X X

RS232 two wires DBGU X X X X X

CAN0 X X

CAN1 X X

2 * USB 2.0 Host X X X X X

1 * USB 2.0 Host/Device X X X X X

µSD Card Slot Onboard

MMC/MMC+/SD/SDIO/CE-ATA

HSMCI

0

HSMCI

1

XXXXX

ISI X

LCD + Touch Screen 24-bit Output Mode X X X

ZigBee

®

XXXXX

SPI XXXXX

TWI XXXXX

DEBUG JTAG Test Access Port X X X X X

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4.2 Computer Module (CM)

4.2.1 CM Board Overview

The CM board is the CPU module at the heart of the system. It connects to the EK board through a SODIMM200 interface. It carries the processor and external memories. The CM board serves as a minimal CPU sub-system. All five processors:SAM9G15, SAM9G25, SAM9X25,SAM9G35 and SAM9X35 share the same CM circuitry with minor configuration settings.

Note: There are three CM boards from three different manufacturers. The five processors are

implemented as shown in Table 4-2 below:

Table 4-2. CM Board Implementation

Evaluation Kit Hardware

Manufacturer &

Module kind

mfg 1 x x

mfg 2 x x

mfg3xxxxx

The three CM boards share the same circuitry design but with different designator information and PCB layouts. The circuitry reference in this guide, for common design parts, refers to schematics from SAM9G25-CM (mfg 3). All the other schematics are provided in

Figure 4-1. Board Architecture

SAM9G15-CM SAM9G25-CM SAM9G35-CM SAM9X25-CM SAM9X35-CM

Section 4.2.6 ”Schematics”.

4.2.2 Equipment List

The CM board is built around the integration of an ARM926-based microcontroller (BGA217 package) with external memory and optional Ethernet PHYsical Layer Transceiver.

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Evaluation Kit Hardware

4.2.2.1 Devices

Following is the list of the CM board components:

 One SAM9 Embedded MPU from the list below

– SAM9G15

– SAM9G25

– SAM9G35

– SAM9X25

– SAM9X35

 12 MHz crystal

 32.768 KHz crystal

 1 Gbit DDR2 memory

 2 Gits NAND Flash memory with Chip Selection control switch

 32 Mbits SPI Serial DataFlash with Chip Selection control switch

 512 Kbits EEPROM

 1 Kbyte 1-Wire EEPROM

 On-board power regulation

 Two user LEDs

 Optional PHY

4.2.2.2 Interface Connection

 SODIMM200 card edge interface

4.2.2.3 Configuration Items

 Dual ON/OFF switch for NAND Flash and SPI DataFlash Chip Select connection

Figure 4-2. CM Board Layout Commented

DDR2 SDRAM

NAND Flash

Sodimm200 card edge

SAM9 chip

PHY

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4.2.3 Function Blocks

4.2.3.1 Processor

The CM Board is equipped with an Atmel ARM-based embedded MPU, as listed below, in a 217-ball BGA package. The five devices share an identical footprint. All five share the same CM Board PCB with minor configuration differences.

The five devices are:

 SAM9G15

 SAM9G25

 SAM9G35

 SAM9X25

 SAM9X35

As different interfaces can be defined using the same pins, it depends on the actual configuration of the CPU as to which functions are in fact available to the EK board.

Refer to Section 4.2.4.1 ”Chip Identification” for details. The processor runs at a nominal frequency of 400 MHz for the core and 133 MHz for the system bus.

The peripheral configuration possibilities and implementation requirements of the CM are dependent on the module's chipset. Two configuration resistors are implemented on board in order to select the mode of configuration.

Evaluation Kit Hardware

4.2.3.2 Clock Circuitry

The CM includes 3 clock sources:

 Two are alternatives for the processor main clock

 One crystal and one crystal oscillator are used for the Ethernet MII/RMII chip

Table 4-3. Main Components Associated with the Clock Systems

Quantity Description Component assignment

4.2.3.3 Reset Circuitry

The reset sources for the CM board are:

 Power on reset

 Push button reset (Push button is equipped on EK board)

 JTAG reset from an in-circuit emulator (JTAG interface is equipped on EK board)

1 Crystal for Internal Clock, 12 MHz Y1

1 Crystal for RTC Clock, 32.768 kHz Y2

1 Oscillator for Ethernet Clock RMII, 50 MHz Y3

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Evaluation Kit Hardware

4.2.3.4 Power Supplies

The CM Board is driven by +3V3 input power rail from the EK board through the SODIMM200 connector. The CM Board embeds all the necessary power rails required for the micro processor.

When additional voltages are required, for example VDDCORE, they are generated on board from the

3.3V supply. The detailed power supply requirements for any given module are specified within the cor-

responding product documentation. The following table summarizes the power specifications.

Table 4-4. Power Rails Associated with the Systems

Nominal Name Powers Component

3.3v VDDNF

3.3v VDDIOP0 Partial Peripheral I/O lines From SODIMM200 connector

3.3v VDDIOP1 Partial Peripheral I/O lines From SODIMM200 connector

3.0v VDDBU

3.3v VDDUTMII the USB device and host UTMI+ interface From SODIMM200 connector

3.3v VDDOSC the Main Oscillator cells From SODIMM200 connector

3.3v VDDANA the Analog to Digital Converter From SODIMM200 connector

1.8v VDDIOM the External Memory Interface I/O lines on-board

1.0v VDDUTMIC DC Supply UDPHS and UHPHS UTMI+ Core on-board

3.3v VDDPLLUTMI

1.0v VDDPLLA the PLLA cell on-board

1.0v VDDCORE

3.0V or 3.3V configurable

ADVREF ADC Reference voltage From SODIMM200 connector

the NAND Flash I/O and control, D16-D32 and multiplexed SMC lines

the Slow Clock oscillator, the internal 32 kHz RC, the internal 12 MHz RC and a part of the System Controller

DC Supply UDPHS and UHPHS UTMI+ Interface

the core, including the processor, the embedded memories and the peripherals

From SODIMM200 connector

on-board

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Figure 4-3. CM Power Supply

+3V3 MN3

4

C10

4.7uF

1

PWR_EN

AS1301EHT-adj

IN

GND

EN

2

LX

FB

3

2.2uH 3D 16

5

Evaluation Kit Hardware

L2

C7 C11 22pF

R2

39.2K 1%

R4 59K 1%

C12 10uF

C3

4.7uF

C6 100nF

100nF

C8 100nF

VDDCORE

PWR_EN

C1

4.7uF

MN1 AS1301EHT-adj

4

IN

1

EN

L1

3

LX

2.2uH 3D 16

R1

C9

118K 1%

5

GND

FB

2

120 OHM@100MHZ

22pF

R3 59K 1%

B2

21

C38 100nF

C41 100nF

C2 10uF

L5 10uH/150m A

L6 10uH/150m A

C39

4.7uF

C43

4.7uF

C4 100nF

R22

1R

R25

1R

C5 100nF

C13 100nF

C14 100nF

C15 100nF

C40 100nF

C42 100nF

VDDIOM

VDDNF

VDDUTMII

VDDOSC

C27 100nF

L4 10uH/150m A

L3

10uH/150m A

C34

4.7uF

C28

4.7uF

R17

1R

R10

1R

C25

100nF

C33 100nF

C30 100nF

C26 100nF

VDDPLLA

VDDUTMIC

VDDAN A

ADVREF

C35 100nF

VDDI OP0

C20 100nF

C21

100nF

C17 1uF

VDDBU

VDDIOP1

PWR_EN

C36 1uF

C23 100nF

MN4 TPS71710DCK

IN1OUT

GND

EN3NR

2

C37 100nF

5

4

ADVREF

VDDBU

VDDI OP0

VDDI OP1

C18 10nF

+1V

C16 1uF

C32 100nF

VDDANA

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Evaluation Kit Hardware

4.2.3.5 Memory

The Device serial processor features a DDR/SDR memory interface and an External Bus Interface (EBI) to enable interfacing to a wide range of external memories and to almost any kind of parallel peripheral.

The External Bus Interface (EBI) is connected to two kinds of memory devices:

 One 1 Gbyte DDR2 SDRAM

 One 2 Gbytes (or 4 Gbytes depending on supplier) NAND Flash

4-8 Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

Figure 4-4. CM Board External Memory

C50 100nF

C52 100nF

C48 100nF

C49 100nF

J1

VDD

VDDL

CKEK2CKJ8CK

K8

DDR2_SDCK

DDR2_NSDCK

A9

C1

VDDQ

C51 100nF

VDDQC3VDDQC7VDDQ

VDDQ

CS

L8

DDR2_NCS1

DDR2_D9

DDR 2_D12

DDR 2_D11

DDR 2_D10

DDR 2_D14

DDR2_D2

DDR2_D1

DDR2_D0

DDR2_D3

DDR2_D4

DDR2_D5

DDR2_D6

DDR2_D7

F9

DQ0G8DQ1G2DQ2H7DQ3H3DQ4H1DQ5H9DQ6F1DQ7

DDR2 SDRAM

MT47H64M16HR

A0M8A1M3A2M7A3N2A4N8A5N3A6N7A7P2A8P8A9P3A10M2BA0L2ODT

MN5

EBI_A3

EBI_A4

EBI_A5

EBI_A6

EBI_A7

EBI_A8

EBI_A2

EBI_A9

DDR2_D8

EBI_A10

C2

DQ8C8DQ9

EBI_A11

DDR 2_D13

DQ10D7DQ11D3DQ12D1DQ13D9DQ14B1DQ15

A11P7BA1

A12R2BA2

EBI_SDA10

EBI_A13

EBI_A14

EBI_A16

B9

L3

DDR 2_D15

EBI_A17

L1

EBI_A18

VDDI OM

C44 100nF

C47 100nF

C45 100nF

C46 100nF

M9

E1

A1

R1

VDDJ9VDD

VDD

K9

DDR2_SDCKE

C53 100nF

C9

C54 100nF

C56 100nF

C55 100nF

E9

VDDQ

VDDQG1VDDQG7VDDQ

CASL7RASK7WE

DDR2_RAS

DDR2_CAS

G3

C57 100nF

VDDQ

K3

DDR2_SDWE

C58 100nF

G9

C59 100nF

Evaluation Kit Hardware

C66

100nF

C60

100nF

C65

12

37

VCC

N.C811N.C710N.C914N.C10

100nF

34

39

36

13

25

48

VSS

VSS_N.C

N.C1223N.C13

VSS_N.C

DNU121DNU2

N.C14

DNU3

MT29F2G08AAD

22

24

35

38

NANDCS

NANDCLE

NANDALE

NANDWE

NANDOE

NANDR_B

VCC_N .C

N.C11

20

15

DDR2 SDRAM

DDR_VREF

J2

E3

VSSA3VSS

VREF

UDQSB7UDQS

A8

DDR2_DQS1

B2

J3

N1

P9

VSS

VSSQA7VSSQB8VSSQH2VSSQ

UDM

LDQSE8LDQS

F3

B3

F7

DDR2_DQM1

DDR2_DQM0

DDR2_DQS0

VSSQ

LDM

D2

VSSQD8VSSQE7VSSQF2VSSQ

VSSQ

F8

RFU1A2RFU2

RFU3

E2

R3

H8

J7

VSSDL

RFU4R7RFU5

R8

EBI_A15

NAND_FSH_D2

NAND_FSH_D6

NAND_FSH_D3

NAND_FSH_D4

NAND_FSH_D5

NAND_FSH_D1

NAND_FSH_D0

29

I/O0

I/O130I/O332I/O2

MN1 1

ALE

CLE

17

16

CLE

ALE

R40 0R

R43 0R

PD3

PD2

NAND_FSH_D7

31

41

I/O744I/O643I/O542I/O4

WE

CE9RE

R/B

8

7

18

19

WP

CEWERE

RB

R47 470K

R42 0R

R44 0R

R41 0R

R46 470K

R48 470K

PD0

PD1

PD5

NAND FLASH

28

33

45

40

27

I/O8_N.C26I/O9_N.C

I/O10_N .C

I/O11_N .C

I/O12_N .C

WP

N.C11N.C22N.C33N.C4

5

4

R49

DNP

I/O15_N .C47I/O14_N .C46I/O13_N .C

N.C5

6

VDDNF

N.C6

DDR2_D1

DDR2_D0

DDR2_D5

DDR2_D4

DDR2_D3

DDR2_D2

DDR2_D6

RR1B

RR1A

RR2C

RR1D

RR2A

RR1C

2 7

EBI_D0

SAM9x5_LBGA217 - EBI

MN2 F

RR2B

1 8

3 6

4 5

1 8

3 6

2 7

EBI_D1

EBI_D3

EBI_D2

EBI_D5

EBI_D4

EBI_D6

EBI_D2

EBI_D3

EBI_D4

EBI_D5

EBI_D0

EBI_D1

D14D1D15D2A16D3B16D4A17D5B15D6C14D7B14D8A15D9C15

D0

VDDNF

R34

1.5K 1%

DDR2_D9

DDR2_D8

DDR2_D7

RR2D

4 5

EBI_D7

EBI_D6

DDR2_D13

DDR2_D12

DDR2_D11

DDR2_D10

DDR2_D15

DDR2_D14

EBI_A11

F15

DDR2_SDCK

R36 27R

EBI_SDC K

D17

A11

A12

DDR2_NSDCK

R37 27R

EBI_NSDCK

EBI_A13

C17

EBI_A14

E16

A13

A14

EBI_A15

D16

A15

DDR2_NCS1

R38 27R

EBI_NCS1_SDCS

EBI_A16

C16

A16/BA0

EBI_A17

B17

EBI_A18

E15

A17/BA1

A18/BA2

E14

A19

EBI_DQM0

A10

C62

104

R33

1R

L7

10uH

150mA

C61

4.7uF

VDDIOM

EBI_DQS0

EBI_DQM1

EBI_DQS1

EBI_RAS

EBI_SDW E

EBI_CAS

A9

A11

B10

B11

C10

A12

RAS

CAS

DQS1

DQS0

DQM1

DQM0

DDR2_DQS1

EBI_A4

R29 27R

EBI_DQS1

EBI_A5

EBI_A6

DDR2_RAS

R30 27R

EBI_RAS

DDR2_CAS

R31 27R

EBI_CAS

EBI_A7

EBI_A8

DDR2_SDWE

R32 27R

EBI_SDW E

EBI_A9

R35 27R

EBI_SDC KE

EBI_A10

G14

A10

DDR2_DQM1

DDR2_DQM0

DDR2_DQS0

RR3A

RR3D

RR4B

4 5

2 7

EBI_D9

EBI_D8

EBI_D7

EBI_D8

RR4C

RR4A

RR3B

RR3C

RR4D

1 8

3 6

1 8

2 7

3 6

4 5

EBI_D13

EBI_D12

EBI_D11

EBI_D10

EBI_D15

EBI_D14

EBI_D9

EBI_D11

EBI_D10

EBI_D14

EBI_D12

EBI_D13

D12

C13

A14

B13

A13

D10

D11

D12

D13

D14

R26 27R

EBI_DQM0

EBI_D15

C12

J15

H16

D15

A0/NBS0

R28 27R

R27 27R

EBI_DQM1

EBI_DQS0

EBI_A2

EBI_A3

H15A3H17A4G17A5G16A6F17A7E17A8F16A9G15

A2

A1/NBS2/ DQM2/NWR2

DDR2_SDCKE

SDWE

EBI_SDC KE

B12

R39

1.5K 1%

ON

C64

104

1

SW1A

SWITCH -2-1.27mm

C63

4.7uF

NCS0

EBI_SDC K

EBI_NSD CK

EBI_SDA10

EBI_NCS1_SDCS

A8

C11

C8

D11

SDCK

SDA10

SDCKE

C7

D9

C9

B9

B8

NWR 1/NBS1

NWR0/NWRE

NRD

NWR 3/NBS3/DQM3

NCS0

#SDCK

NCS1/ SDCS

1 4

PD4

(NAND OE)

PD0

P13

SAM9x5_LBGA217 - PIOD

MN2 E

NAND_FSH_D1

NAND_FSH_D0

NAND_FSH_D3

NAND_FSH_D2

NAND_FSH_D6

NAND_FSH_D5

NAND_FSH_D4

NAND_FSH_D7

RR16A

RR16B

RR16C

RR17A

RR17B

1 8

2 7

PD7

PD6

PD[5..21] {3,5}

(NAND CS)

(NAND CLE)

(NAND WE)

(NAND ALE)

PD5

PD4

PD6

PD1

PD3

PD2

N14

P14

R14

P15

R13

P12

PD6/D 16

PD4/N CS3

PD5/N WAIT

PD0/N ANDOE

PD1/N ANDWE

PD2/A21/ NANDALE

PD3/A22/ NANDCLE

RR16D

RR17C

RR17D

1 8

2 7

3 6

4 5

PD9

PD8

PD12

PD11

PD10

PD7

PD9

PD8

PD10

PD11

R15

M14

N16

N17

N15

PD7/D 17

PD8/D 18

PD9/D 19

PD10/D 20

PD11/D 21

4 5

PD13

PD12

K15

R50 0R

R51 0R

R55 0R

R52 0R

R53 0R

R54 0R

(NANDCS)

(NANDCLE)

(NANDWE)

(NAND OE)

(NANDALE)

(NANDR/B)

PD6

PD3

PD4

PD1

PD0

PD2

PD13

PD15

PD14

PD19

PD18

PD17

PD16

PD20

PD21

M16

L16

L15

K17

J17

K16

PD16/D 26/A23

PD17/D 27/A24

PD18/D 28/A25

J16

PD19/D 29/NCS2

PD20/D 30/NCS4

PD21/D 31/NCS5

M15

L14

PD12/D 22

PD13/D 23

PD14/D 24

PD15/D 25/A20

Evaluation Kit (EK) User Guide 4-9

11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

4.2.3.6 Serial Peripheral Interface (SPI) Controller

The serial processor provides two high-speed Serial Peripheral Interface (SPI) controllers. One port is used to interface with the on-board serial DataFlash

Figure 4-5. SPI

PA14

4.2.3.7 Two Wire Interface (TWI)

The serial processor has a full speed (400 kHz) master/slave TWI Serial Controller. The controller is mostly compatible with industry standard I2C and SMBus Interfaces. This port is used to interface with the on-board Serial EEPROM, ISI, QTouch device and audio codec interface.

Figure 4-6. TWI

SW1B SWITCH -2-1.27mm

2 3

ON

2

PA12 PA11 PA13

(SPI0_MOSI) (SPI0_MIS0) (SPI0_SPCK)

(SPI0_NPC S0)

VDDI OP0

®

.

VDDI OP0

R56

470K

MN7

AT25DF321 R57 0R R58 0R R59 0R

VDDI OP0 VDDIOP0

5 2 6

1

SI SO SCK

CS

VCC

WP

HOLD

GND

VDDIOP0

8

3 7

4

C69 100nF

4.2.3.8 1-Wire EEPROM

The Evaluation Kit uses a 1-Wire device as “firmware label” to store the information such as chip type, manufacturer’s name, production date etc.

Figure 4-7. 1-Wire Device

PA31 PA30

PB18

(TWCKO) (TWDO)

R61

4.7K

VDDI OP0 R64

R66 0R

C70

100nF

R62

4.7K

VDDAN A

6 5

8

4

MN8 AT24C512BN-SH25-B

MN9 DS2431P+

2

IO

WP

A0 A1 A3

R65

1.5K

SCL SDA

VCC

GND

1 2 3

7

NC1 NC2 NC3

GND

NC4

1

R63

10K

DNP

3 4 5 6

4-10 Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

4.2.3.9 Optional PHY

Some of the device modules provide a location for a 10/100 Ethernet MAC/PHY interface.

For more information about the Ethernet controller device, refer to the Davicom DM9161 controller manufacturer's datasheet.

Evaluation Kit Hardware

Evaluation Kit (EK) User Guide 4-11

11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

Figure 4-8. Ethernet

PB[0.. 18]

PB6

PB5

PB8

E0_MDIO

E0_MDC

E0_INTR

1 8

2 7

RR15A

RR14A

RR14B

VDDAN A

NRST

R99 0R

10KX4

RR7

RR8

1 2 3 4 5

R91 DNP R92 4.7K R93 10K

R94 10K

R95 DNP

C80 100nF

C81 100nF

8 7 6

VDDAN A

R86 1.5K

PB3

PB1

PB0

PB2

E0_RX0

E0_RX1

E0_RXDV

E0_RXER

4 5

2 7

3 6

RR15C

3 6

RR14D

RR15B

RR14C

TP27

SMD

PB4

PB10

PB9

PB7

E0_TX0

E0_TX1

E0_TXEN

E0_TXCK

R73 22R

2 7

4 5

3 6

RR13B

RR13D

RR13C

R74 22R

DNP to remain

single PHY

connection on

EK board

VSS OUT

32

100nF

Y3

OE

50MHz

R70

10K

VDD

41

VDDAN A

C71

VDDAN A

40

15

33

VDDANA

+

C82

10uF

R100

0R

GND_ETH

RESET

N.C

45

PWRD WN10DGND

CABLESTS/LIN KSTS

DGND44DGND

LED2/OP213LED1/OP112LED0/OP0

14

LEDMODE

BGRES

31

11

1 2 3 4 5

23

DVDD

DVDD30DVDD

BGRESG

48

R97

6.8K

R98

10K

8 7 6

RR9

10KX4

41

47

R96 0RC79 100nF

GND_ETH

32

24

DM9161AEP

AVDDT

C74 100nF

+

C75

10uF

+

C76

10uF

49.9R 1%

38

TX_ER/TXD416COL/R MII36MDC

CRS/ PHYAD435MDI O25MDI NTR

2

RX_CLK/10BTSER34RX_DV/TESTMODE37RX_ER/RXD4/RPTR

AVDDR1AVDDR

RX-

4

C73 100nF

BLM21BD222TN1

AVDDTB1

TP28

SMD

R83

R84

39

DISMDIX

AVDDT

AGND5AGND

AGND

9

6

46

C77 100nF

VDDAN A

C78

100nF

RXD0/PHYAD029RXD1/PHYAD128RXD2/PHYAD227RXD3/PHYAD3

RX+

3

22

26

TX_EN

TX-

8

21

TXD317TXD218TXD020TXD119TX_CLK/I SOLATE

TX+7XT1

42

MN1 0

REF_CLK/XT2

43

49.9R 1%

R71

C72 100nF

R72

49.9R 1%

GND_ETH

ETH0_RX+

LED0

LED1

LED2

ETH0_RX-

ETH0_TX+

ETH0_TX-

4-12 Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

4.2.3.10 SODIMM200 Interface

The CM board uses SODIMM200 card edge connector to interface with the EK board.

Figure 4-9. SODIMM200 Interface on CM Board

+3V3

C83

VDDI OP0

VDDI OP1

HHSD PC HHSDMC

HHSDMB HHSD PB

DIBP DIBN

HHSDMA HHSD PA

NANDOE NAND ALE NANDCS NANDR_B

ETH0_TX+ ETH0_TXETH0_RX+ ETH0_RX-

PD8

PD10 PD12 PD14 PD16 PD18 PD20

PA0 PA2 PA4 PA11 PA13

PA8 PA22 PA31

PA16 PA18 PA20 PA5 PA10

PA25 PA27 PA29

PC0 PC2 PC4

PC7 PC9 PC11 PC12 PC14

PC17 PC19 PC21 PC22 PC24 PC26

PC29 PC31

PB0 PB2 PB4 PB6 PB8 PB9 PB11 PB13 PB15 PB17 PB18

10uF

VDDNF

VDDANA

J1

VCC_3V31VCC_3V3 VCC_3V33VCC_3V3

5

GND USBC_D P7JTAGSEL USBC_D M9WKUP

11

GND

13

USBB_DM

15

USBB_DP

17

GND

19

DIBP

21

DIBN

23

GND

25

USBA_DM

27

USBA_DP

29

GND

31

RFU1

33

RFU3

35

RFU5

37

RFU7

39

RFU9

41

GND

43

RFU11

45

RFU13

47

RFU15

49

RFU17

51

GND

53

RFU19

55

RFU21

57

RFU23

59

RFU25

61

VDDNF

63

PD0

65

PD2

67

PD4

69

PD6

71

PD8

73

NC

75

PD10

77

PD12

79

PD14

81

PD16

83

PD18

85

PD20 VDDIOP087VDDIOP0

89

PA0

91

PA2

93

PA4

95

PA11

97

PA13

99

GND

101

PA8

103

PA22

105

PA31

107

GND

109

PA16

111

PA18

113

PA20

115

PA5

117

PA10

119

GND

121

PA25

123

PA27

125

PA29

127

VDDIOP1

129

PC0

131

PC2

133

PC4

135

GND

137

PC7

139

PC9

141

PC11

143

PC12

145

PC14

147

GND

149

PC17

151

PC19

153

PC21

155

PC22

157

PC24

159

PC26

161

GND

163

PC29

165

PC31

167

VDDANA

169

PB0

171

PB2

173

PB4

175

PB6

177

PB8

179

PB9

181

PB11

183

PB13

185

PB15

187

PB17

189

PB18

191

GND

193

ETH0_TX+

195

ETH0_TX-

197

ETH0_RX+

199

ETH0_RX-

PIO 200-pin SODI MM

VBAT

SHDN

BMS

nRST

nTRST

TCK TMS

TDO

RTCK

PWR_EN

RFU2 RFU4 RFU6 RFU8

RFU10

GND RFU12 RFU14 RFU16 RFU18

GND RFU20 RFU22 RFU24 RFU26

VDDNF

PD1 PD3 PD5 PD7 PD9

GND

PD11 PD13 PD15 PD17 PD19 PD21

PA1

PA3 GND PA12 PA14

PA7 PA21 PA23 PA30 PA15 PA17 PA19 GND

PA6

PA9 PA24 PA26 PA28 GND

VDDIOP1

PC1

PC3

PC5

PC6

PC8

PC10

GND

PC13 PC15 PC16 PC18 PC20

GND

PC23 PC25 PC27 PC28 PC30

SELCONFIG0

VDDANA

PB1

PB3

PB5

PB7

GNDANA

PB10 PB12 PB14 PB16

GNDANA

ADVREF

LED0 LED1 LED2

AVDDT

GND_ETH

Evaluation Kit Hardware

VDDBU

VDDNF

VDDANA

GND_ETH

C84 1uF

PD5 PD7 PD9

PD11 PD13 PD15 PD17 PD19 PD21

PA1 PA3

PA12 PA14 PA7 PA21 PA23 PA30 PA15 PA17 PA19

PA6 PA9 PA24 PA26 PA28

PC1 PC3 PC5 PC6 PC8 PC10

PC13 PC15 PC16 PC18 PC20

PC23 PC25 PC27 PC28 PC30

PB1 PB3 PB5 PB7

PB10 PB12 PB14 PB16

AVDDT

C85

4.7uF

JTAGSEL WKUP SHDN BMS NRST NTRST TDI TCK TMS TDO RTCK PWR_EN

NANDWE NANDCLE

VDDI OP0

VDDI OP1

ADVREF

LED0 LED1 LED2

C86

4.7uF

C87

4.7uF

+3V3

R101

DNP

R102

0R

C88

1uF

R101 only if G15, G35, X35

R102 only if G25, X25

+3V3

2 4 6 8 10 12 14 16 18 20

TDI

22 24 26 28 30 32 34 36 38 40

42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 102 104 106 108 110 112 114 116 118 120 122 124 126 128 130 132 134 136 138 140 142 144 146 148 150 152 154 156 158 160 162 164 166 168 170 172 174 176 178 180 182 184 186 188 190 192 194 196 198 200

Evaluation Kit (EK) User Guide 4-13

11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

4.2.4 Configuration

4.2.4.1 Chip Identification

The CM board may be equipped with any of the five processors, all sharing an identical BGA217 footprint. There are two resistors on the CM board for the purpose of identifying which of the five is the one actually mounted.

The tables below show in detail how the CM board, relative to different processors, determines the dedicated “SELCONFIG” logic.

Table 4-5. Resistor Identification

Resistor SAM9G15 SAM9G25 SAM9G35 SAM9X25 SAM9X35

R49 Populated Not Populated

R50 Not Populated Populated

R87 Populated Populated

R88 Not Populated Not Populated

R101 Populated Not Populated Populated Not Populated Populated

R102 Not Populated Populated Not Populated Populated Not Populated

Table 4-6. Module Configuration Identification

SAM9G15

module

R101 Populated Populated Populated Not Populated Not Populated

CM

Setting

EK

Setting

DM

Setting

R102 Not Populated Not Populated Not Populated Populated Populated

SELCONFIG

(SODIMM200

pin 166)

USART3 Not Selected Not Selected Not Selected Selected Selected

ETH1 Not Selected Not Selected Not Selected Not Selected Selected

LCD Selected Selected Selected Not Selected Not Selected

High High High Low Low

SAM9G35

module

SAM9X35

module

SAM9G25

module

SAM9X25

module

4-14 Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

4.2.4.2 Boot Configuration

In order to use SAM-BA boot, the NAND Flash and SPI DataFlash must be deselected. SW1 is dedicated to this purpose.

Table 4-7. Boot Configuration

4.2.5 Connectors

Figure 4-10. CM Board Dimensions

Evaluation Kit Hardware

Designation Default Setting Feature

SW1 (1, 4) ON Set to OFF disables the NAND flash

SW1 (2, 3) ON Set to OFF disables the SPI DataFlash

Evaluation Kit (EK) User Guide 4-15

11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

4.2.6 Schematics

Figure 4-11. CM Board Schematics – 1of 5

15Thursday,November 04,2010Zhu Xueliang

SMD

TP3

NTRST

SMD

TP4

TDI

SMD

TP5

TMS

SMD

TP6

TP8

TP9

TCK

RTCK

TDO

SMD

TP13

TP10

TP12

NRST

WKUP

SHDN

15Thursday,November 04,2010Zhu Xueliang

1

J10

H10

H9

K10

H8

GNDIOM

GNDIOMJ9GNDIOM

GNDIOM

GNDCOREJ8GNDCORE

GNDCORE

VDDIOM

VDDCOREK9VDDCOREK8VDDCORE

SAM9X5_LBGA217 - POWER

MN2A

H14

C8

C7

2

3

C6

TP1

SMD

TP1

SMD

L2

2.2uH 3D16L22.2uH 3D16

3

LX

IN4EN

MN3

AS1301EHT-adj

MN3

AS1301EHT-adj

SMD

TP2

4

VDDIOM+3V3 VDDCORE+3V 3

100nFC8100nF

100nFC7100nF

100nFC6100nF

C3

C12

R2

C11

C10

C2

R1

C9

F14

D13

D10

C15

100nF

C14

100nF

C13

100nF

VDDIOM

4.7uFC34.7uF

10uF

39.2K 1%R239.2K 1%

22pF

VDDNF

B2

+3V3

R4

59K 1%R459K 1%

5

FB

GND

2

1

4.7uF

R6

DNPR6DNP

+3V3

10uFC210uF

118K 1%R1118K 1%

R3

59K 1%R359K 1%

22pFC922pF

M4

P6

GNDIOP

VDDNF

J14

K14

21

VDDIOP 0P7VDDIOP 1

C5

100nFC5100nF

C4

100nFC4100nF

VDDIOP0

120 OHM@100MHZB2120 OHM@100MHZ

C16

1uF

C18

10nF

4

5

NR

OUT

GND

2

IN

EN

MN4

TPS71710DCK

MN4

TPS71710DCK

1

3

PWR_EN

C17

1uF

+3V3 +1V

C19 20pFC19 20pF

1234

T12

XIN

T16

D6

GNDANA

GNDUTMI

C26

100nF

C25

100nF

R101RR10

10uH/150mAL310uH/150mA

C24

1R

C27

100nF

20pF

12

A6

XIN32

VDDUTMIC

VDDPLLA

T17

R12

C33

100nF

C30

100nF

+1V

R171RR17

1R

C34

C28

4.7uF

L4

VDDIOP0

C29 20pFC29 20pF

VDDBU

Y2 32.768 kHzY2 32.768 kHz

A5

XOUT32

C34

4.7uF

10uH/150mAL410uH/150mA

C32

100nF

+1V

NTRST {5}

TDI {5}

JTAGSEL {5}

R15

100K

R15

100K

R14

100K

R14

100K

R13

100K

R13

100K

R12

DNP

R12

DNP

NTRST

TDI

D7

T11

T9

TDI

NTRST

JTAGSEL

VDDANA

C6

H4

C23

100nF

VDDIOP1

C21

100nF

C20

100nF

L3

VDDANA

Y1

12MHzY112MHz

C22 20pFC22 20pF

U12

XOUT

B6

GNDBU

ADVREF

A4

C35

100nF

ADVREF

TP7

SMD

TP7

SMD

TDO {5}

RTCK {5}

TMS {5}

TCK {5}

NRST {4,5}

VDDIOP0

NRST

TMS

TCK

RTCK

TDO

R18 100KR18 100K

U10

U11

T10

R10

P10

TCK

TMS

TDO

RTCK

NRST

TP11

VDDBU

VDDBUB5VDDUTMII

SMD

VDDBU

L5

10uH/150mAL510uH/150mA

+3V3

R21

100K

R21

100K

U13

GNDOSC

VDDOSC

T13

U16

C40

C37

100nF

C36

1uF

R221RR22

1R

C38

100nF

WKUP {5}

WKUP

A7

WKUP

C42

100nF

R251RR25

1R

C43

C39

4.7uF

C43

4.7uF

L6

10uH/150mAL610uH/150mA

C41

100nF

+3V3

TP16

SMD

TP16

SMD

SHDN {5}

VDDIOP0

SHDN

TP15

SMD

TP15

SMD

D8

SHDN

+3V3

TP14

SMD

TP14

SMD

1

MBC-SAM9X5

Title:

Date: Sheet: of

AT91SAM9G45-I&POWER A

A3

Size: Document Number: Rev:

Draw By:

Size: Document Number: Rev:

2

TP19

SMD

TP19

SMD

TP22

SMD

TP22

SMD

3

VDDIOP1

VDDNF

TP18

SMD

TP18

SMD

TP21

SMD

TP21

SMD

+1V

VDDANA

4

TP17

SMD

TP17

SMD

TP20

SMD

TP20

SMD

L1

SAM9x5_LBGA217 - INTERFACE

2.2uH 3D16L12.2uH 3D16

3

5

LX

FB

GND

2

IN4EN

MN1

AS1301EHT-adj

MN1

AS1301EHT-adj

1

C1

5

4.7uFC14.7uF

D D

PWR_EN

PWR_EN{5 }

SAM9x5_LBGA217 - INTERFACE

HHSDMA

HHSDPA

HFSDMA

HFSDPA

MN2G

T15

T14

U15

U14

R8 39RR8 39R

R7 39RR7 39R

HHSDMA{5}

HHSDPA{5 }

C C

M17

R23 27RR23 27R

HHSDMC{5}

HFSDPC

HFSDMC

L17

R24 27RR24 27R

HHSDPC{5}

DIBN

DIBP

P11

R11

5

DIBP{5}

DIBN{5}

A A

HHSDMB

HHSDPB

HFSDMB

TST

B7

BMSP9VBG

U17

C31

10pF

C31

10pF

R16

6.8K

R11 100KR11 100K

VDDIOP0

BMS{5}

HFSDPB

P17

P16

R17

R16

R19 39RR19 39R

R20 39RR20 39R

HHSDMB{5}

HHSDPB{5 }

B B

4-16 Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11

Figure 4-12. CM Board Schematics – 2 of 5

1

DDR2 SDRAM

C53 100nFC53 100nF

C54 100nFC54 100nF

C50 100nFC50 100nF

C48 100nFC48 100nF

C51 100nFC51 100nF

C52 100nFC52 100nF

C47 100nFC47 100nF

C49 100nFC49 100nF

A9

C9

C1

R1

J1

VDD

VDDL

VDDQ

VDDQC3VDDQC7VDDQ

VDDQ

CKEK2CKJ8CKK8CASL7RASK7WE

CS

L8

DDR2_NCS1

DDR2_SDCKE

DDR2_SDCK

DDR2_NSDCK

DDR2_D15

DDR2_D2

DDR2_D1

DDR2_D0

DDR2_D4

DDR2_D3

DDR2_D6

DDR2_D5

2

DQ0G8DQ1G2DQ2H7DQ3H3DQ4H1DQ5H9DQ6F1DQ7

DDR2 SDRAM

MT47H64M16HR

A0M8A1M3A2M7A3N2A4N8A5N3A6N7A7P2A8P8A9P3A10M2BA0L2ODT

MN5

EBI_A3

EBI_A4

EBI_A5

EBI_A6

EBI_A7

EBI_A8

EBI_A2

3

DDR2_D7

DDR2_D8

F9

DQ8C8DQ9

EBI_A10

EBI_A9

DDR2_D0

DDR2_D1

DDR2_D9

DDR2_D10

DDR2_D11

DDR2_D12

C2

DQ10D7DQ11D3DQ12D1DQ13D9DQ14B1DQ15

A11P7BA1L3A12R2BA2

EBI_A11

EBI_SDA10

EBI_A13

EBI_A14

DDR2_D2

DDR2_D3

DDR2_D4

DDR2_D5

C46 100nFC46 100nF

C44 100nFC44 100nF

C45 100nFC45 100nF

DDR2_D13

DDR2_D15

DDR2_D14

VDDIOM

M9

E1

A1

B9

VDDJ9VDD

VDD

L1

K9

EBI_A16

EBI_A17

EBI_A18

DDR2_D6

DDR2_D7

DDR2_D8

DDR2_D9

DDR2_D10

DDR2_D11

DDR2_D12

DDR2_D13

DDR2_D14

Evaluation Kit Hardware

25Thursday,November 04,2010Zhu Xueliang

SMD

TP23

DDR_VREF

R34

1.5K 1%

R34

1.5K 1%

R39

1.5K 1%

R39

1.5K 1%

C64

104

C64

104

C62

104

C62

104

L7

10uH

150mAL710uH

150mA

VDDIOM

C61

4.7uF

C61

4.7uF

C58 100nFC58 100nF

C59 100nFC59 100nF

C55 100nFC55 100nF

C56 100nFC56 100nF

C57 100nFC57 100nF

C60

100nF

C60

100nF

DDR_VREF

E9

G9

G3

J2

VDDQ

VDDQG1VDDQG7VDDQ

VDDQ

K3

DDR2_DQS1

DDR2_SDWE

DDR2_RAS

DDR2_CAS

DDR2_DQM0

DDR2_DQM1

DDR2_DQS0

VREF

UDQSB7UDQS

A8

DDR2_DQS1

B2

E3

J3

N1

P9

VSSA3VSS

VSS

VSSQ

LDM

UDMB3LDQSE8LDQS

F3

F7

DDR2_DQM0

DDR2_DQM1

DDR2_DQS0

DDR2_SDCKE

DDR2_SDWE

DDR2_SDCK

DDR2_RAS

DDR2_CAS

R331RR33

1R

VSSQD8VSSQE7VSSQF2VSSQ

VSSQD2VSSQA7VSSQB8VSSQH2VSSQ

RFU1A2RFU2

DDR2_NCS1

DDR2_NSDCK

C63

4.7uF

C63

4.7uF

NAND FLASH

C66

100nF

C65

100nF

NAND_FSH_ D2

NAND_FSH_ D4

NAND_FSH_ D3

NAND_FSH_ D6

NAND_FSH_ D7

NAND_FSH_ D5

NAND_FSH_ D0

NAND_FSH_ D1

F8

H8

J7

VSSDL

RFU3

RFU4R7RFU5

E2

R3

R8

EBI_A15

29

31

41

28

33

45

40

27

I/O0

I/O130I/O332I/O2

I/O744I/O643I/O542I/O4

I/O8_N.C26I/O9_N.C

I/O10_N.C

I/O11_N.C

I/O12_N.C

MN11

WE

CE9RE

WP19N.C5

N.C11N.C22N.C33N.C4

R/B

ALE

CLE

8

7

17

16

18

REWECERBCLE

ALE

R40 0RR40 0R

R43 0RR43 0R

R44 0RR44 0R

R41 0RR41 0R

R46 470KR46 470K

PD3

PD2

PD0

PD1

VDDNF

ON

1

SW1A

SWITCH-2-1.27mm

SW1A

SWITCH-2-1.27mm

1 4

PD4

4

WP

R49

DNP

R48 470KR48 470K

R47 470KR47 470K

R42 0RR42 0R

PD5

VDDNF

100nF

VDDNF

34

39

25

48

36

13

37

12

VSS

VCC

VSS_N.C

VCC_N.C

I/O15_N.C47I/O14_N.C46I/O13_N.C

N.C6

N.C11

DNU121DNU2

N.C1223N.C13

N.C14

N.C811N.C710N.C914N.C10

6

5

NAND_FSH_ D0

NAND_FSH_ D1

DNU3

MT29F2G08AAD

20

22

24

35

38

15

NANDCLE {5}

NANDALE {5}

NANDWE {5}

NANDOE {5 }

NAND_FSH_ D2

NAND_FSH_ D3

NAND_FSH_ D4

NAND_FSH_ D5

NAND_FSH_ D6

NAND_FSH_ D7

25Thursday,November 04,2010Zhu Xueliang

1

MBC-SAM9X5

Title:

Date: Sheet: of

AT91SAM9G45-II&DDR2&NANDFLASH A

A3

Size: Document Number: Rev:

Draw By:

2

3

NANDCS {5}

NANDR_B {5}

4

5

RR1BRR1B

2 7

EBI_D0

EBI_D2

EBI_D4

EBI_D3

EBI_D0

EBI_D1

D14D1D15D2A16D3B16D4A17D5B15D6C14D7B14D8A15D9C15

D0

SAM9x5_LBGA217 - EBI

MN2F

RR17CRR17C

RR17ARR17A

RR16CRR16C

RR16ARR16A

RR17DRR17D

RR17BRR17B

RR16DRR16D

RR16BRR16B

R50 0RR50 0R

R51 0RR51 0R

R52 0RR52 0R

R53 0RR53 0R

R54 0RR54 0R

PD19

PD18

PD20

J17

K16

K17

PD18/D28/A25

PD19/D29/NCS2

PD20/D30/NCS4

A A

(NANDOE )

(NANDWE )

(NANDAL E)

(NANDCLE )

(NANDCS )

PD3

PD0

PD1

PD4

PD2

PD21

J16

PD21/D31/NCS5

R55 0RR55 0R

(NANDR/B)

4

PD6

5

3 6

1 8

3 6

1 8

4 5

2 7

4 5

PD6

N14

PD6/D16

PD7

R15

PD6

PD8

PD9

M14

N16

PD7/D17

PD8/D18

PD7

PD8

PD11

PD10

N17

N15

PD9/D19

PD10/D20

PD9

PD10

PD13

PD12

K15

M15

PD11/D21

PD12/D22

2 7

PD11

PD12

PD14

PD15

L14

M16

PD13/D23

PD14/D24

PD15/D25/A20

PD13

PD16

PD17

L16

L15

PD16/D26/A23

PD17/D27/A24

RR2ARR2A

RR1CRR1C

RR1ARR1A

RR2CRR2C

RR1DRR1D

1 8

3 6

1 8

3 6

4 5

EBI_D1

EBI_D2

EBI_D3

EBI_D4

EBI_D5

EBI_D6

EBI_D7

EBI_D8

EBI_D5

EBI_D9

D D

RR3ARR3A

RR2BRR2B

2 7

EBI_D6

EBI_D10

D12

D10

RR4CRR4C

RR2DRR2D

RR3DRR3D

RR4BRR4B

RR4ARR4A

RR3BRR3B

RR3CRR3C

RR4DRR4D

1 8

3 6

4 5

2 7

1 8

2 7

3 6

4 5

EBI_D7

EBI_D8

EBI_D9

EBI_D10

EBI_D11

EBI_D12

EBI_D13

EBI_D14

EBI_D15

EBI_A2

EBI_A3

EBI_A4

EBI_A5

H16

H15A3H17A4G17A5G16A6F17A7E17A8F16A9G15

A2

A0/NBS0

EBI_A8

EBI_A6

EBI_A7

EBI_D11

EBI_D12

EBI_D15

EBI_D14

EBI_D13

C13

A14

B13

A13

C12

J15

D11

D12

D13

D14

D15

A1/NBS2/DQM2/NWR2

R28 27RR28 27R

R35 27RR35 27R

R29 27RR29 27R

R36 27RR36 27R

R30 27RR30 27R

R37 27RR37 27R

R32 27RR32 27R

R31 27RR31 27R

R26 27RR26 27R

R27 27RR27 27R

EBI_DQM1

EBI_DQM0

EBI_DQS0

EBI_RAS

EBI_DQS1

EBI_CAS

EBI_A9

EBI_A10

EBI_A11

EBI_A14

EBI_A13

EBI_A18

EBI_A16

EBI_A17

EBI_A15

EBI_DQM0

G14

F15

D17

C17

E16

D16

E14

C16

B17

E15

A10

A11

A12

A13

A14

A15

A19

DQM0

A16/BA0

A17/BA1

A18/BA2

C C

R38 27RR38 27R

EBI_SDCKE

EBI_SDCK

EBI_NSDCK

EBI_SDWE

EBI_NCS1_SDCS

EBI_SDCKE

EBI_DQM1

EBI_DQS0

A11

B10

DQS0

DQM1

EBI_SDCK

EBI_NSDCK

EBI_RAS

EBI_DQS1

EBI_CAS

EBI_SDWE

EBI_SDA10

A9

DQS1

C11

B12

D11

C8

B11

C10

A12

RAS

CAS

SDCK

SDWE

SDA10

#SDCK

SDCKE

NCS0

EBI_NCS1_SDCS

B9

B8

NCS0

C7

C9

NCS1/SDCS

NWR0/NWRE

SMD

TP24

NCS0

D9

A8

NRD

NWR1/NBS1

NWR3/NBS3/DQM3

PD[5..21] {3,5}

(NANDOE )

(NANDWE )

(NANDAL E)

(NANDCLE )

(NANDCS )

PD4

PD5

PD0

PD1

PD2

PD3

P14

R13

P15

P12

P13

R14

PD4/NCS3

PD5/NWAIT

PD0/NANDOE

PD1/NANDWE

PD2/A21/NANDALE

PD3/A22/NANDCLE

SAM9x5_LBGA217 - PIOD

MN2E

B B

Evaluation Kit (EK) User Guide 4-17

11115A–ATARM–27-Jul-11

Evaluation Kit Hardware

Figure 4-13. CM Board Schematics – 3 of 5

1

DDR2 SDRAM

C53 100nFC53 100nF

C54 100nFC54 100nF

C50 100nFC50 100nF

C48 100nFC48 100nF

C51 100nFC51 100nF

C52 100nFC52 100nF

C47 100nFC47 100nF

C49 100nFC49 100nF

J1

A9

C9

C1

R1

VDD

VDDL

VDDQ

VDDQC3VDDQC7VDDQ

VDDQ

CKEK2CKJ8CKK8CASL7RASK7WE

CS

L8

DDR2_NCS1

DDR2_SDCKE

DDR2_SDCK

DDR2_NSDCK

DDR2_D15

DDR2_D2

DDR2_D1

DDR2_D0

DDR2_D4

DDR2_D3

DDR2_D6

DDR2_D5

2

DQ0G8DQ1G2DQ2H7DQ3H3DQ4H1DQ5H9DQ6F1DQ7

DDR2 SDRAM

MT47H64M16HR

A0M8A1M3A2M7A3N2A4N8A5N3A6N7A7P2A8P8A9P3A10M2BA0L2ODT

MN5

EBI_A3

EBI_A4

EBI_A5

EBI_A6

EBI_A7

EBI_A8

EBI_A2

3

DDR2_D7

DDR2_D8

F9

DQ8C8DQ9

EBI_A10

EBI_A9

DDR2_D0

DDR2_D1

DDR2_D9

DDR2_D10

DDR2_D11

DDR2_D12

C2

DQ10D7DQ11D3DQ12D1DQ13D9DQ14B1DQ15

A11P7BA1L3A12R2BA2

EBI_A11

EBI_SDA10

EBI_A13

EBI_A14

DDR2_D2

DDR2_D3

DDR2_D4

DDR2_D5

C46 100nFC46 100nF

C44 100nFC44 100nF

C45 100nFC45 100nF

DDR2_D13

DDR2_D15

DDR2_D14

VDDIOM

B9

M9

E1

A1

VDDJ9VDD

VDD

L1

K9

EBI_A16

EBI_A17

EBI_A18

DDR2_D6

DDR2_D7

DDR2_D8

DDR2_D9

DDR2_D10

DDR2_D11

DDR2_D12

DDR2_D13

DDR2_D14

C55 100nFC55 100nF

C56 100nFC56 100nF

E9

VDDQ

VDDQG1VDDQG7VDDQ

DDR2_RAS

DDR2_CAS

VDDIOM

C58 100nFC58 100nF

C59 100nFC59 100nF

C57 100nFC57 100nF

J2

G9

G3

VDDQ

K3

DDR2_SDWE

DDR2_DQM0

DDR2_DQM1

L7

10uH

150mAL710uH

150mA

C61

4.7uF

C61

4.7uF

C60

100nF

C60

100nF

DDR_VREF

E3

J3

N1

P9

VSSA3VSS

VSS

VREF

UDQSB7UDQSA8LDM

F7

DDR2_DQS1

DDR2_DQS0

DDR2_SDCKE

DDR2_SDWE

DDR2_RAS

DDR2_CAS

DDR2_DQS1

DDR2_DQS0

B2

VSSQ

UDMB3LDQSE8LDQS

F3

DDR2_DQM0

DDR2_DQM1

DDR2_SDCK

DDR2_NSDCK

SMD

TP23

DDR_VREF

R34

1.5K 1%

R34

1.5K 1%

C62

104

C62

104

R331RR33

1R

F8

H8

VSSQD8VSSQE7VSSQF2VSSQ

VSSQD2VSSQA7VSSQB8VSSQH2VSSQ

RFU1A2RFU2

RFU3

RFU4R7RFU5

E2

R3

R8

EBI_A15

DDR2_NCS1

25Thursday,November 04,2010Zhu Xueliang

R39

1.5K 1%

R39

1.5K 1%

C64

104

C64

104

C63

4.7uF

C63

4.7uF

NAND FLASH

C66

100nF

C65

100nF

NAND_FSH_ D2

NAND_FSH_ D4

NAND_FSH_ D3

NAND_FSH_ D6

NAND_FSH_ D7

NAND_FSH_ D5

NAND_FSH_ D0

NAND_FSH_ D1

J7

VSSDL

29

I/O0

MN11

CLE

16

R40 0RR40 0R

PD3

27

31

41

28

33

45

40

I/O130I/O332I/O2

I/O744I/O643I/O542I/O4

I/O8_N.C26I/O9_N.C

I/O10_N.C

I/O11_N.C

I/O12_N.C

WE

CE9RE

WP

N.C11N.C22N.C33N.C4

R/B

ALE

8

7

18

17

REWECERBCLE

ALE

R43 0RR43 0R

R44 0RR44 0R

R41 0RR41 0R

R46 470KR46 470K

PD2

PD0

PD1

VDDNF

ON

1

SW1A

SWITCH-2-1.27mm

SW1A

SWITCH-2-1.27mm

1 4

PD4

4

19

WP

R49

DNP

R48 470KR48 470K

R47 470KR47 470K

R42 0RR42 0R

PD5

VDDNF

100nF

VDDNF

34

39

25

48

36

13

37

12

VSS

VCC

VSS_N.C

VCC_N.C

I/O15_N.C47I/O14_N.C46I/O13_N.C

N.C6

N.C11

N.C5

6

5

N.C811N.C710N.C914N.C10

NAND_FSH_ D0

NAND_FSH_ D1

DNU121DNU2

N.C1223N.C13

N.C14

DNU3

MT29F2G08AAD

20

22

24

35

38

15

NANDCS {5}

NANDCLE {5}

NANDALE {5}

NANDWE {5}

NANDOE {5 }

NAND_FSH_ D2

NAND_FSH_ D3

NAND_FSH_ D4

NAND_FSH_ D5

NAND_FSH_ D6

NAND_FSH_ D7

1

MBC-SAM9X5

Title:

Date: Sheet: of

AT91SAM9G45-II&DDR2&NANDFLASH A

A3

Size: Document Number: Rev:

Draw By:

2

3

NANDR_B {5}

4

5

RR1BRR1B

2 7

EBI_D0

EBI_D2

EBI_D4

EBI_D3

EBI_D0

EBI_D1

D14D1D15D2A16D3B16D4A17D5B15D6C14D7B14D8A15D9C15

D0

SAM9x5_LBGA217 - EBI

MN2F

RR17CRR17C

RR17ARR17A

RR16CRR16C

RR16ARR16A

RR17DRR17D

RR17BRR17B

RR16DRR16D

RR16BRR16B

R50 0RR50 0R

R51 0RR51 0R

R52 0RR52 0R

R53 0RR53 0R

R54 0RR54 0R

PD19

PD18

PD20

J17

K16

K17

PD18/D28/A25

PD19/D29/NCS2

PD20/D30/NCS4

A A

(NANDOE )

(NANDWE )

(NANDAL E)

(NANDCLE )

(NANDCS )

PD3

PD0

PD1

PD4

PD2

PD21

J16

PD21/D31/NCS5

R55 0RR55 0R

(NANDR/B)

4

PD6

5

3 6

1 8

3 6

1 8

4 5

2 7

4 5

PD6

N14

PD5/NWAIT

PD7

PD8

R15

M14

PD6/D16

PD7/D17

PD6

PD7

PD9

PD10

N16

N17

PD8/D18

PD9/D19

PD8

PD9

PD12

PD11

N15

K15

PD10/D20

PD11/D21

PD12/D22

2 7

PD10

PD11

PD14

PD13

M15

L14

PD13/D23

PD12

PD13

PD15

PD16

M16

L16

PD14/D24

PD15/D25/A20

PD16/D26/A23

PD17

L15

PD17/D27/A24

RR2ARR2A

RR1CRR1C

RR1ARR1A

RR2CRR2C

RR1DRR1D

1 8

3 6

1 8

3 6

4 5

EBI_D1

EBI_D2

EBI_D3

EBI_D4

EBI_D5

EBI_D6

EBI_D7

EBI_D8

EBI_D5

EBI_D9

D D

RR3ARR3A

RR2BRR2B

2 7

EBI_D6

EBI_D10

D12

D10

RR4CRR4C

RR2DRR2D

RR3DRR3D

RR4BRR4B

RR4ARR4A

RR3BRR3B

RR3CRR3C

RR4DRR4D

1 8

3 6

4 5

2 7

1 8

2 7

3 6

4 5

EBI_D7

EBI_D8

EBI_D9

EBI_D10

EBI_D11

EBI_D12

EBI_D13

EBI_D14

EBI_D15

EBI_A2

EBI_A3

EBI_A4

J15

H16

H15A3H17A4G17A5G16A6F17A7E17A8F16A9G15

A2

A0/NBS0

EBI_A8

EBI_A5

EBI_A6

EBI_A7

EBI_D11

EBI_D12

EBI_D15

EBI_D14

EBI_D13

C13

A14

B13

A13

C12

D11

D12

D13

D14

D15

A1/NBS2/DQM2/NWR2

R28 27RR28 27R

R35 27RR35 27R

R29 27RR29 27R

R36 27RR36 27R

R30 27RR30 27R

R37 27RR37 27R

R32 27RR32 27R

R31 27RR31 27R

R26 27RR26 27R

R27 27RR27 27R

EBI_DQM1

EBI_DQM0

EBI_DQS0

EBI_RAS

EBI_DQS1

EBI_CAS

EBI_A9

EBI_A10

EBI_A11

EBI_A14

EBI_A13

EBI_A18

EBI_A16

EBI_A17

EBI_A15

EBI_DQM0

G14

F15

D17

C17

E16

D16

E14

C16

B17

E15

A10

A11

A12

A13

A14

A15

A19

DQM0

A16/BA0

A17/BA1

A18/BA2

C C

R38 27RR38 27R

EBI_SDCKE

EBI_SDCK

EBI_NSDCK

EBI_SDWE

EBI_NCS1_SDCS

EBI_SDCKE

EBI_DQM1

EBI_DQS0

B10

A11

DQS0

DQM1

EBI_SDCK

EBI_NSDCK

EBI_RAS

EBI_DQS1

EBI_CAS

EBI_SDWE

EBI_SDA10

C11

B12

D11

C8

B11

C10

A12

A9

RAS

CAS

DQS1

SDCK

SDWE

SDA10

#SDCK

SDCKE

NCS0

EBI_NCS1_SDCS

B9

B8

NCS0

C7

C9

NCS1/SDCS

NWR0/NWRE

SMD

TP24

NCS0

D9

A8

NRD

NWR1/NBS1

NWR3/NBS3/DQM3

PD[5..21] {3,5}

(NANDOE )

(NANDWE )

(NANDAL E)

(NANDCLE )

(NANDCS )

PD4

PD5

PD0

PD1

PD2

PD3

P14

R13

P15

P12

P13

R14

PD4/NCS3

PD0/NANDOE

PD1/NANDWE

PD2/A21/NANDALE

PD3/A22/NANDCLE

SAM9x5_LBGA217 - PIOD

MN2E

B B

4-18 Evaluation Kit (EK) User Guide

11115A–ATARM–27-Jul-11