5.1Revision History ................................................................................................................. 5-1
iiEvaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
1.1Scope
Section 1
Introduction
This User Guide introduces the Evaluation Kit and describes the development and debugging capabilities running on an AT91SAM9 ARM®-based Embedded MPUs as listed below:
SAM9G15
SAM9G25
SAM9X25
SAM9G35
SAM9X35
The User Guide pertains to the following Evaluation Kit references:
SAM9G15-EK
SAM9G25-EK
SAM9X25-EK
SAM9G35-EK
SAM9X35-EK
This User Guide gives design details on the Evaluation Kit and is made up of 5 sections:
Section 1 includes a photo of the board, device and kit references and applicable documents.
Section 2 describes the kit contents, its main features.
Section 3 provides instructions to power up the Evaluation Kit and describes how to use it.
Section 4 describes the CPU Module (CM), the Main Board (MB) and optional Display Module (DM).
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Introduction
Figure 1-1.Board Photo (Display module is optional)
EK (Evaluation Kit)
CM (Computer Module)
DM (Display Module)
-10° to +50° C
-40° to +85° C
165 mm x 135 mm
67.6 mm x 35 mm
135 mm x 80 mm
RoHS statusCompliant
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2.3Electrostatic Warning
The Evaluation Kit is shipped in a protective anti-static package. The board system must not be subjected to high electrostatic potentials. A grounding strap or similar ESD protective device should be worn
when handling the board in hostile ESD environments (offices with synthetic carpet, for example). Avoid
touching the component pins or any other metallic element on the board.
Kit Contents
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3.1Power Up the Board
Unpack the board taking care to avoid electrostatic discharge. Unpack the power supply, select the right
power plug adapter corresponding to that of your country, and insert it in the power supply.
Connect the power supply DC connector to the board and plug the power supply to an AC power plug.
The board LCD should light up and display a welcome page. Then, click or touch icons displayed on the
screen and enjoy the demo.
3.2DevStart
The on-board NAND Flash contains an installation guide named: “SAM9x5-EK DevStart”.
It is stored in the “SAM9x5-EK DevStart” folder on the USB Flash disk available when the Evaluation Kit
is connected to a host computer.
Click the file “welcome.html” in this folder to launch the SAM9x5-EK DevStart.
Section 3
Power Up
DevStart guides the user through the installation processes of IAR™ EWARM, Keil™ MDK and GNU
toolkits. Then, it gives step-by-step instructions on how to rebuild a single example project and how to
program it into the Evaluation Kit. Optionally, if the user has a SAM-ICE™ interface, instructions are also
given about how to debug the code.
It is strongly recommended that users backup the “SAM9x5-EK DevStart” folder on their computer before launching it.
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Power Up
3.3Recovery Procedure
The DevStart ends by giving step-by-step instructions on how to recover the Evaluation Kit to the state
as it was when shipped by Atmel.
Follow the instructions if contents of the NAND Flash or the SPI DataFlash®have been deleted, in order
to recover from this situation.
3.4Sample Code and Technical Support
After boot up, designers can run sample code or their own application, on the development kit. Users
can download sample code and get technical support from the Atmel web site:
Note: Different interfaces on the EK boards share the same connections to the CPU module. Therefore the actual
usage depends on the CPU module featured in the evaluation kit.
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4.1Introduction
The Evaluation Kit is a fully-featured evaluation platform for the Atmel MPU. The Evaluation Kit enables
users to extensively evaluate, prototype and create application-specific designs.
The Evaluation Kit is a new platform architecture based on a Main Board (MB), a CPU Module (CM)
equipped with one of the five processors and an optional Display Module (DM).
The Evaluation Kit consists of three boards:
1. The CPU Module (CM) board, is a single-board computer that integrates all the core components
and is mounted onto an application-specific carrier board (EK board). The CPU Module has specified pinouts based on the SODIMM200 connector. It provides the functional requirements for an
embedded application. These functions include, but are not limited to, graphics, audio, mass storage,
network and multiple serial and USB ports. A single SODIMM200 connector provides an interface for
the carrier board to carry all the I/O signals to and from the CPU Module.
2. The Evaluation Kit board (EK Main Board) provides all the interface connectors required to attach
the system to the application specific peripherals. This versatility allows the designer to create a
densely packed solution, which results in a more reliable product while simplifying system
integration.
3. The optional Display Module (DM) board integrates LCD, TouchScreen and Qtouch®technology.
Section 4
Evaluation Kit Hardware
Table 4-1, on the page that follows, lists the features provided on the Evaluation Kit:
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Evaluation Kit Hardware
Table 4-1. Evaluation Kit Features
Supported modulesSAM9 products
Expansion SlotSO-DIMM200
Processor options
LAN
USART/UART
CANCAN interface Shared interface
USB
SMDSoftware Modem DeviceXXXXX
Memory Card Support
MII/RMII Ethernet 10/100 w/PHY and three
Led status
RMII Ethernet 10/100 w/PHY and three Led
status
RS232 four wires/RS485
Shared interface
SAM9
G15
ETH0XXXX
ETH1X
COM0XXXXX
SAM9
G25
SAM9
G35
SAM9
X25
SAM9
X35
RS232 four wiresCOM3XX
RS232 two wiresDBGUXXXXX
CAN0XX
CAN1XX
2 * USB 2.0 HostXXXXX
1 * USB 2.0 Host/DeviceXXXXX
µSD Card Slot Onboard
MMC/MMC+/SD/SDIO/CE-ATA
HSMCI
0
HSMCI
1
XXXXX
XXXXX
ISIX
LCD + Touch Screen24-bit Output ModeXXX
ZigBee
®
XXXXX
SPIXXXXX
TWIXXXXX
DEBUGJTAG Test Access PortXXXXX
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4.2Computer Module (CM)
4.2.1CM Board Overview
The CM board is the CPU module at the heart of the system. It connects to the EK board through a SODIMM200 interface. It carries the processor and external memories. The CM board serves as a minimal
CPU sub-system. All five processors:SAM9G15, SAM9G25, SAM9X25,SAM9G35 and SAM9X35 share
the same CM circuitry with minor configuration settings.
Note:There are three CM boards from three different manufacturers. The five processors are
implemented as shown in Table 4-2 below:
Table 4-2. CM Board Implementation
Evaluation Kit Hardware
Manufacturer &
Module kind
mfg 1xx
mfg 2xx
mfg3xxxxx
The three CM boards share the same circuitry design but with different designator information and PCB layouts. The
circuitry reference in this guide, for common design parts, refers to schematics from SAM9G25-CM (mfg 3). All the
other schematics are provided in
The CM board is built around the integration of an ARM926-based microcontroller (BGA217 package)
with external memory and optional Ethernet PHYsical Layer Transceiver.
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Evaluation Kit Hardware
4.2.2.1Devices
Following is the list of the CM board components:
One SAM9 Embedded MPU from the list below
– SAM9G15
– SAM9G25
– SAM9G35
– SAM9X25
– SAM9X35
12 MHz crystal
32.768 KHz crystal
1 Gbit DDR2 memory
2 Gits NAND Flash memory with Chip Selection control switch
32 Mbits SPI Serial DataFlash with Chip Selection control switch
512 Kbits EEPROM
1 Kbyte 1-Wire EEPROM
On-board power regulation
Two user LEDs
Optional PHY
4.2.2.2Interface Connection
SODIMM200 card edge interface
4.2.2.3Configuration Items
Dual ON/OFF switch for NAND Flash and SPI DataFlash Chip Select connection
Figure 4-2.CM Board Layout Commented
DDR2 SDRAM
NAND Flash
Sodimm200 card edge
SAM9 chip
PHY
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4.2.3Function Blocks
4.2.3.1Processor
The CM Board is equipped with an Atmel ARM-based embedded MPU, as listed below, in a 217-ball
BGA package. The five devices share an identical footprint. All five share the same CM Board PCB with
minor configuration differences.
The five devices are:
SAM9G15
SAM9G25
SAM9G35
SAM9X25
SAM9X35
As different interfaces can be defined using the same pins, it depends on the actual configuration of the
CPU as to which functions are in fact available to the EK board.
Refer to Section 4.2.4.1 ”Chip Identification” for details. The processor runs at a nominal frequency of
400 MHz for the core and 133 MHz for the system bus.
The peripheral configuration possibilities and implementation requirements of the CM are dependent on
the module's chipset. Two configuration resistors are implemented on board in order to select the mode
of configuration.
Evaluation Kit Hardware
4.2.3.2Clock Circuitry
The CM includes 3 clock sources:
Two are alternatives for the processor main clock
One crystal and one crystal oscillator are used for the Ethernet MII/RMII chip
Table 4-3. Main Components Associated with the Clock Systems
QuantityDescriptionComponent assignment
4.2.3.3Reset Circuitry
The reset sources for the CM board are:
Power on reset
Push button reset (Push button is equipped on EK board)
JTAG reset from an in-circuit emulator (JTAG interface is equipped on EK board)
1Crystal for Internal Clock, 12 MHzY1
1Crystal for RTC Clock, 32.768 kHzY2
1Oscillator for Ethernet Clock RMII, 50 MHzY3
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Evaluation Kit Hardware
4.2.3.4Power Supplies
The CM Board is driven by +3V3 input power rail from the EK board through the SODIMM200 connector.
The CM Board embeds all the necessary power rails required for the micro processor.
When additional voltages are required, for example VDDCORE, they are generated on board from the
3.3V supply. The detailed power supply requirements for any given module are specified within the cor-
responding product documentation. The following table summarizes the power specifications.
Table 4-4. Power Rails Associated with the Systems
the NAND Flash I/O and control, D16-D32 and
multiplexed SMC lines
the Slow Clock oscillator, the internal 32 kHz
RC, the internal 12 MHz RC and a part of the
System Controller
DC Supply UDPHS and UHPHS UTMI+
Interface
the core, including the processor, the
embedded memories and the peripherals
From SODIMM200 connector
From SODIMM200 connector
From SODIMM200 connector
on-board
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Figure 4-3.CM Power Supply
+3V3MN3
4
C10
4.7uF
1
PWR_EN
AS1301EHT-adj
IN
GND
EN
2
LX
FB
3
2.2uH 3D 16
5
Evaluation Kit Hardware
L2
C7
C11
22pF
R2
39.2K 1%
R4
59K 1%
C12
10uF
C3
4.7uF
C6
100nF
100nF
C8
100nF
VDDCORE
PWR_EN
C1
4.7uF
MN1
AS1301EHT-adj
4
IN
1
EN
L1
3
LX
2.2uH 3D 16
R1
C9
118K 1%
5
GND
FB
2
120 OHM@100MHZ
22pF
R3
59K 1%
B2
21
C38
100nF
C41
100nF
C2
10uF
L5
10uH/150m A
L6
10uH/150m A
C39
4.7uF
C43
4.7uF
C4
100nF
R22
1R
R25
1R
C5
100nF
C13
100nF
C14
100nF
C15
100nF
C40
100nF
C42
100nF
VDDIOM
VDDNF
VDDUTMII
VDDOSC
C27
100nF
L4
10uH/150m A
L3
10uH/150m A
C34
4.7uF
C28
4.7uF
R17
1R
R10
1R
C25
100nF
C33
100nF
C30
100nF
C26
100nF
VDDPLLA
VDDUTMIC
VDDAN A
ADVREF
C35
100nF
VDDI OP0
C20
100nF
C21
100nF
C17
1uF
VDDBU
VDDIOP1
PWR_EN
C36
1uF
C23
100nF
MN4
TPS71710DCK
IN1OUT
GND
EN3NR
2
C37
100nF
5
4
ADVREF
VDDBU
VDDI OP0
VDDI OP1
C18
10nF
+1V
C16
1uF
C32
100nF
VDDANA
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Evaluation Kit Hardware
4.2.3.5Memory
The Device serial processor features a DDR/SDR memory interface and an External Bus Interface (EBI)
to enable interfacing to a wide range of external memories and to almost any kind of parallel peripheral.
The External Bus Interface (EBI) is connected to two kinds of memory devices:
One 1 Gbyte DDR2 SDRAM
One 2 Gbytes (or 4 Gbytes depending on supplier) NAND Flash
The serial processor provides two high-speed Serial Peripheral Interface (SPI) controllers. One port is
used to interface with the on-board serial DataFlash
Figure 4-5.SPI
PA14
4.2.3.7Two Wire Interface (TWI)
The serial processor has a full speed (400 kHz) master/slave TWI Serial Controller. The controller is
mostly compatible with industry standard I2C and SMBus Interfaces. This port is used to interface with
the on-board Serial EEPROM, ISI, QTouch device and audio codec interface.
Figure 4-6.TWI
SW1B
SWITCH -2-1.27mm
23
ON
2
PA12
PA11
PA13
(SPI0_MOSI)
(SPI0_MIS0)
(SPI0_SPCK)
(SPI0_NPC S0)
VDDI OP0
®
.
VDDI OP0
R56
470K
MN7
AT25DF321
R570R
R580R
R590R
VDDI OP0VDDIOP0
5
2
6
1
SI
SO
SCK
CS
VCC
WP
HOLD
GND
VDDIOP0
8
3
7
4
C69
100nF
4.2.3.81-Wire EEPROM
The Evaluation Kit uses a 1-Wire device as “firmware label” to store the information such as chip type,
manufacturer’s name, production date etc.
Figure 4-7.1-Wire Device
PA31
PA30
PB18
(TWCKO)
(TWDO)
R61
4.7K
VDDI OP0R64
R660R
C70
100nF
R62
4.7K
VDDAN A
6
5
8
4
MN8
AT24C512BN-SH25-B
MN9
DS2431P+
2
IO
WP
A0
A1
A3
R65
1.5K
SCL
SDA
VCC
GND
1
2
3
7
NC1
NC2
NC3
GND
NC4
1
R63
10K
DNP
3
4
5
6
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4.2.3.9Optional PHY
Some of the device modules provide a location for a 10/100 Ethernet MAC/PHY interface.
For more information about the Ethernet controller device, refer to the Davicom DM9161 controller manufacturer's datasheet.
The CM board may be equipped with any of the five processors, all sharing an identical BGA217 footprint. There are two resistors on the CM board for the purpose of identifying which of the five is the one
actually mounted.
The tables below show in detail how the CM board, relative to different processors, determines the dedicated “SELCONFIG” logic.
JP9 f or BMS Conf ig:
When Open,BMS=1: Boot on embedded ROM
R83
When Clos e,BMS=0: Boot on Ex ternal m emory
4.7k
ZB_SLPTR
(MCI1_CD A)
(MCI0_DA0)
(MCI0_DA2)
CANRX1CANTX1
CANRX0
TK
TD
RKRD
E1_RXER
E1_TX0
E1_RX0
E1_TXEN
E1_CRSD V
E1_MDC
E0_RX1
E0_RXDV
E0_MDIO
E0_TXEN
JP9
12
SIP2
JTAG
PD5
PD9
PD11
PD13
PD15
PD17
PD19
PD21
PA1
PA3
PA12
PA14
PA7
PA21
PA23
PA30
PA15
PA17
PA19
PA6
PA9
PA24
PA26
PA28
PC1
PC3
PC5
PC6
PC8
PC10
PC13
PC15
PC16
PC18
PC20
PC23
PC25
PC27
PC28
PC30
SELCONF IG
VDDANA
PB1
PB3
PB5
PB7
PB10
PB12
PB14
PB16
ADVREF
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4.3.3.2Power Supplies
The EK Board features one adjustable LDO. It accepts DC 5V power input and outputs a regulated
+3.3V to most other circuits on the board through four 3.3V rails.
VDDPIO0
VDDPIO1
VDDANA
VDDISI
This LDO is enabled through a dual FET scheme. The processor can assert SHDN (which is a VDDBUpowered I/O) to shut down the LDO to enter the so-called backup mode. The regulator on CM board is
also shut down by the action of the SHDN signal.
If the 3V battery is mounted on J5, both CM and EK boards can be woken up by action on the BP2 button, which drives the WKUP signal (also a VDDBU-powered I/O).
Figure 4-18. EK Board Power Management
Evaluation Kit Hardware
VDDI SI
VDDANA
12
L1
VOUT =
3V33V3
12
220ohm at 100MHz
L2
220ohm at 100MHz
R3
470R
12
R247k
C510n
0.8V x (Rtop + Rbottom)/Rbottom
R1
100k
6
7
8
ADJ
GND
VOUT
PGOOD1EN2VIN3VDD
MN3
RT9018A
5V
POWER_EN
5V
VDDIOP0
VDDIOP1
12
L16
5
4
12
220ohm at 100MHz
L17
220ohm at 100MHz
D2
Red
3V3
C9
10u
C8
1u
R5
15k
NC
EP
9
C7
1u
C6
10u
456
VBAT
JP4
SIP2
12
3
1
D1
BAT54CLT1G
J5
C4
100n
2
Place C22 near MN3. pin2
C22
1u
R8
10k
R7
10k
3V3
PWR_EN
R25
10k
3
Q6
IRLML2402
R4
100k
C120
1u
2
1
Q1
JP5
Si1563EDH
PWR_EN #
12
C57
100n
15p
C10
132
SIP2
FORCE
POWER
ON
SHDN
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Evaluation Kit Hardware
There is another 3.3V rail, VDDNF, supplied from the CM board. VDDNF is set to 3.3V in the current CM
design. The processors also support a 1.8V NAND Flash device, in which case VDDNF is set to 1.8V. In
order to avoid potential voltage conflict on user-defined applications, a level shifter is inserted between
the PIO lines on VDDNF rail and the 3.3V application.
Figure 4-19. Level Shifter For VDDNF Rail
4.3.3.3JTAG/ICE
Software debug is accessed by a standard 20-pin JTAG connection. This allows connection to a standard USB-to-JTAG in-circuit emulator such as SAM-ICE™.
PD17
PD16
PD20
PD19
PD18
VDDN F
MN1 8
1
VCCA
VCCB1
2
DIR
VCCB2
3
A1
4
A2
5
A3
6
A4
7
A5
8
A6
9
A7
10
A8
11
GND1
GND212GND3
SN74AVC8T245PWR
OE
3V3
24
23
22
21
B1
20
B2
19
B3
18
B4
17
B5
16
B6
15
B7
14
B8
13
C119 100nC118 100n
EN5V_HD C#
EN5V_HD B#
EN5V_HD A#
ZB_SLPTR
ZB_RSTN
Figure 4-20. JTAG Interface
VDDI OP0
J9
14
16
18
20
BR20-H
VDDI OP0
12
34
56
78
910
1112
13
15
17
19
VDDI OP0
R46
100k
DNP
R47
R48
100k
100k
DNP
DNP
R540R
R49
100k
DNP
DNP
R500R
R510R
R58
0R
DNP
NTRST
TDI
TMS
TCK
RTCK
TDO
NRST
NTRST
TDI
TMS
TCK
RTCK
TDO
NRST
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4.3.3.4DBGU
Evaluation Kit Hardware
The UART is connected to the DB-9 male socket through an RS-232 Transceiver (TXD and RXD only).
A jumper, JP11, is used to select DBGU or CAN0 between IO (PA9, PA10) sharing scheme. Close JP11
to select DBGU.
Figure 4-21. DBGU Com Port
VDDI OP0
C31
100n
R720R
PWR_EN
1
6
2
7
3
8
4
9
5
10
J11
11
EARTH_RS232
SEL_CAN
PA9
PA10
DTXD
DRXD
R59
100k
VDDIOP0
VDDI OP0
R60
100k
R670R
R710R
R73100k
C30
100n
C36
100n
JP11
SIP2
12
MN8
217
C1+V+VCC
4
5
6
12
11
13
109
118
GND
C1C2+
C2-V-
T1
T2
R1
R2
EN
ADM3222ARW
SD
16
3
7
15
8
14
C33 100n
C38 100n
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Evaluation Kit Hardware
4.3.3.5USART
The USART0 and USART3 are used as serial communication ports. Both USARTs are buffered with an
RS-232 Transceiver (TXD, RXD and handshake CTS/RTS control) and connected to the DB-9 male
socket. The software must assign the appropriate PIO pins to enable the USART function.
The USART3 is only supported by SAM9G25 and SAM9X25 processors. The RS-232 Transceiver for
USART3 is enabled by the signal SELCONFIG comprised of a pull down resistor on CM board. Ref to
Section 4.4.1 ”DM Board Overview” for details.
Figure 4-22. USART Com Port
USART0
VDDIOP0
C14
100n
MN4
3
VCC
23
GND
V+1C2+
21
V-
19
SD
5
EN
7
T1IN
8
T2IN
9
T3IN
10
R1OUT
11
R2OUT
R3OUT12R3IN
ADM3312EARU
T1OU T
T2OU T
T3OU T
R1IN
R2IN
6
C16 100n
C1+
20
C1-
2
C17 100n
4
C2-
24
C19 100n
C3+
22
C3-
18
17
16
15
14
13
R290R
RTSC0
TXDC0
CTSC0
RXDC0
1
6
2
7
3
8
4
9
5
10
EARTH_RS232
J8
11
L5
220ohm at 100MHz
12
C13
VDDIOP0
R23
R22
47k
RTS0
PA2
TXD0
PA0
CTS0
PA3
RXD0
PA1
R270R
R280R
R300R
R310R
47k
4.7u
C15 100n
C18 100n
R24
47k
USART3
(only for SAM9G25/SAM9X25)
VDDIOP1
SELCONFI G
PC24
PC22
PC25
PC23
RTS3
TXD3
CTS3
RXD3
R650R
R660R
R690R
R700R
VDDIOP1
MN9
C29
C28
4.7u
C35 100n
C37 100n
R64
R63
R62
R61
47k
47k
47k
47k
100n
3
VCC
23
GND
V+1C2+
21
V-
19
SD
5
EN
7
T1IN
8
T2IN
9
T3IN
10
R1OUT
11
R2OUT
R3OUT12R3IN
ADM3312EARU
C1+
C3+
T1OU T
T2OU T
T3OU T
R1IN
R2IN
6
C32 100n
20
C1-
2
C34 100n
4
C2-
24
C39 100n
22
C3-
18
17
16
15
14
13
R680R
RTSC3
TXDC3
CTSC3
RXDC3
1
6
2
7
3
8
4
9
5
10
EARTH_RS232
J12
11
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4.3.3.6USB Ports
The Evaluation Kit features three USB communication ports:
All three USB Host ports are equipped with 500 mA high-side power switch for self-powered and buspowered applications. The USB device port features VBUS insert detection function through the resistor
ladder R138 and R139.
Refer to the embedded MPU product datasheet for detailed programming information. For datasheet reference numbers and titles, see Section 1.2 ”Applicable Documents”.
Figure 4-23. USB Port (A)
Evaluation Kit Hardware
Port AHost High Speed (EHCI) and Full Speed (OHCI) multiplexed with USB
Device High speed Micro AB connector, J20
Port BHost High Speed (EHCI) and Full Speed (OHCI) standard type A
connector, J19 upper port
Port CHost Full speed OHCI only standard type A connector, J19 lower port
3V3
USB A HOST/DEVICE INTERFACE
J20
76
1
VBUS
EARTH_USB
EARTH_USB
2
DM
3
SHD
DP
4
ID
5
GND
G3515-09010101-00
Figure 4-24. USB Port (B & C)
USB HOST B&C INTERFACE
J19
Dual USB A
A1
A2
A
A3
A4
B
1 2
L21
220ohm at 100MHz
12
EARTH_USB
3 4
EARTH_USB
C107
100n
C109
100n
R13882k
B1
B2
B3
B4
C111
15p
C102
100n
C105
100n
+
33u
+
33u
12
C106
220ohm at 100MHz
12
C110
220ohm at 100MHz
L14
L15
(VBUS_SENSE)
R139
47k
C103
+
33u
C104
+
33u
8
5V
7
C108
100n
5
(IDU SBA)
L12
12
220ohm at 100MHz
L13
12
220ohm at 100MHz
MN1 5
OUTA
IN
GNG6FLGB
OUTB
AIC1526-0GS
PB16
R140
47k
C101
100n
ENA
FLGA
ENB
3V3
1
2
3
4
5V
ACTIVE LOW
OVCUR_USB
MN1 4
8
ENA
OUTA
7
FLGA
IN
GNG6FLGB
5
ENB
OUTB
AIC1526-0GS
R137
47k
LCD_D ETECT#5V_INTER
USBA_DM
USBA_DP
USBB_DP
USBB_DM
USBC_D M
USBC_D P
PB17
PB17
EN5V_HD A#
1
2
3
4
EN5V_HD B#
OVCUR_USB
EN5V_HDC#
Evaluation Kit (EK) User Guide4-29
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.3.3.7Ethernet 10/100 (EMAC) Port
Except for SAM9G15, the processor has two 10/100 Mbps Ethernet Mac Controllers.
SAM9G15SAM9G35SAM9X35SAM9G25SAM9X25
EMAC–RMIIRMIIMIIMII + RMII
The EK board is equipped with two Davicom DM9161AEP PHYs for each Ethernet port. Both PHY
Transceivers are configured as RMII mode. Both PHY transceivers have an RJ45 port with embedded
transformer and three-status LEDs.
By default, the ETH0 interface is implemented on the EK board. Additionally, for monitoring and control
purposes, an LED functionality is carried on the RJ45 connectors to indicate activity, link, and speed status information for the respective ports.
Ethernet 1 is only available for SAM9X25. The PHY on Ethernet 1 is enabled by the SELCONFIG signal
from a pull-down resistor on the CM board. Refer to Section 4.4.1 ”DM Board Overview” for detail.
Some pins (PC16, PC20, PC21, PC28, PC26 and PC29) are configured as Ethernet 1 input from PHY
for SAM9X25, whereas they are configured as LCD data pins on other processors. An IO buffer MN17 is
inserted in series with these signals to prevent the LCD from being disturbed by unknown status of the
PHY device.
The Evaluation Kit includes a WM8731 CODEC for digital sound input and output. This interface
includes audio jacks for line audio input (J13) and headphone line output (J15).
The SAM9 processor is configured in IIS slave mode to interface with the WM8731 Codec. The IIS master mode is also possible for evaluation by populating R162/R164 and removing the crystal Y3.
Figure 4-27. Audio Interface
VDDIOP0
R79
R77
CSB = 1:
addr=0011011
R76
R75
MODE = 0: 2-wire
MPU mode for 9x5
TWI interface
PA31
PA30
C117
PA27
PA24
PA26
PA25
PA29
PA28
4.7k
4.7k
C4010u
C4610u
22
CSB
TWI_addr
C45100n
TWC K0
TWD 0
VDDIOP0
27
12324
SDIN
SCLK
DBVDD
DCVDD
10k
10k
21
MODE
C47100n
AUDI O_GND
C4810u
C51 10u
C50 100n
VCC_D AC
14
8
AVDD
HPVDD
AUDI O_GND
RK
C53100n
C56100n
C5410u
R860R
164357
VMIDMICIN
TKTDTF
R8733R
DACDAT
BCLK
RF
RD
R880R
R890R
in Slave Mode
IIS of Audio Interface
6
ADCLRC
ADCD AT
DACLRC
DGND
VCC_D AC
L18
VDDIOP0
28
100n
AUDI O_GND
12
220ohm at 100MHz
R1650R
C116
100n
C115
10u
Y3
12.288MHz
C122
22p
24
13
C121
22p
DNP
R1620R
R162 near CODEC
R164 near SODIMM
R164
22R DNP
PCK0
PB10
11
OSC
15
LLINEIN
LOUT
34
C44
C41
470p
470p
ROUT
13
12
470p
470p
5.6K
5.6K
AUDI O_GND
AUDI O_GND
CLKOUT
XTI/M CLK
MN1 0W M8731SEDS
R74
5.6K
R78
12
L3
220ohm at 100MHz
L4
25
XTO
2
25
26
R81
R80
5.6K
C43
12
220ohm at 100MHz
1
C42
RLINEIN
MICBIAS
RHPOUT
18
C55 100n
10
17
AUDI O_GND
19
20
C49 1u
C52 1u
AUDI O_GND
AUDIO_GND
AGNDHPGND
LHPOU T
9
+
C59220uF /10V+C60220uF /10V
L6
220ohm at 100MHz
12
25
AUDIO_GND
R91
47k
R90
L7
220ohm at 100MHz
12
1
34
AUDIO_GND
47k
C62
470p
AUDIO_GND
C61
470p
AUDI O_GND
J13
LINE_IN
STEREO_3.5mm
HEADPHONE
J15
STEREO_3.5mm
4-34Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
4.3.3.91-Wire EEPROM
The EK board also features a 1-Wire device acting as a “firmware label” to store information like chip
type, manufacturer’s name, production date etc.
Figure 4-28. 1-Wire on EK
4.3.3.10 CAN Bus
Two boards, the SAM9X35-EK and SAM9X25-EK, feature two Controller Area Network (CAN) ports with
transceiver.
PB18
ONE_WIRE
R1450R
VDDAN A
R144
1.5k
MN1 6
2
1
DS2431P
I/O
GND
Evaluation Kit Hardware
3
NC1
4
NC2
5
NC3
6
NC4
CAN0 uses the same IOs (PA9, PA10) as the DBGU. A jumper, JP11, is used to select either of the
interfaces.
Open JP11 to select the CAN function.
Close JP11 to select the DBGU function.
A 3-state output buffer, MN19 is inserted in series with the output channels of the CAN transceiver,
which share IOs with the DBGU. This is necessary because the CAN transceiver does not feature
3-state outputs.
Figure 4-29. CAN on EK
(only for SAM9X35/SAM9X25)
R2110k
Y
R200R
5
4
R3210k
R330R
R3510k
R370R
PA10
SEL_CAN
PA9
CANTX0
CANRX0
PA5
PA6
MN1 9
1
OE
VCC
2
A
3
GND
SN74LVC1G126D BV
CANTX1
VDDI OP0
CANRX1
VDDI OP0
MN5
8
RS
CANH
1
D
CANL
5
EN
4
R
GND
SN65HVD234DR
MN6
8
RS
CANH
1
D
CANL
5
EN
4
R
GND
SN65HVD234DR
VCC
VCC
JP7
12
C20
100n
12
C23
100n
SIP2
JP8
SIP2
7
6
3
2
7
6
3
2
VDDI OP0
VDDI OP0
C24
10u
C21
10u
R19
120R
R34
120R
3V3
5V
3V3
5V
CON2
1
2
3
4
5
6
MJM0606GE06-H
CON3
1
2
3
4
5
6
MJM0606GE06-H
CAN0
CAN1
Evaluation Kit (EK) User Guide4-35
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.3.3.11 Telephone Interface
The Evaluation Kit features a smart DAA (Data Access Arrangement) chip to drive an analog telephone
line on RJ11 6P4C port (J16).
Figure 4-30. Telephone Interface
RJ11
12345
J16
12
L8
220ohm at 100MHz
3
0805
R926.81M
MN11
MJM0606GE06-H
6
D4
TB3100M-13-F
C63
470p12C64
470p
12
12
L9
220ohm at 100MHz
2
2
MMBD3004S-7-FD3
3
MMBD3004S-7-FD5
1
1
DAA_GND
0805
R936.81M
C67 100n
5
TAC
PWR15AVDD
11
EIC
2
4
RAC
TEST
12
100V
1%
R98
280R
1206
1%
R97
280R
12061206
1%1%
R96
280R
R95
280R
1206
MMBAT42
Q5
23
R101
3.01R
1
Q4
1
C69
10n
DAA_GND
MMBAT42
Q2
23
1
C68 47n
DAA_GND
R94
237K
6
RXI
DIBN
16
1
Q3
R99100R
10
7
8
9
EIF
EIO
TXF
TXO
DIBP
14
1%
R103
9R1
1%
MMBAT42
23
R100
3.01R
1%
23
R102
MMBAT42
1
110R
13
CX20548-11Z
GPIO
EP
17
VC
3
DVDD
1206
DAA_GND
DAA_GND
C74
100n
DAA_GND
C66
100n
DAA_GND
C65
100n
TX1
0R can be replaced by
bead to improve EMI
DVDD
C70
47pF
4
LAN0066-50
1
23
C72
150pF
C71
150pF
R1660R
R1670R
DIBP
DIBN
DAA_GND
C73
100n
4-36Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
4.3.3.12 SD/MMC Interface
The Evaluation Kit has two high-speed MultiMedia Card Interfaces (MCI). The first interface is used as a
4-bit interface (MCI0), connected to a MicroSD card slot. The second interface is used as a 4-bit interface (MCI1), connected to an SD/MMC card slot.
The memory card is not included in the Evaluation Kit.
Please note that the power is connected to VCC, which is 3.3 volts.
Figure 4-31. SD/MMC Interface
PD15
PA18
PA15
PA17
PA16
PA20
PA19
(MCI0_CD)
(MCI0_DA1)
(MCI0_DA0)
(MCI0_CK)
(MCI0_CDA)
(MCI0_DA3)
(MCI0_DA2)
VDDNFVDDI OP0
R10
R12
R11
68k
68k
R13
68k
R14
10k
R9
10k
RR1 27R
1
2
3
45
1
2
3
45
RR2 27R
68k
8
7
6
8
7
6
C11
100n
Evaluation Kit Hardware
Micro SD
J6
10
SW2
8
7
6
5
4
3
2
1
SW1
PJS008-2110-0
9
11
12
13
14
PD14
PA2
PA11
PA13
PA12
PA4
PA3
JP6
12
SIP2
(MCI1_WP)
(MCI1_CD)
(MCI1_DA1)
(MCI1_DA0)
(MCI1_CK)
(MCI1_CDA)
(MCI1_DA3)
(MCI1_DA2)
RR427R
1
2
3
45
1
2
3
45
VDDI OP0VDD NF
R15
R16
R17
R18
68k
68k
68k
68k
8
7
6
8
RR5
7
27R
6
123
3V3
678
RR3
10k
45
J7
8
DAT1
7
DAT0
6
VSS
C12
100n
5
CLK
4
VDD
3
VSS
2
CMD
1
DAT3
9
DAT2
7SDCN-B0-0101-F
GND
GND
SH
SH
10
CD
11
WP
12
13
14
15
Evaluation Kit (EK) User Guide4-37
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.3.3.13 ZigBee
The EK board has a 10-pin male connector for the Atmel RZ600 ZigBee module.
DNP 0 Ohm resistors have been implemented in series with the PIO lines that are used elsewhere in the
design. Thereby, enable their individual disconnections, should a conflict occur in user application.
Figure 4-32. ZigBee Interface
4.3.3.14 LED Indicators
The EK board has three LED indicators for purposes shown below:
ZB_RSTN
PA13
PA0
PA21
PD16
ZB_IRQ1
SPI1_NPCS1
SPI1_MISO
DNP
DNP
DNP
DNP
R520R
R560R
R550R
R820R
J10
12
34
56
78
910
HD2X05
DNP
DNP
R530R
R570R
C25
15p
C26
2.2n
ZB_IRQ0
PD17
SPI1_MOSI
SPI1_SPCK
JP10
C27
DNP
2.2u
12
DNP
3V3
PA7
ZB_SLPTR
PA22
PA23
Table 4-8. LED Indicators
ReferenceColorFunction
D2Red3v3 Power indicator
D7RedETH0 Full Duplex
D8RedETH1 Full Duplex
Refer to Section 4.3.3.2 ”Power Supplies” and Section 4.3.3.7 ”Ethernet 10/100 (EMAC) Port” for
details.
4.3.3.15 Expansion Ports
Most GPIOs are routed to expansion ports J1, J2, J3.
All I/Os of the MPU Image Sensor Interface (ISI) are routed to connectors J21.
The LCD and touch screen interfaces are routed to connectors J21, J22.
Table 4-21. SODIMM200 CON1 Signal Descriptions (Continued)
FunctionTypex5 pad nameSODIMM 200x5 pad nameTypeFunction
PC17GPIO CLCDDAT17149150LCDDAT18GPIO CPC18
PC19GPIO CLCDDAT19151152LCDDAT20GPIO CPC20
PC21GPIO CLCDDAT21153154GND
PC22GPIO CLCDDAT22155156LCDDAT23GPIO CPC23
PC24GPIO CLCDDISP157158GPIO CPC25
PC26GPIO CLCDPWM159160LCDVSYNCGPIO CPC27
GND161162LCDHSYNCGPIO CPC28
PC29GPIO CLCDDEN163164E1_MDCGPIO CPC30
PC31GPIO CE1_MDIO165166SELCONFIG
VDDANAPOWER OUTPUT167168POWER OUTPUTVDDANA
PB0GPIO BE0_RX0169170E0_RX1GPIO BPB1
PB2GPIO BE0_RXER171172E0_RXDVGPIO BPB3
PB4GPIO BE0_TXCK173174E0_MDIOGPIO BPB5
PB6GPIO BE0_MDC175176E0_TXENGPIO BPB7
PB8GPIO BE0_TXER177178GNDANA
PB9GPIO BE0_TX0179180E0_TX1GPIO BPB10
PB11GPIO BE0_TX2181182E0_TX3GPIO BPB12
PB13GPIO BE0_RX2183184E0_RX3GPIO BPB14
PB15GPIO BE0_RXCK185186E0_CRSGPIO BPB16
PB17GPIO BE0_COL187188GNDANA
PB18GPIO BIRQ189190POWER OUTPUTPOWR_REF
GND191192ETHLED0
ETH0_TX+ETH193194ETHLED1
ETH0_TX-ETH195196ETHLED2
ETH0_RX+ETH197198ETHAVDDT
ETH0_RX-ETH199200GND_ETH
4.3.5.3JTAG/ICE Connector
Figure 4-37. JTAG J9
4-50Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
Table 4-22. JTAG/ICE Connector J13 Signal Descriptions
PinMnemonicDescription
This is the target reference voltage. It is used to check if the target has power,
1VTref. 3.3V power
to create the logic-level reference for the input comparators, and to control the
output logic levels to the target. It is normally fed from VDD on the target board
and must not have a series resistor.
Evaluation Kit Hardware
2Vsupply. 3.3V power
nTRST TARGET RESET - Active-low output
3
signal that resets the target
4GNDCommon ground
TDI TEST DATA INPUT - Serial data output
5
line, sampled on the rising edge of the TCK
signal.
6GNDCommon ground
7TMS TEST MODE SELECT
8GNDCommon ground
TCK TEST CLOCK - Output timing signal,
9
for synchronizing test logic and control
register access.
10GNDCommon ground
RTCK - Input Return test clock signal from
11
the target.
This pin is not connected in SAM-ICE. It is reserved for compatibility with other
equipment. Connect to VDD or leave open in target system.
JTAG Reset. Output from SAM-ICE to the Reset signal on the target JTAG port.
Typically connected to nTRST on the target CPU. This pin is normally pulled
HIGH on the target to avoid unintentional resets when there is no connection.
JTAG data input of target CPU. It is recommended that this pin is pulled to a
defined state on the target board. Typically connected to TDI on target CPU.
JTAG mode set input of target CPU. This pin should be pulled up on the target.
Typically connected to TMS on target CPU. Output signal that sequences the
target's JTAG state machine, sampled on the rising edge of the TCK signal.
JTAG clock signal to target CPU. It is recommended that this pin is pulled to a
defined state on the target board. Typically connected to TCK on target CPU.
Some targets must synchronize the JTAG inputs to internal clocks. To assist in
meeting this requirement, a returned and retimed TCK can be used to
dynamically control the TCK rate. SAM-ICE supports adaptive clocking which
waits for TCK changes to be echoed correctly before making further changes.
Connect to RTCK if available, otherwise to GND.
12GNDCommon ground
TDO JTAG TEST DATA OUTPUT - Serial
13
data input from the target.
14GNDCommon ground
15nSRST RESETActive-low reset signal. Target CPU reset signal.
16GNDCommon ground
17RFUThis pin is not connected in SAM-ICE.
18GNDCommon ground
19RFUThis pin is not connected in SAM-ICE.
20GNDCommon ground
JTAG data output from target CPU. Typically connected to TDO on target CPU.
Evaluation Kit (EK) User Guide4-51
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.3.5.4USB Type A Dual Port
Figure 4-38. USB Type A Dual Port J19
Table 4-23. USB Type A Dual Port J19 Signal Descriptions
PinMnemonicDescription
A1Vbus – USB_A5V power
A2DM – USB_AData minus
A3DP – USB_AData plus
A4GNDCommon ground
B1Vbus – USB_A5V power
B2DM – USB_AData minus
B3DP – USB_AData plus
B4GNDCommon ground
Mechanical pinsShield
4-52Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
4.3.5.5USB Micro AB
Figure 4-39. USB USB Host/Device Micro AB Connector J20
Table 4-24. USB USB Host/Device Micro AB Connector J20 Signal Descriptions
Evaluation Kit Hardware
PinMnemonicDescription
1Vbus5v power
2DMData minus
3DPData plus
4IDOn the Go Identification
5GNDCommon ground
4.3.5.6DBGU
Figure 4-40. DBGU Connector J11
Table 4-25. DBGU Connector J11 Signal Descriptions
PinMnemonicDescription
1, 4, 6, 9NO CONNECTION
2RXD (RECEIVED DATA)RS232 serial data output signal
3TXD (TRANSMITTED Data)RS232 serial data input signal
5GNDCommon ground
7RTS (REQUEST TO SEND)NO USED
8CTS (CLEAR TO SEND)NO USED
Mechanical pinsShield
Evaluation Kit (EK) User Guide4-53
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.3.5.7RS232 Connector with RTS/CTS Handshake Support
Figure 4-41. USART Connector J12, J13
Table 4-26. USART Connector J12 Signal Descriptions
PinMnemonicDescription
1, 4, 6, 9NO CONNECTION
2RXD (RECEIVED DATA)PA1RS232 serial data output signal
3TXD (TRANSMITTED Data)PA0RS232 serial data input signal
5GNDCommon ground
7RTS (REQUEST TO SEND)PA2Active-positive RS232 input signal
8CTS (CLEAR TO SEND)PA3Active-positive RS232 output signal
Mechanical pinsShield
Table 4-27. USART Connector J13 Signal Descriptions
PinMnemonicDescription
1, 4, 6, 9NO CONNECTION
2RXD (RECEIVED DATA)PC23RS232 serial data output signal
3TXD (TRANSMITTED Data)PC22RS232 serial data input signal
5GNDCommon ground
7RTS (REQUEST TO SEND)PC24Active-positive RS232 input signal
8CTS (CLEAR TO SEND)PC25Active-positive RS232 output signal
Mechanical pinsShield
4-54Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
4.3.5.8DAA RJ11 Socket (6P4C)
Figure 4-42. DAA RJ11 Socket J16
Table 4-28. DAA RJ11 Socket J16 Signal Descriptions
PinMnemonicDescription
1, 2, 5, 6NO CONNECTION
3RAC RING side of ordinary telephone line
4TACTIP side of ordinary telephone line
4.3.5.9CAN RJ12 Socket (6P6C)
Evaluation Kit Hardware
Figure 4-43. CAN RJ12 Socket CON2, CON3
Table 4-29. DAA RJ11 Socket J16 Signal Descriptions
PinMnemonicDescription
13V3POWER PIN
25VPOWER PIN
4CANLCAN bus differential pair
5CANHCAN bus differential pair
4, 6GNDCommon ground
Evaluation Kit (EK) User Guide4-55
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.3.5.10 MicroSD MCI0
Figure 4-44. MicroSD Socket J6
Table 4-30. MicroSD Socket J6 Signal Descriptions
PinMnemonicDescription
1DAT2Data Bit 2
2CD/DAT3Card Detect/Data Bit 3
3CMDCommand Line
4VCCSupply Voltage 3.3V
5CLKCommand Line
6VSSCommon ground
7DAT0Data Bit 0
8DAT1Data Bit 1
9SW1No use, grounded
10CARD DETECTCARD DETECT
4.3.5.11 SD/MMC MCI1
Figure 4-45. SD/MMC Socket J7
Table 4-31. SD Socket J7 Signal Descriptions
PinMnemonicPIO
Signal
SD Card
MMC Card
1-Bit Mode4-Bit Mode
1MCI1_DA2PA3Not UsedRead Wait (RW)Data Line DAT2 or Read Wait (RW)
2MCI1_DA3PA4ReservedNot UsedData Line DAT3
3MCI1_CDAPA12Command/Response
4VDDIOP0Supply Voltage (3.3-volts) VDDIOP0
4-56Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
Table 4-31. SD Socket J7 Signal Descriptions (Continued)
Evaluation Kit Hardware
Signal
PinMnemonicPIO
MMC Card
1-Bit Mode4-Bit Mode
5MCI1_CKPA13Clock
6GNDGround
7MCI1_DA0PA11Data Line DAT0
8MC1_DA1PA2Not UsedInterrupt (IRQ)Data Line DAT1 or Interrupt (IRQ)
9GNDGround
10MCI1_CDPD14Card Detect, configured as GPIO, Power domain VDDNF
11WPWrite Protect Detect, connects to jumper JP6
12GNDGround
13GNDGround
14GNDGround
15GNDGround
SD Card
4.3.5.12 Ethernet RJ45 Socket J17, J18
Figure 4-46. Ethernet RJ45 Socket J17, J18
Table 4-32. DAA RJ11 Socket J16 Signal Descriptions
PinMnemonicDescription
1TX+DIFFERENTIAL OUTPUT PLUS
2TX-DIFFERENTIAL OUTPUT MINUS
3RX+DIFFERENTIAL INPUT PLUS
4Reserved
5ReservedDIFFERENTIAL INPUT MINUS
6RX-
7Reserved
8Reserved
Evaluation Kit (EK) User Guide4-57
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.3.5.13 ZigBee Socket J10
Figure 4-47. ZigBee Socket J10
Table 4-33. ZigBee Socket J10 Signal Descriptions
Function
Reset/RST12Misc.
Interrupt
Request
SPI chip select/SEL56MOSISPI MOSI
SPI MISOMISO78SCLKSPI CLK
Power SupplyGNDGND910VCCVCCVCC
Signal
Name
IRQ34SLP_TRSLP_TR
PortPinPinPort
Signal
Name
Function
4.3.5.14 LCD/ISI Socket J21
Figure 4-48. LCD/ISI Socket J21
Option on misc. port set by
OR or solder shunts
EEprom for MAC
address, cap array
settings and serial
number
TST: test mode
activation
CLKM: RF chip clock
output
Voltage range: 1.8v to 5.5v,
regulated to 3.3v
Table 4-34. LCD/ISI Socket J21 Signal Descriptions
LCDISIPin NumPin NumISILCD
3V33V312GNDGND
VDDISIVDDISI34GNDGND
ZB_IRQ0ZB_IRQ056ZB_IRQ1
TWCK0TWCK078TWD0
GNDGND910ISI_MCKLCDDAT15
GNDGND1112ISI_VSYNCLCDDAT13
GNDGND1314ISI_HSYNCLCDDAT14
4-58Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
Table 4-34. LCD/ISI Socket J21 Signal Descriptions (Continued)
LCDISIPin NumPin NumISILCD
GNDGND1516ISI_PCKLCDDAT12
GNDGND1718ISI_D0LCDDAT0
LCDDAT1ISI_D11920ISI_D2LCDDAT2
LCDDAT3ISI_D32122ISI_D4LCDDAT4
LCDDAT5ISI_D52324ISI_D6LCDDAT6
LCDDAT7ISI_D72526ISI_D8LCDDAT8
LCDDAT9ISI_D92728ISI_D10LCDDAT10
LCDDAT11ISI_D112930GNDGND
4.3.5.15 LCD/TSC Socket J22
Figure 4-49. LCD/TSC Socket J22
Evaluation Kit Hardware
Table 4-35. LCD/TSC Socket J22 Signal Descriptions
LCDPin NumPin NumLCD
5V5V_INTER12GNDGND
5V5V_INTER34GNDGND
LCDDAT1656LCDDAT17
LCDDAT1878LCDDAT19
LCDDAT20910LCDDAT21
LCDDAT221112LCDDAT23
GNDGND1314GNDGND
LCDDISP1516LCDPWM
LCDCSYNC1718LCDHSYNC
LCDDEN1920LCDPCK
GNDGND2122GNDGND
AD0_XPTSC2324TSCAD1_XM
AD2_YPTSC2526TSCAD3_YM
AD4_LRTSC2728ONE_WIRE
GNDGND2930GNDGND
SPI1_MISO3132SPI1_MOSI
SPI1_SPCK3334SPI1_NPCS1
EN_PWRLCDSELCONFIG3536LCD_DETECTLCD_DETECT#
PD163738PD17
GNDGND3940GNDGND
Evaluation Kit (EK) User Guide4-59
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.3.5.16 IO Expansion Port J1
Figure 4-50. IO Expansion Socket J1
Table 4-36. Expansion Socket J1 Signal Descriptions
PIOPowerPin NumPin NumPowerPIO
PA056PA16
PA178PA17
PA2910PA18
PA31112PA19
PA41314PA20
3V3, or 5V123V3, or 5V
GND34GND
PA51516PA21
PA61718PA22
PA71920PA23
PA82122PA24
PA92324PA25
PA102526PA26
PA112728PA27
PA122930PA28
PA133132PA29
PA143334PA30
PA153536PA31
GND3738GND
3V339403V3
4-60Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
4.3.5.17 IO Expansion Port J2
Figure 4-51. IO Expansion Socket J2
Table 4-37. Expansion Socket J1 Signal Descriptions
PIOPowerPin NumPin NumPowerPIO
PC056PC16
PC178PC17
PC2910PC18
PC31112PC19
PC41314PC20
Evaluation Kit Hardware
3V3, or 5V123V3, or 5V
GND34GND
PC51516PC21
PC61718PC22
PC71920PC23
PC82122PC24
PC92324PC25
PC102526PC26
PC112728PC27
PC122930PC28
PC133132PC29
PC143334PC30
PC153536PC31
GND3738GND
3V339403V3
Evaluation Kit (EK) User Guide4-61
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.3.5.18 IO Expansion Port J3
Figure 4-52. IO Expansion Socket J3
Table 4-38. Expansion Socket J1 Signal Descriptions
This agreement is our pr operty. Reproduction and publ ication without our writ ten authorization shal l expose offender to legal proceedings.
This agreement is our pr operty. Reproduction and publ ication without our writ ten authorization shal l expose offender to legal proceedings.
This agreement is our pr operty. Reproduction and publ ication without our writ ten authorization shal l expose offender to legal proceedings.
ANALOG Reference 3V
3
NC13NC24NC35NC4
I/O2GND
MN16
MN16
R1450RR1450R
6
DS2431P
DS2431P
1
NRST {3,6,10,1 1}
WAKE UP {3}
R144
1.5k
R144
1.5k
R142
1.5k
R142
1.5k
4
3V3
R141
100k
R141
100k
VDDANA
3
4
BP2BP2
BP1BP1
VBAT{3,4}
5
WAKE UP
NRST
PUSH BUTTON
DD
CC
ONE WIRE EEPROM
BB
ONE_WIRE
PB18{3,14}
AA
4-76Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
5
1
2
LCD & ISI
PA13{3,5 ,6}
PA30{3,8 }
R1480RR1480R
R1490RR1490R
PC15{3}
PC13{3}
PC14{3}
PC12{3}
R19422RR19422R
R19722RR19722R
R19622RR19622R
R19522RR19522R
ISI_MCK
ISI_VSYNC
ISI_HSYNC
ISI_PCK
PC0{3}
PC2{3}
PC4{3}
R20022RR20022R
R19922RR19922R
R19822RR19822R
ISI_D0
ISI_D2
ISI_D4
PC6{3}
PC8{3}
PC10{3}
R20322RR20322R
R20222RR20222R
R20122RR20122R
ISI_D6
ISI_D8
ISI_D10
LCD/TSC
Evaluation Kit Hardware
14
14
14
14
14
14
XX-XXX-XXDerekX.X
XX-XXX-XXDerekX.X
XX-XXX-XXDerekX.X
B
B
B
REV. SHEET
REV. SHEET
REV. SHEET
VER.
VER.
VER.
1
DATE
DATE
DATE
10-JUN-10
10-JUN-10
PC17{3}
PC19{3,11}
PC21{3,11}
PC23{3,7}
PC26{3,11}
PC28{3,11}
PC30{3,11}
PB12{3}
PB14{3}
PB18{3,1 3}
PA22{3,6 }
PA0{3,6,7}
PD17{3,12}
LCD_DETECT# {12}
R1610RR1610R
R1570RR1570R
R1550RR1550R
R1530RR1530R
R21222RR21222R
R21422RR21422R
R21122RR21122R
R21322RR21322R
R1510RR1510RR1500RR1500R
R21522RR21522R
R21622RR21622R
R1700RR1700R
R1590RR1590R
10-JUN-10
DES.
DES.
DES.
1/1
1/1
1/1
MODIF.
MODIF.
MODIF.
BDerek 11- Oct-10 X.X XX-XXX- XX
A
A
A
SCALE
SCALE
SCALE
REVDATE
REVDATE
REVDATE
2
LCD & ISI
LCD & ISI
LCD & ISI
This agreement is our pr operty. Reproduction and publ ication without our writ ten authorization shal l expose offender to legal proceedings.
This agreement is our pr operty. Reproduction and publ ication without our writ ten authorization shal l expose offender to legal proceedings.
This agreement is our pr operty. Reproduction and publ ication without our writ ten authorization shal l expose offender to legal proceedings.
AT91SAM9x5-EK
AT91SAM9x5-EK
AT91SAM9x5-EK
LCDDAT19
LCDDAT21
LCDDAT23
141618
910
111213151719
LCDDAT22
LCDDISPLCDPWM
LCDDAT18
LCDDAT20
R20522RR20522R
R20822RR20822R
R20722RR20722R
R20622RR20622R
LCDHSYNC
LCDPCK
AD1_XM
20
2122
2324
LCDDEN
LCDVSYNC
AD0_XP
R21022RR21022RR21722RR21722R
R20922RR20922R
AD3_YM
ONE_WIRE
2526
2728
2930
3132
AD2_YP
AD4_LR
R1560RR1560R
R1540RR1540R
R1520RR1520R
SPI1_NPCS1
3334
3536
3738
3940
SPI1_MISOSPI1_MOSI
SPI1_SPCK
EN_PWRLCD
R1580RR1580R
R1600RR1600R
R1630RR1630R
3
ESW-120-3 3-L-D
ESW-120-3 3-L-D
4
DNP
DNP
R1870R
R1870R
PB18LCDHSYNC
5V_INTER{12}
J22
J22
12
34
LCDDAT17
56
78
LCDDAT16
R20422RR20422R
LCDDAT0
LCDDAT2
LCDDAT4
LCDDAT12
LCDDAT14
LCDDAT13
LCDDAT15
ZB_IRQ1
141618
3
4
J21
J21
12
34
56
78
910
111213151719
ZB_IRQ0
R1470RR1470R
TWCK0TWD0
R1460RR1460R
3V3
LCDDAT8
20
2122
2324
2526
LCDDAT7
LCDDAT3
LCDDAT1
LCDDAT5LCDDAT6
ISI_D1
ISI_D3
ISI_D5
ISI_D7
R18922RR18922R
R18822RR18822R
R19122RR19122R
R19022RR19022R
LCDDAT10
2728
2930
ESW-115-3 3-L-D
ESW-115-3 3-L-D
LCDDAT9
LCDDAT11
ISI_D9
ISI_D11
R19222RR19222R
R19322RR19322R
5V_INTER
5
ISI only For SAM9G25
PA7{3,6}
PA31{3,8}
VDDISI{4}
PC1{3}
PC3{3}
PC5{3}
PC7{3}
PC9{3}
PC11{3}
LCD only for SAM9G15/SAM9G35/SAM9X35
DD
CC
PC16{3,11}
PC18{3,11}
PC20{3,11}
PC22{3,7}
PC24{3,7}
PC27{3,11}
PC29{3,11}
BB
PA21{3,6}
PB11{3}
PA23{3,6}
PB13{3}
PB15{3}
PD16{3,12}
SELCONFIG{ 3,7,11}
AA
Evaluation Kit (EK) User Guide4-77
11115A–ATARM–27-Jul-11
5
Evaluation Kit Hardware
4.4Optional Display Module (DM) Board Hardware
4.4.1DM Board Overview
The optional DM board carries a 5.0" TFT LCD module with touch screen. The DM board also carries
four QTouch pads.
Figure 4-54. DM Board Layout
4.4.2Equipment List
The list of the DM board components follows:
One 5.0" TFT LCD module
LCD Back light driver
3.3V regulator
QTouch device
1-Wire device
4.4.3Function Blocks
4.4.3.13.3V Regulator
The DM Board features its own LDO for local power regulation. It accepts DC 5V power from a 500 mA
high-side power switch on the EK and outputs a regulated +3.3 V to most other circuits on the board.
Figure 4-55. DM Board Power Supply
SELCONF IG
C12
10u
5V_INTER
C13
100n
MN3
1
VIN
2
GND
EN3BYP
C15
SPX3819
2.2u
500mA capability
VOUT
3V3_LCD
5
C10
10u
4
C11
100n
4-78Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
4.4.3.2TFT LCD with Touch Panel
A 5" 800x480 LCD provides the DM with a low power display feature, back light unit and a touch panel,
similar to that used on commercial PDAs.
Graphics and text can be displayed on the dot matrix panel with up to 16 million colors by supplying 24bit data signals (8bit x RGB by default) or 16-bit data signals (5+6+5bit x RGB in option). This allows the
user to develop graphical user interfaces for a wide variety of end applications.
Warning: Never connect/disconnect the LCD display from the board while the power supply is on. Doing
so may damage both units.
The back light voltage is generated from a CP2122ST boost converter. It is powered directly by the DC
5V from the EK board. The back light level is controlled by a PWM signal generated from the MPU
Device processor.
Figure 4-57. Back Light Control
LCDPW M
MN1
5
VIN
4
SHDN #
CP2122ST
L1
22uH
880mA
SW
GND
D1
RB160M-60
60V/1A
1
2
3
FB
5V_INTER
5V/217mA24.5V/40mA
C7
10u
10V
R40
10k
2 x 7 LEDs Bac k Light
2*20mA, 24.5V
C9
2.2u
50V
300mV
R41
7R5
VLED+
VLED-
4.4.3.4QTouch
The DM board carries a QTouch device piloted through a TWI interface. It manages four capacitive
touch buttons directly printed on the PCB.
There are dual footprints for the QTouch device, and SOIC is the default mounted one.
Figure 4-58. QTouch
3V3_LCD
MN5
R63
10k
TWC K0
TWD 0
CHAN GE#
R56
4.7k
3V3_LCD
R57
R58
DNP
DNP
4.7k
4.7k
RESET#
15
12
14
13
10
18
19
20
MN4
6
7
SCL
SDA
CHANGE
RESET
QT1070
NC5
NC4
NC3
NC2
NC1
NC0
8
3V3_LCD
9
DNP
VSS
11
VDD
MODE(VSS)
C14
100n
KEY6
KEY5
KEY4
KEY3
KEY2
KEY1
KEY0
21
TWD 0
RESET#
CHANGE#
TWC K0
1
VDD
2
MODE(VSS)
3
SDA
4
RESET
5
CHANGE
6
SCL
KEY67KEY5
QT1070_SOIC
C16 100n
16
17
1
2
KEY4
3
4
5
Thermal
R594.7k DNP
KEY3
R604.7k DNP
KEY2
R614.7k DNP
KEY1
R624.7k DNP
VSS
KEY0
KEY1
KEY2
KEY3
KEY4
14
13
12
11
10
9
8
R654.7k
R664.7k
R674.7k
R684.7k
KEY
KEY
KEY
K4
K3
K2KEY
K1
4-80Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
4.4.3.51-Wire
Evaluation Kit Hardware
The DM board also uses a 1-Wire device as “firmware label” to store the information such as chip type,
manufacturer’s name, production date etc.
Figure 4-59. 1-Wire on DM
3V3_LCD
R45
4.7k
ONE_WI RE
MN2
1
NC1
2
NC2
3
DATA
GND4NC3
DS2433S
NC6
NC5
NC4
8
7
6
5
Evaluation Kit (EK) User Guide4-81
11115A–ATARM–27-Jul-11
Evaluation Kit Hardware
4.4.4Schematics
Figure 4-60. DM Board Schematics
1
1
1
1
1
1
XX-XXX-XX
XX-XXX-XX
XX-XXX-XX
XX-XXX-XX
X.X01-tcO-11B
B
B
B
X.X
X.X
X.X
REV. SHEET
REV. SHEET
REV. SHEET
VER.
VER.
VER.
DATE
DATE
DATE
10-JUN-10
10-JUN-10
10-JUN-10
DES.
DES.
DES.
Derek
Derek
Derek
Derek
1
1/1
1/1
1/1
MODIF.
MODIF.
MODIF.
A
A
A
SCALE
SCALE
SCALE
REVDATE
REVDATE
REVDATE
blication without our written authorization shall expose offender to legal proceedings.
blication without our written authorization shall expose offender to legal proceedings.
blication without our written authorization shall expose offender to legal proceedings.
XX-XXX-XX
LCD BOARD
LCD BOARD
LCD BOARD
This agreement is our property. Reproduction and pu
This agreement is our property. Reproduction and pu
This agreement is our property. Reproduction and pu
AT91SAM9x5-EK
AT91SAM9x5-EK
AT91SAM9x5-EK
2
R614.7k DNPR614.7k DNP
KEY2
4
NC47NC3
10
KEY1
K1
K3
K2KEY K2KEY
KEYK3KEY
KEYK1KEY
R624.7k DNPR624.7k DNP
KEY1
5
Thermal
21
KEY0
MODE(VSS)
11
VSS
8
NC218NC1
NC0
19
20
K4
KEYK4KEY
1
R674.7kR674.7k
R664.7kR664.7k
R654.7kR654.7k
R684.7kR684.7k
14
10
13
9
11
VSS
KEY3
KEY112KEY0
KEY58KEY4
KEY2
QT1070_SOIC
QT1070_SOIC
VDD1MODE(VSS)
RESET
SCL6KEY6
SDA
CHANGE
MN5
MN5
4
5
7
2
3
ONE_WIRE
LCDDAT23
11121315
LCDDAT22
141618
R190RR190R
AD3_YM
AD1_XM
LCDHSYNC
LCDPWM
LCDPCK
20
17
19
2324
2728
2122
2526
2930
3132
LCDDEN
AD0_XP
LCDDISP
AD2_YP
AD4_LR
LCDVSYNC
LCDDAT21
LCDDAT17
LCDDAT8
LCDDAT15
LCDDAT2
LCDDAT4
LCDDAT10
LCDDAT14
LCDDAT12
LCDDAT13
LCDDAT0
TWCK0TWD0
910
111213151719
141618
LCDDAT6
20
30
2122
23242526
2728
29
LCDDAT1
LCDDAT11
LCDDAT3
LCDDAT5
LCDDAT7
LCDDAT9
2
45678
J2
3
12
3V3
DNP
DNP
ZB_IRQ0
CHANGE#
R50R DNPR50R DNP
R60R
R60R
3V3_LCD
LCDDAT19
J3
TSM-115-01-L-DV-AJ2TSM-115-01-L-DV-A
56
910
12
34
78
5V_INTER
LCDDAT16
LCDDAT18
LCDDAT20
3V3_LCD
TWD0
RESET#
CHANGE#
TWCK0
R230RR230R
LCD_DETECT
3536
3334
3738
R220RR220R
SELCONFIG
C16 100nC16 100n
C14
100n
C14
100n
3V3_LCD
3940
TSM-120-01-L-DV-AJ3TSM-120-01-L-DV-A
R58
DNP
R58
DNP
R57
R57
DNP
DNP
3V3_LCD
R56
R56
R63
R63
DNP
DNP
R604.7k
R604.7k
R594.7k DNPR594.7k DNP
KEY4
KEY3
3
17
16
KEY41KEY32KEY2
KEY5
KEY6
VDD
9
DNP
DNP
QT1070
QT1070
SDA
RESET13NC5
SCL
CHANGE
MN4
MN4
6
12
15
14
4.7k
4.7k
RESET#
4.7k
4.7k
4.7k
4.7k
10k
10k
TWCK0
TWD0
CHANGE#
LCDDAT14
FB
SHDN#
CP2122ST
CP2122ST
VLED-
300mV
R40
R40
LCDDAT15
LCDDAT22
LCDDAT23
DNP
DNP
R420R
R420R
R430RR430R
R460RR460R
R440R DNPR440R DNP
RED6
RED7
R41
R41
7R5
7R5
2 x 7 LEDs Back Light
10k
10k
LCDDAT13
LCDDAT11
LCDDAT12
LCDDAT21
LCDDAT20
LCDDAT19
DNP
DNP
R510R DNPR510R DNP
R490R
R490R
R520RR520R
R480RR480R
R500RR500R
R470R DNPR470R DNP
R0R1R2R3R4
RED5
RED4
RED3
3V3_LCD
3V3_LCD
2*20mA, 24.5V
5V_INTER
LCDDAT18
R530RR530R
RED2
LCDDAT17
R540RR540R
RED1
MN3
MN3
LCDDAT16
R550RR550R
RED0
R45
R45
C10
C10
5
VOUT
VIN1GND2EN
8
MN2
MN2
4.7k
4.7k
C11
C11
100n
100n
10u
10u
4
BYP
3
SELCONFIG
AA
6
5
NC4
NC3
NC57NC6
DS2433S
DS2433S
GND
NC11NC22DATA
3
4
ONE_WIRE
SPX3819
SPX3819
500mA capability
C15
2.2u
C15
2.2u
100n
100n
C13
C13
C12
10u
C12
10u
3
4
5
LCDDAT0
LCDDAT2
LCDDAT3
LCDDAT4
LCDDAT1
3
AD2_YP
AD1_XM
AD0_XP
AD3_YM
R64
R64
C3
10n
C3
10n
C2
10n
C1
10n
C4
10n
C4
10n
R10RR10R
R20RR20R
R40RR40R
R30RR30R
4
X_RIGHT
VLED+
VLED-
43
41
45
44
42
40
GND6
LED1-
LED2-
LED2+
LED1+
5
M1
M1
LCDDISP
220K
DNP
220K
DNP
DNP
DNP
DNPC210n
DNP
R727RR727R
DNPC110n
DNP
DNP
DNP
X_LEFT
Y_LOW
Y_UP
LCDVSYNC
LCDDEN
LCDHSYNC
LCDPCK
36
30
35
34
29
32
31
33
39
38
Y237X2
X1
Y1
DE
STB
GND5
GND4
VSYNC
HSYNC
DOTCLK
PIN 45
PIN 45
DD
BLUE3
BLUE7
BLUE5
BLUE4
BLUE1
BLUE2
BLUE6
28
26
B627B7
GND3
TOP SIDE
TOP SIDE
on
on
Conductors
Conductors
800(H)×RGB×480(V)
800(H)×RGB×480(V)
5'' LCD,
5'' LCD,
GREEN7
BLUE0
20
B021B122B223B324B425B5
PIN 1
PIN 1
FOXLINK
FOXLINK
LCDDAT4
LCDDAT5BLUE5
LCDDAT6
LCDDAT7
DNP
DNP
R120R DNPR120R DNP
R160R DNPR160R DNP
R150RR150R
R100R DNPR100R DNP
R110R DNPR110R DNP
R140R
R140R
R130RR130R
R90RR90R
R80RR80R
B0B1B2
B3
B4
BLUE7
BLUE4
BLUE6
BLUE[0..7]
RED5
GREEN1
GREEN3
GREEN4
GREEN5
RED6
RED7
GREEN0
GREEN2
GREEN6
19
11
12
16
10
18
R7
R6
G417G5
G7
G013G114G215G3
G6
CC
LCDDAT10
LCDDAT6
LCDDAT7
LCDDAT9
LCDDAT3
LCDDAT1
LCDDAT0
LCDDAT2
R200RR200R
R210RR210R
R170RR170R
R180RR180R
BLUE0
BLUE2
BLUE3
BLUE1
GREEN[0..7]
RED4
RED1
RED3
RED2
RED0
5
9
8
R16R27R3
R5
R4
FL500WVR00-A0T
FL500WVR00-A0T
LCDDAT13GREEN5
LCDDAT10
LCDDAT12
LCDDAT14
LCDDAT15GREEN7
DNP
DNP
R270RR270R
R240R DNPR240R DNP
R250RR250R
R290RR290R
R280R DNPR280R DNP
R260R
R260R
G3
G5
G4
GREEN6
RED[0..7]
3V3_LCD
10uC610u
C6
C5
100nC5100n
3
2
4
1
J1J1
R0
VCC2
VCC1
GND1
GND2
880mA
22uHL122uH
L1
5V_INTER
DNP
DNP
R300R
R300R
R320RR320R
R340R DNPR340R DNP
G1
G2
GREEN4
VLED+
24.5V/40mA
D1
RB160M-60D1RB160M-60
5V/217mA
C7
R330RR330R
GREEN3LCDDAT11
C9
60V/1A
10uC710u
10V
LCDDAT8
R360RR360R
R350R DNPR350R DNP
R380RR380R
R370RR370R
G0
GREEN0
GREEN1
GREEN2
50V
2.2uC92.2u
1
3
2
SW
GND
VIN
MN1
MN1
4
5
LCDPWM
BB
LCDDAT5
LCDDAT8
LCDDAT9
4-82Evaluation Kit (EK) User Guide
11115A–ATARM–27-Jul-11
5.1Revision History
Table 5-1.
DocumentComments
11115AFirst issue.
Section 5
Revision History
Change
Request Ref.
Evaluation Kit (EK) User Guide5-1
11115A–ATARM–27-Jul-11
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