– 131 Powerful Instructions – Most Single-clock Cycle Execution
– 32 x 8 General Purpose Working Registers
– Fully Static Operation
– Up to 20 MIPS Throughput at 20 MHz
– On-chip 2-cycle Multiplier
• High Endurance Non-volatile Memory segments
– 16/32/64K Bytes of In-System Self-programmable Flash program memory
– 512B/1K/2K Bytes EEPROM
– 1/2/4K Bytes Internal SRAM
– Write/Erase Cycles: 10,000 Flash/ 100,000 EEPROM
– Data retention: 20 years at 85°C/100 years at 25°C
– Optional Boot Code Section with Independent Lock Bits
In-System Programming by On-chip Boot Program
True Read-While-Write Operation
– Programming Lock for Software Security
• JTAG (IEEE std. 1149.1 Compliant) Interface
– Boundary-scan Capabilities According to the JTAG Standard
– Extensive On-chip Debug Support
– Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface
• Peripheral Features
– Two 8-bit Timer/Counters with Separate Prescalers and Compare Modes
– One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode
– Real Time Counter with Separate Oscillator
– Six PWM Channels
– 8-channel, 10-bit ADC
Differential mode with selectable gain at 1x, 10x or 200x
– Byte-oriented Two-wire Serial Interface
– Two Programmable Serial USART
– Master/Slave SPI Serial Interface
– Programmable Watchdog Timer with Separate On-chip Oscillator
– On-chip Analog Comparator
– Interrupt and Wake-up on Pin Change
• Special Microcontroller Features
– Power-on Reset and Programmable Brown-out Detection
– Internal Calibrated RC Oscillator
– External and Internal Interrupt Sources
– Six Sleep Modes: Idle, ADC Noise Reduction, Power-save, Power-down, Standby and
Note:The large center pad underneath the VQFN/QFN/MLF package should be soldered to ground on
the board to ensure good mechanical stability.
ATmega164P/324P/644P
8011MS–AVR–08/09
Page 3
1.2Pinout - DRQFN
Top viewBottom view
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A6
A18
B15
A17
B14
A16
B13
A15
B12
A14
B11
A13
A12
B10
A11
B9
A10
B8A9 B7A8 B6
A7
A24
B20
A23
B19
A22
B18
A21
B17
A20
B16
A19
A18
B15
A17
B14
A16
B13
A15
B12
A14
B11
A13
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A6
A19
B16
A20
B17
A21
B18
A22
B19
A23
B20
A24
Figure 1-2.DRQFN - Pinout ATmega164P
ATmega164P/324P/644P
Table 1-1.DRQFN - Pinout ATmega164P/324P
A1PB5A7PD3A13PC4A19PA 3
B1PB6B6PD4B11PC5B16PA 2
A2PB7A8PD5A14PC6A20PA 1
B2RESET
A3VCCA9PD7A15AVC CA21VCC
B3GNDB8VCCB13GNDB18GND
A4XTAL2A10GNDA16AREFA22PB0
B4XTAL1B9PC0B14PA 7B19PB1
A5PD0A11PC1A17PA 6A23PB2
B5PD1B10PC2B15PA 5B20PB3
8011MS–AVR–08/09
A6PD2A12PC3A18PA 4A24PB4
B7PD6B12PC7B17PA 0
3
Page 4
2.Overview
CPU
GND
VCC
RESET
Powe r
Supervision
POR / BOD &
RESET
Watchdog
Oscillator
Watchdog
Timer
Oscillator
Circuits /
Clock
Generation
XTAL1
XTAL2
PORT A (8)
PORT D (8)
PD7..0
PORT C (8)
PC5..0
TWI
SPI
EEPROM
JTAG/OCD
16bit T/C 1
8bit T/C 2
8bit T/C 0
SRAMFLASH
USART 0
Internal
Bandgap reference
Analog
Comparator
A/D
Converter
PA7..0
PORT B (8)
PB7..0
USART 1
TOSC1/PC6TOSC2/PC7
The ATmega164P/324P/644P is a low-power CMOS 8-bit microcontroller based on the AVR
enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the
ATmega164P/324P/644P achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed.
2.1Block Diagram
Figure 2-1.Block Diagram
The AVR core combines a rich instruction set with 32 general purpose working registers. All the
32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent
registers to be accessed in one single instruction executed in one clock cycle. The resulting
architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers.
4
ATmega164P/324P/644P
8011MS–AVR–08/09
Page 5
ATmega164P/324P/644P
The ATmega164P/324P/644P provides the following features: 16/32/64K bytes of In-System
Programmable Flash with Read-While-Write capabilities, 512B/1K/2K bytes EEPROM, 1/2/4K
bytes SRAM, 32 general purpose I/O lines, 32 general purpose working registers, Real Time
Counter (RTC), three flexible Timer/Counters with compare modes and PWM, 2 USARTs, a byte
oriented 2-wire Serial Interface, a 8-channel, 10-bit ADC with optional differential input stage
with programmable gain, programmable Watchdog Timer with Internal Oscillator, an SPI serial
port, IEEE std. 1149.1 compliant JTAG test interface, also used for accessing the On-chip
Debug system and programming and six software selectable power saving modes. The Idle
mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system
to continue functioning. The Power-down mode saves the register contents but freezes the
Oscillator, disabling all other chip functions until the next interrupt or Hardware Reset. In Powersave mode, the asynchronous timer continues to run, allowing the user to maintain a timer base
while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all
I/O modules except Asynchronous Timer and ADC, to minimize switching noise during ADC
conversions. In Standby mode, the Crystal/Resonator Oscillator is running while the rest of the
device is sleeping. This allows very fast start-up combined with low power consumption. In
Extended Standby mode, both the main Oscillator and the Asynchronous Timer continue to run.
The device is manufactured using Atmel’s high-density nonvolatile memory technology. The Onchip ISP Flash allows the program memory to be reprogrammed in-system through an SPI serial
interface, by a conventional nonvolatile memory programmer, or by an On-chip Boot program
running on the AVR core. The boot program can use any interface to download the application
program in the application Flash memory. Software in the Boot Flash section will continue to run
while the Application Flash section is updated, providing true Read-While-Write operation. By
combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip,
the Atmel ATmega164P/324P/644P is a powerful microcontroller that provides a highly flexible
and cost effective solution to many embedded control applications.
The ATmega164P/324P/644P AVR is supported with a full suite of program and system development tools including: C compilers, macro assemblers, program debugger/simulators, in-circuit
emulators, and evaluation kits.
2.2Comparison Between ATmega164P, ATmega324P and ATmega644P
Table 2-1.Differences between ATmega164P and ATmega644P
DeviceFlashEEPROMRAM
ATmega164P16 Kbyte512 Bytes1 Kbyte
ATmega324P32 Kbyte1 Kbyte2 Kbyte
ATmega644P64 Kbyte2 Kbyte4 Kbyte
8011MS–AVR–08/09
5
Page 6
2.3Pin Descriptions
2.3.1VCC
Digital supply voltage.
2.3.2GND
Ground.
2.3.3Port A (PA7:PA0)
Port A serves as analog inputs to the Analog-to-digital Converter.
Port A also serves as an 8-bit bi-directional I/O port with internal pull-up resistors (selected for
each bit). The Port A output buffers have symmetrical drive characteristics with both high sink
and source capability. As inputs, Port A pins that are externally pulled low will source current if
the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes
active, even if the clock is not running.
Port A also serves the functions of various special features of the ATmega164P/324P/644P as
listed on page 81.
2.3.4Port B (PB7:PB0)
Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port B output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port B pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port B also serves the functions of various special features of the ATmega164P/324P/644P as
listed on page 83.
2.3.5Port C (PC7:PC0)
Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port C output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port C pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port C pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port C also serves the functions of the JTAG interface, along with special features of the
ATmega164P/324P/644P as listed on page 86.
2.3.6Port D (PD7:PD0)
Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port D output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port D pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port D also serves the functions of various special features of the ATmega164P/324P/644P as
listed on page 88.
6
ATmega164P/324P/644P
8011MS–AVR–08/09
Page 7
2.3.7RESET
2.3.8XTAL1
2.3.9XTAL2
2.3.10AVCC
2.3.11AREF
ATmega164P/324P/644P
Reset input. A low level on this pin for longer than the minimum pulse length will generate a
reset, even if the clock is not running. The minimum pulse length is given in ”System and Reset
Characteristics” on page 332. Shorter pulses are not guaranteed to generate a reset.
Input to the inverting Oscillator amplifier and input to the internal clock operating circuit.
Output from the inverting Oscillator amplifier.
AVCC is the supply voltage pin for Port A and the Analog-to-digital Converter. It should be externally connected to V
to V
through a low-pass filter.
CC
This is the analog reference pin for the Analog-to-digital Converter.
, even if the ADC is not used. If the ADC is used, it should be connected
CC
8011MS–AVR–08/09
7
Page 8
3.About
3.1Resources
A comprehensive set of development tools, application notes and datasheetsare available for
download on http://www.atmel.com/avr.
3.2About Code Examples
This documentation contains simple code examples that briefly show how to use various parts of
the device. Be aware that not all C compiler vendors include bit definitions in the header files
and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details.
The code examples assume that the part specific header file is included before compilation. For
I/O registers located in extended I/O map, "IN", "OUT", "SBIS", "SBIC", "CBI", and "SBI" instructions must be replaced with instructions that allow access to extended I/O. Typically "LDS" and
"STS" combined with "SBRS", "SBRC", "SBR", and "CBR".
3.3Data Retention
Reliability Qualification results show that the projected data retention failure rate is much less
than 1 PPM over 20 years at 85°C or 100 years at 25°C.
Notes:1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses
should never be written.
2. I/O registers within the address range $00 - $1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions.
3. Some of the status flags are cleared by writing a logical one to them. Note that the CBI and SBI instructions will operate on
all bits in the I/O register, writing a one back into any flag read as set, thus clearing the flag. The CBI and SBI instructions
work with registers 0x00 to 0x1F only.
4. When using the I/O specific commands IN and OUT, the I/O addresses $00 - $3F must be used. When addressing I/O registers as data space using LD and ST instructions, $20 must be added to these addresses. The ATmega164P/324P/644P is a
complex microcontroller with more peripheral units than can be supported within the 64 location reserved in Opcode for the
IN and OUT instructions. For the Extended I/O space from $60 - $FF, only the ST/STS/STD and LD/LDS/LDD instructions
can be used.
12
ATmega164P/324P/644P
8011MS–AVR–08/09
Page 13
ATmega164P/324P/644P
5.Instruction Set Summary
MnemonicsOperandsDescriptionOperationFlags#Clocks
ARITHMETIC AND LOGIC INSTRUCTIONS
ADDRd, RrAdd two RegistersRd ← Rd + RrZ,C,N,V,H1
ADCRd, RrAdd with Carry two RegistersRd ← Rd + Rr + CZ,C,N,V,H1
ADIWRdl,KAdd Immediate to WordRdh:Rdl ← Rdh:Rdl + KZ,C,N,V,S2
SUBRd, RrSubtract two RegistersRd ← Rd - RrZ,C,N,V,H1
SUBIRd, KSubtract Constant from Register Rd ← Rd - KZ,C,N,V,H1
SBCRd, RrSubtract with Carry two RegistersRd ← Rd - Rr - CZ,C,N,V,H1
SBCIRd, KSubtract with Carry Constant from Reg.Rd ← Rd - K - CZ,C,N,V,H1
SBIWRdl,KSubtract Immediate from WordRdh:Rdl ← Rdh:Rdl - KZ,C,N,V,S2
ANDRd, RrLogical AND RegistersRd ← Rd • RrZ,N,V1
ANDIRd, KLogical AND Register and ConstantRd ← Rd • KZ,N,V1
ORRd, RrLogical OR RegistersRd ← Rd v RrZ,N,V1
ORIRd, KLogical OR Register and ConstantRd ← Rd v KZ,N,V1
EORRd, RrExclusive OR RegistersRd ← Rd ⊕ RrZ,N,V1
COMRdOne’s ComplementRd ← 0xFF − RdZ,C,N,V1
NEGRdTwo’s ComplementRd ← 0x00 − RdZ,C,N,V,H1
SBRRd,KSet Bit(s) in RegisterRd ← Rd v KZ,N,V1
CBRRd,KClear Bit(s) in RegisterRd ← Rd • (0xFF - K)Z,N,V1
INCRdIncrementRd ← Rd + 1Z,N,V1
DECRdDecrementRd ← Rd − 1 Z,N,V1
TSTRdTest for Zero or MinusRd ← Rd • Rd Z,N,V1
CLRRdClear RegisterRd ← Rd ⊕ RdZ,N,V1
SERRdSet RegisterRd ← 0xFFNone1
MULRd, RrMultiply UnsignedR1:R0 ← Rd x RrZ,C2
MULSRd, RrMultiply SignedR1:R0 ← Rd x RrZ,C2
MULSURd, RrMultiply Signed with UnsignedR1:R0 ← Rd x RrZ,C2
FMULRd, RrFractional Multiply UnsignedR1:R0 ← (Rd x Rr) << 1Z,C2
FMULSRd, RrFractional Multiply SignedR1:R0 ← (Rd x Rr) << 1Z,C2
FMULSURd, RrFractional Multiply Signed with UnsignedR1:R0 ← (Rd x Rr) << 1Z,C2
BRANCH INSTRUCTIONS
RJMPkRelative JumpPC ← PC + k + 1None2
IJMPIndirect Jump to (Z)PC ← Z None2
JMPkDirect JumpPC ← kNone3
RCALLkRelative Subroutine Call PC ← PC + k + 1None4
ICALLIndirect Call to (Z)PC ← ZNone4
CALLkDirect Subroutine Call PC ← kNone5
RETSubroutine ReturnPC ← STACKNone5
RETIInterrupt ReturnPC ← STACKI5
CPSERd,RrCompare, Skip if Equalif (Rd = Rr) PC ← PC + 2 or 3None1/2/3
CPRd,RrCompareRd − RrZ, N,V,C,H1
CPCRd,RrCompare with CarryRd − Rr − CZ, N,V,C,H1
CPIRd,KCompare Register with ImmediateRd − KZ, N,V,C,H1
SBRCRr, bSkip if Bit in Register Clearedif (Rr(b)=0) PC ← PC + 2 or 3 None1/2/3
SBRSRr, bSkip if Bit in Register is Setif (Rr(b)=1) PC ← PC + 2 or 3None1/2/3
SBICP, bSkip if Bit in I/O Register Clearedif (P(b)=0) PC ← PC + 2 or 3 None1/2/3
SBISP, bSkip if Bit in I/O Register is Setif (P(b)=1) PC ← PC + 2 or 3None1/2/3
BRBSs, kBranch if Status Flag Setif (SREG(s) = 1) then PC←PC+k + 1None1/2
BRBCs, kBranch if Status Flag Clearedif (SREG(s) = 0) then PC←PC+k + 1None1/2
BREQ kBranch if Equal if (Z = 1) then PC ← PC + k + 1None1/2
BRNE kBranch if Not Equalif (Z = 0) then PC ← PC + k + 1None1/2
BRCS kBranch if Carry Setif (C = 1) then PC ← PC + k + 1None1/2
BRCC kBranch if Carry Clearedif (C = 0) then PC ← PC + k + 1None1/2
BRSH kBranch if Same or Higher if (C = 0) then PC ← PC + k + 1None1/2
BRLO kBranch if Lowerif (C = 1) then PC ← PC + k + 1None1/2
BRMI kBranch if Minusif (N = 1) then PC ← PC + k + 1None1/2
BRPL kBranch if Plus if (N = 0) then PC ← PC + k + 1None1/2
BRGE kBranch if Greater or Equal, Signedif (N ⊕ V= 0) then PC ← PC + k + 1None1/2
BRLT kBranch if Less Than Zero, Signedif (N ⊕ V= 1) then PC ← PC + k + 1None1/2
BRHS kBranch if Half Carry Flag Setif (H = 1) then PC ← PC + k + 1None1/2
BRHC kBranch if Half Carry Flag Clearedif (H = 0) then PC ← PC + k + 1None1/2
BRTS kBranch if T Flag Setif (T = 1) then PC ← PC + k + 1None1/2
BRTC kBranch if T Flag Clearedif (T = 0) then PC ← PC + k + 1None1/2
BRVS kBranch if Overflow Flag is Setif (V = 1) then PC ← PC + k + 1None1/2
8011MS–AVR–08/09
13
Page 14
MnemonicsOperandsDescriptionOperationFlags#Clocks
BRVC kBranch if Overflow Flag is Clearedif (V = 0) then PC ← PC + k + 1None1/2
BRIE kBranch if Interrupt Enabledif ( I = 1) then PC ← PC + k + 1None1/2
BRID kBranch if Interrupt Disabledif ( I = 0) then PC ← PC + k + 1None1/2
44M144-pad, 7 x 7 x 1.0 mm body, lead pitch 0.50 mm, Thermally Enhanced Plastic Very Thin Quad Flat No-Lead (VQFN)
18
ATmega164P/324P/644P
8011MS–AVR–08/09
Page 19
7.Packaging Information
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
B
44A
10/5/2001
PIN 1 IDENTIFIER
0˚~7˚
PIN 1
L
C
A1
A2A
D1
D
e
E1E
B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes:1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A––1.20
A10.05–0.15
A2 0.951.001.05
D11.7512.0012.25
D19.9010.0010.10Note 2
E11.7512.0012.25
E19.9010.0010.10Note 2
B 0.30–0.45
C0.09–0.20
L0.45– 0.75
e0.80 TYP
7.144A
ATmega164P/324P/644P
8011MS–AVR–08/09
19
Page 20
7.240P6
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
40P6, 40-lead (0.600"/15.24 mm Wide) Plastic Dual
Inline Package (PDIP)
B
40P6
09/28/01
PIN
1
E1
A1
B
REF
E
B1
C
L
SEATING PLANE
A
0º ~ 15º
D
e
eB
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A––4.826
A10.381––
D52.070–52.578Note 2
E15.240–15.875
E113.462–13.970Note 2
B0.356–0.559
B11.041–1.651
L3.048–3.556
C0.203– 0.381
eB15.494–17.526
e2.540 TYP
Notes:1. This package conforms to JEDEC reference MS-011, Variation AC.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
44M1, 44-pad, 7 x 7 x 1.0 mm Body, Lead
Pitch 0.50 mm, 5.20 mm Exposed Pad, Thermally
Enhanced Plastic Very Thin Quad Flat No
Lead Package (VQFN)
9/26/08
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.80 0.90 1.00
A1 – 0.02 0.05
A3 0.20 REF
b 0.180.230.30
D
D2 5.005.205.40
6.907.007.10
6.907.007.10
E
E2 5.005.205.40
e 0.50 BSC
L 0.59 0.64 0.69
K0.200.260.41
Note: JEDEC Standard MO-220, Fig. 1 (SAW Singulation) VKKD-3.
TOP VIEW
SIDE VIEW
BOTTOM VIEW
D
E
Marked Pin# 1 ID
E2
D2
b
e
Pin #1 Corner
L
A1
A3
A
SEATING PLANE
Pin #1
Triangle
Pin #1
Chamfer
(C 0.30)
Option A
Option B
Pin #1
Notch
(0.20 R)
Option C
K
K
1
2
3
ATmega164P/324P/644P
8011MS–AVR–08/09
21
Page 22
8.Errata
8.1ATmega164P
8.1.1Rev. A
8.2ATmega324P
8.2.1Rev. A
8.3ATmega644P
8.3.1Rev. A
8.3.2Rev. B
No known Errata.
No known Errata.
Not sampled.
No known Errata.
22
ATmega164P/324P/644P
8011MS–AVR–08/09
Page 23
9.Datasheet Revision History
Please note that the referring page numbers in this section are referred to this document. The
referring revision in this section are referring to the document revision.
9.1Rev. 8011M- 08/09
1.Updated ”Features” on page 1.
2.Removed VFBGA - pinout from ”Pin Configurations” on page 2.
3.Updated ”System Control and Reset” on page 50.
4.Updated Input Hysteresis Unit (V) in the “Typical Characteristics”.
Updated ”Ordering Information” on page 420. Removed 44MC and 49C2 packages.
5.
Updated ”Packaging Information” on page 423.
6.
9.2Rev. 8011L- 02/09
ATmega164P/324P/644P
1.Updated ”Features” on page 1 by inserting a table note 1.
2.Merged Sections 3.1, 3.2 and 3.3 in one section ”About” on page 9.
3.Updated the front page by removing “Preliminary”.
4.Updated the ”DC Characteristics” on page 326 by removing
5.Updated the table note1 of the Table 25-6 on page 332.
6.Updated ”Typical Characteristics” on page 339.
6.Updated ”Typical Characteristics” on page 339
9.3Rev. 8011K- 09/08
1.Updated ”Features” on page 1, ”Pin Configurations” on page 2 and ”Ordering Informa-
2.Updated V
3.Updated t
4.Updated typical values for ATmega324P and ATmega644P in the tables of ”DC Char-
5.Replaced the package drawing ”44M1” on page 426 by a rev H update.
2.Added 49-ball VFBGA pinout for ATmega164P/324P in ”Pinout - VFBGA” on page 4.
6.Added 49-ball VFBGA (49C2) to ”Packaging Information” on page 19.
V
IL3/VIH3
the table note 5.
tion” on page 15 according to the updated 44M1 package drawing.
in the table of ”DC Characteristics” on page 326.
OL
RST
and t
unites in the table of ”System and Reset Characteristics” on
BOD
page 332.
acteristics” on page 326.
and V
OL3/VOH3
and
8011MS–AVR–08/09
23
Page 24
9.4Rev. 8011J- 09/08
1.Updated ATmega644P ”Errata” on page 428.
2.Added 49-ball VFBGA pinout for ATmega164P/324P in ”Pinout - VFBGA” on page 4.
6.Added 49-ball VFBGA (49C2) to ”Packaging Information” on page 425.
9.5Rev. 8011I- 05/08
1.Updated description in ”AVCC” on page 7.
2.Updated ”Stack Pointer” on page 14.
3.Updated Data Memory Map addresses, Figure 7-2 on page 21.
4.Updated description of use of external capacitors in ”Low Frequency Crystal Oscillator”
5.Updated typo in”Alternate Functions of Port C” on page 86.
6.Updated bit description in ”TWSR – TWI Status Register” on page 235.
7.Updated typo in ”Programming via the JTAG Interface” on page 313.
8.Updated conditions for V
9.Updated ”External Clock Drive” on page 331.
10.Updated conditions for V
11.Updated Minimum Reference Voltage in Table 27-12 (Differential channels) in ”ADC
12.Updated bit bit field typos in ”Register Summary” on page 414.
2.Added 49-ball VFBGA pinout for ATmega164P/324P in ”Pinout - VFBGA” on page 4.
6.Added 49-ball VFBGA (49C2) to ”Packaging Information” on page 425.
on page 35.
in the table of ”DC Characteristics” on page 326.
OL
INT2
teristics” on page 336.
Characteristics” on page 336.
in Table 27-11 (Single Ended channels) in ”ADC Charac-
9.6Rev. 8011H- 04/08
1.Added 44-pad DRQFN pinout for ATmega164P in ”Pinout - DRQFN” on page 3.
2.Added 49-ball VFBGA pinout for ATmega164P/324P in ”Pinout - VFBGA” on page 4.
2.Added note to ”Address Match Unit” on page 215.
3.Updated ATmega164P ”Ordering Information” on page 421.
4.Added 44-lead QFN (44MC) to ”Packaging Information” on page 424.
6.Added 49-ball VFBGA (49C2) to ”Packaging Information” on page 425.
9.7Rev. 8011G- 08/07
1.Updated ”Features” on page 1
2.Added ”Data Retention” on page 9.
3.Updated ”SPH and SPL – Stack Pointer High and Stack pointer Low” on page 15.
4.LCD reference removed from table note in ”Sleep Modes” on page 43.
5.Updated code example in ”Bit 0 – IVCE: Interrupt Vector Change Enable” on page 66.
24
ATmega164P/324P/644P
8011MS–AVR–08/09
Page 25
6.Removed reference to External Memory Interface in ”Alternate Functions of Port A” on
7.Updated ”Data Reception – The USART Receiver” on page 181.
8.Updated ”ADCSRB – ADC Control and Status Register B” on page 239.
9.Updated overview in ”ADC - Analog-to-digital Converter” on page 241.
10.Added ”ATmega644P Typical Characteristic” on page 389.
11.Updated Figure 28-31 on page 355, Figure 28-32 on page 356,Figure 28-33 on page
12.Updated notes in Table 8-3 on page 33.Table 8-8 on page 36, Table 8-9 on page 37,
13.Updated Table 13-7 on page 85, Table 13-8 on page 85, Table 13-10 on page 87,
14.Updated ”ATmega324P DC Characteristics” on page 328 and ”ATmega644P DC Char-
15.Updated Table 27-7 on page 332 and Table 8-13 on page 38.
9.8Rev. 8011F- 04/07
ATmega164P/324P/644P
page 81.
356
and Table 8-11 on page 38.
Table 13-11 on page 88, Table 13-14 on page 91, Table 27-1 on page 328,Table 27-2
on page 328,Table 27-5 on page 331, Table 27-9 on page 333, and Table 27-12 on
page 337
acteristics” on page 329.
1.Updated ”Watchdog Timer Configuration” on page 60.
9.9Rev. 8011E - 04/07
1.Updated ”GTCCR – General Timer/Counter Control Register” on page 160.
2.Updated ”EECR – The EEPROM Control Register” on page 24.
9.10Rev. 8011D - 02/07
1.Updated ”Pinout ATmega164P/324P/644P” on page 2.
2.Updated ”Power-down Mode” on page 45.
3.Updated note in Table 12-1 on page 69.
4.Updated Table 24-1 on page 273.
5.Updated ”Boot Size Configuration
6.Updated V
7.Updated note 3 and 4 in ”DC Characteristics” on page 326.
8.Added note to ”ATmega164P DC Characteristics” on page 328.
9.Added note to ”ATmega324P DC Characteristics” on page 328.
10.Updated Figure 28-13 on page 346 and Figure 28-60 on page 371.
(1)
” on page 290.
limits in ”DC Characteristics” on page 326.
OL
9.11Rev. 8011C - 10/06
1.Updated ”DC Characteristics” on page 326.
8011MS–AVR–08/09
25
Page 26
9.12Rev. 8011B - 09/06
1.Updated ”DC Characteristics” on page 326.
Page 27
9.13Rev. 8011A - 08/06
1.Initial revision.
ATmega164P/324P/644P
8011MS–AVR–08/09
27
Page 28
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