– 120 Powe rful Instructions – Most Single Clock Cycle Execution
– 32 x 8 General Purpose Working Registers
– Fully Static Operation
– Up to 20 MIPS Througput at 20 MHz
• High Endurance Non-volatile Memory segments
– 1K Bytes of In-System Self-programmable Flash program memory
– 64 Bytes EEPROM
– 64 Bytes Internal SRAM
– Write/Erase Cycles: 10,000 Flash/100,000 EEPROM
– Data retention: 20 Years at 85°C/100 Years at 25°C (see page 6)
– Programming Lock for Self-Programming Flash & EEPROM Data Security
• Peripheral Features
– One 8-bit Timer/Counter with Prescaler and Two PWM Channels
– 4-channel, 10-bit ADC with Internal Voltage Reference
– Programmable Watchdog Timer with Separate On-chip Oscillator
– On-chip Analog Comparator
• Special Microcontroller Features
– debugWIRE On-chip Debug System
– In-System Programmab le via SPI Port
– External and Internal Interrupt Sources
– Low Power Idle, ADC Noise Reduction, and Power-down Modes
– Enhanced Power-on Reset Circuit
– Programmable Brown-out Detection Circuit with Software Disable Function
– Internal Calibrated Oscillator
• I/O and Pac kages
– 8-pin PDIP/SOIC: Six Programmable I/O Lines
– 20-pad MLF: Six Programmable I/O Lines
NOTE: Bottom pad should be soldered to ground.
DNC: Do Not Connect
Figure 1-1.Pinout of ATtiny13A
2
8126BS–AVR–12/08
Page 3
1.1Pin Description
1.1.1VCC
Supply voltage.
1.1.2GND
Ground.
1.1.3Port B (PB5:PB0)
Port B is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port B output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port B pins are tri-stated when a reset co ndition becomes active,
even if the clock is not running.
Port B also serves the functions of various special features of the ATtiny13A as listed on page
55.
ATtiny13A
1.1.4
RESET
Reset input. A low level on this pin for longer than the minimum pulse length will generate a
reset, even if the clock is not running and provided the reset pin ha s not been disabled. Th e minimum pulse length is given in Table 18-4 on page 120. Shorter pulses are not guaranteed to
generate a reset.
The reset pin can also be used as a (weak) I/O pin.
8126BS–AVR–12/08
3
Page 4
ATtiny13A
2.Overview
2.1Block Diagram
The ATtiny13A is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC
architecture. By executing powerful instructions in a single clock cycle, the ATtiny13A achieves
throughputs approaching 1 MIPS pe r MHz allow ing the sy stem de signer to optimize power c onsumption versus processing speed.
Figure 2-1.Block Diagram
8-BIT DATABUS
VCC
GND
INSTRUCTION
REGISTER
INSTRUCTION
DECODER
CONTROL
LINES
STACK
POINTER
SRAM
PROGRAM
COUNTER
PROGRAM
FLASH
GENERAL
PURPOSE
REGISTERS
X
Y
Z
ALU
STATU S
REGISTER
WATCHDOG
OSCILLATOR
WATCHDOG
TIMER
MCU CONTROL
REGISTER
MCU STATUS
REGISTER
TIMER/
COUNTER0
INTERRUPT
UNIT
PROGRAMMING
LOGIC
DATA
EEPROM
CALIBRATED
INTERNAL
TOR
OSCILLA
TIMING AND
CONTROL
4
ADC /
ANALOG COMPARATOR
DATA REGISTER
PORT B
PORT B DRIVERS
PB0-PB5
DATA DIR.
REG.PORT B
RESET
CLKI
8126BS–AVR–12/08
Page 5
ATtiny13A
The AVR core combines a rich instruction set with 32 general purpose working registers. All 32
registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent
registers to be accessed in one single instruction executed in one clock cycle. The resulting
architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers.
The ATtiny13A provides the following feat ures: 1K byte of In -System Programm able Flash, 64
bytes EEPROM, 64 bytes SRAM, 6 general purpose I/O lines, 32 general purpose working registers, one 8-bit Timer/Counter with compare modes, Internal and External Interrupts, a 4channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, and three software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM,
Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. The
Power-down mode saves the register contents, disabling all chip functions until the next Interrupt or Hardware Reset. The ADC Noise Reduction mode stops the CPU and all I/O modules
except ADC, to minimize switching noise during ADC conversions.
The device is manufactured using Atmel’s high density non-volatile memory technology. The
On-chip ISP Flash allows the Program memory to be re-programmed In-System through an SPI
serial interface, by a conventional non-volatile memory programmer or by an On-chip boot code
running on the AVR core.
The ATtiny13A AVR is supported with a full suite of program and system development tools
including: C Compilers, Macro Assemblers, Program Debugger/Simulators, and Evaluation kits.
8126BS–AVR–12/08
5
Page 6
ATtiny13A
3.About
3.1Resources
A comprehensive set of drivers, application notes, data sheet s and descr iption s on development
tools are available for download at http://www.atmel.com/avr.
3.2Code Examples
This documentation contains simple code examples t hat brief ly show h ow to us e various parts of
the device. These code examples assume that the part specific header file is included b efore
compilation. Be aware that not all C compiler vendors include bit definitions in the header files
and interrupt handling in C is compiler dependent . Please con firm wit h the C com piler d ocume ntation for more details.
3.3Data Retention
Reliability Qualification results show that the projected data retention failure rate is much less
than 1 PPM over 20 years at 85°C or 100 years at 25⋅C.
Notes: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses
should never be written.
2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these
registers, the value of single bits can be checked by using the SBIS and SBIC instructions.ome of the Status Flags are
cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation
the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work
with registers 0x00 to 0x1F only.
8
8126BS–AVR–12/08
Page 9
ATtiny13A
5.Instruction Set Summary
MnemonicsOperandsDescriptionOperationFlags#Clocks
ADDRd, RrAdd two RegistersRd ← Rd + RrZ,C,N,V,H1
ADCRd, RrAdd with Carry two RegistersRd ← Rd + Rr + CZ,C,N,V,H1
ADIWRdl,KAdd Immediate to WordRdh:Rdl ← Rdh:Rdl + KZ,C,N,V,S2
SUBRd, RrSubtract two RegistersRd ← Rd - RrZ,C,N,V,H1
SUBIRd, KSubtract Constant from Register Rd ← Rd - KZ,C,N,V,H1
SBCRd, RrSubtract with Carry two RegistersRd ← Rd - Rr - CZ,C,N,V,H1
SBCIRd, KSubtract with Carry Constant from Reg.Rd ← Rd - K - CZ,C,N,V,H1
SBIWRdl,KSubtract Immediate from WordRdh:Rdl ← Rdh:Rdl - KZ,C,N,V,S2
ANDRd, RrLogical AND RegistersRd ← Rd • RrZ,N,V1
ANDIRd, KLogical AND Register and ConstantRd ← Rd • KZ,N,V1
ORRd, RrLogical OR RegistersRd ← Rd v RrZ,N,V1
ORIRd, KLogical OR Register and ConstantRd ← Rd v KZ,N,V1
EORRd, RrExclusive OR RegistersRd ← Rd ⊕ RrZ,N,V1
COMRdOne’s ComplementRd ← 0xFF − RdZ,C,N,V1
NEGRdTwo’s ComplementRd ← 0x00 − RdZ,C,N,V,H1
SBRRd,KSet Bit(s) in RegisterRd ← Rd v KZ,N,V1
CBRRd,KClear Bit(s) in RegisterRd ← Rd • (0xFF - K)Z,N,V1
TSTRdTest for Zero or MinusRd ← Rd • Rd Z,N,V1
CLRRdClear RegisterRd ← Rd ⊕ RdZ,N,V1
SERRdSet RegisterRd ← 0xFFNone1
RJMPkRelative JumpPC ← PC + k + 1None2
IJMPIndirect Jump to (Z)PC ← Z None2
RCALLkRelative Subroutine Call PC ← PC + k + 1None3
ICALLIndirect Call to (Z)PC ← ZNone3
RETSubroutine ReturnPC ← STACKNone4
RETIInterrupt ReturnPC ← STACKI4
CPSERd,RrCompare, Skip if Equalif (Rd = Rr) PC ← PC + 2 or 3None1/2/3
CPRd,RrCompareRd − RrZ, N,V,C,H1
CPCRd,RrCompare with CarryRd − Rr − CZ, N,V,C,H1
CPIRd,KCompare Register with ImmediateRd − KZ, N,V,C,H1
SBRCRr, bSkip if Bit in Register Clearedif (Rr(b)=0) PC ← PC + 2 or 3 None1/2/3
SBRSRr, bSkip if Bit in Register is Setif (Rr(b)=1) PC ← PC + 2 or 3None1/2/3
SBICP, bSkip if Bit in I/O Register Clearedif (P(b)=0) PC ← PC + 2 or 3 None1/2/3
SBISP, bSkip if Bit in I/O Register is Setif (P(b)=1) PC ← PC + 2 or 3None1/2/3
BRBSs, kBranch if Status Flag Setif (SREG(s) = 1) then PC←PC+k + 1None1/2
BRBCs, kBranch if Status Flag Clearedif (SREG(s) = 0) then PC←PC+k + 1None1/2
BREQ kBranch if Equal if (Z = 1) then PC ← PC + k + 1None1/2
BRNE kBranch if Not Equalif (Z = 0) then PC ← PC + k + 1None1/2
BRCS kBranch if Carry Setif (C = 1) then PC ← PC + k + 1None1/2
BRCC kBranch if Carry Clearedif (C = 0) then PC ← PC + k + 1None1/2
BRSH kBranch if Same or Higher if (C = 0) then PC ← PC + k + 1None1/2
BRLO kBranch if Lowerif (C = 1) then PC ← PC + k + 1None1/2
BRMI kBranch if Minusif (N = 1) then PC ← PC + k + 1None1/2
BRPL kBranch if Plus if (N = 0) then PC ← PC + k + 1None1/2
BRGE kBranch if Greater or Equal, Signedif (N ⊕ V= 0) then PC ← PC + k + 1N one1/2
BRLT kBranch if Less Than Zero, Signedif (N ⊕ V= 1) then PC ← PC + k + 1None1/2
BRHS kBranch if Half Carry Flag Setif (H = 1) then PC ← PC + k + 1None1/2
BRHC kBranch if Half Carry Flag Clearedif (H = 0) then PC ← PC + k + 1None1/2
BRTS kBranch if T Flag Setif (T = 1) then PC ← PC + k + 1None1/2
BRTC kBranch if T Flag Clearedif (T = 0) then PC ← PC + k + 1None1/2
BRVS kBranch if Overflow Flag is Setif (V = 1) then PC ← PC + k + 1None1/2
BRVC kBranch if Overflow Flag is Clearedif (V = 0) then PC ← PC + k + 1None1/2
BRIE kBranch if Interrupt Enabledif ( I = 1) then PC ← PC + k + 1None1/2
BRID kBranch if Interrupt Disabledif ( I = 0) then PC ← PC + k + 1None1/2
BSTRr, bBit Store from Register to TT ← Rr(b)T1
BLDRd, bBit load from T to RegisterRd(b) ← TNone1
SECSet CarryC ← 1C1
CLCClear CarryC ← 0 C1
SENSet Negative FlagN ← 1N1
CLNClear Negative FlagN ← 0 N1
SEZSet Zero FlagZ ← 1Z1
CLZClear Zero FlagZ ← 0 Z1
SEIGlobal Interrupt EnableI ← 1I1
CLIGlobal Interrupt DisableI ← 0 I1
SESSet Signed Test FlagS ← 1S1
CLSClear Signed Test FlagS ← 0 S1
SEVSet Twos Complement Overflow.V ← 1V1
CLVClear Twos Complement OverflowV ← 0 V1
SETSet T in SREGT ← 1T1
CLTClear T in SREGT ← 0 T1
SEHSet Half Carry Flag in SREGH ← 1H1
CLHClear Half Carry Flag in SREGH ← 0 H
MOVRd, RrMove Between RegistersRd ← RrNone1
MOVWRd, RrCopy Register Word
LDIRd, KLoad ImmediateRd ← KNone1
LDRd, XLoad IndirectRd ← (X)None2
LDRd, X+Load Indirect and Post-In c.Rd ← (X), X ← X + 1None2
LDRd, - XLoad Indirect and Pre-Dec.X ← X - 1, Rd ← (X)None2
LDRd, YLoad IndirectRd ← (Y)None2
LDRd, Y+Load Indirect and Post-In c.Rd ← (Y), Y ← Y + 1None2
LDRd, - YLoad Indirect and Pre-Dec.Y ← Y - 1, Rd ← (Y)None2
LDDRd,Y+qLoad Indirec t with DisplacementRd ← (Y + q)None2
LDRd, ZLoad Indirect Rd ← (Z)None2
LDRd, Z+Load Indirect and Post-Inc.Rd ← (Z), Z ← Z+1None2
LDRd, -ZLoad Indirect and Pre-Dec.Z ← Z - 1, Rd ← (Z)None2
LDDRd, Z+qLoad Indirect with DisplacementRd ← (Z + q)Non e2
LDSRd, kLoad Direct from SRAMRd ← (k)None2
STX, RrStore Indirect(X) ← RrNone2
STX+, RrStore Indirect and Post-Inc.(X) ← Rr , X ← X + 1None2
ST- X, RrStore Indirect and Pre-Dec.X ← X - 1, (X) ← RrNone2
STY, RrStore Indirect(Y) ← RrNone2
STY+, RrStore Indirect and Post-Inc.(Y) ← Rr, Y ← Y + 1None2
ST- Y, RrStore Indirect and Pre-Dec.Y ← Y - 1, (Y) ← RrNone2
STDY+q,RrStore Indirect with Displacement(Y + q) ← RrNone2
STZ, RrStore Indirect(Z) ← RrNone2
STZ+, RrStore Indirect and Post-Inc.(Z) ← Rr, Z ← Z + 1None2
ST-Z, RrStore Indirect and Pre-Dec.Z ← Z - 1, (Z) ← RrNone2
STDZ+q,RrStore Indirect with Displacement(Z + q) ← RrNone2
STSk, RrStore Direct to SRAM(k) ← RrNone2
LPMLoad Program MemoryR0 ← (Z)None3
LPMRd, ZLoad Program MemoryRd ← (Z)None3
LPMRd, Z+Load Program Memory and Post-IncRd ← (Z), Z ← Z+1None3
SPMStore Program Memory(z) ← R1:R0None
INRd, PIn PortRd ← PNone1
OUTP, RrOut PortP ← RrNone1
PUSHRrPush Register on StackSTACK ← RrNone2
POPRdPop Register from StackRd ← STACKNone2
NOPNo OperationNone1
SLEEPSleep(see specific descr. for Sleep func tion)None1
WDRWatchdog Reset(see specific descr. for WDR/Timer)None1
BREAKBreakFor On-chip Debug OnlyNoneN/A
DATA TRANSFER INSTRUCTIONS
MCU CONTROL INSTRUCTIONS
Rd+1:Rd ← Rr+1:Rr
None1
1
10
8126BS–AVR–12/08
Page 11
6.Ordering Information
Speed (MHz)
Notes: 1. For device speed vs. VCC, see “Speed Grades” on page 118.
2. This device can also be supplied in wafer f orm. Please contact your local Atmel sales office for detailed ordering information
3. All packages are Pb-free, Halide-free, fully green and they comply with the European directive for Restriction of Hazardous
20-pad, 4 x 4 x 0.8 mm Body, Lea d Pitch 0.50 mm, Micro Lead Frame Package (MLF)
10-pad, 3 x 3 x 1 mm Body, Le ad Pitch 0.50 mm, Micro Lead Frame Package (MLF)
11
Page 12
ATtiny13A
7.Packaging Information
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes:1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc.
A––1.75
B––0.51
C––0.25
D––5.00
E––4.00
e1.27 BSC
H––6.20
L––1.27
14
8126BS–AVR–12/08
Page 15
7.420M1
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm,
A
20M1
10/27/04
2.6 mm Exposed Pad, Micro Lead Frame Package (MLF)
A 0.70 0.75 0.80
A1 – 0.01 0.05
A2 0.20 REF
b 0.18 0.23 0.30
D 4.00 BSC
D2 2.45 2.60 2.75
E 4.00 BSC
E2 2.45 2.60 2.75
e0.50 BSC
L 0.35 0.40 0.55
SIDE VIEW
Pin 1 ID
Pin #1
Notch
(0.20 R)
BOTTOM VIEW
TOP VIEW
Note:
Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D
E
e
A2
A1
A
D2
E2
0.08
C
L
1
2
3
b
1
2
3
ATtiny13A
8126BS–AVR–12/08
15
Page 16
ATtiny13A
7.510M1
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
10M1, 10-pad, 3 x 3 x 1.0 mm Body, Lead Pitch 0.50 mm,
1.64 x 2.60 mm Exposed Pad, Micro Lead Frame Package
A
10M1
7/7/06
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.80 0.90 1.00
A1 0.00 0.02 0.05
b 0.18 0.25 0.30
D 2.90 3.00 3.10
D1 1.40 – 1.75
E 2.90 3.00 3.10
E1 2.20 – 2.70
e 0.50
L 0.30 – 0.50
y – – 0.08
K 0.20 ––
Pin 1 ID
TOP VIEW
D
E
A1
A
SIDE VIEW
BOTTOM VIEW
D1
E1
L
b
e
K
1
2
Notes: 1. This package conforms to JEDEC reference MO-229C, Variation VEED-5.
2. The terminal #1 ID is a Lasser-marked Feature.
y
16
8126BS–AVR–12/08
Page 17
8.Errata
The revision letters in this section refer to the revision of the ATtiny13A device.
8.1ATtiny13A Rev. G – H
No known errata.
8.2ATtiny13A Rev. E – F
These device revisions were not sampled.
8.3ATtiny13A Rev. A – D
These device revisions were referred to as ATtiny13/ATtiny13V.
ATtiny13A
8126BS–AVR–12/08
17
Page 18
ATtiny13A
9.Datasheet Revision History
Please note that page numbers in this section refer to the current version of this document and
may not apply to previous versions.
9.1Rev. 8126B – 11/08
1. Updated order codes on page 11 to reflect changes in material composition.
2. Updated sections:
– “DIDR0 – Digital Input Disable Register 0” on page 81
– “DIDR0 – Digital Input Disable Register 0” on page 95
3. Updated “Register Summary” on page 7 .
9.2Rev. 8126A – 05/08
1. Initial revision, created from document 2535I – 04/08.
2. Updated characteristic plots of section “Typical Characteristics” , starting on page 124.
3. Updated “Ordering Information” on page 11.
4. Updated section:
– “Speed Grades” on page 118
5. Update tables:
– “DC Characte ristics, T
– “Calibration Accuracy of Internal RC Oscillator” on page 119
– “Reset, Bro wn-out, and Internal Voltage Characteristics” on page 120
– “ADC Characteristics, Single Ended Channels. TA = -40⋅C - 85⋅C” on page 121
– “Serial Programming Characteristics, T
6. Added description of new function, “Power Reduction Register”:
– Added functional description on page 31
– Added bit description on page 34
– Added section “Supply Current of I/O Modules” on page 124
– Updated Register Summary on page 7
7. Added description of new funct ion, “Software BOD Disable”:
– Added functional description on page 31
– Updated section on page 32
– Added register description on page 33
– Updated Register Summary on page 7
8. Added description of enhanced function, “Enhanced Power-On Reset”:
– Updated Table 18-4 on page 120, and Table 18-5 on page 120
= -40⋅C to 85⋅C” on page 117
A
= -40⋅C to 85⋅C” on page 122
A
18
8126BS–AVR–12/08
Page 19
ATtiny13A
8126BS–AVR–12/08
19
Page 20
HeadquartersInternational
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Atmel Asia
Unit 1-5 & 16, 19/F
BEA Tower, Millennium City 5
418 Kwun Tong Road
Kwun Tong, Kowloon
Hong Kong
Tel: (852) 2245-6100
Fax: (852) 2722-1369
Product Contact
Web Site
www.atmel.com
Literature Requests
www.atmel.com/literature
Atmel Europe
Le Krebs
8, Rue Jean-Pierre Timbaud
BP 309
78054 Saint-Quentin-enYvelines Cedex
France
Tel: (33) 1-30-60-70-00
Fax: (33) 1-30-60-71-11
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Sales Contact
www.atmel.com/contacts
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in conne ction with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-
TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENT AL DAMAGES (INCLUDING, WITHOUT LIMITATION, D AMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INF ORMATION) ARISING OUT OF
THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained here in. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to suppor t or sustain life.