Atec TSE-11-A User Manual

CAT.NO.E01133-T1202
Thermal Shock Chamber
TSE−11−A
ESPEC offers a compact, but highly performant
*The paperless recorder and additional overheat protector are optional.
Equipped with superior temperature recovery performance
capable of answering the requirements of severe test specifications,
this thermal shock model offers a wide test area in a compact, slim design.
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*The paperless recorder and additional overheat protector are optional.
Characteristics
A high performance compact package to meet severe test requirements.
A temperature recovery time of less than 5 minutes is achieved in 2 zones (+150℃ and −65℃) without auxiliary cooling
By realizing a temperature recovery time of less than 5 minutes for the upstream air in the 2 zones (+150 and −65), we have achieved performance equivalent to that of a large thermal shock chamber without having to use auxiliary cooling by means of liquid carbon dioxide, which was required in previous compact thermal shock chamber.
Complies with MIL-STD-883H
and other test standards
This compact thermal shock chamber satisfies the temperature cycle test requirements of MIL-STD-883H and other test standard (see page 5).
Smooth specimen transfer
The "soft-move mode" is used to reduce vibration shock when specimens are moving between the hot and cold chambers.
Uniform temperature
distribution across specimens
High temperature uniformity performance ensures consistent stress on specimens.
Examples of temperature uniformity
Test conditions
High temperature exposure +150℃ 30 min.
Low temperature exposure −65℃ 30 min.
Specimen Plastic molded IC 2kg
High-temperature exposure Low-temperature exposure
Temperature uniformity measurement method
Thermocouples were embedded in 10 plastic molded ICs (16 pin DIPs), which were then placed on two levels in each of the corners and in the center of a specimen basket.
Within ±1.5
Sensor temperature (Test area: upstream)
Within ±1.0
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